ATE489727T1 - Verfahren zum durchtrennung einen halbleiter substrat und verwendung einer schutzschicht für jenes verfahren - Google Patents

Verfahren zum durchtrennung einen halbleiter substrat und verwendung einer schutzschicht für jenes verfahren

Info

Publication number
ATE489727T1
ATE489727T1 AT03786235T AT03786235T ATE489727T1 AT E489727 T1 ATE489727 T1 AT E489727T1 AT 03786235 T AT03786235 T AT 03786235T AT 03786235 T AT03786235 T AT 03786235T AT E489727 T1 ATE489727 T1 AT E489727T1
Authority
AT
Austria
Prior art keywords
etching
plasma
separating
progress
plasma etching
Prior art date
Application number
AT03786235T
Other languages
English (en)
Inventor
Kiyoshi Arita
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Application granted granted Critical
Publication of ATE489727T1 publication Critical patent/ATE489727T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7422—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer

Landscapes

  • Dicing (AREA)
  • Drying Of Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Formation Of Insulating Films (AREA)
AT03786235T 2002-12-11 2003-12-11 Verfahren zum durchtrennung einen halbleiter substrat und verwendung einer schutzschicht für jenes verfahren ATE489727T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002359051A JP4013753B2 (ja) 2002-12-11 2002-12-11 半導体ウェハの切断方法
PCT/JP2003/015887 WO2004053981A1 (en) 2002-12-11 2003-12-11 Method of cutting semiconductor wafer and protective sheet used in the cutting method

Publications (1)

Publication Number Publication Date
ATE489727T1 true ATE489727T1 (de) 2010-12-15

Family

ID=32500922

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03786235T ATE489727T1 (de) 2002-12-11 2003-12-11 Verfahren zum durchtrennung einen halbleiter substrat und verwendung einer schutzschicht für jenes verfahren

Country Status (9)

Country Link
US (1) US7060531B2 (de)
EP (1) EP1570519B1 (de)
JP (1) JP4013753B2 (de)
KR (1) KR100971760B1 (de)
CN (1) CN100356549C (de)
AT (1) ATE489727T1 (de)
AU (1) AU2003295231A1 (de)
DE (1) DE60335137D1 (de)
WO (1) WO2004053981A1 (de)

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KR100828025B1 (ko) * 2007-06-13 2008-05-08 삼성전자주식회사 웨이퍼 절단 방법
US7838424B2 (en) * 2007-07-03 2010-11-23 Taiwan Semiconductor Manufacturing Company, Ltd. Enhanced reliability of wafer-level chip-scale packaging (WLCSP) die separation using dry etching
US7781310B2 (en) 2007-08-07 2010-08-24 Semiconductor Components Industries, Llc Semiconductor die singulation method
US8859396B2 (en) * 2007-08-07 2014-10-14 Semiconductor Components Industries, Llc Semiconductor die singulation method
US8012857B2 (en) * 2007-08-07 2011-09-06 Semiconductor Components Industries, Llc Semiconductor die singulation method
US7989319B2 (en) * 2007-08-07 2011-08-02 Semiconductor Components Industries, Llc Semiconductor die singulation method
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JP5218238B2 (ja) * 2009-04-10 2013-06-26 パナソニック株式会社 基板の加工方法および半導体チップの製造方法ならびに樹脂接着層付き半導体チップの製造方法
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KR101104134B1 (ko) * 2009-10-30 2012-01-13 전자부품연구원 반도체 칩 패키징 방법
TWI430415B (zh) * 2009-12-01 2014-03-11 精材科技股份有限公司 晶片封裝體及其製造方法
US9165833B2 (en) * 2010-01-18 2015-10-20 Semiconductor Components Industries, Llc Method of forming a semiconductor die
US9299664B2 (en) * 2010-01-18 2016-03-29 Semiconductor Components Industries, Llc Method of forming an EM protected semiconductor die
US20110175209A1 (en) * 2010-01-18 2011-07-21 Seddon Michael J Method of forming an em protected semiconductor die
US8384231B2 (en) 2010-01-18 2013-02-26 Semiconductor Components Industries, Llc Method of forming a semiconductor die
US8802545B2 (en) 2011-03-14 2014-08-12 Plasma-Therm Llc Method and apparatus for plasma dicing a semi-conductor wafer
USRE46339E1 (en) * 2011-03-14 2017-03-14 Plasma-Therm Llc Method and apparatus for plasma dicing a semi-conductor wafer
US9343365B2 (en) * 2011-03-14 2016-05-17 Plasma-Therm Llc Method and apparatus for plasma dicing a semi-conductor wafer
JP5833411B2 (ja) * 2011-11-11 2015-12-16 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法ならびに液晶表示装置
US8815706B2 (en) 2012-01-20 2014-08-26 Infineon Technologies Ag Methods of forming semiconductor devices
US9553021B2 (en) * 2012-09-03 2017-01-24 Infineon Technologies Ag Method for processing a wafer and method for dicing a wafer
US9484260B2 (en) 2012-11-07 2016-11-01 Semiconductor Components Industries, Llc Heated carrier substrate semiconductor die singulation method
US9136173B2 (en) 2012-11-07 2015-09-15 Semiconductor Components Industries, Llc Singulation method for semiconductor die having a layer of material along one major surface
KR102029646B1 (ko) * 2013-01-31 2019-11-08 삼성전자 주식회사 반도체 장치 제조 방법
US9299614B2 (en) * 2013-12-10 2016-03-29 Applied Materials, Inc. Method and carrier for dicing a wafer
US9418894B2 (en) 2014-03-21 2016-08-16 Semiconductor Components Industries, Llc Electronic die singulation method
US9112050B1 (en) * 2014-05-13 2015-08-18 Applied Materials, Inc. Dicing tape thermal management by wafer frame support ring cooling during plasma dicing
US9472458B2 (en) 2014-06-04 2016-10-18 Semiconductor Components Industries, Llc Method of reducing residual contamination in singulated semiconductor die
US9385041B2 (en) 2014-08-26 2016-07-05 Semiconductor Components Industries, Llc Method for insulating singulated electronic die
JP2016207737A (ja) * 2015-04-17 2016-12-08 株式会社ディスコ 分割方法
JP6506606B2 (ja) * 2015-04-27 2019-04-24 株式会社ディスコ ウエーハの分割方法
JP6516125B2 (ja) * 2015-09-07 2019-05-22 パナソニックＩｐマネジメント株式会社 プラズマ処理方法および電子部品の製造方法
JP6492287B2 (ja) * 2015-10-01 2019-04-03 パナソニックＩｐマネジメント株式会社 素子チップの製造方法および電子部品実装構造体の製造方法
JP6492288B2 (ja) * 2015-10-01 2019-04-03 パナソニックＩｐマネジメント株式会社 素子チップの製造方法
GB201518756D0 (en) 2015-10-22 2015-12-09 Spts Technologies Ltd Apparatus for plasma dicing
JP6575874B2 (ja) * 2016-03-09 2019-09-18 パナソニックＩｐマネジメント株式会社 素子チップの製造方法
KR101938306B1 (ko) * 2016-04-18 2019-01-14 최상준 건식 에칭장치의 제어방법
US10366923B2 (en) 2016-06-02 2019-07-30 Semiconductor Components Industries, Llc Method of separating electronic devices having a back layer and apparatus
US10373869B2 (en) 2017-05-24 2019-08-06 Semiconductor Components Industries, Llc Method of separating a back layer on a substrate using exposure to reduced temperature and related apparatus
CN111201482A (zh) * 2017-11-30 2020-05-26 深圳市柔宇科技有限公司 显示屏保护结构、显示组件及切割方法、贴膜方法
TWI825080B (zh) 2018-03-30 2023-12-11 日商琳得科股份有限公司 半導體晶片的製造方法
US10916474B2 (en) * 2018-06-25 2021-02-09 Semiconductor Components Industries, Llc Method of reducing residual contamination in singulated semiconductor die
CN110634796A (zh) * 2018-06-25 2019-12-31 半导体元件工业有限责任公司 用于处理电子管芯的方法及半导体晶圆和管芯的切单方法
US10607889B1 (en) * 2018-09-19 2020-03-31 Semiconductor Components Industries, Llc Jet ablation die singulation systems and related methods
US10818551B2 (en) 2019-01-09 2020-10-27 Semiconductor Components Industries, Llc Plasma die singulation systems and related methods
CN111640827B (zh) * 2019-03-01 2021-03-12 山东浪潮华光光电子股份有限公司 一种GaAs基LED芯片的切割方法
CN116053125A (zh) * 2022-03-18 2023-05-02 全讯射频科技(无锡)有限公司 一种使用等离子切割的声表面波温补滤波器晶圆
EP4345872A1 (de) * 2022-09-28 2024-04-03 Nexperia B.V. Verfahren zur vereinzelung von chips aus einem wafer

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Also Published As

Publication number Publication date
DE60335137D1 (de) 2011-01-05
EP1570519A1 (de) 2005-09-07
US20040121611A1 (en) 2004-06-24
CN100356549C (zh) 2007-12-19
JP4013753B2 (ja) 2007-11-28
US7060531B2 (en) 2006-06-13
JP2004193305A (ja) 2004-07-08
KR20050084789A (ko) 2005-08-29
AU2003295231A1 (en) 2004-06-30
WO2004053981A1 (en) 2004-06-24
KR100971760B1 (ko) 2010-07-21
CN1692493A (zh) 2005-11-02
EP1570519B1 (de) 2010-11-24

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