MY176699A - Pressure-sensitive adhesive tape for semiconductor substrate fabrication and method for manufacturing semiconductor device - Google Patents

Pressure-sensitive adhesive tape for semiconductor substrate fabrication and method for manufacturing semiconductor device

Info

Publication number
MY176699A
MY176699A MYPI2019004818A MYPI2019004818A MY176699A MY 176699 A MY176699 A MY 176699A MY PI2019004818 A MYPI2019004818 A MY PI2019004818A MY PI2019004818 A MYPI2019004818 A MY PI2019004818A MY 176699 A MY176699 A MY 176699A
Authority
MY
Malaysia
Prior art keywords
pressure
sensitive adhesive
semiconductor
adhesive tape
sealing
Prior art date
Application number
MYPI2019004818A
Inventor
Yoshinori Nagao
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of MY176699A publication Critical patent/MY176699A/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/11Manufacturing methods

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

According to the present invention, it is possible to provide a pressure-sensitive adhesive tape (100) for semiconductor substrate fabrication, including a base material (4), and a pressure-sensitive adhesive layer (2) laminated on one surface of the base material (4), in which the pressure-sensitive adhesive tape (100) is used for a process of performing fabrication in which when a sealed semiconductor connection (270) including a substrate, a plurality of semiconductor elements disposed on the substrate, and a sealing portion (27) sealing the plurality of semiconductor elements is cut in a thickness direction thereof to obtain a plurality of semiconductor sealing bodies, the sealed semiconductor connection (270) is temporarily fixed to the base material (4) through the pressure-sensitive adhesive layer (2), the pressure-sensitive adhesive layer (2) contains a peeling agent for reducing adhesiveness to the sealing portion (27) when the semiconductor sealing bodies are peeled from the pressure-sensitive adhesive tape (100) for semiconductor substrate fabrication, the sealing portion (27) is formed of a sealing material containing an epoxy group-containing compound, the epoxy group-containing compound has a double bond in a molecular structure thereof, and the peeling agent is a silicone-based oil or a fluorine-based surfactant.
MYPI2019004818A 2017-02-28 2018-02-21 Pressure-sensitive adhesive tape for semiconductor substrate fabrication and method for manufacturing semiconductor device MY176699A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017036945 2017-02-28
PCT/JP2018/006282 WO2018159418A1 (en) 2017-02-28 2018-02-21 Adhesive tape of use in processing of semiconductor substrate, and method for manufacturing semiconductor device

Publications (1)

Publication Number Publication Date
MY176699A true MY176699A (en) 2020-08-19

Family

ID=63370318

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019004818A MY176699A (en) 2017-02-28 2018-02-21 Pressure-sensitive adhesive tape for semiconductor substrate fabrication and method for manufacturing semiconductor device

Country Status (7)

Country Link
JP (1) JP6443590B1 (en)
CN (1) CN110352472B (en)
MY (1) MY176699A (en)
PH (1) PH12019501778A1 (en)
SG (1) SG11201907801PA (en)
TW (1) TWI717587B (en)
WO (1) WO2018159418A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11435257B2 (en) * 2018-07-27 2022-09-06 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for monitoring vacuum valve closing condition in vacuum processing system
JP6639712B1 (en) * 2019-02-15 2020-02-05 桜宮化学株式会社 Thermosetting release coating and thermosetting release coating kit
JP2020164787A (en) * 2019-03-27 2020-10-08 住友ベークライト株式会社 Pressure-sensitive adhesive tape
JP6733803B1 (en) * 2019-05-10 2020-08-05 住友ベークライト株式会社 Adhesive tape for sticking substrates and base material for adhesive tape

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4816835B2 (en) * 1999-07-19 2011-11-16 日立化成工業株式会社 Non-conductive resin paste composition and semiconductor device using the same
JP4319892B2 (en) * 2003-11-07 2009-08-26 株式会社巴川製紙所 Adhesive sheet for manufacturing semiconductor device and method for manufacturing semiconductor device
TWI478997B (en) * 2009-07-16 2015-04-01 Sekisui Chemical Co Ltd Adhesive tape, laminated body and image display device
JP5992692B2 (en) * 2012-02-20 2016-09-14 株式会社イーテック Adhesive composition and adhesive sheet using the same
JP2017188539A (en) * 2016-04-04 2017-10-12 住友ベークライト株式会社 Semiconductor element, semiconductor element manufacturing method and semiconductor device

Also Published As

Publication number Publication date
CN110352472B (en) 2020-09-29
WO2018159418A1 (en) 2018-09-07
TWI717587B (en) 2021-02-01
JPWO2018159418A1 (en) 2019-03-14
PH12019501778B1 (en) 2020-06-29
TW201842114A (en) 2018-12-01
CN110352472A (en) 2019-10-18
JP6443590B1 (en) 2018-12-26
SG11201907801PA (en) 2019-09-27
PH12019501778A1 (en) 2020-06-29

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