ATE525430T1 - Wärmeleitfähiges flächengebilde und herstellungsverfahren dafür - Google Patents
Wärmeleitfähiges flächengebilde und herstellungsverfahren dafürInfo
- Publication number
- ATE525430T1 ATE525430T1 AT05824536T AT05824536T ATE525430T1 AT E525430 T1 ATE525430 T1 AT E525430T1 AT 05824536 T AT05824536 T AT 05824536T AT 05824536 T AT05824536 T AT 05824536T AT E525430 T1 ATE525430 T1 AT E525430T1
- Authority
- AT
- Austria
- Prior art keywords
- thermally conductive
- production method
- conductive sheet
- conductive surface
- amount
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
- C08K5/134—Phenols containing ester groups
- C08K5/1345—Carboxylic esters of phenolcarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
- C08K5/37—Thiols
- C08K5/372—Sulfides, e.g. R-(S)x-R'
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004351422A JP4869584B2 (ja) | 2004-12-03 | 2004-12-03 | 熱伝導性シート及びその製造方法 |
PCT/US2005/039098 WO2006062614A1 (en) | 2004-12-03 | 2005-10-28 | Thermally conductive sheet and method of production thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE525430T1 true ATE525430T1 (de) | 2011-10-15 |
Family
ID=35781375
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT05824536T ATE525430T1 (de) | 2004-12-03 | 2005-10-28 | Wärmeleitfähiges flächengebilde und herstellungsverfahren dafür |
Country Status (5)
Country | Link |
---|---|
US (2) | US20080081859A1 (de) |
EP (1) | EP1833903B1 (de) |
JP (1) | JP4869584B2 (de) |
AT (1) | ATE525430T1 (de) |
WO (1) | WO2006062614A1 (de) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100731279B1 (ko) | 2003-05-19 | 2007-06-21 | 니폰 쇼쿠바이 컴파니 리미티드 | 열전도성 재료용 수지 조성물 및 열전도성 재료 |
JP5134824B2 (ja) * | 2007-02-05 | 2013-01-30 | 日東電工株式会社 | 樹脂成形品製造方法 |
JP5547032B2 (ja) * | 2010-10-21 | 2014-07-09 | パナソニック株式会社 | 熱伝導性樹脂組成物、樹脂シート、プリプレグ、金属積層板およびプリント配線板 |
WO2012077168A1 (ja) * | 2010-12-10 | 2012-06-14 | 株式会社アドマテックス | 難燃剤及びその製造方法、難燃性樹脂組成物及びその製造方法 |
JP5892734B2 (ja) * | 2011-05-02 | 2016-03-23 | スリーエム イノベイティブ プロパティズ カンパニー | 熱伝導性シート |
JP6008706B2 (ja) * | 2012-11-16 | 2016-10-19 | アイカ工業株式会社 | 熱伝導性組成物 |
JP6212950B2 (ja) * | 2013-05-22 | 2017-10-18 | デクセリアルズ株式会社 | 光硬化性アクリル系熱伝導組成物、アクリル系熱伝導性シート及びその製造方法 |
TWI564328B (zh) * | 2015-08-27 | 2017-01-01 | Fdc Lees Chemical Industry Co | Composite stabilizer composition and modified polymer material |
JP6710828B2 (ja) * | 2016-04-06 | 2020-06-17 | 北川工業株式会社 | 熱伝導シート、および、熱伝導シートの製造方法 |
KR102476584B1 (ko) * | 2019-07-10 | 2022-12-13 | 주식회사 엘지화학 | 열전도성 시트용 조성물 및 그로부터 제조된 열전도성 시트 |
JP7235633B2 (ja) * | 2019-09-30 | 2023-03-08 | 積水化学工業株式会社 | 熱伝導性樹脂シート |
WO2021065899A1 (ja) * | 2019-09-30 | 2021-04-08 | 積水化学工業株式会社 | 熱伝導性樹脂シート |
CN111334226B (zh) * | 2019-12-31 | 2021-06-18 | 武汉长盈鑫科技有限公司 | 一种低玻璃化温度的导热胶及其制备方法 |
Family Cites Families (34)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS5448852A (en) | 1977-09-27 | 1979-04-17 | Asahi Chem Ind Co Ltd | Thermoplastic polymer composition |
JPS573841A (en) | 1980-06-11 | 1982-01-09 | Karupu Kogyo Kk | Resin composition for heat-shrinkable film |
JPS5742750A (en) | 1980-08-28 | 1982-03-10 | Nippon Petrochem Co Ltd | Production of polyolefin resin composition |
JPS57125257A (en) * | 1981-01-27 | 1982-08-04 | Sumitomo Chem Co Ltd | Stabilized synthetic resin composition |
JPS5991139A (ja) * | 1982-11-16 | 1984-05-25 | Meidensha Electric Mfg Co Ltd | 熱伝導性電気絶縁材料 |
JPS6116940A (ja) * | 1984-07-04 | 1986-01-24 | Hitachi Cable Ltd | 耐熱性透明ポリオレフイン樹脂組成物 |
US4980086A (en) * | 1985-10-16 | 1990-12-25 | Toagosei Chemical Industry, Co., Ltd. | Curable composition |
JP2615829B2 (ja) | 1988-05-09 | 1997-06-04 | 住友化学工業株式会社 | 熱酸化安定性ポリオレフィン組成物 |
JPH03218909A (ja) * | 1990-01-24 | 1991-09-26 | Asahi Chem Ind Co Ltd | 窒化アルミニウム粉末の製造法 |
EP0476224A1 (de) | 1990-08-21 | 1992-03-25 | Ricon Resins, Inc. | Gummi-Klebemischung |
JPH05171057A (ja) | 1990-11-09 | 1993-07-09 | Ajinomoto Co Inc | チタンオリゴマー表面処理フィラー |
JP3133375B2 (ja) | 1991-06-11 | 2001-02-05 | 旭電化工業株式会社 | ポリオレフィン系樹脂組成物 |
JPH05230341A (ja) * | 1991-08-02 | 1993-09-07 | Matsushita Electric Works Ltd | 封止用エポキシ樹脂成形材料 |
JPH05125669A (ja) * | 1991-11-05 | 1993-05-21 | Dai Ichi Kogyo Seiyaku Co Ltd | 耐熱アクリル繊維の処理剤及び処理方法 |
DE69231635T2 (de) | 1991-11-15 | 2001-08-16 | Ici Plc | Polymerisierbare zusammensetzungen |
JPH05320414A (ja) | 1992-05-25 | 1993-12-03 | Dai Ichi Kogyo Seiyaku Co Ltd | 無機フィラー表面改質剤 |
JP3456544B2 (ja) * | 1993-11-19 | 2003-10-14 | 出光興産株式会社 | スチレン系樹脂組成物 |
DE19581850T1 (de) * | 1994-11-21 | 1997-10-16 | Asahi Chemical Ind | Polymeres Verbundmaterial |
BR9508009A (pt) * | 1995-04-27 | 1997-08-05 | Polyplastics Co | Composições de resina termoplástica e processo de produção das mesmas |
JPH09174563A (ja) * | 1995-12-26 | 1997-07-08 | Teijin Seiki Co Ltd | 光造形型およびその製造方法 |
JPH10316953A (ja) | 1997-05-16 | 1998-12-02 | Nitto Denko Corp | 剥離可能な熱伝導性感圧接着剤とその接着シ―ト類 |
JP3813301B2 (ja) | 1997-06-04 | 2006-08-23 | エフコ株式会社 | 熱伝導性ゴム組成物および熱伝導性ゴムシート |
JP3290127B2 (ja) | 1998-01-27 | 2002-06-10 | 松下電工株式会社 | 熱伝導性シリコーンゴム組成物及びこの熱伝導性シリコーンゴム組成物によりなる放熱シート |
JP3636884B2 (ja) | 1998-04-03 | 2005-04-06 | ミネソタ マイニング アンド マニュファクチャリング カンパニー | 熱伝導性シート |
JP2992285B1 (ja) * | 1998-11-10 | 1999-12-20 | 北川工業株式会社 | 熱伝導材 |
US5989459A (en) | 1999-03-09 | 1999-11-23 | Johnson Matthey, Inc. | Compliant and crosslinkable thermal interface materials |
JP4624521B2 (ja) | 2000-04-24 | 2011-02-02 | 昭和電工株式会社 | 水酸化アルミニウムの表面処理方法 |
JP4369594B2 (ja) | 2000-04-28 | 2009-11-25 | 古河電気工業株式会社 | 熱伝導性成形体 |
JP2002284884A (ja) | 2001-03-26 | 2002-10-03 | Sumitomo Wiring Syst Ltd | フィラー、それを含む樹脂組成物および樹脂組成物の製造方法 |
JP4588285B2 (ja) | 2002-01-25 | 2010-11-24 | 信越化学工業株式会社 | 熱伝導性シリコーンゴム組成物 |
JP2003238760A (ja) | 2002-02-19 | 2003-08-27 | C I Kasei Co Ltd | ノンハロゲン難燃性放熱シート |
JP2004002527A (ja) * | 2002-05-31 | 2004-01-08 | Dainippon Ink & Chem Inc | 難燃性熱伝導電気絶縁粘着体 |
JP2004010859A (ja) | 2002-06-11 | 2004-01-15 | Dainippon Ink & Chem Inc | 熱伝導電気絶縁感圧接着剤用組成物、およびこれを用いた粘着シート |
JP4385573B2 (ja) | 2002-07-31 | 2009-12-16 | Dic株式会社 | 熱伝導電気絶縁感圧接着剤用組成物、およびこれを用いた粘着シート |
-
2004
- 2004-12-03 JP JP2004351422A patent/JP4869584B2/ja not_active Expired - Fee Related
-
2005
- 2005-10-28 AT AT05824536T patent/ATE525430T1/de not_active IP Right Cessation
- 2005-10-28 US US11/720,121 patent/US20080081859A1/en not_active Abandoned
- 2005-10-28 WO PCT/US2005/039098 patent/WO2006062614A1/en active Application Filing
- 2005-10-28 EP EP05824536A patent/EP1833903B1/de not_active Not-in-force
-
2009
- 2009-09-29 US US12/569,562 patent/US7956116B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20080081859A1 (en) | 2008-04-03 |
EP1833903B1 (de) | 2011-09-21 |
WO2006062614A1 (en) | 2006-06-15 |
US20100020496A1 (en) | 2010-01-28 |
JP2006160830A (ja) | 2006-06-22 |
EP1833903A1 (de) | 2007-09-19 |
US7956116B2 (en) | 2011-06-07 |
JP4869584B2 (ja) | 2012-02-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |