JP2004079793A - Method for treating substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for treating a substrate which can efficiently treat the substrate. <P>SOLUTION: When the substrate is treated by a treatment fluid emitted onto the surface of the substrate K from a nozzle 12, the substrate K is made to incline at an angle θ of 5-7.5° to a horizontal plane, and the nozzle 12 is vibrated in parallel to the slanting direction of the substrate K in a plane orthogonal to the substrate K so that the treatment fluid emitted from the nozzle 12 is vibrated in the upward and downward directions of the slanting substrate K. While the treatment fluid supplied onto the surface of the substrate K causes a liquid flow flowing downward by the slope and the treatment fluid on the surface of the substrate K is replaced in order with a newly supplied treatment fluid due to the liquid flow, retention and staying of the treatment fluid on the substrate K repeatedly occur over the entire surface of the substrate K by the vibration in the ejecting direction of the treatment fluid, thereby enhancing the cleaning effect. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a substrate processing method for processing a substrate by supplying a processing fluid onto various substrates such as a semiconductor (silicon) wafer, a liquid crystal glass substrate, a glass substrate for a photomask, and a substrate for an optical disk.
[0002]
[Prior art]
Examples of the processing of the substrate include application of a developing solution, application of an etching solution, application of a stripping solution for stripping a resist film, and washing treatment for washing away the developing solution, etching solution, and stripping solution. Can be. As an example of a processing apparatus for performing such processing, a cleaning apparatus as shown in FIG. 4 is conventionally known.
[0003]
As shown in FIG. 4, the cleaning apparatus 100 includes a processing chamber 101 having a closed space, and is disposed in the processing chamber 101. The cleaning apparatus 100 supports the substrate K horizontally and in a predetermined direction (in this case, And a plurality of nozzles 103 disposed above the transport roller 102 and discharging a cleaning liquid toward the upper surface (front surface) of the substrate K.
[0004]
Although not shown, a plurality of the transport rollers 102 are disposed at predetermined intervals in the transport direction, and both ends of a rotating shaft 102 a are respectively rotated by respective supporting devices 104 fixed to a side wall of the processing chamber 101. It is freely supported. Further, a flange portion 102c is formed on each of the rollers 102b located on both sides of the transport roller 102, and the flange portion 102c prevents the substrate K from moving in a direction orthogonal to the transport direction (arrow direction). Regulating.
[0005]
Note that one end of the rotating shaft 102a is connected to a driving device (not shown), and the driving device causes the rotating shaft 102a to rotate about its axis, whereby the transport roller 102 rotates to transfer the substrate K. The sheet is transported in the transport direction.
[0006]
Each of the nozzles 103 is fixed to a supply pipe 105 connected to a cleaning liquid supply device (not shown) as appropriate, and a plurality of the supply pipes 105 are provided in the transport direction in the same manner as the transport roller 102. Are arranged at predetermined intervals.
[0007]
According to the cleaning apparatus 100 configured as described above, the substrate K is transported in the transport direction by the transport roller 102, and the cleaning liquid is supplied to each of the supply pipes 105 from the cleaning liquid supply apparatus (not shown). The cleaning liquid is discharged from each nozzle 103 provided in each supply pipe 105, and the upper surface of the substrate K is cleaned by the cleaning liquid.
[0008]
[Problems to be solved by the invention]
However, in the above-described conventional cleaning apparatus 100, the cleaning liquid is discharged onto the substrate K and washed while transporting the horizontally supported substrate K in the horizontal direction. However, there is a problem that the flow of the cleaning liquid is hardly generated. For this reason, if a small amount of cleaning liquid is used, the initially supplied cleaning liquid stays on the surface of the substrate K, and it is difficult to replace it with a new cleaning liquid that is subsequently supplied. There has been a disadvantage that uniform cleaning cannot be performed.
[0009]
On the other hand, if a large amount of the cleaning liquid is used, the replacement property of the cleaning liquid on the surface of the substrate K is improved, but on the other hand, the manufacturing cost is high and inefficient, and further, the storage tank for storing the cleaning liquid is enlarged. This also leads to an increase in the size of the device.
