ATE303657T1 - Drahtlose hochfrequenzprüfmethode für integrierte schaltungen und scheiben - Google Patents

Drahtlose hochfrequenzprüfmethode für integrierte schaltungen und scheiben

Info

Publication number
ATE303657T1
ATE303657T1 AT01933500T AT01933500T ATE303657T1 AT E303657 T1 ATE303657 T1 AT E303657T1 AT 01933500 T AT01933500 T AT 01933500T AT 01933500 T AT01933500 T AT 01933500T AT E303657 T1 ATE303657 T1 AT E303657T1
Authority
AT
Austria
Prior art keywords
test
integrated circuits
discs
high frequency
testing method
Prior art date
Application number
AT01933500T
Other languages
English (en)
Inventor
Brian Moore
Original Assignee
Univ Alberta
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Alberta filed Critical Univ Alberta
Application granted granted Critical
Publication of ATE303657T1 publication Critical patent/ATE303657T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/3025—Wireless interface with the DUT
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/303—Contactless testing of integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Automation & Control Theory (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Stabilization Of Oscillater, Synchronisation, Frequency Synthesizers (AREA)
AT01933500T 2000-05-15 2001-05-15 Drahtlose hochfrequenzprüfmethode für integrierte schaltungen und scheiben ATE303657T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CA002308820A CA2308820A1 (en) 2000-05-15 2000-05-15 Wireless radio frequency technique design and method for testing of integrated circuits and wafers
PCT/CA2001/000688 WO2001088976A2 (en) 2000-05-15 2001-05-15 Wireless radio frequency testing methode of integrated circuits and wafers

Publications (1)

Publication Number Publication Date
ATE303657T1 true ATE303657T1 (de) 2005-09-15

Family

ID=4166180

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01933500T ATE303657T1 (de) 2000-05-15 2001-05-15 Drahtlose hochfrequenzprüfmethode für integrierte schaltungen und scheiben

Country Status (8)

Country Link
US (3) US6759863B2 (de)
EP (1) EP1282913B1 (de)
JP (2) JP4869535B2 (de)
AT (1) ATE303657T1 (de)
CA (1) CA2308820A1 (de)
DE (1) DE60113096T2 (de)
ES (1) ES2248327T3 (de)
WO (1) WO2001088976A2 (de)

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US6759863B2 (en) 2004-07-06
US20030146771A1 (en) 2003-08-07
CA2308820A1 (en) 2001-11-15
EP1282913A2 (de) 2003-02-12
US8028208B2 (en) 2011-09-27
ES2248327T3 (es) 2006-03-16
JP2012023382A (ja) 2012-02-02
DE60113096D1 (de) 2005-10-06
WO2001088976A3 (en) 2002-07-18
US7183788B2 (en) 2007-02-27
US20040164760A1 (en) 2004-08-26
JP4869535B2 (ja) 2012-02-08
EP1282913B1 (de) 2005-08-31
US20070162801A1 (en) 2007-07-12
JP2003533882A (ja) 2003-11-11
WO2001088976A2 (en) 2001-11-22
DE60113096T2 (de) 2006-06-29
WO2001088976B1 (en) 2002-08-29

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