ATE227784T1 - Lösung für stromlose kupferplattierung und verfahren zur stromlosen kupferplattierung - Google Patents

Lösung für stromlose kupferplattierung und verfahren zur stromlosen kupferplattierung

Info

Publication number
ATE227784T1
ATE227784T1 AT96943311T AT96943311T ATE227784T1 AT E227784 T1 ATE227784 T1 AT E227784T1 AT 96943311 T AT96943311 T AT 96943311T AT 96943311 T AT96943311 T AT 96943311T AT E227784 T1 ATE227784 T1 AT E227784T1
Authority
AT
Austria
Prior art keywords
electroless copper
copper plating
plating solution
copper
electroless
Prior art date
Application number
AT96943311T
Other languages
English (en)
Inventor
Hideo Honma
Tomoyuki Fujinami
Yoshitaka Terashima
Shinji Hayashi
Satoru Shimizu
Original Assignee
Ebara Udylite Kk
Hideo Honma
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Udylite Kk, Hideo Honma filed Critical Ebara Udylite Kk
Application granted granted Critical
Publication of ATE227784T1 publication Critical patent/ATE227784T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
AT96943311T 1996-06-03 1996-12-26 Lösung für stromlose kupferplattierung und verfahren zur stromlosen kupferplattierung ATE227784T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP16044496 1996-06-03
PCT/JP1996/003829 WO1997046731A1 (fr) 1996-06-03 1996-12-26 Solution de depot de cuivre sans electrolyse et procede de depot de cuivre sans electrolyse

Publications (1)

Publication Number Publication Date
ATE227784T1 true ATE227784T1 (de) 2002-11-15

Family

ID=15715071

Family Applications (1)

Application Number Title Priority Date Filing Date
AT96943311T ATE227784T1 (de) 1996-06-03 1996-12-26 Lösung für stromlose kupferplattierung und verfahren zur stromlosen kupferplattierung

Country Status (13)

Country Link
US (1) US6193789B1 (de)
EP (1) EP0909838B1 (de)
JP (1) JP3192431B2 (de)
KR (1) KR100413240B1 (de)
CN (1) CN1195889C (de)
AT (1) ATE227784T1 (de)
AU (1) AU726422B2 (de)
CA (1) CA2257185A1 (de)
DE (1) DE69624846T2 (de)
HK (1) HK1019773A1 (de)
RU (1) RU2182936C2 (de)
TW (1) TW448241B (de)
WO (1) WO1997046731A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050205111A1 (en) * 1999-10-12 2005-09-22 Ritzdorf Thomas L Method and apparatus for processing a microfeature workpiece with multiple fluid streams
US6875691B2 (en) * 2002-06-21 2005-04-05 Mattson Technology, Inc. Temperature control sequence of electroless plating baths
US8241701B2 (en) * 2005-08-31 2012-08-14 Lam Research Corporation Processes and systems for engineering a barrier surface for copper deposition
DE102005038208B4 (de) * 2005-08-12 2009-02-26 Müller, Thomas Verfahren zur Herstellung von Silberschichten und seine Verwendung
US7905994B2 (en) * 2007-10-03 2011-03-15 Moses Lake Industries, Inc. Substrate holder and electroplating system
US20090188553A1 (en) * 2008-01-25 2009-07-30 Emat Technology, Llc Methods of fabricating solar-cell structures and resulting solar-cell structures
US8262894B2 (en) 2009-04-30 2012-09-11 Moses Lake Industries, Inc. High speed copper plating bath
DE102010012204B4 (de) * 2010-03-19 2019-01-24 MacDermid Enthone Inc. (n.d.Ges.d. Staates Delaware) Verbessertes Verfahren zur Direktmetallisierung von nicht leitenden Substraten
ES2828459T3 (es) 2014-07-10 2021-05-26 Okuno Chem Ind Co Método de galvanización de resina
CN105063582B (zh) * 2015-07-23 2017-10-31 珠海元盛电子科技股份有限公司 一种离子液体化学镀铜的方法
EP3714085B1 (de) * 2017-11-20 2023-08-09 Basf Se Zusammensetzung zur elektroplattierung von kobalt oder kobaltlegierung mit verlaufsmittel
CN108336473A (zh) * 2018-02-06 2018-07-27 北京宏诚创新科技有限公司 铜-铝纳米接面常温制程方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5177404A (de) * 1974-12-26 1976-07-05 Fuji Photo Film Co Ltd
DE3473890D1 (en) 1983-07-25 1988-10-13 Hitachi Ltd Electroless copper plating solution
JPS60155683A (ja) 1984-01-25 1985-08-15 Hitachi Chem Co Ltd 無電解銅めつき液
KR920002710B1 (ko) * 1984-06-18 1992-03-31 가부시기가이샤 히다찌세이사꾸쇼 화학동도금방법
US4908242A (en) * 1986-10-31 1990-03-13 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
US4818286A (en) * 1988-03-08 1989-04-04 International Business Machines Corporation Electroless copper plating bath
JPH0230768A (ja) * 1988-07-18 1990-02-01 Hitachi Chem Co Ltd 無電解めっき用前処理液
JPH02145771A (ja) 1988-11-24 1990-06-05 Hitachi Chem Co Ltd 無電解銅めっき液建浴用銅濃縮液
JPH04198486A (ja) * 1990-06-18 1992-07-17 Hitachi Chem Co Ltd 無電解めっき前処理液
JP2648729B2 (ja) * 1990-09-04 1997-09-03 英夫 本間 無電解銅めっき液および無電解銅めっき方法
JPH04157167A (ja) * 1990-10-17 1992-05-29 Hitachi Chem Co Ltd 無電解めっき用前処理液
JP2819523B2 (ja) * 1992-10-09 1998-10-30 インターナショナル・ビジネス・マシーンズ・コーポレイション 印刷配線板及びその製造方法
JPH0783171B2 (ja) 1993-04-12 1995-09-06 日本電気株式会社 半田膜形成方法
US5338342A (en) 1993-05-21 1994-08-16 Mallory Jr Glen O Stabilized electroless nickel plating baths
JPH07240579A (ja) * 1994-02-25 1995-09-12 Mitsubishi Electric Corp 多層プリント配線板の製造方法

Also Published As

Publication number Publication date
AU1208797A (en) 1998-01-05
CN1219981A (zh) 1999-06-16
AU726422B2 (en) 2000-11-09
HK1019773A1 (en) 2000-02-25
DE69624846T2 (de) 2003-03-20
EP0909838A1 (de) 1999-04-21
EP0909838A4 (de) 2000-02-02
TW448241B (en) 2001-08-01
RU2182936C2 (ru) 2002-05-27
US6193789B1 (en) 2001-02-27
KR100413240B1 (ko) 2004-06-09
CN1195889C (zh) 2005-04-06
CA2257185A1 (en) 1997-12-11
KR20000016062A (ko) 2000-03-25
EP0909838B1 (de) 2002-11-13
JP3192431B2 (ja) 2001-07-30
DE69624846D1 (de) 2002-12-19
WO1997046731A1 (fr) 1997-12-11

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