[0010]
The present invention has been made in view of the above circumstances, and has as its object to provide a substrate processing method capable of efficiently processing a substrate.
[0011]
Means for Solving the Problems and Their Effects
The present invention for achieving the above object is a substrate processing method for processing a substrate by discharging a processing fluid toward the substrate from a nozzle disposed above the substrate,
While tilting the substrate at an angle of 5 ° or more and 7.5 ° or less with respect to a horizontal plane,
The present invention relates to a substrate processing method, characterized in that the nozzle is swung in a plane parallel to an inclination direction of the substrate and orthogonal to the substrate.
[0012]
According to the present invention, the processing is performed on the upper surface (front surface) of the substrate inclined at an angle in the above range with respect to the horizontal plane from the nozzle which is swung in a plane parallel to the inclination direction of the substrate and orthogonal to the substrate. Fluid is discharged. That is, the processing fluid is discharged onto the substrate while the discharge direction of the processing fluid is swung in the upward and downward directions of inclination of the substrate.
[0013]
The processing fluid supplied on the substrate surface generates a liquid flow that flows downward due to the inclination of the substrate, and the processing fluid on the substrate surface is sequentially replaced by a new processing fluid that is continuously supplied by the liquid flow. Then, the particles and the like attached to the substrate surface are washed away by the replacement action, and the substrate surface is purified. Further, when the discharge direction of the processing fluid is swung in the direction in which the substrate is inclined upward, the swing increases the action of retaining the processing fluid on the substrate surface, while the discharge direction of the processing fluid is decreased when the substrate is inclined downward. When the processing fluid is swung in the direction, the speed of the processing fluid flowing down on the substrate surface increases due to the swing, and the stagnation and flowing down of the processing fluid are repeatedly generated over the entire substrate surface. Become. As described above, according to the substrate processing method, such an operation allows the entire substrate surface to be uniformly processed in a short time with a small amount of processing fluid.
[0014]
By the way, the tilt angle of the substrate controls the speed of the liquid flow flowing down on the substrate surface, in other words, controls the time during which the processing fluid stays on the substrate surface, and this speed is appropriate. At a certain time, a desired processing effect can be obtained.
[0015]
From this point of view, the flow velocity of the treatment liquid is preferably such that the acceleration is in the range of 0.08 to 0.13 times the gravitational acceleration. Must be within the range of 5 ° or more and 7.5 ° or less. When the flow-down acceleration of the processing fluid exceeds 0.13 times the gravitational acceleration, that is, when the inclination angle exceeds 7.5 °, the velocity of the liquid flow becomes too high, and the residence time of the processing fluid on the substrate surface is reduced. On the contrary, if the flow-down acceleration of the processing fluid is less than 0.08 times the gravitational acceleration, that is, if the inclination angle is less than 5 °, the velocity of the liquid flow becomes too slow and the processing fluid This is because the stagnation occurs, and the treatment is not sufficiently performed in any case, and the usage amount of the treatment fluid increases.
[0016]
In recent years, as the size of the substrate increases, the amount of processing fluid used for processing the same and the processing time tend to increase. However, the substrate is inclined at the above angle, and the discharge direction of the processing fluid is changed By performing the processing by swinging the liquid in the upward and downward directions, the amount of processing fluid used can be reduced, the size of the apparatus can be reduced, and the processing cost can be reduced.
[0017]
The processing fluid includes various fluids for processing the substrate such as a developing solution, an etching solution, a stripping solution for stripping the resist film, and a cleaning solution for cleaning. To process this.
[0018]
Further, the processing may be performed by transporting the substrate in a preset direction and tilting the substrate at the above angle in a direction orthogonal to the transport direction.
[0019]
The swing angle of the nozzle is preferably in the range of 90 ° or more and 120 ° or less, and the operation time of one swing operation is preferably in the range of 2 seconds or more and 4 seconds or less. preferable. In this way, the substrate can be more effectively processed. Note that the swing angle of the nozzle is an inner angle at which the ejection center lines of the processing fluid ejected from the nozzle at the oscillation limit position cross each other.
[0020]
The plurality of nozzles may be arranged in a row so as to be orthogonal to the tilt direction of the substrate, or may be arranged in multiple rows along the tilt direction of the substrate. In this way, processing can be performed over a wide range, and a substrate having a large processing area can be processed at a time.
[0021]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, a substrate processing method according to a specific embodiment of the present invention will be described with reference to the accompanying drawings.
[0022]
First, a configuration of a substrate processing apparatus for performing the present substrate processing method will be described with reference to FIGS. FIG. 1 is a cross-sectional view showing a schematic configuration of the substrate processing apparatus, FIG. 2 is a cross-sectional view taken along the line AA in FIG. 1, and FIG. 3 is a line BB in FIG. It is sectional drawing of a direction.
[0023]
As shown in FIGS. 1 and 2, a substrate processing apparatus 1 of the present embodiment has a processing chamber 10 having a closed space, and is disposed in the processing chamber 10 and supports a substrate K in a predetermined direction (FIG. 2 includes a transport roller 11 that transports the cleaning liquid toward the upper surface (front surface) of the substrate K, and a plurality of nozzles 12 that are disposed above the transport roller 11 to transport the cleaning liquid toward the upper surface (front surface) of the substrate K.
[0024]
The transport rollers 11 are arranged at predetermined intervals in the transport direction, and the substrates K supported and transported by the transport rollers 11 are inclined at a predetermined angle θ in a direction perpendicular to the transport direction. The rotating shaft 11a is arranged to be inclined, and both ends of the rotating shaft 11a are rotatably supported by respective supporting devices 13 fixed to the side wall of the processing chamber 10. The inclination angle θ of the substrate K with respect to the horizontal plane is preferably in the range of 5 ° to 7.5 °, and is set to 7 ° in this example.
[0025]
One end of the rotating shaft 11a is connected to a driving device (not shown). The driving device (not shown) causes the rotating shaft 11a to rotate about its axis, thereby rotating the transport roller 11. Then, the substrate K is transported in the transport direction. A flange 11c is formed on the lowermost roller 11b in the direction of inclination of the transport roller 11, and the flange 11c prevents the substrate K from moving (sliding down) in the direction of inclination. ing.
[0026]
Each of the nozzles 12 is fixed to a plurality of supply pipes 14 connected to a cleaning liquid supply device (not shown) as appropriate along the axial direction thereof. Are arranged in parallel with each other in the transfer direction, and are arranged side by side in multiple rows in a plane inclined at the same angle as the inclination angle θ of the substrate K.
[0027]
Support portions 14a are formed at both ends of each supply pipe 14, and each of the support portions 14a is rotatably supported by a bearing 16 fixed to a support member 15. Each of the supply pipes 14 is configured to be rotated in the forward and reverse directions about the axis thereof by the swinging device 20, and the forward and reverse rotation of each of the supply pipes 14 causes each nozzle 12 to be orthogonal to the transport direction. The cleaning liquid discharged from these is swung in a plane, and the discharge direction of the cleaning liquid is swung in the upward and downward inclination directions of the substrate K. Note that the support member 15 is fixed to the side wall of the processing chamber 10 via the fixing member 17.
[0028]
As shown in FIGS. 2 and 3, the swing device 20 includes a driving motor 21, a rotating plate 22 provided on an output shaft 21 a of the driving motor 21, and a position deviated from a center position of the rotating plate 22. A first rod 23 rotatably provided upright about the axis, a first drive shaft 24 having one end provided inside the processing chamber 10 and the other end provided outside the processing chamber 10, A second rod 25 erected on the other end side so as to be rotatable about the axis, a first link 26 connecting the first rod 23 and the second rod 25, and a lower position of the supply pipe 14. A second drive shaft 27 which is disposed in parallel with the support member 15 at a predetermined interval and has a cutout portion 27a with which an engagement shaft 24a protruded from the first drive shaft 24 is engaged. , One end of which has an engagement hole 28a which engages with the support portion 14a of each supply pipe 14. Is formed, the engaging shaft 28b which is fitted into the engaging hole 27b formed on the second drive shaft 27 is made of a plurality of second link 28 projecting from the other end.
[0029]
Thus, when the drive motor 21 rotates, the rotational power is transmitted to the rotary plate 22 via the output shaft 21a and rotates, and the rotation of the rotary plate 22 causes the first rod 23, the first link 26 and the The first drive shaft 24 is moved back and forth (reciprocating) in the axial direction via the two rods 25. When the first drive shaft 24 moves back and forth in the axial direction, the power is transmitted to the second drive shaft 27, which is driven back and forth, and the second drive shaft 27 moves back and forth through the second link 28. As described above, the supply pipes 14 connected to the second drive shaft 27 are rotated forward and reverse around the axis thereof, and the nozzles 12 fixed thereto are swung in a plane perpendicular to the transport direction. I'm sullen.
[0030]
Note that the swing angle α of each nozzle 12 (the inner angle at which the discharge center lines of the cleaning liquid discharged from the nozzle 12 at the swing limit position intersect each other) is set in a range of 90 ° or more and 120 ° or less. It is preferable that the one swing operation time (swing cycle) of each nozzle 12 be set in a range from 2 seconds to 4 seconds.
[0031]
Next, a method of cleaning the substrate K using the substrate processing apparatus 1 configured as described above will be described. First, the substrate K is transported in the direction of arrow C in a state inclined by 7 ° with respect to the horizontal plane by the transport roller 11, and the cleaning liquid is supplied from the cleaning liquid supply device (not shown) to each of the supply pipes 14, respectively. The cleaning liquid is discharged from each nozzle 12 provided in the pipe 14. During the discharge of the cleaning liquid, each of the supply pipes 14 is rotated in the forward and reverse directions about the axis thereof by the oscillating device 20, and the discharge directions of the cleaning liquid discharged from the nozzles 12 are inclined upward and downward of the substrate K. Rocked in the direction.
[0032]
The cleaning liquid supplied to the surface of the substrate K generates a liquid flow that flows downward due to the inclination of the substrate K, and the cleaning liquid on the surface of the substrate K is sequentially replaced by a new cleaning liquid that is continuously supplied by the liquid flow. By such a replacement action, particles and the like attached to the surface of the substrate K are washed away, and the surface of the substrate K is purified.
[0033]
Further, when the discharge direction of the cleaning liquid is swung in the direction of ascending the substrate K, such a swing increases the action of retaining the cleaning liquid on the surface of the substrate K. When the cleaning liquid is swung in the direction, the speed of the cleaning liquid flowing down on the surface of the substrate K is increased by the rocking, and the retention and the flow of the cleaning liquid are repeatedly generated over the entire surface of the substrate K. Become. By such an action, the entire surface of the substrate K is uniformly cleaned with a small amount of cleaning liquid in a short time.
[0034]
In recent years, as the size of the substrate increases, the amount of the cleaning liquid used for cleaning the cleaning liquid and the cleaning time tend to increase. However, as described above, the substrate K is tilted, and the discharge direction of the cleaning liquid is changed. By cleaning the substrate K by swinging the substrate K in the upward and downward directions, the amount of cleaning liquid used can be reduced and the size of the apparatus can be reduced, and the processing cost can be reduced.
[0035]
By the way, the inclination angle θ of the substrate K controls the speed of the liquid flowing down on the surface of the substrate K. In other words, the inclination angle θ controls the time during which the cleaning liquid stays on the surface of the substrate K. When is suitable, a desired cleaning effect can be obtained.
[0036]
From such a viewpoint, the flow rate of the cleaning liquid is preferably such that the acceleration is in a range of 0.08 to 0.13 times the gravitational acceleration. The inclination angle needs to be in the range of 5 ° or more and 7.5 ° or less, and in this example, the inclination angle is set to 7 °.
[0037]
If the flow-down acceleration of the cleaning liquid exceeds 0.13 times the gravitational acceleration, that is, if the inclination angle of the substrate K exceeds 7.5 °, the velocity of the liquid flow becomes too high and the processing fluid on the surface of the substrate K If the residence time of the cleaning liquid is too short, on the contrary, if the falling velocity of the cleaning liquid is less than 0.08 times the gravitational acceleration, that is, if the inclination angle is less than 5 °, the velocity of the liquid flow becomes too slow and the surface of the substrate K This is because the cleaning liquid stays for a long time, and the treatment is not sufficiently performed in any case, and the amount of the cleaning liquid used increases.
[0038]
Incidentally, pure water was used as a cleaning liquid, the substrate K of 1100 mm × 1300 mm was placed in a horizontal posture, the nozzle 12 was fixed, the discharge rate was set to 120 L / min, and the surface of the substrate K was cleaned for 90 seconds. Although only 80% of particles having a diameter of 0.0 μm or more could be removed, the same substrate K was inclined by 7 ° with respect to the horizontal plane, and the nozzle 12 was swung in the upward and downward directions of the substrate K by 60 °. After cleaning for 2 seconds, 90% or more of particles having a diameter of 1.0 μm or more could be removed even if the discharge amount of the cleaning liquid from the nozzle 12 was 60 L / min.
[0039]
As mentioned above, although one Embodiment of this invention was described, the specific aspect which this invention can take is not limited to this at all.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view illustrating a schematic configuration of a substrate processing apparatus for performing a substrate processing method according to an embodiment of the present invention.
FIG. 2 is a sectional view in the direction of arrows AA in FIG.
FIG. 3 is a cross-sectional view in the direction of arrows BB in FIG. 2;
FIG. 4 is a cross-sectional view illustrating a schematic configuration of a substrate processing apparatus according to a conventional example.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 11 Transport roller 12 Nozzle 14 Supply pipe 16 Bearing 17 Support member 20 Swinging device 21 Drive motor 22 Rotating plate 23 First rod 24 First drive shaft 25 Second rod 26 First link 27 Second drive shaft 28 2nd link

Claims (7)

A substrate processing method for discharging a processing fluid from a nozzle disposed above a substrate toward the substrate, and processing the substrate,
While tilting the substrate at an angle of 5 ° or more and 7.5 ° or less with respect to a horizontal plane,
A substrate processing method, wherein the nozzle is swung in a plane parallel to a tilt direction of the substrate and orthogonal to the substrate. A substrate processing method for discharging a processing fluid from a nozzle disposed above a substrate toward the substrate, and processing the substrate,
The substrate is inclined with respect to a horizontal plane, and the inclination angle is set to an angle at which the acceleration of the processing fluid flowing down along the inclination direction of the substrate is 0.08 to 0.13 times the gravitational acceleration. With
A substrate processing method, wherein the nozzle is swung in a plane parallel to a tilt direction of the substrate and orthogonal to the substrate. 3. The substrate processing according to claim 1, wherein the substrate is transported in a preset direction, and the substrate is inclined in a direction orthogonal to the transport direction so that the processing fluid is discharged from the nozzle. Method. 4. The substrate processing method according to claim 1, wherein a swing angle of the nozzle is not less than 90 [deg.] And not more than 120 [deg.]. 5. The substrate processing method according to claim 1, wherein the one swing operation of the nozzle is performed within a time period of 2 seconds or more and 4 seconds or less. The substrate processing method according to any one of claims 1 to 5, wherein the processing fluid is discharged from a plurality of nozzles arranged in a row so as to be orthogonal to the tilt direction of the substrate. 7. The substrate processing method according to claim 6, wherein the processing fluid is discharged from a plurality of nozzles arranged in multiple rows along the direction of inclination of the substrate.

Images