ATE544182T1 - Feldeffekttransistor des fin-typs - Google Patents
Feldeffekttransistor des fin-typsInfo
- Publication number
- ATE544182T1 ATE544182T1 AT06788172T AT06788172T ATE544182T1 AT E544182 T1 ATE544182 T1 AT E544182T1 AT 06788172 T AT06788172 T AT 06788172T AT 06788172 T AT06788172 T AT 06788172T AT E544182 T1 ATE544182 T1 AT E544182T1
- Authority
- AT
- Austria
- Prior art keywords
- fin
- finfet
- gate
- field effect
- effect transistor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/62—Fin field-effect transistors [FinFET]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/024—Manufacture or treatment of FETs having insulated gates [IGFET] of fin field-effect transistors [FinFET]
- H10D30/0245—Manufacture or treatment of FETs having insulated gates [IGFET] of fin field-effect transistors [FinFET] by further thinning the channel after patterning the channel, e.g. using sacrificial oxidation on fins
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/62—Fin field-effect transistors [FinFET]
- H10D30/6217—Fin field-effect transistors [FinFET] having non-uniform gate electrodes, e.g. gate conductors having varying doping
Landscapes
- Thin Film Transistor (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Bipolar Transistors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/161,442 US7348642B2 (en) | 2005-08-03 | 2005-08-03 | Fin-type field effect transistor |
| PCT/US2006/028465 WO2007019023A2 (en) | 2005-08-03 | 2006-07-21 | Fin-type field effect transistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE544182T1 true ATE544182T1 (de) | 2012-02-15 |
Family
ID=37716900
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT06788172T ATE544182T1 (de) | 2005-08-03 | 2006-07-21 | Feldeffekttransistor des fin-typs |
Country Status (8)
| Country | Link |
|---|---|
| US (4) | US7348642B2 (enExample) |
| EP (1) | EP1920467B1 (enExample) |
| JP (1) | JP5220604B2 (enExample) |
| KR (1) | KR101027173B1 (enExample) |
| CN (1) | CN101443912B (enExample) |
| AT (1) | ATE544182T1 (enExample) |
| TW (1) | TWI397999B (enExample) |
| WO (1) | WO2007019023A2 (enExample) |
Families Citing this family (67)
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| US7456476B2 (en) | 2003-06-27 | 2008-11-25 | Intel Corporation | Nonplanar semiconductor device with partially or fully wrapped around gate electrode and methods of fabrication |
| US7268058B2 (en) * | 2004-01-16 | 2007-09-11 | Intel Corporation | Tri-gate transistors and methods to fabricate same |
| US7042009B2 (en) | 2004-06-30 | 2006-05-09 | Intel Corporation | High mobility tri-gate devices and methods of fabrication |
| US7332439B2 (en) * | 2004-09-29 | 2008-02-19 | Intel Corporation | Metal gate transistors with epitaxial source and drain regions |
| US20060086977A1 (en) | 2004-10-25 | 2006-04-27 | Uday Shah | Nonplanar device with thinned lower body portion and method of fabrication |
| US7518196B2 (en) | 2005-02-23 | 2009-04-14 | Intel Corporation | Field effect transistor with narrow bandgap source and drain regions and method of fabrication |
| US7858481B2 (en) | 2005-06-15 | 2010-12-28 | Intel Corporation | Method for fabricating transistor with thinned channel |
| US7547637B2 (en) | 2005-06-21 | 2009-06-16 | Intel Corporation | Methods for patterning a semiconductor film |
| US7279375B2 (en) * | 2005-06-30 | 2007-10-09 | Intel Corporation | Block contact architectures for nanoscale channel transistors |
| US7348642B2 (en) * | 2005-08-03 | 2008-03-25 | International Business Machines Corporation | Fin-type field effect transistor |
| US7595245B2 (en) * | 2005-08-12 | 2009-09-29 | Texas Instruments Incorporated | Semiconductor device having a gate electrode material feature located adjacent a gate width side of its gate electrode and a method of manufacture therefor |
| DE102005039365B4 (de) * | 2005-08-19 | 2022-02-10 | Infineon Technologies Ag | Gate-gesteuertes Fin-Widerstandselement, welches als pinch - resistor arbeitet, zur Verwendung als ESD-Schutzelement in einem elektrischen Schaltkreis und Einrichtung zum Schutz vor elektrostatischen Entladungen in einem elektrischen Schaltkreis |
| US20070090416A1 (en) | 2005-09-28 | 2007-04-26 | Doyle Brian S | CMOS devices with a single work function gate electrode and method of fabrication |
| US7485503B2 (en) | 2005-11-30 | 2009-02-03 | Intel Corporation | Dielectric interface for group III-V semiconductor device |
| US8143646B2 (en) | 2006-08-02 | 2012-03-27 | Intel Corporation | Stacking fault and twin blocking barrier for integrating III-V on Si |
| JP2008177278A (ja) * | 2007-01-17 | 2008-07-31 | Toshiba Corp | スタティック型半導体記憶装置 |
| KR100887007B1 (ko) | 2007-10-12 | 2009-03-04 | 주식회사 동부하이텍 | Ldi의 알-스트링내 폴리 패턴 형성 방법 및 구조 |
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| WO2009130629A1 (en) * | 2008-04-23 | 2009-10-29 | Nxp B.V. | A fin fet and a method of manufacturing a fin fet |
| US8362566B2 (en) | 2008-06-23 | 2013-01-29 | Intel Corporation | Stress in trigate devices using complimentary gate fill materials |
| US7781283B2 (en) * | 2008-08-15 | 2010-08-24 | International Business Machines Corporation | Split-gate DRAM with MuGFET, design structure, and method of manufacture |
| US7979836B2 (en) * | 2008-08-15 | 2011-07-12 | International Business Machines Corporation | Split-gate DRAM with MuGFET, design structure, and method of manufacture |
| US8331068B2 (en) * | 2009-02-19 | 2012-12-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | ESD protection for FinFETs |
| US8184472B2 (en) | 2009-03-13 | 2012-05-22 | International Business Machines Corporation | Split-gate DRAM with lateral control-gate MuGFET |
| US8202780B2 (en) * | 2009-07-31 | 2012-06-19 | International Business Machines Corporation | Method for manufacturing a FinFET device comprising a mask to define a gate perimeter and another mask to define fin regions |
| US8946028B2 (en) * | 2009-10-06 | 2015-02-03 | International Business Machines Corporation | Merged FinFETs and method of manufacturing the same |
| US8716797B2 (en) | 2009-11-03 | 2014-05-06 | International Business Machines Corporation | FinFET spacer formation by oriented implantation |
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| US8513102B2 (en) | 2010-11-08 | 2013-08-20 | Leonard Forbes | Reduction of random telegraph signal (RTS) and 1/f noise in silicon MOS devices, circuits, and sensors |
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| KR101805634B1 (ko) * | 2011-11-15 | 2017-12-08 | 삼성전자 주식회사 | Ⅲ-ⅴ족 배리어를 포함하는 반도체 소자 및 그 제조방법 |
| CN103165428B (zh) * | 2011-12-14 | 2015-12-09 | 中芯国际集成电路制造(上海)有限公司 | 制作半导体器件的方法 |
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| US8927432B2 (en) * | 2012-06-14 | 2015-01-06 | International Business Machines Corporation | Continuously scalable width and height semiconductor fins |
| KR20140040543A (ko) | 2012-09-26 | 2014-04-03 | 삼성전자주식회사 | 핀 구조의 전계효과 트랜지스터, 이를 포함하는 메모리 장치 및 그 반도체 장치 |
| CN103779217A (zh) * | 2012-10-18 | 2014-05-07 | 中芯国际集成电路制造(上海)有限公司 | 一种鳍片型场效应晶体管及其制作方法 |
| CN103811338B (zh) * | 2012-11-08 | 2016-12-21 | 中芯国际集成电路制造(上海)有限公司 | 一种半导体器件及其制备方法 |
| US9123654B2 (en) * | 2013-02-15 | 2015-09-01 | International Business Machines Corporation | Trilayer SIT process with transfer layer for FINFET patterning |
| US9231106B2 (en) * | 2013-03-08 | 2016-01-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | FinFET with an asymmetric source/drain structure and method of making same |
| CN104103319B (zh) * | 2013-04-11 | 2017-08-25 | 中芯国际集成电路制造(上海)有限公司 | 反熔丝电路及其编程方法、反熔丝结构 |
| KR102089682B1 (ko) | 2013-07-15 | 2020-03-16 | 삼성전자 주식회사 | 반도체 장치 및 이의 제조 방법 |
| US9484460B2 (en) | 2013-09-19 | 2016-11-01 | Taiwan Semiconductor Manufacturing Company Limited | Semiconductor device having gate dielectric surrounding at least some of channel region and gate electrode surrounding at least some of gate dielectric |
| US9691763B2 (en) | 2013-12-27 | 2017-06-27 | International Business Machines Corporation | Multi-gate FinFET semiconductor device with flexible design width |
| US9190466B2 (en) | 2013-12-27 | 2015-11-17 | International Business Machines Corporation | Independent gate vertical FinFET structure |
| US9633906B2 (en) | 2014-01-24 | 2017-04-25 | International Business Machines Corporation | Gate structure cut after formation of epitaxial active regions |
| US10141311B2 (en) * | 2014-03-24 | 2018-11-27 | Intel Corporation | Techniques for achieving multiple transistor fin dimensions on a single die |
| US9318574B2 (en) * | 2014-06-18 | 2016-04-19 | International Business Machines Corporation | Method and structure for enabling high aspect ratio sacrificial gates |
| US9281065B2 (en) | 2014-08-11 | 2016-03-08 | Empire Technology Development Llc | Low-power nonvolatile memory cells with select gates |
| JP6373686B2 (ja) | 2014-08-22 | 2018-08-15 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| US10559690B2 (en) | 2014-09-18 | 2020-02-11 | International Business Machines Corporation | Embedded source/drain structure for tall FinFET and method of formation |
| KR102168302B1 (ko) | 2014-11-21 | 2020-10-22 | 삼성전자주식회사 | 3차원 채널을 이용하는 반도체 장치 |
| KR102320049B1 (ko) | 2015-02-26 | 2021-11-01 | 삼성전자주식회사 | 경사진 활성 영역을 갖는 반도체 소자 |
| US10018515B2 (en) * | 2015-09-16 | 2018-07-10 | Qualcomm Incorporated | Transistor temperature sensing |
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| TWI594421B (zh) * | 2016-06-28 | 2017-08-01 | 瑞昱半導體股份有限公司 | 鰭式場效電晶體及其製造方法 |
| CN107579116A (zh) * | 2016-07-05 | 2018-01-12 | 瑞昱半导体股份有限公司 | 鳍式场效晶体管及其制造方法 |
| KR101859587B1 (ko) | 2016-12-30 | 2018-05-18 | 서울시립대학교 산학협력단 | 네거티브 캐패시턴스 핀펫 소자 및 제조 방법 |
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| KR102446403B1 (ko) * | 2018-06-22 | 2022-09-21 | 삼성전자주식회사 | 반도체 장치, 반도체 장치의 제조 방법 및 반도체 장치의 레이아웃 디자인 방법 |
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| US11060846B2 (en) * | 2018-12-19 | 2021-07-13 | Kla Corporation | Scatterometry based methods and systems for measurement of strain in semiconductor structures |
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-
2005
- 2005-08-03 US US11/161,442 patent/US7348642B2/en not_active Expired - Lifetime
-
2006
- 2006-07-21 EP EP06788172A patent/EP1920467B1/en active Active
- 2006-07-21 CN CN2006800285758A patent/CN101443912B/zh active Active
- 2006-07-21 KR KR1020087004466A patent/KR101027173B1/ko not_active Expired - Fee Related
- 2006-07-21 JP JP2008525007A patent/JP5220604B2/ja not_active Expired - Fee Related
- 2006-07-21 AT AT06788172T patent/ATE544182T1/de active
- 2006-07-21 WO PCT/US2006/028465 patent/WO2007019023A2/en not_active Ceased
- 2006-08-02 TW TW095128273A patent/TWI397999B/zh active
-
2007
- 2007-12-13 US US11/955,579 patent/US8129773B2/en active Active
-
2008
- 2008-01-10 US US11/972,412 patent/US8106439B2/en active Active
-
2012
- 2012-01-30 US US13/361,050 patent/US8524547B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2009503893A (ja) | 2009-01-29 |
| TW200717805A (en) | 2007-05-01 |
| US8524547B2 (en) | 2013-09-03 |
| CN101443912B (zh) | 2011-03-23 |
| CN101443912A (zh) | 2009-05-27 |
| JP5220604B2 (ja) | 2013-06-26 |
| EP1920467A4 (en) | 2011-03-02 |
| US8129773B2 (en) | 2012-03-06 |
| US8106439B2 (en) | 2012-01-31 |
| TWI397999B (zh) | 2013-06-01 |
| EP1920467A2 (en) | 2008-05-14 |
| US20070029624A1 (en) | 2007-02-08 |
| US20080124868A1 (en) | 2008-05-29 |
| US20120129304A1 (en) | 2012-05-24 |
| US20080087968A1 (en) | 2008-04-17 |
| WO2007019023A3 (en) | 2008-11-13 |
| KR20080030110A (ko) | 2008-04-03 |
| US7348642B2 (en) | 2008-03-25 |
| WO2007019023A2 (en) | 2007-02-15 |
| EP1920467B1 (en) | 2012-02-01 |
| KR101027173B1 (ko) | 2011-04-05 |
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