ATE525430T1 - Wärmeleitfähiges flächengebilde und herstellungsverfahren dafür - Google Patents

Wärmeleitfähiges flächengebilde und herstellungsverfahren dafür

Info

Publication number
ATE525430T1
ATE525430T1 AT05824536T AT05824536T ATE525430T1 AT E525430 T1 ATE525430 T1 AT E525430T1 AT 05824536 T AT05824536 T AT 05824536T AT 05824536 T AT05824536 T AT 05824536T AT E525430 T1 ATE525430 T1 AT E525430T1
Authority
AT
Austria
Prior art keywords
thermally conductive
production method
conductive sheet
conductive surface
amount
Prior art date
Application number
AT05824536T
Other languages
English (en)
Inventor
Masaki Yoda
Yoshinao Yamazaki
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Application granted granted Critical
Publication of ATE525430T1 publication Critical patent/ATE525430T1/de

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/13Phenols; Phenolates
    • C08K5/134Phenols containing ester groups
    • C08K5/1345Carboxylic esters of phenolcarboxylic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/36Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/37Thiols
    • C08K5/372Sulfides, e.g. R-(S)x-R'
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2227Oxides; Hydroxides of metals of aluminium
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10Methods of surface bonding and/or assembly therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
AT05824536T 2004-12-03 2005-10-28 Wärmeleitfähiges flächengebilde und herstellungsverfahren dafür ATE525430T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004351422A JP4869584B2 (ja) 2004-12-03 2004-12-03 熱伝導性シート及びその製造方法
PCT/US2005/039098 WO2006062614A1 (en) 2004-12-03 2005-10-28 Thermally conductive sheet and method of production thereof

Publications (1)

Publication Number Publication Date
ATE525430T1 true ATE525430T1 (de) 2011-10-15

Family

ID=35781375

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05824536T ATE525430T1 (de) 2004-12-03 2005-10-28 Wärmeleitfähiges flächengebilde und herstellungsverfahren dafür

Country Status (5)

Country Link
US (2) US20080081859A1 (de)
EP (1) EP1833903B1 (de)
JP (1) JP4869584B2 (de)
AT (1) ATE525430T1 (de)
WO (1) WO2006062614A1 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100731279B1 (ko) 2003-05-19 2007-06-21 니폰 쇼쿠바이 컴파니 리미티드 열전도성 재료용 수지 조성물 및 열전도성 재료
JP5134824B2 (ja) * 2007-02-05 2013-01-30 日東電工株式会社 樹脂成形品製造方法
JP5547032B2 (ja) * 2010-10-21 2014-07-09 パナソニック株式会社 熱伝導性樹脂組成物、樹脂シート、プリプレグ、金属積層板およびプリント配線板
WO2012077168A1 (ja) * 2010-12-10 2012-06-14 株式会社アドマテックス 難燃剤及びその製造方法、難燃性樹脂組成物及びその製造方法
JP5892734B2 (ja) * 2011-05-02 2016-03-23 スリーエム イノベイティブ プロパティズ カンパニー 熱伝導性シート
JP6008706B2 (ja) * 2012-11-16 2016-10-19 アイカ工業株式会社 熱伝導性組成物
JP6212950B2 (ja) * 2013-05-22 2017-10-18 デクセリアルズ株式会社 光硬化性アクリル系熱伝導組成物、アクリル系熱伝導性シート及びその製造方法
TWI564328B (zh) * 2015-08-27 2017-01-01 Fdc Lees Chemical Industry Co Composite stabilizer composition and modified polymer material
JP6710828B2 (ja) * 2016-04-06 2020-06-17 北川工業株式会社 熱伝導シート、および、熱伝導シートの製造方法
KR102476584B1 (ko) * 2019-07-10 2022-12-13 주식회사 엘지화학 열전도성 시트용 조성물 및 그로부터 제조된 열전도성 시트
JP7235633B2 (ja) * 2019-09-30 2023-03-08 積水化学工業株式会社 熱伝導性樹脂シート
WO2021065899A1 (ja) * 2019-09-30 2021-04-08 積水化学工業株式会社 熱伝導性樹脂シート
CN111334226B (zh) * 2019-12-31 2021-06-18 武汉长盈鑫科技有限公司 一种低玻璃化温度的导热胶及其制备方法

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5448852A (en) 1977-09-27 1979-04-17 Asahi Chem Ind Co Ltd Thermoplastic polymer composition
JPS573841A (en) 1980-06-11 1982-01-09 Karupu Kogyo Kk Resin composition for heat-shrinkable film
JPS5742750A (en) 1980-08-28 1982-03-10 Nippon Petrochem Co Ltd Production of polyolefin resin composition
JPS57125257A (en) * 1981-01-27 1982-08-04 Sumitomo Chem Co Ltd Stabilized synthetic resin composition
JPS5991139A (ja) * 1982-11-16 1984-05-25 Meidensha Electric Mfg Co Ltd 熱伝導性電気絶縁材料
JPS6116940A (ja) * 1984-07-04 1986-01-24 Hitachi Cable Ltd 耐熱性透明ポリオレフイン樹脂組成物
US4980086A (en) * 1985-10-16 1990-12-25 Toagosei Chemical Industry, Co., Ltd. Curable composition
JP2615829B2 (ja) 1988-05-09 1997-06-04 住友化学工業株式会社 熱酸化安定性ポリオレフィン組成物
JPH03218909A (ja) * 1990-01-24 1991-09-26 Asahi Chem Ind Co Ltd 窒化アルミニウム粉末の製造法
EP0476224A1 (de) 1990-08-21 1992-03-25 Ricon Resins, Inc. Gummi-Klebemischung
JPH05171057A (ja) 1990-11-09 1993-07-09 Ajinomoto Co Inc チタンオリゴマー表面処理フィラー
JP3133375B2 (ja) 1991-06-11 2001-02-05 旭電化工業株式会社 ポリオレフィン系樹脂組成物
JPH05230341A (ja) * 1991-08-02 1993-09-07 Matsushita Electric Works Ltd 封止用エポキシ樹脂成形材料
JPH05125669A (ja) * 1991-11-05 1993-05-21 Dai Ichi Kogyo Seiyaku Co Ltd 耐熱アクリル繊維の処理剤及び処理方法
DE69231635T2 (de) 1991-11-15 2001-08-16 Ici Plc Polymerisierbare zusammensetzungen
JPH05320414A (ja) 1992-05-25 1993-12-03 Dai Ichi Kogyo Seiyaku Co Ltd 無機フィラー表面改質剤
JP3456544B2 (ja) * 1993-11-19 2003-10-14 出光興産株式会社 スチレン系樹脂組成物
DE19581850T1 (de) * 1994-11-21 1997-10-16 Asahi Chemical Ind Polymeres Verbundmaterial
BR9508009A (pt) * 1995-04-27 1997-08-05 Polyplastics Co Composições de resina termoplástica e processo de produção das mesmas
JPH09174563A (ja) * 1995-12-26 1997-07-08 Teijin Seiki Co Ltd 光造形型およびその製造方法
JPH10316953A (ja) 1997-05-16 1998-12-02 Nitto Denko Corp 剥離可能な熱伝導性感圧接着剤とその接着シ―ト類
JP3813301B2 (ja) 1997-06-04 2006-08-23 エフコ株式会社 熱伝導性ゴム組成物および熱伝導性ゴムシート
JP3290127B2 (ja) 1998-01-27 2002-06-10 松下電工株式会社 熱伝導性シリコーンゴム組成物及びこの熱伝導性シリコーンゴム組成物によりなる放熱シート
JP3636884B2 (ja) 1998-04-03 2005-04-06 ミネソタ マイニング アンド マニュファクチャリング カンパニー 熱伝導性シート
JP2992285B1 (ja) * 1998-11-10 1999-12-20 北川工業株式会社 熱伝導材
US5989459A (en) 1999-03-09 1999-11-23 Johnson Matthey, Inc. Compliant and crosslinkable thermal interface materials
JP4624521B2 (ja) 2000-04-24 2011-02-02 昭和電工株式会社 水酸化アルミニウムの表面処理方法
JP4369594B2 (ja) 2000-04-28 2009-11-25 古河電気工業株式会社 熱伝導性成形体
JP2002284884A (ja) 2001-03-26 2002-10-03 Sumitomo Wiring Syst Ltd フィラー、それを含む樹脂組成物および樹脂組成物の製造方法
JP4588285B2 (ja) 2002-01-25 2010-11-24 信越化学工業株式会社 熱伝導性シリコーンゴム組成物
JP2003238760A (ja) 2002-02-19 2003-08-27 C I Kasei Co Ltd ノンハロゲン難燃性放熱シート
JP2004002527A (ja) * 2002-05-31 2004-01-08 Dainippon Ink & Chem Inc 難燃性熱伝導電気絶縁粘着体
JP2004010859A (ja) 2002-06-11 2004-01-15 Dainippon Ink & Chem Inc 熱伝導電気絶縁感圧接着剤用組成物、およびこれを用いた粘着シート
JP4385573B2 (ja) 2002-07-31 2009-12-16 Dic株式会社 熱伝導電気絶縁感圧接着剤用組成物、およびこれを用いた粘着シート

Also Published As

Publication number Publication date
US20080081859A1 (en) 2008-04-03
EP1833903B1 (de) 2011-09-21
WO2006062614A1 (en) 2006-06-15
US20100020496A1 (en) 2010-01-28
JP2006160830A (ja) 2006-06-22
EP1833903A1 (de) 2007-09-19
US7956116B2 (en) 2011-06-07
JP4869584B2 (ja) 2012-02-08

Similar Documents

Publication Publication Date Title
ATE525430T1 (de) Wärmeleitfähiges flächengebilde und herstellungsverfahren dafür
ATE396498T1 (de) Mikro-strukturierter kühler und verwendung dafür
SG142174A1 (en) Method for heat transfer and device therefor
CN106876554A (zh) 一种高散热led集成电路板
ATE538345T1 (de) Elektrische schaltungsanordnung
TW200740986A (en) Thermally conductive grease and methods and devices in which said grease is used
EP1715732A3 (de) Gedruckte Leiterplattenstruktur mit einer Schicht auf einer ihrer Oberflächen zur Wärmeableitung durch Konvektion
TW200726384A (en) Radiator and manufacture method thereof (I)
CN209627785U (zh) 一种高效散热电路板
CN205669799U (zh) 一种led灯散热结构
WO2008000551A3 (de) Kühlkörper
CN105065947A (zh) 一种led隔热灯
CN206806361U (zh) 一种高散热led集成电路板
CN203482488U (zh) 热导性好的线路板
CN202095182U (zh) 一种具有散热结构的电路板
CN203099757U (zh) 一种led路灯电源散热装置
TW200726385A (en) Radiator and manufacture method thereof (II)
TW200745823A (en) Heat dissipation device
CN206293430U (zh) 一种太阳能控制器散热装置
CN202511088U (zh) 一种高导热led灯
CN203395887U (zh) 一种热管式led灯
CN202165930U (zh) 一种改进散热的led路灯
CN204879596U (zh) 一种led隔热灯
CN209234073U (zh) 一种感温方式的ptc电加热器
RU2008133051A (ru) Радиоэлектронный блок

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties