ATE491827T1 - Vorrichtung und verfahren zur herstellung eines iii-v-nitridfilms - Google Patents
Vorrichtung und verfahren zur herstellung eines iii-v-nitridfilmsInfo
- Publication number
- ATE491827T1 ATE491827T1 AT01119823T AT01119823T ATE491827T1 AT E491827 T1 ATE491827 T1 AT E491827T1 AT 01119823 T AT01119823 T AT 01119823T AT 01119823 T AT01119823 T AT 01119823T AT E491827 T1 ATE491827 T1 AT E491827T1
- Authority
- AT
- Austria
- Prior art keywords
- gas
- iii
- aluminum
- nitride film
- producing
- Prior art date
Links
- 150000004767 nitrides Chemical class 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000007789 gas Substances 0.000 abstract 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 abstract 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 abstract 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 2
- 229910052782 aluminium Inorganic materials 0.000 abstract 2
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 abstract 2
- 229910000041 hydrogen chloride Inorganic materials 0.000 abstract 2
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 abstract 2
- 239000007769 metal material Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract 1
- 239000012159 carrier gas Substances 0.000 abstract 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 abstract 1
- 238000005260 corrosion Methods 0.000 abstract 1
- 230000007797 corrosion Effects 0.000 abstract 1
- 238000002248 hydride vapour-phase epitaxy Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
- C30B29/406—Gallium nitride
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
- Y10T117/1004—Apparatus with means for measuring, testing, or sensing
- Y10T117/1008—Apparatus with means for measuring, testing, or sensing with responsive control means
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000264934 | 2000-09-01 | ||
JP2000293596 | 2000-09-27 | ||
JP2001207785A JP4374156B2 (ja) | 2000-09-01 | 2001-07-09 | Iii−v族窒化物膜の製造装置及び製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE491827T1 true ATE491827T1 (de) | 2011-01-15 |
Family
ID=27344502
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT01119823T ATE491827T1 (de) | 2000-09-01 | 2001-08-16 | Vorrichtung und verfahren zur herstellung eines iii-v-nitridfilms |
Country Status (7)
Country | Link |
---|---|
US (2) | US7033439B2 (de) |
EP (1) | EP1184488B1 (de) |
JP (1) | JP4374156B2 (de) |
KR (1) | KR100449222B1 (de) |
AT (1) | ATE491827T1 (de) |
DE (1) | DE60143639D1 (de) |
TW (1) | TW554091B (de) |
Families Citing this family (52)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100304664B1 (ko) * | 1999-02-05 | 2001-09-26 | 윤종용 | GaN막 제조 방법 |
US6632725B2 (en) * | 2001-06-29 | 2003-10-14 | Centre National De La Recherche Scientifique (Cnrs) | Process for producing an epitaxial layer of gallium nitride by the HVPE method |
JP3803788B2 (ja) * | 2002-04-09 | 2006-08-02 | 農工大ティー・エル・オー株式会社 | Al系III−V族化合物半導体の気相成長方法、Al系III−V族化合物半導体の製造方法ならびに製造装置 |
KR100467267B1 (ko) * | 2002-05-24 | 2005-01-24 | 엘지전자 주식회사 | 질화갈륨 기판 제조 장치 및 방법 |
JP2006044982A (ja) * | 2004-08-04 | 2006-02-16 | Sumitomo Electric Ind Ltd | 窒化物半導体単結晶基板とその合成方法 |
JP2006089811A (ja) * | 2004-09-24 | 2006-04-06 | Hokkaido Univ | 気相結晶作成装置 |
JP2006173560A (ja) * | 2004-11-16 | 2006-06-29 | Sumitomo Electric Ind Ltd | ウエハガイド、有機金属気相成長装置および窒化物系半導体を堆積する方法 |
JP2006290662A (ja) * | 2005-04-08 | 2006-10-26 | Tokyo Univ Of Agriculture & Technology | アルミニウム系iii族窒化物結晶の製造方法並びに製造装置 |
JP2007039275A (ja) * | 2005-08-03 | 2007-02-15 | Furukawa Co Ltd | 気相成長装置、iii族窒化物半導体基板の製造方法、iii族窒化物半導体基板 |
JP4594820B2 (ja) * | 2005-08-03 | 2010-12-08 | 古河機械金属株式会社 | ハイドライド気相成長装置、iii族窒化物半導体基板の製造方法 |
JP2007039271A (ja) * | 2005-08-03 | 2007-02-15 | Furukawa Co Ltd | ハイドライド気相成長装置、iii族窒化物半導体基板の製造方法、iii族窒化物半導体基板 |
JP2007042843A (ja) * | 2005-08-03 | 2007-02-15 | Furukawa Co Ltd | Al含有窒化物のハイドライド気相成長装置およびAl含有窒化物半導体基板の製造方法ならびにAl含有窒化物半導体基板 |
JP4749792B2 (ja) * | 2005-08-03 | 2011-08-17 | 国立大学法人東京農工大学 | アルミニウム系iii族窒化物結晶の製造方法および結晶積層基板 |
JP2007039274A (ja) * | 2005-08-03 | 2007-02-15 | Furukawa Co Ltd | 気相成長装置、iii族窒化物半導体基板の製造方法、iii族窒化物半導体基板 |
JP4817042B2 (ja) * | 2005-08-26 | 2011-11-16 | 国立大学法人三重大学 | Alを含むIII族窒化物結晶の作製方法、およびAlを含むIII族窒化物結晶 |
US7942970B2 (en) * | 2005-12-20 | 2011-05-17 | Momentive Performance Materials Inc. | Apparatus for making crystalline composition |
JP2007220927A (ja) * | 2006-02-17 | 2007-08-30 | Tokyo Univ Of Agriculture & Technology | AlGaN三元混晶結晶の製造方法及び気相成長装置 |
JP2007294878A (ja) * | 2006-03-31 | 2007-11-08 | Fujifilm Corp | 半導体層とその成膜方法、半導体発光素子、及び半導体発光装置 |
US8764903B2 (en) | 2009-05-05 | 2014-07-01 | Sixpoint Materials, Inc. | Growth reactor for gallium-nitride crystals using ammonia and hydrogen chloride |
US8357243B2 (en) | 2008-06-12 | 2013-01-22 | Sixpoint Materials, Inc. | Method for testing group III-nitride wafers and group III-nitride wafers with test data |
US20080083970A1 (en) * | 2006-05-08 | 2008-04-10 | Kamber Derrick S | Method and materials for growing III-nitride semiconductor compounds containing aluminum |
US7494546B1 (en) * | 2006-07-14 | 2009-02-24 | Blue Wave Semicodnuctors, Inc. | Method of growing insulating, semiconducting, and conducting group III-nitride thin films and coatings, and use as radiation hard coatings for electronics and optoelectronic devices |
JP5071703B2 (ja) * | 2006-08-08 | 2012-11-14 | 独立行政法人物質・材料研究機構 | 半導体製造装置 |
KR100826305B1 (ko) * | 2006-11-17 | 2008-04-30 | 한국과학기술연구원 | 침상형 구조를 갖는 질화알루미늄 단결정 나노막대의제조방법 |
JP4940928B2 (ja) * | 2006-12-15 | 2012-05-30 | 日立電線株式会社 | 窒化物半導体の製造方法 |
CN101255064B (zh) * | 2007-03-01 | 2012-08-22 | 中国科学院金属研究所 | 一种催化剂“种子”法制备准一维掺杂AlN阵列的方法 |
US20080276860A1 (en) * | 2007-05-10 | 2008-11-13 | Burrows Brian H | Cross flow apparatus and method for hydride vapor phase deposition |
US20080289575A1 (en) * | 2007-05-24 | 2008-11-27 | Burrows Brian H | Methods and apparatus for depositing a group iii-v film using a hydride vapor phase epitaxy process |
JP5241855B2 (ja) * | 2008-02-25 | 2013-07-17 | シックスポイント マテリアルズ, インコーポレイテッド | Iii族窒化物ウエハを製造する方法およびiii族窒化物ウエハ |
JP5631746B2 (ja) * | 2008-06-04 | 2014-11-26 | シックスポイント マテリアルズ, インコーポレイテッド | Iii族窒化物結晶を成長させるための高圧ベッセル、ならびに高圧ベッセルおよびiii族窒化物結晶を用いてiii族窒化物結晶を成長させる方法 |
