ATE3476T1 - Waermebestaendige positivresists und verfahren zur herstellung waermebestaendiger reliefstrukturen. - Google Patents

Waermebestaendige positivresists und verfahren zur herstellung waermebestaendiger reliefstrukturen.

Info

Publication number
ATE3476T1
ATE3476T1 AT80104288T AT80104288T ATE3476T1 AT E3476 T1 ATE3476 T1 AT E3476T1 AT 80104288 T AT80104288 T AT 80104288T AT 80104288 T AT80104288 T AT 80104288T AT E3476 T1 ATE3476 T1 AT E3476T1
Authority
AT
Austria
Prior art keywords
resistant
heat
positive resists
relief structures
processes
Prior art date
Application number
AT80104288T
Other languages
German (de)
English (en)
Inventor
Hellmut Dr. Ahne
Roland Dr. Rubner
Eberhard Kuehn
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Application granted granted Critical
Publication of ATE3476T1 publication Critical patent/ATE3476T1/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Materials For Photolithography (AREA)
  • Drying Of Semiconductors (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
AT80104288T 1979-08-01 1980-07-21 Waermebestaendige positivresists und verfahren zur herstellung waermebestaendiger reliefstrukturen. ATE3476T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19792931297 DE2931297A1 (de) 1979-08-01 1979-08-01 Waermebestaendige positivresists und verfahren zur herstellung waermebestaendiger reliefstrukturen
EP80104288A EP0023662B1 (de) 1979-08-01 1980-07-21 Wärmebeständige Positivresists und Verfahren zur Herstellung wärmebeständiger Reliefstrukturen

Publications (1)

Publication Number Publication Date
ATE3476T1 true ATE3476T1 (de) 1983-06-15

Family

ID=6077402

Family Applications (1)

Application Number Title Priority Date Filing Date
AT80104288T ATE3476T1 (de) 1979-08-01 1980-07-21 Waermebestaendige positivresists und verfahren zur herstellung waermebestaendiger reliefstrukturen.

Country Status (5)

Country Link
US (2) US4339521A (cg-RX-API-DMAC7.html)
EP (1) EP0023662B1 (cg-RX-API-DMAC7.html)
JP (1) JPS5627140A (cg-RX-API-DMAC7.html)
AT (1) ATE3476T1 (cg-RX-API-DMAC7.html)
DE (2) DE2931297A1 (cg-RX-API-DMAC7.html)

Families Citing this family (129)

* Cited by examiner, † Cited by third party
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JP5613851B1 (ja) * 2014-02-28 2014-10-29 Jsr株式会社 表示又は照明装置
KR102585279B1 (ko) 2014-10-02 2023-10-05 에이치디 마이크로시스템즈 가부시키가이샤 포지티브형 감광성 수지 조성물, 패턴 경화막의 제조 방법, 경화물, 층간 절연막, 커버 코트층, 표면 보호막 및 전자 부품
JP6711273B2 (ja) 2014-11-27 2020-06-17 東レ株式会社 樹脂および感光性樹脂組成物
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