TW200614355A - Apparatus for treating substrates and method of treating substrates - Google Patents

Apparatus for treating substrates and method of treating substrates

Info

Publication number
TW200614355A
TW200614355A TW094130696A TW94130696A TW200614355A TW 200614355 A TW200614355 A TW 200614355A TW 094130696 A TW094130696 A TW 094130696A TW 94130696 A TW94130696 A TW 94130696A TW 200614355 A TW200614355 A TW 200614355A
Authority
TW
Taiwan
Prior art keywords
substrate
treating substrates
carried
treatment solution
inclined direction
Prior art date
Application number
TW094130696A
Other languages
Chinese (zh)
Other versions
TWI264770B (en
Inventor
Shinsuke Ueki
Yukinobu Nishibe
Akinori Iso
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of TW200614355A publication Critical patent/TW200614355A/en
Application granted granted Critical
Publication of TWI264770B publication Critical patent/TWI264770B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1026—Valves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Weting (AREA)

Abstract

There is provided an apparatus for treating a substrate in which a surface of a substrate to be carried is treated with a treatment solution heated to a predetermined temperature, comprising: a carrying means for carrying a substrate in a state inclined at a predetermined angle such that the surface is on the upper side in an inclined direction; a surface nozzle for supplying the treatment solution to the surface of a substrate to be carried by the carrying means, wherein the surface is on the upper side in an inclined direction; and a branch pipe for supplying the treatment solution to a rear surface of a substrate to be carried by the carrying means, wherein the rear surface is on the lower side in an inclined direction.
TW094130696A 2004-09-14 2005-09-07 Apparatus for treating substrates and method of treating substrates TWI264770B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004267063 2004-09-14
JP2005247901A JP4669760B2 (en) 2004-09-14 2005-08-29 Substrate processing apparatus and processing method

Publications (2)

Publication Number Publication Date
TW200614355A true TW200614355A (en) 2006-05-01
TWI264770B TWI264770B (en) 2006-10-21

Family

ID=36379490

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094130696A TWI264770B (en) 2004-09-14 2005-09-07 Apparatus for treating substrates and method of treating substrates

Country Status (4)

Country Link
JP (1) JP4669760B2 (en)
KR (1) KR100624653B1 (en)
CN (1) CN1748878B (en)
TW (1) TWI264770B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI724850B (en) * 2012-09-14 2021-04-11 日商尼康股份有限公司 Substrate processing device and component manufacturing method

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4820705B2 (en) * 2006-07-24 2011-11-24 芝浦メカトロニクス株式会社 Substrate processing equipment
JP4829710B2 (en) * 2006-07-26 2011-12-07 芝浦メカトロニクス株式会社 Substrate processing equipment
JP5125038B2 (en) * 2006-09-12 2013-01-23 カシオ計算機株式会社 Resist stripping apparatus and resist stripping method
US20120006485A1 (en) * 2009-02-02 2012-01-12 Makoto Tanabe Substrate treatment device
CN102315148A (en) * 2010-06-30 2012-01-11 上方能源技术(杭州)有限公司 Substrate conveying device and substrate conveying method for coating purpose
CN104241541B (en) 2014-09-15 2016-12-14 京东方科技集团股份有限公司 Organic electroluminescence device and display device
CN104923534B (en) * 2015-05-22 2017-11-14 合肥京东方光电科技有限公司 Panel orientation membrane removal equipment
CN105140167A (en) * 2015-07-28 2015-12-09 合肥鑫晟光电科技有限公司 Carrying device, wet etching equipment and application method of wet etching equipment
KR102228353B1 (en) * 2019-09-05 2021-03-16 주식회사 태성 Substrate developing apparatus having function of discharging developing solution
CN113894001B (en) * 2021-10-20 2022-07-19 盐城吉研智能科技有限公司 Compounding device and production process of foamed aluminum multilayer composite board

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000114221A (en) 1998-10-02 2000-04-21 Dainippon Screen Mfg Co Ltd Substrate-processing device
JP3556110B2 (en) 1998-12-22 2004-08-18 大日本スクリーン製造株式会社 Substrate processing equipment
JP3626640B2 (en) * 1999-08-10 2005-03-09 大日本スクリーン製造株式会社 Substrate processing equipment
JP2003088789A (en) * 2001-09-19 2003-03-25 Sharp Corp Wet treatment device
US20030162283A1 (en) * 2002-02-22 2003-08-28 Hitachi, Ltd. Circulating type biochemical reaction apparatus
JP2004079793A (en) 2002-08-19 2004-03-11 Sumitomo Precision Prod Co Ltd Method for treating substrate
JP2004174308A (en) * 2002-11-25 2004-06-24 Kawaju Plant Kk Sheet material washing equipment
JP4280075B2 (en) * 2003-01-07 2009-06-17 芝浦メカトロニクス株式会社 Substrate processing equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI724850B (en) * 2012-09-14 2021-04-11 日商尼康股份有限公司 Substrate processing device and component manufacturing method

Also Published As

Publication number Publication date
CN1748878B (en) 2011-05-25
KR100624653B1 (en) 2006-09-15
JP4669760B2 (en) 2011-04-13
CN1748878A (en) 2006-03-22
KR20060051248A (en) 2006-05-19
JP2006110541A (en) 2006-04-27
TWI264770B (en) 2006-10-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees