ITMI20070386A1 - Soppressione di interferenza in collaudo senza fili di dispositivi a semiconduttore - Google Patents

Soppressione di interferenza in collaudo senza fili di dispositivi a semiconduttore

Info

Publication number
ITMI20070386A1
ITMI20070386A1 IT000386A ITMI20070386A ITMI20070386A1 IT MI20070386 A1 ITMI20070386 A1 IT MI20070386A1 IT 000386 A IT000386 A IT 000386A IT MI20070386 A ITMI20070386 A IT MI20070386A IT MI20070386 A1 ITMI20070386 A1 IT MI20070386A1
Authority
IT
Italy
Prior art keywords
wires
test
semiconductor devices
interference suppression
suppression
Prior art date
Application number
IT000386A
Other languages
English (en)
Inventor
Alberto Pagani
Original Assignee
St Microelectronics Srl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by St Microelectronics Srl filed Critical St Microelectronics Srl
Priority to IT000386A priority Critical patent/ITMI20070386A1/it
Priority to CN2008100819402A priority patent/CN101256215B/zh
Priority to US12/037,319 priority patent/US7915908B2/en
Publication of ITMI20070386A1 publication Critical patent/ITMI20070386A1/it
Priority to US13/006,942 priority patent/US8643395B2/en
Priority to US14/171,211 priority patent/US9791498B2/en
Priority to US15/782,962 priority patent/US10641821B2/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302Contactless testing
    • G01R31/3025Wireless interface with the DUT
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302Contactless testing
    • G01R31/303Contactless testing of integrated circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Tests Of Electronic Circuits (AREA)
IT000386A 2007-02-28 2007-02-28 Soppressione di interferenza in collaudo senza fili di dispositivi a semiconduttore ITMI20070386A1 (it)

Priority Applications (6)

Application Number Priority Date Filing Date Title
IT000386A ITMI20070386A1 (it) 2007-02-28 2007-02-28 Soppressione di interferenza in collaudo senza fili di dispositivi a semiconduttore
CN2008100819402A CN101256215B (zh) 2007-02-28 2008-02-26 半导体器件无线测试中的串扰抑制
US12/037,319 US7915908B2 (en) 2007-02-28 2008-02-26 Crosstalk suppression in wireless testing of semiconductor devices
US13/006,942 US8643395B2 (en) 2007-02-28 2011-01-14 Crosstalk suppression in wireless testing of semiconductor devices
US14/171,211 US9791498B2 (en) 2007-02-28 2014-02-03 Crosstalk suppression in wireless testing of semiconductor devices
US15/782,962 US10641821B2 (en) 2007-02-28 2017-10-13 Crosstalk suppression in wireless testing of semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT000386A ITMI20070386A1 (it) 2007-02-28 2007-02-28 Soppressione di interferenza in collaudo senza fili di dispositivi a semiconduttore

Publications (1)

Publication Number Publication Date
ITMI20070386A1 true ITMI20070386A1 (it) 2008-09-01

Family

ID=39715159

Family Applications (1)

Application Number Title Priority Date Filing Date
IT000386A ITMI20070386A1 (it) 2007-02-28 2007-02-28 Soppressione di interferenza in collaudo senza fili di dispositivi a semiconduttore

Country Status (3)

Country Link
US (4) US7915908B2 (it)
CN (1) CN101256215B (it)
IT (1) ITMI20070386A1 (it)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8032030B2 (en) 2008-05-30 2011-10-04 Freescale Semiconductor, Inc. Multiple core system
US8294483B2 (en) * 2008-05-30 2012-10-23 Freescale Semiconductor, Inc. Testing of multiple integrated circuits
KR101548176B1 (ko) * 2009-02-02 2015-08-31 삼성전자주식회사 메모리 시스템, 메모리 테스트 시스템 및 이의 테스트 방법
US8952712B2 (en) 2010-06-16 2015-02-10 Broadcom Corporation Tagging of functional blocks of a semiconductor component on a wafer
US9002673B2 (en) 2010-06-16 2015-04-07 Broadcom Corporation Simultaneous testing of semiconductor components on a wafer
US8847617B2 (en) 2011-04-22 2014-09-30 Apple Inc. Non-contact test system for determining whether electronic device structures contain manufacturing faults
US9134368B2 (en) * 2012-05-07 2015-09-15 Taiwan Semiconductor Manufacturing Co., Ltd. Contactless wafer probing with improved power supply
US9876487B2 (en) * 2013-09-27 2018-01-23 International Business Machines Corporation Contactless readable programmable transponder to monitor chip join
US9891266B2 (en) 2014-02-25 2018-02-13 Taiwan Semiconductor Manufacturing Co., Ltd. Test circuit and method
JP2015197365A (ja) * 2014-04-01 2015-11-09 株式会社デンソー 半導体装置および半導体装置のテストシステム
DE102014222203B3 (de) * 2014-10-30 2016-03-10 Infineon Technologies Ag Überprüfung von Randschäden
KR20160104967A (ko) * 2015-02-27 2016-09-06 에스케이하이닉스 주식회사 주파수 가변형 프로브 테스트 패드를 갖는 반도체 집적 회로 장치, 이를 포함하는 반도체 시스템, 및 프로브 테스트 방법
CN106771959A (zh) * 2016-11-16 2017-05-31 上海华岭集成电路技术股份有限公司 一种晶圆测试系统
CN106841980B (zh) * 2017-01-10 2020-10-23 芯原微电子(上海)股份有限公司 一种蓝牙集成电路测试系统和测试方法
US10852344B2 (en) 2017-12-12 2020-12-01 Micron Technology, Inc. Inductive testing probe apparatus for testing semiconductor die and related systems and methods
CN109188253A (zh) * 2018-10-22 2019-01-11 珠海格力智能装备有限公司 检测方法及检测系统
CN109471016A (zh) * 2018-11-09 2019-03-15 德淮半导体有限公司 探针卡、晶圆、无线测试系统及方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4649569A (en) * 1984-05-31 1987-03-10 Westinghouse Electric Corp. Transceiver with auto frequency sense
US4859990A (en) * 1987-04-15 1989-08-22 Linear Corporation Electrically programmable transceiver security system and integrated circuit
US6058497A (en) * 1992-11-20 2000-05-02 Micron Technology, Inc. Testing and burn-in of IC chips using radio frequency transmission
US6362737B1 (en) * 1998-06-02 2002-03-26 Rf Code, Inc. Object Identification system with adaptive transceivers and methods of operation
US6373447B1 (en) * 1998-12-28 2002-04-16 Kawasaki Steel Corporation On-chip antenna, and systems utilizing same
CA2308820A1 (en) * 2000-05-15 2001-11-15 The Governors Of The University Of Alberta Wireless radio frequency technique design and method for testing of integrated circuits and wafers
US6785180B2 (en) * 2001-03-15 2004-08-31 Micron Technology, Inc. Programmable soft-start control for charge pump
US7336174B1 (en) * 2001-08-09 2008-02-26 Key Control Holding, Inc. Object tracking system with automated system control and user identification
CA2404183C (en) * 2002-09-19 2008-09-02 Scanimetrics Inc. Non-contact tester for integrated circuits
US7325180B2 (en) * 2003-11-26 2008-01-29 Carnegie Mellon University System and method to test integrated circuits on a wafer
US7466157B2 (en) * 2004-02-05 2008-12-16 Formfactor, Inc. Contactless interfacing of test signals with a device under test
US7181663B2 (en) * 2004-03-01 2007-02-20 Verigy Pte, Ltd. Wireless no-touch testing of integrated circuits
US7202687B2 (en) * 2004-04-08 2007-04-10 Formfactor, Inc. Systems and methods for wireless semiconductor device testing
US20060132167A1 (en) * 2004-12-22 2006-06-22 Jian Chen Contactless wafer level burn-in
TWI264551B (en) * 2005-05-04 2006-10-21 Univ Tsinghua System for probing integrated circuit devices
US7257504B2 (en) * 2005-06-03 2007-08-14 Tagent Corporation Production of radio frequency ID tags
US7417449B1 (en) * 2005-11-15 2008-08-26 Advanced Micro Devices, Inc. Wafer stage storage structure speed testing
ITTO20070563A1 (it) * 2007-07-30 2009-01-31 St Microelectronics Srl Dispositivo di identificazione a radiofrequenza con antenna accoppiata in near field

Also Published As

Publication number Publication date
CN101256215A (zh) 2008-09-03
US20140191779A1 (en) 2014-07-10
US20180045775A1 (en) 2018-02-15
US7915908B2 (en) 2011-03-29
US8643395B2 (en) 2014-02-04
US10641821B2 (en) 2020-05-05
CN101256215B (zh) 2012-10-10
US20110109342A1 (en) 2011-05-12
US20080204055A1 (en) 2008-08-28
US9791498B2 (en) 2017-10-17

Similar Documents

Publication Publication Date Title
ITMI20070386A1 (it) Soppressione di interferenza in collaudo senza fili di dispositivi a semiconduttore
TWI366875B (en) Method of manufacturing semiconductor device
DE112009000253B8 (de) Halbleitervorrichtung
DE602008000468D1 (de) Halbleiterbauelement
TWI365508B (en) Manufacturing method of semiconductor device
BRPI1012070A2 (pt) "dispositivo semicondutor"
DE112009005394T8 (de) Kühlstruktur einer Halbleitervorrichtung
DK2249392T3 (da) Omvendt ledende halvlederenhed
IT1400778B1 (it) Dispositivo di soppressione di vibrazioni
DE602008002784D1 (de) Halbleiterbauelement
DE602007013318D1 (de) Halbleiterbauelement
EP2634824A4 (en) COMPOSITE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
EP2244301A4 (en) METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
DE102011082289A8 (de) SiC-Halbleitervorrichtung und Herstellungsverfahren hierfür
BR112012031951A2 (pt) estrutura semicondutora e método de fabricação da mesma
EP2549528A4 (en) COMPOSITE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
GB2488401B (en) Method of manufacturing semiconductor device structure
DE602007013972D1 (de) Halbleiterbauelement
FI20085109A0 (fi) Tietoliikenneyksiköiden välinen koeksistenssi
DE102009052393B8 (de) Halbleiterherstellungsverfahren
DE602007002105D1 (de) Halbleiterbauelement
DK2161745T3 (da) Stakkede arrangementer indeholdende halvlederindretninger
IT1393670B1 (it) Dispositivo di timbratura
DE602008003590D1 (de) Halbleiterbauelement
DK2568948T4 (da) Tilslutningsindretning