ATE255962T1 - Reaktor mit mikroumgebung zur verarbeitung eines mikroelektronischen werkstücks - Google Patents
Reaktor mit mikroumgebung zur verarbeitung eines mikroelektronischen werkstücksInfo
- Publication number
- ATE255962T1 ATE255962T1 AT99912558T AT99912558T ATE255962T1 AT E255962 T1 ATE255962 T1 AT E255962T1 AT 99912558 T AT99912558 T AT 99912558T AT 99912558 T AT99912558 T AT 99912558T AT E255962 T1 ATE255962 T1 AT E255962T1
- Authority
- AT
- Austria
- Prior art keywords
- workpiece
- processing
- reactor
- housing
- microelectronic workpiece
- Prior art date
Links
- 238000004377 microelectronic Methods 0.000 title 1
- 230000001133 acceleration Effects 0.000 abstract 1
- 239000012530 fluid Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32134—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by liquid etching only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
- ing And Chemical Polishing (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Coating Apparatus (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/041,901 US6350319B1 (en) | 1998-03-13 | 1998-03-13 | Micro-environment reactor for processing a workpiece |
US09/041,649 US6318385B1 (en) | 1998-03-13 | 1998-03-13 | Micro-environment chamber and system for rinsing and drying a semiconductor workpiece |
US09/113,435 US6264752B1 (en) | 1998-03-13 | 1998-07-10 | Reactor for processing a microelectronic workpiece |
US11675099P | 1999-01-22 | 1999-01-22 | |
US11747499P | 1999-01-27 | 1999-01-27 | |
PCT/US1999/005676 WO1999046065A1 (en) | 1998-03-13 | 1999-03-15 | Micro-environment reactor for processing a microelectronic workpiece |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE255962T1 true ATE255962T1 (de) | 2003-12-15 |
Family
ID=27534766
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT99912558T ATE255962T1 (de) | 1998-03-13 | 1999-03-15 | Reaktor mit mikroumgebung zur verarbeitung eines mikroelektronischen werkstücks |
AT99912557T ATE299402T1 (de) | 1998-03-13 | 1999-03-15 | Selektive behandlung der oberfläche eines mikroelektronischen werkstücks |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT99912557T ATE299402T1 (de) | 1998-03-13 | 1999-03-15 | Selektive behandlung der oberfläche eines mikroelektronischen werkstücks |
Country Status (8)
Country | Link |
---|---|
EP (2) | EP1085948B1 (de) |
JP (2) | JP4189125B2 (de) |
KR (1) | KR100555258B1 (de) |
CN (2) | CN100342487C (de) |
AT (2) | ATE255962T1 (de) |
DE (2) | DE69926127T2 (de) |
TW (2) | TW452828B (de) |
WO (2) | WO1999046065A1 (de) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6900132B2 (en) | 1998-03-13 | 2005-05-31 | Semitool, Inc. | Single workpiece processing system |
US6423642B1 (en) * | 1998-03-13 | 2002-07-23 | Semitool, Inc. | Reactor for processing a semiconductor wafer |
US6680253B2 (en) | 1999-01-22 | 2004-01-20 | Semitool, Inc. | Apparatus for processing a workpiece |
US7217325B2 (en) | 1999-01-22 | 2007-05-15 | Semitool, Inc. | System for processing a workpiece |
US6548411B2 (en) | 1999-01-22 | 2003-04-15 | Semitool, Inc. | Apparatus and methods for processing a workpiece |
US6969682B2 (en) | 1999-01-22 | 2005-11-29 | Semitool, Inc. | Single workpiece processing system |
US6492284B2 (en) | 1999-01-22 | 2002-12-10 | Semitool, Inc. | Reactor for processing a workpiece using sonic energy |
US6930046B2 (en) | 1999-01-22 | 2005-08-16 | Semitool, Inc. | Single workpiece processing system |
JP3395696B2 (ja) * | 1999-03-15 | 2003-04-14 | 日本電気株式会社 | ウェハ処理装置およびウェハ処理方法 |
FI118342B (fi) | 1999-05-10 | 2007-10-15 | Asm Int | Laite ohutkalvojen valmistamiseksi |
US7780867B1 (en) | 1999-10-01 | 2010-08-24 | Novellus Systems, Inc. | Edge bevel removal of copper from silicon wafers |
US6423636B1 (en) * | 1999-11-19 | 2002-07-23 | Applied Materials, Inc. | Process sequence for improved seed layer productivity and achieving 3mm edge exclusion for a copper metalization process on semiconductor wafer |
US6286231B1 (en) | 2000-01-12 | 2001-09-11 | Semitool, Inc. | Method and apparatus for high-pressure wafer processing and drying |
JP2001319849A (ja) * | 2000-05-08 | 2001-11-16 | Tokyo Electron Ltd | 液処理装置及び液処理方法 |
US8100081B1 (en) | 2006-06-30 | 2012-01-24 | Novellus Systems, Inc. | Edge removal of films using externally generated plasma species |
US9732416B1 (en) | 2007-04-18 | 2017-08-15 | Novellus Systems, Inc. | Wafer chuck with aerodynamic design for turbulence reduction |
WO2008143476A1 (en) * | 2007-05-23 | 2008-11-27 | Semes Co., Ltd. | Apparatus and method for drying substrates |
JP5705723B2 (ja) * | 2008-05-09 | 2015-04-22 | テル エフエスアイ インコーポレイテッド | 操作において開モードと閉モードとの切り替えを簡単に行う加工チェンバ設計を用いてマイクロ電子加工品を加工するための道具および方法 |
US8419964B2 (en) | 2008-08-27 | 2013-04-16 | Novellus Systems, Inc. | Apparatus and method for edge bevel removal of copper from silicon wafers |
JP4864949B2 (ja) * | 2008-09-12 | 2012-02-01 | 株式会社東芝 | 半導体装置の製造方法及び半導体製造装置 |
US8172646B2 (en) | 2009-02-27 | 2012-05-08 | Novellus Systems, Inc. | Magnetically actuated chuck for edge bevel removal |
US8496790B2 (en) * | 2011-05-18 | 2013-07-30 | Applied Materials, Inc. | Electrochemical processor |
US8899246B2 (en) * | 2011-11-23 | 2014-12-02 | Lam Research Ag | Device and method for processing wafer shaped articles |
US9435025B2 (en) | 2013-09-25 | 2016-09-06 | Applied Materials, Inc. | Gas apparatus, systems, and methods for chamber ports |
DE102014017451A1 (de) * | 2014-11-26 | 2016-06-02 | Eisenmann Se | Anlage zum Behandeln eines Guts |
DE102015001246B3 (de) | 2015-01-31 | 2016-06-16 | Audi Ag | Reinigungsvorrichtung für eine mechanische Reinigung einer Gasdüse eines Schutzgas-Schweißbrenners |
CN107497639B (zh) * | 2017-09-27 | 2022-09-06 | 济南迈克阀门科技有限公司 | 一种阀盖浸塑工装 |
Family Cites Families (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3727620A (en) * | 1970-03-18 | 1973-04-17 | Fluoroware Of California Inc | Rinsing and drying device |
JPS5212576A (en) * | 1975-07-21 | 1977-01-31 | Hitachi Ltd | Wafer washing drying device |
US4439244A (en) * | 1982-08-03 | 1984-03-27 | Texas Instruments Incorporated | Apparatus and method of material removal having a fluid filled slot |
US4838289A (en) * | 1982-08-03 | 1989-06-13 | Texas Instruments Incorporated | Apparatus and method for edge cleaning |
US4439243A (en) * | 1982-08-03 | 1984-03-27 | Texas Instruments Incorporated | Apparatus and method of material removal with fluid flow within a slot |
JPS609129A (ja) * | 1983-06-29 | 1985-01-18 | Fujitsu Ltd | ウエツト処理装置 |
US4544446A (en) * | 1984-07-24 | 1985-10-01 | J. T. Baker Chemical Co. | VLSI chemical reactor |
JPS61178187U (de) * | 1985-04-26 | 1986-11-06 | ||
JPH0444216Y2 (de) * | 1985-10-07 | 1992-10-19 | ||
JPS62166515A (ja) * | 1986-01-20 | 1987-07-23 | Hitachi Electronics Eng Co Ltd | 半導体製造装置の処理カツプ |
US4788994A (en) * | 1986-08-13 | 1988-12-06 | Dainippon Screen Mfg. Co. | Wafer holding mechanism |
US4732785A (en) * | 1986-09-26 | 1988-03-22 | Motorola, Inc. | Edge bead removal process for spin on films |
JPS63185029A (ja) * | 1987-01-28 | 1988-07-30 | Hitachi Ltd | ウエハ処理装置 |
JPH01120023A (ja) * | 1987-11-02 | 1989-05-12 | Seiko Epson Corp | スピン現像装置 |
AT389959B (de) * | 1987-11-09 | 1990-02-26 | Sez Semiconduct Equip Zubehoer | Vorrichtung zum aetzen von scheibenfoermigen gegenstaenden, insbesondere von siliziumscheiben |
US5224504A (en) * | 1988-05-25 | 1993-07-06 | Semitool, Inc. | Single wafer processor |
US5168886A (en) * | 1988-05-25 | 1992-12-08 | Semitool, Inc. | Single wafer processor |
JPH0264646A (ja) * | 1988-08-31 | 1990-03-05 | Toshiba Corp | レジストパターンの現像方法及びこの方法に使用する現像装置 |
US5234499A (en) * | 1990-06-26 | 1993-08-10 | Dainippon Screen Mgf. Co., Ltd. | Spin coating apparatus |
DE4024576A1 (de) * | 1990-08-02 | 1992-02-06 | Bosch Gmbh Robert | Vorrichtung zum einseitigen aetzen einer halbleiterscheibe |
DE4109955A1 (de) * | 1991-03-26 | 1992-10-01 | Siemens Ag | Verfahren zum nasschemischen aetzen einer wolframrueckseitenbeschichtung auf einer halbleiterscheibe |
JP3241058B2 (ja) * | 1991-03-28 | 2001-12-25 | 大日本スクリーン製造株式会社 | 回転式塗布装置及び回転式塗布方法 |
JPH0513322A (ja) * | 1991-07-09 | 1993-01-22 | Ryoden Semiconductor Syst Eng Kk | 被膜溶剤塗布装置 |
JPH0521332A (ja) * | 1991-07-10 | 1993-01-29 | Oki Electric Ind Co Ltd | レジスト除去装置 |
JP2591555B2 (ja) * | 1991-12-20 | 1997-03-19 | 東京応化工業株式会社 | 塗布装置 |
DE4202194C2 (de) * | 1992-01-28 | 1996-09-19 | Fairchild Convac Gmbh Geraete | Verfahren und Vorrichtung zum partiellen Entfernen von dünnen Schichten von einem Substrat |
US5439519A (en) * | 1992-04-28 | 1995-08-08 | Tokyo Ohka Kogyo Co., Ltd. | Solution applying apparatus |
JPH05326483A (ja) * | 1992-05-15 | 1993-12-10 | Sony Corp | ウエハ処理装置およびウエハ一貫処理装置 |
JP2654314B2 (ja) * | 1992-06-04 | 1997-09-17 | 東京応化工業株式会社 | 裏面洗浄装置 |
JP3030796B2 (ja) * | 1992-07-24 | 2000-04-10 | 東京エレクトロン株式会社 | 洗浄処理方法 |
US5474807A (en) * | 1992-09-30 | 1995-12-12 | Hoya Corporation | Method for applying or removing coatings at a confined peripheral region of a substrate |
JP3388628B2 (ja) * | 1994-03-24 | 2003-03-24 | 東京応化工業株式会社 | 回転式薬液処理装置 |
US5718763A (en) * | 1994-04-04 | 1998-02-17 | Tokyo Electron Limited | Resist processing apparatus for a rectangular substrate |
JP3521587B2 (ja) * | 1995-02-07 | 2004-04-19 | セイコーエプソン株式会社 | 基板周縁の不要物除去方法及び装置並びにそれを用いた塗布方法 |
JPH09181026A (ja) * | 1995-12-25 | 1997-07-11 | Toshiba Corp | 半導体装置の製造装置 |
JPH104076A (ja) * | 1996-06-15 | 1998-01-06 | Sony Corp | 枚葉型ウエハ洗浄装置 |
US5897379A (en) * | 1997-12-19 | 1999-04-27 | Sharp Microelectronics Technology, Inc. | Low temperature system and method for CVD copper removal |
JP3395696B2 (ja) * | 1999-03-15 | 2003-04-14 | 日本電気株式会社 | ウェハ処理装置およびウェハ処理方法 |
-
1999
- 1999-03-09 TW TW088103580A patent/TW452828B/zh active
- 1999-03-11 TW TW088103730A patent/TW471059B/zh not_active IP Right Cessation
- 1999-03-15 JP JP2000535469A patent/JP4189125B2/ja not_active Expired - Fee Related
- 1999-03-15 AT AT99912558T patent/ATE255962T1/de active
- 1999-03-15 EP EP99912558A patent/EP1085948B1/de not_active Expired - Lifetime
- 1999-03-15 DE DE69926127T patent/DE69926127T2/de not_active Expired - Lifetime
- 1999-03-15 WO PCT/US1999/005676 patent/WO1999046065A1/en active Application Filing
- 1999-03-15 EP EP99912557A patent/EP1091811B8/de not_active Expired - Lifetime
- 1999-03-15 CN CNB2004100705367A patent/CN100342487C/zh not_active Expired - Fee Related
- 1999-03-15 KR KR1020007010126A patent/KR100555258B1/ko not_active IP Right Cessation
- 1999-03-15 DE DE69913521T patent/DE69913521T2/de not_active Expired - Lifetime
- 1999-03-15 AT AT99912557T patent/ATE299402T1/de active
- 1999-03-15 JP JP2000535468A patent/JP2002506294A/ja active Pending
- 1999-03-15 CN CNB998039543A patent/CN1167518C/zh not_active Expired - Fee Related
- 1999-03-15 WO PCT/US1999/005674 patent/WO1999046064A1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
EP1085948A1 (de) | 2001-03-28 |
TW452828B (en) | 2001-09-01 |
EP1091811B1 (de) | 2005-07-13 |
EP1091811A4 (de) | 2002-01-30 |
EP1091811A1 (de) | 2001-04-18 |
EP1085948A4 (de) | 2002-01-23 |
ATE299402T1 (de) | 2005-07-15 |
CN1167518C (zh) | 2004-09-22 |
EP1085948B1 (de) | 2003-12-10 |
TW471059B (en) | 2002-01-01 |
DE69926127T2 (de) | 2006-05-11 |
KR20010052209A (ko) | 2001-06-25 |
DE69926127D1 (de) | 2005-08-18 |
JP4189125B2 (ja) | 2008-12-03 |
CN1599025A (zh) | 2005-03-23 |
JP2002506294A (ja) | 2002-02-26 |
EP1091811B8 (de) | 2005-12-07 |
CN100342487C (zh) | 2007-10-10 |
DE69913521D1 (de) | 2004-01-22 |
JP2003517364A (ja) | 2003-05-27 |
CN1292736A (zh) | 2001-04-25 |
DE69913521T2 (de) | 2004-10-14 |
WO1999046065A1 (en) | 1999-09-16 |
KR100555258B1 (ko) | 2006-03-03 |
WO1999046064A1 (en) | 1999-09-16 |
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Legal Events
Date | Code | Title | Description |
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UEP | Publication of translation of european patent specification |
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