WO2009149299A1 (en) | 2008-06-04 | 2009-12-10 | Sixpoint Materials | Methods for producing improved crystallinty group iii-nitride crystals from initial group iii-nitride seed by ammonothermal growth |
WO2010045567A1 (en) * | 2008-10-16 | 2010-04-22 | Sixpoint Materials, Inc. | Reactor design for growing group iii nitride crystals and method of growing group iii nitride crystals |
IT1392068B1 (it) * | 2008-11-24 | 2012-02-09 | Lpe Spa | Camera di reazione di un reattore epitassiale |
WO2010060034A1 (en) * | 2008-11-24 | 2010-05-27 | Sixpoint Materials, Inc. | METHODS FOR PRODUCING GaN NUTRIENT FOR AMMONOTHERMAL GROWTH |
JP2009078971A (ja) * | 2009-01-07 | 2009-04-16 | Sumitomo Electric Ind Ltd | 窒化物半導体単結晶基板とその合成方法 |
JP2009078972A (ja) * | 2009-01-07 | 2009-04-16 | Sumitomo Electric Ind Ltd | 窒化物半導体単結晶基板とその合成方法 |
US8491720B2 (en) * | 2009-04-10 | 2013-07-23 | Applied Materials, Inc. | HVPE precursor source hardware |
TW201039381A (en) * | 2009-04-29 | 2010-11-01 | Applied Materials Inc | Method of forming in-situ pre-GaN deposition layer in HVPE |
JP5809152B2 (ja) | 2009-10-20 | 2015-11-10 | エーエスエム インターナショナル エヌ.ヴェー.Asm International N.V. | 誘電体膜をパッシベーションする方法 |
FR2968678B1 (fr) * | 2010-12-08 | 2015-11-20 | Soitec Silicon On Insulator | Procédés pour former des matériaux a base de nitrure du groupe iii et structures formées par ces procédés |
JP2013058741A (ja) * | 2011-08-17 | 2013-03-28 | Hitachi Cable Ltd | 金属塩化物ガス発生装置、ハイドライド気相成長装置、及び窒化物半導体テンプレート |
WO2014031119A1 (en) * | 2012-08-23 | 2014-02-27 | National University Corporation Tokyo University Of Agriculture And Technology | Highly transparent aluminum nitride single crystalline layers and devices made therefrom |
EP2951869A1 (de) | 2013-01-29 | 2015-12-09 | Hexatech Inc. | Optoelektronische vorrichtungen mit einem einkristallinen aluminiumnitridsubstrat |
KR102225693B1 (ko) | 2013-03-14 | 2021-03-12 | 헥사테크, 인크. | 단결정 알루미늄 질화물 기판을 포함하는 전력 반도체 장치들 |
US11015244B2 (en) | 2013-12-30 | 2021-05-25 | Advanced Material Solutions, Llc | Radiation shielding for a CVD reactor |
KR101563817B1 (ko) | 2014-09-23 | 2015-11-09 | 한양대학교 산학협력단 | 막 제조 장치, 및 이를 이용한 막의 제조 방법 |
MD4510C1 (ro) * | 2016-06-23 | 2018-03-31 | Государственный Университет Молд0 | Procedeu de creştere a structurii n+-p-p+ InP pentru celule solare |
US12046471B1 (en) | 2018-06-06 | 2024-07-23 | United States Of America As Represented By The Secretary Of The Air Force | Optimized thick heteroepitaxial growth of semiconductors with in-situ substrate pretreatment |
CN108560055A (zh) * | 2018-06-29 | 2018-09-21 | 汉能新材料科技有限公司 | 水平舟生产法的反应装置和半导体制备方法 |
KR102149338B1 (ko) * | 2019-08-02 | 2020-08-28 | 안형수 | 육각형 실리콘 결정 성장 장치 및 방법 |
CN110817815B (zh) * | 2019-12-13 | 2022-07-19 | 合肥中航纳米技术发展有限公司 | 一种粒径分布可控高纯氮化铝的制备方法 |
KR102670074B1 (ko) * | 2021-09-07 | 2024-05-28 | 주식회사 엘앤비에스 | 육각형 실리콘 결정 성장 장치 및 방법 |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5849290B2 (ja) * | 1980-08-18 | 1983-11-02 | 富士通株式会社 | 石英反応管 |
US4644780A (en) * | 1983-10-19 | 1987-02-24 | Westinghouse Electric Corp. | Self-supporting pipe rupture and whip restraint |
US4830982A (en) * | 1986-12-16 | 1989-05-16 | American Telephone And Telegraph Company | Method of forming III-V semi-insulating films using organo-metallic titanium dopant precursors |
JPS63186422A (ja) * | 1987-01-28 | 1988-08-02 | Tadahiro Omi | ウエハサセプタ装置 |
JPH0234592A (ja) * | 1988-07-22 | 1990-02-05 | Furukawa Electric Co Ltd:The | 化合物半導体単結晶の成長方法 |
US5334277A (en) * | 1990-10-25 | 1994-08-02 | Nichia Kagaky Kogyo K.K. | Method of vapor-growing semiconductor crystal and apparatus for vapor-growing the same |
JPH07153706A (ja) | 1993-05-27 | 1995-06-16 | Applied Materials Inc | サセプタ装置 |
US5599732A (en) * | 1995-08-21 | 1997-02-04 | Northwestern University | Method for growing III-V semiconductor films using a coated reaction chamber |
JP3734860B2 (ja) | 1995-08-25 | 2006-01-11 | 日本碍子株式会社 | 酸化物単結晶の製造方法および装置 |
US5614249A (en) * | 1995-08-28 | 1997-03-25 | Lsi Logic Corporation | Leak detection system for a gas manifold of a chemical vapor deposition apparatus |
KR0161450B1 (ko) * | 1995-11-08 | 1999-02-01 | 김광호 | 검출능력이 향상된 누설가스 검출방법 및 그의 장치 |
US5650361A (en) * | 1995-11-21 | 1997-07-22 | The Aerospace Corporation | Low temperature photolytic deposition of aluminum nitride thin films |
JPH1067584A (ja) | 1996-08-23 | 1998-03-10 | Shin Etsu Chem Co Ltd | 反応容器 |
US6533874B1 (en) * | 1996-12-03 | 2003-03-18 | Advanced Technology Materials, Inc. | GaN-based devices using thick (Ga, Al, In)N base layers |
JP3721674B2 (ja) * | 1996-12-05 | 2005-11-30 | ソニー株式会社 | 窒化物系iii−v族化合物半導体基板の製造方法 |
JP3931394B2 (ja) | 1997-09-05 | 2007-06-13 | ソニー株式会社 | プラズマ処理装置およびプラズマ処理方法 |
US6197683B1 (en) * | 1997-09-29 | 2001-03-06 | Samsung Electronics Co., Ltd. | Method of forming metal nitride film by chemical vapor deposition and method of forming metal contact of semiconductor device using the same |
US6218269B1 (en) * | 1997-11-18 | 2001-04-17 | Technology And Devices International, Inc. | Process for producing III-V nitride pn junctions and p-i-n junctions |
US6086673A (en) * | 1998-04-02 | 2000-07-11 | Massachusetts Institute Of Technology | Process for producing high-quality III-V nitride substrates |
JP3363790B2 (ja) * | 1998-07-03 | 2003-01-08 | 松下電器産業株式会社 | ドライエッチング装置 |
US6271104B1 (en) * | 1998-08-10 | 2001-08-07 | Mp Technologies | Fabrication of defect free III-nitride materials |
US6117213A (en) * | 1999-05-07 | 2000-09-12 | Cbl Technologies, Inc. | Particle trap apparatus and methods |
EP1127957A1 (de) | 2000-02-24 | 2001-08-29 | Asm Japan K.K. | Vorrichtung mit Reinigungsfunktion zur Herstellung von Filmen |
US6596079B1 (en) * | 2000-03-13 | 2003-07-22 | Advanced Technology Materials, Inc. | III-V nitride substrate boule and method of making and using the same |
JP2001345268A (ja) | 2000-05-31 | 2001-12-14 | Matsushita Electric Ind Co Ltd | 半導体製造装置及び半導体の製造方法 |
-
2001
- 2001-07-09 JP JP2001207785A patent/JP4374156B2/ja not_active Expired - Fee Related
- 2001-08-13 US US09/928,523 patent/US7033439B2/en not_active Expired - Fee Related
- 2001-08-16 AT AT01119823T patent/ATE491827T1/de not_active IP Right Cessation
- 2001-08-16 DE DE60143639T patent/DE60143639D1/de not_active Expired - Lifetime
- 2001-08-16 EP EP01119823A patent/EP1184488B1/de not_active Expired - Lifetime
- 2001-08-22 KR KR10-2001-0050586A patent/KR100449222B1/ko not_active IP Right Cessation
- 2001-08-31 TW TW090121585A patent/TW554091B/zh not_active IP Right Cessation
-
2006
- 2006-01-04 US US11/324,940 patent/US7438761B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20020028291A1 (en) | 2002-03-07 |
JP2002173393A (ja) | 2002-06-21 |
DE60143639D1 (de) | 2011-01-27 |
KR20020018557A (ko) | 2002-03-08 |
TW554091B (en) | 2003-09-21 |
US20060150895A1 (en) | 2006-07-13 |
US7033439B2 (en) | 2006-04-25 |
EP1184488A3 (de) | 2006-02-08 |
JP4374156B2 (ja) | 2009-12-02 |
KR100449222B1 (ko) | 2004-09-18 |
EP1184488B1 (de) | 2010-12-15 |
EP1184488A2 (de) | 2002-03-06 |
US7438761B2 (en) | 2008-10-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ATE491827T1 (de) | Vorrichtung und verfahren zur herstellung eines iii-v-nitridfilms | |
ATA166799A (de) | Verfahren und vorrichtung zur herstellung einer nanotube-schicht auf einem substrat | |
EP1045432A3 (de) | Verfahren zur Entfernung einer mit Kohlenstoff verunreinigten Schicht aus der Oberfläche eines Siliziumsubstrats für anschliessendes selektives epitaxiales Siliziumwachstum | |
SE9500326D0 (sv) | Method for protecting the susceptor during epitaxial growth by CVD and a device for epitaxial growth by CVD | |
CA2313155A1 (en) | Group iii-v nitride semiconductor growth method and vapor phase growth apparatus | |
TW200802761A (en) | Gallium nitride material and method for producing the same | |
CA2312790A1 (en) | Growth of very uniform silicon carbide epitaxial layers | |
SE9503428D0 (sv) | A method for epitaxially growing objects and a device for such a growth | |
SE9503426D0 (sv) | A device for heat treatment of objects and a method for producing a susceptor | |
ATE471397T1 (de) | Verfahren und vorrichtung zur herstellung eines iii-v-nitridfilms | |
KR970068061A (ko) | 화합물 반도체의 기상 에피텍시 방법 | |
Takahashi et al. | Vapor phase epitaxy of InN using InCl and InCl3 sources | |
SE9603586D0 (sv) | A device for epitaxially growing objects and method for such a growth | |
JPS59223294A (ja) | 気相成長装置 | |
JPS5645899A (en) | Vapor phase growing method for gallium nitride | |
KR970052110A (ko) | 화합물 반도체에의 n형 도핑방법 | |
SE9503427D0 (sv) | A method for epitaxially growing objects and a device for such a growth | |
ATE264413T1 (de) | Verfahren und vorrichtung zur epitaktischem wachsen von objekten | |
JPH05186295A (ja) | 結晶成長方法 | |
JPH01158721A (ja) | 光照射型低温mocvd方法および装置 | |
JPS6261321A (ja) | 3−5族化合物半導体の製造方法及び装置 | |
EP1207215A3 (de) | Herstellungsverfahren von III-V Nitrid Film und Herstellungsvorrichtung | |
JPH0337186A (ja) | 化合物半導体薄膜の形成方法 | |
JPS57128022A (en) | Forming method for silicon epitaxially grown film | |
SE9500325D0 (sv) | Device for heat shielding when SiC is grown by CVD |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |