ATE450885T1 - Flüssigkeitsverarbeitungsvorrichtung - Google Patents

Flüssigkeitsverarbeitungsvorrichtung

Info

Publication number
ATE450885T1
ATE450885T1 AT07007786T AT07007786T ATE450885T1 AT E450885 T1 ATE450885 T1 AT E450885T1 AT 07007786 T AT07007786 T AT 07007786T AT 07007786 T AT07007786 T AT 07007786T AT E450885 T1 ATE450885 T1 AT E450885T1
Authority
AT
Austria
Prior art keywords
substrate
rotary cup
liquid
rotate along
front surface
Prior art date
Application number
AT07007786T
Other languages
German (de)
English (en)
Inventor
Satoshi Kaneko
Kazuhisa Matsumoto
Norihiro Ito
Masami Akimoto
Takayuki Toshima
Hiromitsu Nanba
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Application granted granted Critical
Publication of ATE450885T1 publication Critical patent/ATE450885T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Weting (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
AT07007786T 2006-04-18 2007-04-17 Flüssigkeitsverarbeitungsvorrichtung ATE450885T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006114960 2006-04-18

Publications (1)

Publication Number Publication Date
ATE450885T1 true ATE450885T1 (de) 2009-12-15

Family

ID=38120656

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07007786T ATE450885T1 (de) 2006-04-18 2007-04-17 Flüssigkeitsverarbeitungsvorrichtung

Country Status (7)

Country Link
US (1) US7998308B2 (enExample)
EP (1) EP1848025B1 (enExample)
KR (1) KR101019445B1 (enExample)
CN (2) CN101060070B (enExample)
AT (1) ATE450885T1 (enExample)
DE (1) DE602007003506D1 (enExample)
TW (1) TW200802579A (enExample)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE602007003506D1 (de) * 2006-04-18 2010-01-14 Tokyo Electron Ltd Flüssigkeitsverarbeitungsvorrichtung
KR101467974B1 (ko) 2007-12-10 2014-12-10 에이씨엠 리서치 (상하이) 인코포레이티드 반도체 웨이퍼 세척 방법 및 장치
WO2009084406A1 (ja) * 2007-12-27 2009-07-09 Tokyo Electron Limited 液処理装置、液処理方法および記憶媒体
KR100969604B1 (ko) * 2008-06-26 2010-07-12 주식회사 에이앤디코퍼레이션 기판 처리장치 및 방법
JP5156661B2 (ja) * 2009-02-12 2013-03-06 東京エレクトロン株式会社 液処理装置および液処理方法
JP5310693B2 (ja) * 2010-10-07 2013-10-09 東京エレクトロン株式会社 液処理装置
US9799537B2 (en) * 2010-12-03 2017-10-24 Applied Materials, Inc. Processing assembly for semiconductor workpiece and methods of processing same
US20120286481A1 (en) * 2011-05-13 2012-11-15 Lam Research Ag Device and process for liquid treatment of wafer shaped articles
US20120305036A1 (en) * 2011-06-01 2012-12-06 Lam Research Ag Device for treating surfaces of wafer-shaped articles
JP5645796B2 (ja) * 2011-11-21 2014-12-24 東京エレクトロン株式会社 液処理装置及び液処理方法
JP5913937B2 (ja) * 2011-11-30 2016-05-11 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ カップおよび基板処理装置
JP6148475B2 (ja) * 2013-01-25 2017-06-14 株式会社東芝 半導体製造装置および半導体装置の製造方法
JP6057334B2 (ja) * 2013-03-15 2017-01-11 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6281161B2 (ja) * 2013-09-27 2018-02-21 東京エレクトロン株式会社 液処理装置
TWI569349B (zh) * 2013-09-27 2017-02-01 斯克林集團公司 基板處理裝置及基板處理方法
JP6229933B2 (ja) * 2013-09-27 2017-11-15 株式会社Ｓｃｒｅｅｎホールディングス 処理カップ洗浄方法、基板処理方法および基板処理装置
JP6090113B2 (ja) * 2013-10-30 2017-03-08 東京エレクトロン株式会社 液処理装置
JP6134673B2 (ja) * 2014-03-13 2017-05-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
US10576604B2 (en) * 2014-04-30 2020-03-03 Ebara Corporation Substrate polishing apparatus
JP6267141B2 (ja) * 2014-06-04 2018-01-24 東京エレクトロン株式会社 液塗布方法、液塗布装置、及びコンピュータ読み取り可能な記録媒体
KR101621482B1 (ko) * 2014-09-30 2016-05-17 세메스 주식회사 기판 처리 장치 및 방법
JP6797526B2 (ja) * 2014-11-11 2020-12-09 株式会社荏原製作所 基板洗浄装置
US10276425B2 (en) * 2014-11-21 2019-04-30 Tokyo Electron Limited Substrate processing system
WO2017062141A1 (en) * 2015-10-04 2017-04-13 Applied Materials, Inc. Substrate support and baffle apparatus
CN105244304B (zh) * 2015-11-11 2018-12-18 北京七星华创电子股份有限公司 一种带静电液雾清洗装置和清洗方法
CN110021535A (zh) * 2018-01-10 2019-07-16 弘塑科技股份有限公司 基板处理装置及其旋转台
CN109411402B (zh) * 2018-08-08 2021-03-30 中芯集成电路（宁波）有限公司 湿法清洗设备
JP7037459B2 (ja) * 2018-09-10 2022-03-16 キオクシア株式会社 半導体製造装置および半導体装置の製造方法
JP7192756B2 (ja) * 2019-12-19 2022-12-20 株式会社Sumco 気相成長装置及び気相成長方法
JP7438015B2 (ja) * 2020-05-01 2024-02-26 東京エレクトロン株式会社 基板処理装置
KR102732711B1 (ko) 2020-09-16 2024-11-20 삼성전자주식회사 웨이퍼 클리닝 장치 및 이를 이용한 웨이퍼 클리닝 방법
GB202018030D0 (en) * 2020-11-17 2020-12-30 Spts Technologies Ltd Spin rinse dryer with improved drying characteristics
CN112670207B (zh) * 2020-12-21 2023-10-31 长江存储科技有限责任公司 晶边处理设备及待处理晶圆结构的处理方法
CN112992733B (zh) * 2021-02-08 2022-03-11 江苏亚电科技有限公司 一种用于晶圆加工的刷洗装置
JP7731250B2 (ja) * 2021-09-22 2025-08-29 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
KR102629496B1 (ko) * 2021-12-24 2024-01-29 세메스 주식회사 홈 포트 및 기판 처리 장치

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3138897B2 (ja) 1993-10-07 2001-02-26 大日本スクリーン製造株式会社 回転式基板処理装置
KR100284559B1 (ko) * 1994-04-04 2001-04-02 다카시마 히로시 처리방법 및 처리장치
JP3102831B2 (ja) 1994-06-20 2000-10-23 大日本スクリーン製造株式会社 回転処理装置
JPH0878368A (ja) 1994-09-07 1996-03-22 Hitachi Ltd ワークの処理方法および装置
US6350319B1 (en) * 1998-03-13 2002-02-26 Semitool, Inc. Micro-environment reactor for processing a workpiece
TW357406B (en) * 1996-10-07 1999-05-01 Tokyo Electron Ltd Method and apparatus for cleaning and drying a substrate
TW466561B (en) 1999-10-06 2001-12-01 Ebara Corp Method and apparatus for cleaning substrates
US6827814B2 (en) * 2000-05-08 2004-12-07 Tokyo Electron Limited Processing apparatus, processing system and processing method
JP3837017B2 (ja) 2000-12-04 2006-10-25 大日本スクリーン製造株式会社 基板処理装置及び基板処理方法ならびに基板処理装置の洗浄方法
JP2002176026A (ja) * 2000-12-05 2002-06-21 Ses Co Ltd 枚葉式基板洗浄方法および枚葉式基板洗浄装置
JP3958539B2 (ja) * 2001-08-02 2007-08-15 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP4018958B2 (ja) * 2001-10-30 2007-12-05 大日本スクリーン製造株式会社 基板処理装置
JP4074814B2 (ja) * 2002-01-30 2008-04-16 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP3890025B2 (ja) 2003-03-10 2007-03-07 東京エレクトロン株式会社 塗布処理装置及び塗布処理方法
DE602007003506D1 (de) * 2006-04-18 2010-01-14 Tokyo Electron Ltd Flüssigkeitsverarbeitungsvorrichtung
KR101042666B1 (ko) * 2006-06-16 2011-06-20 도쿄엘렉트론가부시키가이샤 액 처리 장치 및 액 처리 방법
KR100979979B1 (ko) * 2006-07-26 2010-09-03 도쿄엘렉트론가부시키가이샤 액처리 장치 및 액처리 방법

Also Published As

Publication number Publication date
TWI362068B (enExample) 2012-04-11
KR20070103314A (ko) 2007-10-23
US20070240824A1 (en) 2007-10-18
EP1848025A1 (en) 2007-10-24
DE602007003506D1 (de) 2010-01-14
TW200802579A (en) 2008-01-01
CN101441991B (zh) 2010-11-03
KR101019445B1 (ko) 2011-03-07
US7998308B2 (en) 2011-08-16
CN101060070A (zh) 2007-10-24
CN101441991A (zh) 2009-05-27
CN101060070B (zh) 2010-10-27
EP1848025B1 (en) 2009-12-02

Similar Documents

Publication Publication Date Title
ATE450885T1 (de) Flüssigkeitsverarbeitungsvorrichtung
ATE445229T1 (de) Flüssigkeitsverarbeitungsvorrichtung
ATE424038T1 (de) Flüssigkeitsbearbeitungsvorrichtung und - verfahren
ATE518018T1 (de) Verfahren zur reinigung von ablagerungskammerteilen mithilfe der selektiven spritzätzung
EA201200923A1 (ru) Способ химической обработки поверхности полупроводниковой подложки (варианты)
WO2010014167A3 (en) Devices for vertical treatment of glass
TW200746285A (en) Device and method for wet treating plate-like substrates
ATE459097T1 (de) Flüssigkeitsbehandlungsapparat
TW200705516A (en) Coating apparatus and method of fabricating liquid crystal display device using the same
ATE455365T1 (de) Flüssigkeitsverarbeitungsvorrichtung
GB201101759D0 (en) Surface treated substrates for top gate organic thin film transistors
WO2009144073A3 (de) Reinigungsvorrichtung und verfahren zur reinigung eines werkstücks
DE112008001623A5 (de) Vorrichtung zum Führen von Versorgungsleitungen entlang der Struktur eines Industrieroboters
TW200739674A (en) Coating and developing apparatus, and coating and developing method
TW200620529A (en) Apparatus for treating a substrate
EP2631935A3 (en) Substrate cleaning apparatus and substrate cleaning method
DE502005007992D1 (de) Vorrichtung zur bearbeitung eines substrates mittels mindestens eines plasma-jets
ATE485755T1 (de) Hahn
TW200631915A (en) Apparatus of cleaning glass substrate and method of cleaning glass substrate
TW200746230A (en) Developing treatment apparatus and developing treatment method
TW200631679A (en) Method and device for treating substrates and corresponding nozzle unit
TW200614355A (en) Apparatus for treating substrates and method of treating substrates
IN2012DN03087A (enExample)
BRPI1009993A2 (pt) dispositivo de amostragem de olho
TW200632117A (en) Method of mounting substrate in film deposition apparatus and method of depositing film

Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification

Ref document number: 1848025

Country of ref document: EP