ATE491827T1 - Vorrichtung und verfahren zur herstellung eines iii-v-nitridfilms - Google Patents

Vorrichtung und verfahren zur herstellung eines iii-v-nitridfilms

Info

Publication number
ATE491827T1
ATE491827T1 AT01119823T AT01119823T ATE491827T1 AT E491827 T1 ATE491827 T1 AT E491827T1 AT 01119823 T AT01119823 T AT 01119823T AT 01119823 T AT01119823 T AT 01119823T AT E491827 T1 ATE491827 T1 AT E491827T1
Authority
AT
Austria
Prior art keywords
gas
iii
aluminum
nitride film
producing
Prior art date
Application number
AT01119823T
Other languages
English (en)
Inventor
Tomohiko Shibata
Keiichiro Asai
Mitsuhiro Tanaka
Original Assignee
Ngk Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ngk Insulators Ltd filed Critical Ngk Insulators Ltd
Application granted granted Critical
Publication of ATE491827T1 publication Critical patent/ATE491827T1/de

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/40AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403AIII-nitrides
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/40AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403AIII-nitrides
    • C30B29/406Gallium nitride
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T117/00Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
    • Y10T117/10Apparatus
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T117/00Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
    • Y10T117/10Apparatus
    • Y10T117/1004Apparatus with means for measuring, testing, or sensing
    • Y10T117/1008Apparatus with means for measuring, testing, or sensing with responsive control means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Chemical Vapour Deposition (AREA)
AT01119823T 2000-09-01 2001-08-16 Vorrichtung und verfahren zur herstellung eines iii-v-nitridfilms ATE491827T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000264934 2000-09-01
JP2000293596 2000-09-27
JP2001207785A JP4374156B2 (ja) 2000-09-01 2001-07-09 Iii−v族窒化物膜の製造装置及び製造方法

Publications (1)

Publication Number Publication Date
ATE491827T1 true ATE491827T1 (de) 2011-01-15

Family

ID=27344502

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01119823T ATE491827T1 (de) 2000-09-01 2001-08-16 Vorrichtung und verfahren zur herstellung eines iii-v-nitridfilms

Country Status (7)

Country Link
US (2) US7033439B2 (de)
EP (1) EP1184488B1 (de)
JP (1) JP4374156B2 (de)
KR (1) KR100449222B1 (de)
AT (1) ATE491827T1 (de)
DE (1) DE60143639D1 (de)
TW (1) TW554091B (de)

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100304664B1 (ko) * 1999-02-05 2001-09-26 윤종용 GaN막 제조 방법
US6632725B2 (en) * 2001-06-29 2003-10-14 Centre National De La Recherche Scientifique (Cnrs) Process for producing an epitaxial layer of gallium nitride by the HVPE method
JP3803788B2 (ja) * 2002-04-09 2006-08-02 農工大ティー・エル・オー株式会社 Al系III−V族化合物半導体の気相成長方法、Al系III−V族化合物半導体の製造方法ならびに製造装置
KR100467267B1 (ko) * 2002-05-24 2005-01-24 엘지전자 주식회사 질화갈륨 기판 제조 장치 및 방법
JP2006044982A (ja) * 2004-08-04 2006-02-16 Sumitomo Electric Ind Ltd 窒化物半導体単結晶基板とその合成方法
JP2006089811A (ja) * 2004-09-24 2006-04-06 Hokkaido Univ 気相結晶作成装置
JP2006173560A (ja) * 2004-11-16 2006-06-29 Sumitomo Electric Ind Ltd ウエハガイド、有機金属気相成長装置および窒化物系半導体を堆積する方法
JP2006290662A (ja) * 2005-04-08 2006-10-26 Tokyo Univ Of Agriculture & Technology アルミニウム系iii族窒化物結晶の製造方法並びに製造装置
JP2007039275A (ja) * 2005-08-03 2007-02-15 Furukawa Co Ltd 気相成長装置、iii族窒化物半導体基板の製造方法、iii族窒化物半導体基板
JP4594820B2 (ja) * 2005-08-03 2010-12-08 古河機械金属株式会社 ハイドライド気相成長装置、iii族窒化物半導体基板の製造方法
JP2007039271A (ja) * 2005-08-03 2007-02-15 Furukawa Co Ltd ハイドライド気相成長装置、iii族窒化物半導体基板の製造方法、iii族窒化物半導体基板
JP2007042843A (ja) * 2005-08-03 2007-02-15 Furukawa Co Ltd Al含有窒化物のハイドライド気相成長装置およびAl含有窒化物半導体基板の製造方法ならびにAl含有窒化物半導体基板
JP4749792B2 (ja) * 2005-08-03 2011-08-17 国立大学法人東京農工大学 アルミニウム系iii族窒化物結晶の製造方法および結晶積層基板
JP2007039274A (ja) * 2005-08-03 2007-02-15 Furukawa Co Ltd 気相成長装置、iii族窒化物半導体基板の製造方法、iii族窒化物半導体基板
JP4817042B2 (ja) * 2005-08-26 2011-11-16 国立大学法人三重大学 Alを含むIII族窒化物結晶の作製方法、およびAlを含むIII族窒化物結晶
US7942970B2 (en) * 2005-12-20 2011-05-17 Momentive Performance Materials Inc. Apparatus for making crystalline composition
JP2007220927A (ja) * 2006-02-17 2007-08-30 Tokyo Univ Of Agriculture & Technology AlGaN三元混晶結晶の製造方法及び気相成長装置
JP2007294878A (ja) * 2006-03-31 2007-11-08 Fujifilm Corp 半導体層とその成膜方法、半導体発光素子、及び半導体発光装置
US8764903B2 (en) 2009-05-05 2014-07-01 Sixpoint Materials, Inc. Growth reactor for gallium-nitride crystals using ammonia and hydrogen chloride
US8357243B2 (en) 2008-06-12 2013-01-22 Sixpoint Materials, Inc. Method for testing group III-nitride wafers and group III-nitride wafers with test data
US20080083970A1 (en) * 2006-05-08 2008-04-10 Kamber Derrick S Method and materials for growing III-nitride semiconductor compounds containing aluminum
US7494546B1 (en) * 2006-07-14 2009-02-24 Blue Wave Semicodnuctors, Inc. Method of growing insulating, semiconducting, and conducting group III-nitride thin films and coatings, and use as radiation hard coatings for electronics and optoelectronic devices
JP5071703B2 (ja) * 2006-08-08 2012-11-14 独立行政法人物質・材料研究機構 半導体製造装置
KR100826305B1 (ko) * 2006-11-17 2008-04-30 한국과학기술연구원 침상형 구조를 갖는 질화알루미늄 단결정 나노막대의제조방법
JP4940928B2 (ja) * 2006-12-15 2012-05-30 日立電線株式会社 窒化物半導体の製造方法
CN101255064B (zh) * 2007-03-01 2012-08-22 中国科学院金属研究所 一种催化剂“种子”法制备准一维掺杂AlN阵列的方法
US20080276860A1 (en) * 2007-05-10 2008-11-13 Burrows Brian H Cross flow apparatus and method for hydride vapor phase deposition
US20080289575A1 (en) * 2007-05-24 2008-11-27 Burrows Brian H Methods and apparatus for depositing a group iii-v film using a hydride vapor phase epitaxy process
JP5241855B2 (ja) * 2008-02-25 2013-07-17 シックスポイント マテリアルズ, インコーポレイテッド Iii族窒化物ウエハを製造する方法およびiii族窒化物ウエハ
JP5631746B2 (ja) * 2008-06-04 2014-11-26 シックスポイント マテリアルズ, インコーポレイテッド Iii族窒化物結晶を成長させるための高圧ベッセル、ならびに高圧ベッセルおよびiii族窒化物結晶を用いてiii族窒化物結晶を成長させる方法
WO2009149299A1 (en) 2008-06-04 2009-12-10 Sixpoint Materials Methods for producing improved crystallinty group iii-nitride crystals from initial group iii-nitride seed by ammonothermal growth
WO2010045567A1 (en) * 2008-10-16 2010-04-22 Sixpoint Materials, Inc. Reactor design for growing group iii nitride crystals and method of growing group iii nitride crystals
IT1392068B1 (it) * 2008-11-24 2012-02-09 Lpe Spa Camera di reazione di un reattore epitassiale
WO2010060034A1 (en) * 2008-11-24 2010-05-27 Sixpoint Materials, Inc. METHODS FOR PRODUCING GaN NUTRIENT FOR AMMONOTHERMAL GROWTH
JP2009078971A (ja) * 2009-01-07 2009-04-16 Sumitomo Electric Ind Ltd 窒化物半導体単結晶基板とその合成方法
JP2009078972A (ja) * 2009-01-07 2009-04-16 Sumitomo Electric Ind Ltd 窒化物半導体単結晶基板とその合成方法
US8491720B2 (en) * 2009-04-10 2013-07-23 Applied Materials, Inc. HVPE precursor source hardware
TW201039381A (en) * 2009-04-29 2010-11-01 Applied Materials Inc Method of forming in-situ pre-GaN deposition layer in HVPE
JP5809152B2 (ja) 2009-10-20 2015-11-10 エーエスエム インターナショナル エヌ.ヴェー.Asm International N.V. 誘電体膜をパッシベーションする方法
FR2968678B1 (fr) * 2010-12-08 2015-11-20 Soitec Silicon On Insulator Procédés pour former des matériaux a base de nitrure du groupe iii et structures formées par ces procédés
JP2013058741A (ja) * 2011-08-17 2013-03-28 Hitachi Cable Ltd 金属塩化物ガス発生装置、ハイドライド気相成長装置、及び窒化物半導体テンプレート
WO2014031119A1 (en) * 2012-08-23 2014-02-27 National University Corporation Tokyo University Of Agriculture And Technology Highly transparent aluminum nitride single crystalline layers and devices made therefrom
EP2951869A1 (de) 2013-01-29 2015-12-09 Hexatech Inc. Optoelektronische vorrichtungen mit einem einkristallinen aluminiumnitridsubstrat
KR102225693B1 (ko) 2013-03-14 2021-03-12 헥사테크, 인크. 단결정 알루미늄 질화물 기판을 포함하는 전력 반도체 장치들
US11015244B2 (en) 2013-12-30 2021-05-25 Advanced Material Solutions, Llc Radiation shielding for a CVD reactor
KR101563817B1 (ko) 2014-09-23 2015-11-09 한양대학교 산학협력단 막 제조 장치, 및 이를 이용한 막의 제조 방법
MD4510C1 (ro) * 2016-06-23 2018-03-31 Государственный Университет Молд0 Procedeu de creştere a structurii n+-p-p+ InP pentru celule solare
US12046471B1 (en) 2018-06-06 2024-07-23 United States Of America As Represented By The Secretary Of The Air Force Optimized thick heteroepitaxial growth of semiconductors with in-situ substrate pretreatment
CN108560055A (zh) * 2018-06-29 2018-09-21 汉能新材料科技有限公司 水平舟生产法的反应装置和半导体制备方法
KR102149338B1 (ko) * 2019-08-02 2020-08-28 안형수 육각형 실리콘 결정 성장 장치 및 방법
CN110817815B (zh) * 2019-12-13 2022-07-19 合肥中航纳米技术发展有限公司 一种粒径分布可控高纯氮化铝的制备方法
KR102670074B1 (ko) * 2021-09-07 2024-05-28 주식회사 엘앤비에스 육각형 실리콘 결정 성장 장치 및 방법

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5849290B2 (ja) * 1980-08-18 1983-11-02 富士通株式会社 石英反応管
US4644780A (en) * 1983-10-19 1987-02-24 Westinghouse Electric Corp. Self-supporting pipe rupture and whip restraint
US4830982A (en) * 1986-12-16 1989-05-16 American Telephone And Telegraph Company Method of forming III-V semi-insulating films using organo-metallic titanium dopant precursors
JPS63186422A (ja) * 1987-01-28 1988-08-02 Tadahiro Omi ウエハサセプタ装置
JPH0234592A (ja) * 1988-07-22 1990-02-05 Furukawa Electric Co Ltd:The 化合物半導体単結晶の成長方法
US5334277A (en) * 1990-10-25 1994-08-02 Nichia Kagaky Kogyo K.K. Method of vapor-growing semiconductor crystal and apparatus for vapor-growing the same
JPH07153706A (ja) 1993-05-27 1995-06-16 Applied Materials Inc サセプタ装置
US5599732A (en) * 1995-08-21 1997-02-04 Northwestern University Method for growing III-V semiconductor films using a coated reaction chamber
JP3734860B2 (ja) 1995-08-25 2006-01-11 日本碍子株式会社 酸化物単結晶の製造方法および装置
US5614249A (en) * 1995-08-28 1997-03-25 Lsi Logic Corporation Leak detection system for a gas manifold of a chemical vapor deposition apparatus
KR0161450B1 (ko) * 1995-11-08 1999-02-01 김광호 검출능력이 향상된 누설가스 검출방법 및 그의 장치
US5650361A (en) * 1995-11-21 1997-07-22 The Aerospace Corporation Low temperature photolytic deposition of aluminum nitride thin films
JPH1067584A (ja) 1996-08-23 1998-03-10 Shin Etsu Chem Co Ltd 反応容器
US6533874B1 (en) * 1996-12-03 2003-03-18 Advanced Technology Materials, Inc. GaN-based devices using thick (Ga, Al, In)N base layers
JP3721674B2 (ja) * 1996-12-05 2005-11-30 ソニー株式会社 窒化物系iii−v族化合物半導体基板の製造方法
JP3931394B2 (ja) 1997-09-05 2007-06-13 ソニー株式会社 プラズマ処理装置およびプラズマ処理方法
US6197683B1 (en) * 1997-09-29 2001-03-06 Samsung Electronics Co., Ltd. Method of forming metal nitride film by chemical vapor deposition and method of forming metal contact of semiconductor device using the same
US6218269B1 (en) * 1997-11-18 2001-04-17 Technology And Devices International, Inc. Process for producing III-V nitride pn junctions and p-i-n junctions
US6086673A (en) * 1998-04-02 2000-07-11 Massachusetts Institute Of Technology Process for producing high-quality III-V nitride substrates
JP3363790B2 (ja) * 1998-07-03 2003-01-08 松下電器産業株式会社 ドライエッチング装置
US6271104B1 (en) * 1998-08-10 2001-08-07 Mp Technologies Fabrication of defect free III-nitride materials
US6117213A (en) * 1999-05-07 2000-09-12 Cbl Technologies, Inc. Particle trap apparatus and methods
EP1127957A1 (de) 2000-02-24 2001-08-29 Asm Japan K.K. Vorrichtung mit Reinigungsfunktion zur Herstellung von Filmen
US6596079B1 (en) * 2000-03-13 2003-07-22 Advanced Technology Materials, Inc. III-V nitride substrate boule and method of making and using the same
JP2001345268A (ja) 2000-05-31 2001-12-14 Matsushita Electric Ind Co Ltd 半導体製造装置及び半導体の製造方法

Also Published As

Publication number Publication date
US20020028291A1 (en) 2002-03-07
JP2002173393A (ja) 2002-06-21
DE60143639D1 (de) 2011-01-27
KR20020018557A (ko) 2002-03-08
TW554091B (en) 2003-09-21
US20060150895A1 (en) 2006-07-13
US7033439B2 (en) 2006-04-25
EP1184488A3 (de) 2006-02-08
JP4374156B2 (ja) 2009-12-02
KR100449222B1 (ko) 2004-09-18
EP1184488B1 (de) 2010-12-15
EP1184488A2 (de) 2002-03-06
US7438761B2 (en) 2008-10-21

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