ATE396498T1 - Mikro-strukturierter kühler und verwendung dafür - Google Patents

Mikro-strukturierter kühler und verwendung dafür

Info

Publication number
ATE396498T1
ATE396498T1 AT06776247T AT06776247T ATE396498T1 AT E396498 T1 ATE396498 T1 AT E396498T1 AT 06776247 T AT06776247 T AT 06776247T AT 06776247 T AT06776247 T AT 06776247T AT E396498 T1 ATE396498 T1 AT E396498T1
Authority
AT
Austria
Prior art keywords
ranging
channels
base plate
metal foils
cooler
Prior art date
Application number
AT06776247T
Other languages
English (en)
Inventor
Olaf Kurtz
Ralph Herber
Peter Prechtl
Sven Theisen
Markus Hoehn
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Application granted granted Critical
Publication of ATE396498T1 publication Critical patent/ATE396498T1/de

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
    • F28F3/086—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning having one or more openings therein forming tubular heat-exchange passages
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
AT06776247T 2005-07-13 2006-07-12 Mikro-strukturierter kühler und verwendung dafür ATE396498T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102005033150A DE102005033150A1 (de) 2005-07-13 2005-07-13 Mikrostrukturierter Kühler und dessen Verwendung

Publications (1)

Publication Number Publication Date
ATE396498T1 true ATE396498T1 (de) 2008-06-15

Family

ID=37575524

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06776247T ATE396498T1 (de) 2005-07-13 2006-07-12 Mikro-strukturierter kühler und verwendung dafür

Country Status (9)

Country Link
US (1) US7987899B2 (de)
EP (1) EP1790007B1 (de)
JP (1) JP2009501439A (de)
KR (1) KR20080039413A (de)
CN (1) CN100565856C (de)
AT (1) ATE396498T1 (de)
DE (2) DE102005033150A1 (de)
ES (1) ES2306434T3 (de)
WO (1) WO2007006590A2 (de)

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8464781B2 (en) 2002-11-01 2013-06-18 Cooligy Inc. Cooling systems incorporating heat exchangers and thermoelectric layers
US7836597B2 (en) 2002-11-01 2010-11-23 Cooligy Inc. Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system
US7591302B1 (en) 2003-07-23 2009-09-22 Cooligy Inc. Pump and fan control concepts in a cooling system
US7913719B2 (en) 2006-01-30 2011-03-29 Cooligy Inc. Tape-wrapped multilayer tubing and methods for making the same
TW200813695A (en) 2006-03-30 2008-03-16 Cooligy Inc Integrated liquid to air conduction module
US7715194B2 (en) 2006-04-11 2010-05-11 Cooligy Inc. Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers
TW200934352A (en) 2007-08-07 2009-08-01 Cooligy Inc Internal access mechanism for a server rack
US20090126922A1 (en) * 2007-10-29 2009-05-21 Jan Vetrovec Heat transfer device
US8479806B2 (en) 2007-11-30 2013-07-09 University Of Hawaii Two-phase cross-connected micro-channel heat sink
US9297571B1 (en) 2008-03-10 2016-03-29 Liebert Corporation Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
US20090225514A1 (en) 2008-03-10 2009-09-10 Adrian Correa Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
JP4992808B2 (ja) 2008-04-16 2012-08-08 トヨタ自動車株式会社 熱交換器の製造方法
US8299604B2 (en) 2008-08-05 2012-10-30 Cooligy Inc. Bonded metal and ceramic plates for thermal management of optical and electronic devices
US20100071883A1 (en) * 2008-09-08 2010-03-25 Jan Vetrovec Heat transfer device
SG189779A1 (en) * 2009-10-20 2013-05-31 Agency Science Tech & Res A cooling device, an assembly, and methods for lowering temperature in a chemical reaction
US8218320B2 (en) * 2010-06-29 2012-07-10 General Electric Company Heat sinks with C-shaped manifolds and millichannel cooling
DE102010045905B3 (de) * 2010-09-17 2012-03-29 Karlsruher Institut für Technologie Kreuzstrom-Mikrowärmeübertrager
DE112010006084B4 (de) * 2010-12-24 2015-06-11 Toyota Jidosha Kabushiki Kaisha Kühler
US9245836B2 (en) 2012-06-28 2016-01-26 Soitec Interposers including fluidic microchannels and related structures and methods
US8912643B2 (en) 2012-12-10 2014-12-16 General Electric Company Electronic device cooling with microjet impingement and method of assembly
US20140251585A1 (en) 2013-03-05 2014-09-11 The Boeing Company Micro-lattice Cross-flow Heat Exchangers for Aircraft
JP6115959B2 (ja) * 2013-12-11 2017-04-19 株式会社フィルテック 流体熱交換装置
KR102147615B1 (ko) * 2014-10-30 2020-08-24 도쿄엘렉트론가부시키가이샤 기판 적재대
JP6746593B2 (ja) * 2015-09-18 2020-08-26 株式会社ティラド 積層コア型ヒートシンク
US10371462B2 (en) 2015-09-21 2019-08-06 Lockheed Martin Corporation Integrated multi-chamber heat exchanger
US10527362B2 (en) 2015-09-21 2020-01-07 Lockheed Martin Corporation Integrated multi-chamber heat exchanger
US10352632B2 (en) * 2016-05-26 2019-07-16 Northrop Grumman Systems Corporation Heat transfer utilizing vascular composites and field induced forces
US10139168B2 (en) 2016-09-26 2018-11-27 International Business Machines Corporation Cold plate with radial expanding channels for two-phase cooling
EP3700697B1 (de) 2017-10-26 2022-08-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur herstellung von gussteilen mit mikrokanälen
CN107734840B (zh) * 2017-11-29 2023-08-18 中国电子科技集团公司第二十六研究所 基于印制电路板三维微通道阵列液冷冷却结构
JP7047577B2 (ja) * 2018-04-27 2022-04-05 株式会社デンソー 熱交換器
CN110543069A (zh) * 2018-05-28 2019-12-06 中强光电股份有限公司 液冷式散热器
US10553516B1 (en) 2018-08-13 2020-02-04 International Business Machines Corporation Semiconductor microcooler
US10553522B1 (en) 2018-08-13 2020-02-04 International Business Machines Corporation Semiconductor microcooler
US10490480B1 (en) * 2018-08-21 2019-11-26 International Business Machines Corporation Copper microcooler structure and fabrication
US11545410B2 (en) * 2018-12-17 2023-01-03 Intel Corporation Enhanced systems and methods for improved heat transfer from semiconductor packages
CN110300509A (zh) * 2019-06-29 2019-10-01 联想(北京)有限公司 一种散热装置
CN111081655B (zh) * 2019-12-19 2021-10-22 青岛歌尔智能传感器有限公司 电子封装结构及其制作方法
CN111632565B (zh) * 2020-05-24 2021-09-03 西安交通大学 一种用于超临界水热合成技术制备纳米粉体的微通道快速冷却装置
CN112435976B (zh) * 2020-11-06 2024-04-16 西安交通大学 基于仿生分形结构的超低流阻微通道散热器及其制造方法
US20240234670A1 (en) * 2021-05-27 2024-07-11 Amogreentech Co., Ltd. Ceramic substrate with heat sink and manufacturing method thereof
CN114353562B (zh) * 2021-11-30 2024-06-21 中国船舶重工集团公司第七一九研究所 印刷电路板换热器的换热通道结构及印刷电路板换热器
KR102585892B1 (ko) * 2022-04-14 2023-10-06 창원대학교 산학협력단 평면형 열교환 매니폴드 구조를 갖는 반도체 냉각장치
EP4390291A1 (de) * 2022-12-23 2024-06-26 TechN GmbH Vorrichtung, system und verfahren zum kühlen eines prozessors

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5598632A (en) * 1994-10-06 1997-02-04 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Method for producing micro heat panels
DE19708472C2 (de) 1997-02-20 1999-02-18 Atotech Deutschland Gmbh Herstellverfahren für chemische Mikroreaktoren
DE19710716C2 (de) 1997-03-14 2001-05-10 Fraunhofer Ges Forschung Vorrichtung zum Kühlen von elektronischen Bauelementen
DE19710783C2 (de) * 1997-03-17 2003-08-21 Curamik Electronics Gmbh Kühler zur Verwendung als Wärmesenke für elektrische Bauelemente oder Schaltkreise
US6386278B1 (en) 1998-08-04 2002-05-14 Jurgen Schulz-Harder Cooler
DE19853750A1 (de) * 1998-08-04 2000-02-17 Schulz Harder Juergen Kühler zur Verwendung als Wärmesenke für elektrische oder elektronische Komponenten
US6152215A (en) * 1998-12-23 2000-11-28 Sundstrand Corporation High intensity cooler
JP3681581B2 (ja) * 1999-07-30 2005-08-10 ファナック株式会社 冷却装置とそれを備えた面発光装置
JP2003302176A (ja) * 2001-08-07 2003-10-24 Denso Corp 沸騰冷却器
EP1506054B1 (de) * 2002-03-26 2012-07-25 Peter Prechtl Mikroreaktor und mikrowärmeübertrager
US8087452B2 (en) * 2002-04-11 2012-01-03 Lytron, Inc. Contact cooling device
DE10246990A1 (de) 2002-10-02 2004-04-22 Atotech Deutschland Gmbh Mikrostrukturkühler und dessen Verwendung
US7115987B2 (en) * 2003-12-31 2006-10-03 Intel Corporation Integrated stacked microchannel heat exchanger and heat spreader
JP2007127398A (ja) * 2005-10-05 2007-05-24 Seiko Epson Corp 熱交換器、熱交換器の製造方法、液冷システム、光源装置、プロジェクタ、電子デバイスユニット、電子機器
US7537047B2 (en) * 2006-03-23 2009-05-26 Foxconn Technology Co., Ltd. Liquid-cooling heat sink

Also Published As

Publication number Publication date
EP1790007B1 (de) 2008-05-21
WO2007006590A2 (en) 2007-01-18
KR20080039413A (ko) 2008-05-07
CN100565856C (zh) 2009-12-02
US7987899B2 (en) 2011-08-02
ES2306434T3 (es) 2008-11-01
WO2007006590A3 (en) 2007-03-29
CN101218672A (zh) 2008-07-09
DE102005033150A1 (de) 2007-01-25
JP2009501439A (ja) 2009-01-15
US20080196875A1 (en) 2008-08-21
DE602006001286D1 (de) 2008-07-03
EP1790007A2 (de) 2007-05-30

Similar Documents

Publication Publication Date Title
ATE396498T1 (de) Mikro-strukturierter kühler und verwendung dafür
DE50308958D1 (de) Mikrostrukturkühler und dessen Verwendung
ATE539308T1 (de) Vorrichtung zur kühlung elektrischer elemente
TW200605767A (en) Lightweight heat sink
GB2457842A (en) Method of making a heat exchanger
SG143238A1 (en) Structure and process for wl-csp with metal cover
ATE525430T1 (de) Wärmeleitfähiges flächengebilde und herstellungsverfahren dafür
EP2119549A3 (de) Harzformgebungsvorrichtung
WO2006133211A3 (en) Heat transfer surface for electronic cooling
TW200632629A (en) Systems for improved heat exchanger
EA201100345A1 (ru) Компонент футеровки мельницы и способ изготовления компонента
EP1659838A3 (de) Substrat mit darauf montierten Bauteilen, thermisch leitendes Element für dieses Substrat, und Flüssigkeitsausstosskopf
EP2497906A3 (de) Verfahren zur Herstellung einer mit Heißgas beaufschlagten Komponente und entsprechende Komponente
WO2009041356A1 (ja) 二次冷却装置、鋳造装置
WO2010043405A3 (de) Halte- und kühlungsvorrichtung und verfahren zur herstellung einer halte- und kühlungsvorrichtung
ATE356433T1 (de) Kühlvorrichtung für elektronische bauteile
TW200706301A (en) Method of manufacturing a hollow blade that includes a recessed tip cap and method of repairing such a blade
ATE517434T1 (de) Elektronische vorrichtung mit einer bodenplatte
TW200615135A (en) Carrier film for ceramic green sheet, ceramic green sheet processing method using it and manufacturing method of electronic part
TW200704742A (en) Pressure-sensitive adhesive sheet
JP2006510493A5 (de)
FR2930466B1 (fr) Cale pour le maintien des passages d'echangeurs a plaques et ailettes brases
JP2006287227A5 (de)
ATE447240T1 (de) Vorrichtung zur kühlung von elektronischen bauteilen
EP1768178A3 (de) Optimiert geformte Verteilerplatte für eine elektronische Kühleinrichtung

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties