ATE482475T1 - Verfahren zur bildung einer quantentopfstruktur und verfahren zur herstellung eines lichtemittierenden halbleiterelements - Google Patents
Verfahren zur bildung einer quantentopfstruktur und verfahren zur herstellung eines lichtemittierenden halbleiterelementsInfo
- Publication number
- ATE482475T1 ATE482475T1 AT09005065T AT09005065T ATE482475T1 AT E482475 T1 ATE482475 T1 AT E482475T1 AT 09005065 T AT09005065 T AT 09005065T AT 09005065 T AT09005065 T AT 09005065T AT E482475 T1 ATE482475 T1 AT E482475T1
- Authority
- AT
- Austria
- Prior art keywords
- forming
- quantum well
- well structure
- well
- layers
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
- H10P14/3414—Deposited materials, e.g. layers characterised by the chemical composition being group IIIA-VIA materials
- H10P14/3416—Nitrides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
- H10H20/0137—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials the light-emitting regions comprising nitride materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/24—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
- H10P14/2901—Materials
- H10P14/2907—Materials being Group IIIA-VA materials
- H10P14/2908—Nitrides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
- H10P14/2926—Crystal orientations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/32—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
- H10P14/3202—Materials thereof
- H10P14/3214—Materials thereof being Group IIIA-VA semiconductors
- H10P14/3216—Nitrides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/811—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
- H10H20/812—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions within the light-emitting regions, e.g. having quantum confinement structures
Landscapes
- Led Devices (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008101781A JP4539752B2 (ja) | 2008-04-09 | 2008-04-09 | 量子井戸構造の形成方法および半導体発光素子の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE482475T1 true ATE482475T1 (de) | 2010-10-15 |
Family
ID=40911598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT09005065T ATE482475T1 (de) | 2008-04-09 | 2009-04-06 | Verfahren zur bildung einer quantentopfstruktur und verfahren zur herstellung eines lichtemittierenden halbleiterelements |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8173458B2 (de) |
| EP (1) | EP2124266B1 (de) |
| JP (1) | JP4539752B2 (de) |
| CN (1) | CN101556917B (de) |
| AT (1) | ATE482475T1 (de) |
| DE (1) | DE602009000219D1 (de) |
| TW (1) | TW200945452A (de) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI442455B (zh) | 2010-03-29 | 2014-06-21 | S O I 矽科技絕緣體工業公司 | Iii-v族半導體結構及其形成方法 |
| GB2487531A (en) * | 2011-01-20 | 2012-08-01 | Sharp Kk | Substrate system consisting of a metamorphic transition region comprising a laminate of AlxGa1-x N and the same material as the substrate. |
| CN103003964A (zh) | 2011-01-21 | 2013-03-27 | 松下电器产业株式会社 | 氮化镓类化合物半导体发光元件和具有该发光元件的光源 |
| CN102208500A (zh) * | 2011-05-20 | 2011-10-05 | 武汉迪源光电科技有限公司 | 一种led外延生长方法和led外延结构 |
| US20130023079A1 (en) * | 2011-07-20 | 2013-01-24 | Sang Won Kang | Fabrication of light emitting diodes (leds) using a degas process |
| JP5296264B1 (ja) | 2011-09-29 | 2013-09-25 | パナソニック株式会社 | 窒化物半導体発光素子およびledシステム |
| JP5883331B2 (ja) | 2012-01-25 | 2016-03-15 | 住友化学株式会社 | 窒化物半導体エピタキシャルウェハの製造方法及び電界効果型窒化物トランジスタの製造方法 |
| WO2013132812A1 (ja) | 2012-03-05 | 2013-09-12 | パナソニック株式会社 | 窒化物半導体発光素子、光源及びその製造方法 |
| FR3001334B1 (fr) * | 2013-01-24 | 2016-05-06 | Centre Nat De La Rech Scient (Cnrs) | Procede de fabrication de diodes blanches monolithiques |
| TWI612686B (zh) * | 2014-09-03 | 2018-01-21 | 晶元光電股份有限公司 | 發光元件及其製造方法 |
| TWI714891B (zh) * | 2014-09-03 | 2021-01-01 | 晶元光電股份有限公司 | 發光元件及其製造方法 |
| TWI641160B (zh) * | 2014-09-03 | 2018-11-11 | 晶元光電股份有限公司 | 發光元件及其製造方法 |
| KR102238195B1 (ko) | 2014-11-07 | 2021-04-07 | 엘지이노텍 주식회사 | 자외선 발광소자 및 조명시스템 |
| CN106972083B (zh) * | 2017-02-17 | 2019-02-12 | 华灿光电(浙江)有限公司 | 一种发光二极管的外延片的制备方法 |
| CN107634128A (zh) * | 2017-09-14 | 2018-01-26 | 厦门三安光电有限公司 | 氮化物半导体元件 |
| JP7095498B2 (ja) * | 2018-08-31 | 2022-07-05 | 住友電気工業株式会社 | 垂直共振型面発光レーザ、垂直共振型面発光レーザを作製する方法 |
| CZ2018563A3 (cs) * | 2018-10-22 | 2019-10-30 | Fyzikální Ústav Av Čr, V. V. I. | Způsob výroby epitaxní struktury s InGaN kvantovými jamami |
| CN113394313B (zh) * | 2020-03-13 | 2022-12-27 | 华为技术有限公司 | 一种led芯片及其制作方法、显示模组、终端 |
| CN113036600B (zh) * | 2021-03-04 | 2022-08-02 | 东莞理工学院 | 一种氮化镓基绿光激光器及其制备方法 |
| CN113270525A (zh) * | 2021-04-30 | 2021-08-17 | 广东德力光电有限公司 | 一种绿光外延结构的制备方法 |
| CN114481088B (zh) * | 2022-04-18 | 2022-07-01 | 苏州长光华芯光电技术股份有限公司 | 一种超晶格有源层及半导体发光结构的制作方法 |
| CN114975698B (zh) * | 2022-06-02 | 2025-12-02 | 中国科学院苏州纳米技术与纳米仿生研究所 | 一种生长多量子阱的方法、多量子阱 |
| CN116344693B (zh) * | 2023-05-31 | 2023-09-08 | 江西兆驰半导体有限公司 | 一种高光效发光二极管外延片及其制备方法 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998019375A1 (en) * | 1996-10-30 | 1998-05-07 | Hitachi, Ltd. | Optical information processor and semiconductor light emitting device suitable for the same |
| JP3577206B2 (ja) * | 1997-12-04 | 2004-10-13 | 昭和電工株式会社 | Iii族窒化物半導体発光素子 |
| JP3454200B2 (ja) * | 1998-09-21 | 2003-10-06 | 日亜化学工業株式会社 | 発光素子 |
| US6614059B1 (en) * | 1999-01-07 | 2003-09-02 | Matsushita Electric Industrial Co., Ltd. | Semiconductor light-emitting device with quantum well |
| JP4505915B2 (ja) | 2000-01-13 | 2010-07-21 | 東京エレクトロン株式会社 | 成膜方法 |
| JP4822608B2 (ja) * | 2001-05-14 | 2011-11-24 | シャープ株式会社 | 窒化物系半導体発光素子およびその製造方法 |
| US6734530B2 (en) * | 2001-06-06 | 2004-05-11 | Matsushita Electric Industries Co., Ltd. | GaN-based compound semiconductor EPI-wafer and semiconductor element using the same |
| TW544956B (en) * | 2001-06-13 | 2003-08-01 | Matsushita Electric Industrial Co Ltd | Nitride semiconductor, production method therefor and nitride semiconductor element |
| US6645885B2 (en) * | 2001-09-27 | 2003-11-11 | The National University Of Singapore | Forming indium nitride (InN) and indium gallium nitride (InGaN) quantum dots grown by metal-organic-vapor-phase-epitaxy (MOCVD) |
| JP3926271B2 (ja) * | 2002-01-10 | 2007-06-06 | シャープ株式会社 | Iii族窒化物半導体レーザ素子及びその製造方法 |
| GB2407701A (en) * | 2003-10-28 | 2005-05-04 | Sharp Kk | Manufacture of a semiconductor light-emitting device |
| US7482635B2 (en) * | 2004-02-24 | 2009-01-27 | Showa Denko K.K. | Gallium nitride-based compound semiconductor multilayer structure and production method thereof |
| JP2005268581A (ja) * | 2004-03-19 | 2005-09-29 | Matsushita Electric Ind Co Ltd | 窒化ガリウム系化合物半導体発光素子 |
| ATE418806T1 (de) * | 2004-04-02 | 2009-01-15 | Nichia Corp | Nitrid-halbleiterlaservorrichtung |
| KR100513923B1 (ko) * | 2004-08-13 | 2005-09-08 | 재단법인서울대학교산학협력재단 | 질화물 반도체층을 성장시키는 방법 및 이를 이용하는 질화물 반도체 발광소자 |
| US7339255B2 (en) * | 2004-08-24 | 2008-03-04 | Kabushiki Kaisha Toshiba | Semiconductor device having bidirectionally inclined toward <1-100> and <11-20> relative to {0001} crystal planes |
| KR20070054722A (ko) * | 2004-09-28 | 2007-05-29 | 스미또모 가가꾸 가부시키가이샤 | Ⅲ-ⅴ족 화합물 반도체 및 그 제조 방법 |
| US20090140286A1 (en) | 2005-04-07 | 2009-06-04 | Showa Denko K.K. | Production Method of Group III Nitride Semiconductor Element |
| JP2006332258A (ja) * | 2005-05-25 | 2006-12-07 | Matsushita Electric Ind Co Ltd | 窒化物半導体装置及びその製造方法 |
| JP2007087973A (ja) * | 2005-09-16 | 2007-04-05 | Rohm Co Ltd | 窒化物半導体素子の製法およびその方法により得られる窒化物半導体発光素子 |
| WO2007084782A2 (en) * | 2006-01-20 | 2007-07-26 | The Regents Of The University Of California | Method for improved growth of semipolar (al,in,ga,b)n |
| JP5025168B2 (ja) * | 2006-06-08 | 2012-09-12 | 昭和電工株式会社 | Iii族窒化物半導体積層構造体の製造方法 |
-
2008
- 2008-04-09 JP JP2008101781A patent/JP4539752B2/ja not_active Expired - Fee Related
-
2009
- 2009-04-02 TW TW098111047A patent/TW200945452A/zh unknown
- 2009-04-03 US US12/417,857 patent/US8173458B2/en not_active Expired - Fee Related
- 2009-04-06 DE DE602009000219T patent/DE602009000219D1/de active Active
- 2009-04-06 AT AT09005065T patent/ATE482475T1/de not_active IP Right Cessation
- 2009-04-06 EP EP09005065A patent/EP2124266B1/de not_active Not-in-force
- 2009-04-09 CN CN200910134808.8A patent/CN101556917B/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN101556917B (zh) | 2013-01-09 |
| DE602009000219D1 (de) | 2010-11-04 |
| EP2124266B1 (de) | 2010-09-22 |
| US8173458B2 (en) | 2012-05-08 |
| JP2009253164A (ja) | 2009-10-29 |
| JP4539752B2 (ja) | 2010-09-08 |
| EP2124266A1 (de) | 2009-11-25 |
| TW200945452A (en) | 2009-11-01 |
| US20090258452A1 (en) | 2009-10-15 |
| CN101556917A (zh) | 2009-10-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |