SG10201407169UA - Method and apparatus for treating substrates - Google Patents

Method and apparatus for treating substrates

Info

Publication number
SG10201407169UA
SG10201407169UA SG10201407169UA SG10201407169UA SG10201407169UA SG 10201407169U A SG10201407169U A SG 10201407169UA SG 10201407169U A SG10201407169U A SG 10201407169UA SG 10201407169U A SG10201407169U A SG 10201407169UA SG 10201407169U A SG10201407169U A SG 10201407169UA
Authority
SG
Singapore
Prior art keywords
liquid
substrate
radiation
methods
treating substrates
Prior art date
Application number
SG10201407169UA
Inventor
Uwe Dietze
Peter Dress
Sherjang Sing
Original Assignee
Suss Microtec Photomask Equipment Gmbh & Co Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suss Microtec Photomask Equipment Gmbh & Co Kg filed Critical Suss Microtec Photomask Equipment Gmbh & Co Kg
Publication of SG10201407169UA publication Critical patent/SG10201407169UA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B6/00—Cleaning by electrostatic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0057—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by ultraviolet radiation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Abstract

METHOD AND APPARATUS FOR TREATING SUBSTRATES The application describes several methods and an apparatus for treatment of at least partial areas of a substrate. In said methods, at least one liquid is applied to at least one partial area of the substrate and electromagnetic radiation is introduced into this liquid, in order to achieve a desired effect in accordance with the respective method. In one method, radicals are generated in the liquid by means of UV radiation prior to application of the liquid, wherein generation of the radicals occurs directly before applying the liquid to the substrate. In one method, electromagnetic radiation is introduced into said liquid such that at least a portion of the radiation reaches the substrate surface. In another method, UV radiation of a predetermined range of wavelength is guided through said liquid onto at least the partial area of the surface of said substrate. The methods may be performed in a common apparatus in any desired order in series and/or in parallel. Figure 1
SG10201407169UA 2009-11-03 2010-03-15 Method and apparatus for treating substrates SG10201407169UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US25763309P 2009-11-03 2009-11-03
DE102009058962A DE102009058962B4 (en) 2009-11-03 2009-12-18 Method and device for treating substrates

Publications (1)

Publication Number Publication Date
SG10201407169UA true SG10201407169UA (en) 2014-12-30

Family

ID=43828929

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201407169UA SG10201407169UA (en) 2009-11-03 2010-03-15 Method and apparatus for treating substrates

Country Status (10)

Country Link
US (3) US9662684B2 (en)
EP (1) EP2496367B1 (en)
JP (1) JP5766197B2 (en)
KR (1) KR20120101427A (en)
CN (1) CN102791391B (en)
CA (1) CA2778288C (en)
DE (1) DE102009058962B4 (en)
HK (1) HK1175141A1 (en)
SG (1) SG10201407169UA (en)
WO (1) WO2011054405A2 (en)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013045961A (en) * 2011-08-25 2013-03-04 Dainippon Screen Mfg Co Ltd Substrate cleaning method, substrate cleaning liquid and substrate processing apparatus
DE102012008220A1 (en) * 2012-04-25 2013-10-31 Süss Microtec Photomask Equipment Gmbh & Co. Kg Method for cleaning photomasks using megasonic
US9339853B2 (en) 2012-12-04 2016-05-17 The Boeing Company Surface materials for decontamination with decontaminants
US8764905B1 (en) * 2013-03-14 2014-07-01 Intel Corporation Cleaning organic residues from EUV optics and masks
CN103691714B (en) * 2013-12-19 2015-12-02 合肥京东方光电科技有限公司 A kind of cleaning device and cleaning method
US9857680B2 (en) 2014-01-14 2018-01-02 Taiwan Semiconductor Manufacturing Company, Ltd. Cleaning module, cleaning apparatus and method of cleaning photomask
JP6357319B2 (en) * 2014-02-17 2018-07-11 株式会社プレテック Method and apparatus for cleaning substrate to be cleaned
CN104007610B (en) * 2014-06-12 2018-03-06 深圳市华星光电技术有限公司 The cleaning method and device of mask
KR102296739B1 (en) * 2014-10-27 2021-09-01 삼성전자 주식회사 Method of manufacturing integrated circuit device using photomask cleaning composition
DE102015011228B4 (en) * 2015-08-27 2017-06-14 Süss Microtec Photomask Equipment Gmbh & Co. Kg Device for applying a liquid medium exposed to UV radiation to a substrate
DE102015011229B4 (en) 2015-08-27 2020-07-23 Süss Microtec Photomask Equipment Gmbh & Co. Kg Device for applying a liquid medium exposed to UV radiation to a substrate
DE102015011177B4 (en) 2015-08-27 2017-09-14 Süss Microtec Photomask Equipment Gmbh & Co. Kg Device for applying a liquid medium exposed to UV radiation to a substrate
US11358172B2 (en) * 2015-09-24 2022-06-14 Suss Microtec Photomask Equipment Gmbh & Co. Kg Method for treating substrates with an aqueous liquid medium exposed to UV-radiation
US9966266B2 (en) 2016-04-25 2018-05-08 United Microelectronics Corp. Apparatus for semiconductor wafer treatment and semiconductor wafer treatment
KR101961326B1 (en) 2016-10-19 2019-07-18 세메스 주식회사 Method and Apparatus for cleaning component of apparatus for treating substrate
US10416575B2 (en) * 2016-11-16 2019-09-17 Suss Microtec Photomask Equipment Gmbh & Co. Kg Apparatus and method for cleaning a partial area of a substrate
DE102017203351B4 (en) * 2017-03-01 2021-08-05 Süss Microtec Photomask Equipment Gmbh & Co. Kg Device for applying a liquid medium exposed to UV radiation to a substrate
JP2018163980A (en) 2017-03-24 2018-10-18 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing method and substrate processing apparatus
JP2017113753A (en) * 2017-03-30 2017-06-29 株式会社トクヤマ Cleaning method and cleaning device
CN107203094B (en) * 2017-07-03 2020-07-24 京东方科技集团股份有限公司 Mask plate cleaning device and method
CN108380569A (en) * 2018-03-02 2018-08-10 常州瑞择微电子科技有限公司 High concentration OH free radical generating means
CN108816870B (en) * 2018-04-08 2021-05-25 苏州珮凯科技有限公司 Regeneration method of ceramic annular part of WxZ process in thin film manufacturing process of semiconductor 8-inch wafer
US10896824B2 (en) * 2018-12-14 2021-01-19 Tokyo Electron Limited Roughness reduction methods for materials using illuminated etch solutions
CN110112084A (en) * 2019-05-22 2019-08-09 长江存储科技有限责任公司 Semicoductor device washing apparatus
CN111906093A (en) * 2020-07-15 2020-11-10 常州瑞择微电子科技有限公司 Large-area photon generation spray head
CN112435938A (en) * 2020-11-11 2021-03-02 深圳市华星光电半导体显示技术有限公司 Substrate cleaning apparatus and substrate cleaning method

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2623497B2 (en) * 1988-03-07 1997-06-25 ウシオ電機株式会社 Ozone water activation device
US5068040A (en) * 1989-04-03 1991-11-26 Hughes Aircraft Company Dense phase gas photochemical process for substrate treatment
JPH04277748A (en) 1991-03-06 1992-10-02 Mitsubishi Paper Mills Ltd Planographic printing plate
US5814156A (en) * 1993-09-08 1998-09-29 Uvtech Systems Inc. Photoreactive surface cleaning
US5789755A (en) * 1996-08-28 1998-08-04 New Star Lasers, Inc. Method and apparatus for removal of material utilizing near-blackbody radiator means
US6869487B1 (en) * 1997-05-09 2005-03-22 Semitool, Inc. Process and apparatus for treating a workpiece such as a semiconductor wafer
JPH11121417A (en) * 1997-10-09 1999-04-30 Mitsubishi Electric Corp Treating system and treating method for semiconductor substrates
NL1012389C1 (en) * 1999-06-18 2000-12-19 Remmen Uv Techniek Van Ultraviolet lamp and shower head with a lamp.
DE10130999A1 (en) * 2000-06-29 2002-04-18 D M S Co Multifunction cleaning module of a manufacturing device for flat screens and cleaning device using the same
JP2002110611A (en) 2000-10-04 2002-04-12 Texas Instr Japan Ltd Method and apparatus for cleaning semiconductor wafer
JP4038557B2 (en) 2002-04-16 2008-01-30 リアライズ・アドバンストテクノロジ株式会社 Resist removing apparatus and resist removing method
JP3776092B2 (en) * 2003-03-25 2006-05-17 株式会社ルネサステクノロジ Etching apparatus, etching method, and manufacturing method of semiconductor device
US7921859B2 (en) * 2004-12-16 2011-04-12 Sematech, Inc. Method and apparatus for an in-situ ultraviolet cleaning tool
JP5140916B2 (en) * 2005-10-07 2013-02-13 富士通株式会社 Photochemical treatment apparatus and photochemical treatment method
US20070093406A1 (en) 2005-10-24 2007-04-26 Omoregie Henryson Novel cleaning process for masks and mask blanks
JP2007149972A (en) * 2005-11-28 2007-06-14 Matsushita Electric Ind Co Ltd Electronic device cleaning device and electronic device cleaning method
NL1030589C2 (en) 2005-12-05 2007-06-06 Houston R & D Consultancy B V Cleaning system for fluid conduit, e.g. beer tap system or water pipe, comprises UV radiation source connected to radiation guide inside conduit
JP5019156B2 (en) * 2006-08-21 2012-09-05 ウシオ電機株式会社 Excimer lamp device
JP2008108997A (en) * 2006-10-27 2008-05-08 Shibuya Kogyo Co Ltd Cleaning device
WO2008107933A1 (en) * 2007-03-07 2008-09-12 Fujitsu Limited Cleaning device and cleaning method

Also Published As

Publication number Publication date
CA2778288C (en) 2016-01-19
US10265739B2 (en) 2019-04-23
US20120211024A1 (en) 2012-08-23
US20170320108A1 (en) 2017-11-09
CN102791391A (en) 2012-11-21
CA2778288A1 (en) 2011-05-12
CN102791391B (en) 2016-05-25
KR20120101427A (en) 2012-09-13
US20170252781A1 (en) 2017-09-07
DE102009058962B4 (en) 2012-12-27
US9662684B2 (en) 2017-05-30
EP2496367A2 (en) 2012-09-12
JP5766197B2 (en) 2015-08-19
EP2496367B1 (en) 2016-02-10
HK1175141A1 (en) 2013-06-28
DE102009058962A1 (en) 2011-05-05
WO2011054405A3 (en) 2012-06-28
WO2011054405A2 (en) 2011-05-12
JP2013510332A (en) 2013-03-21

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