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Application filed by Hideo Honma, Ebara Udylite KkfiledCriticalHideo Honma
Priority to MYPI9705769priorityCriticalpatent/MY122145A/en
Publication of MY122145ApublicationCriticalpatent/MY122145A/en
AN ELECTROLESS COPPER PLATING SOLUTION WHICH IS BASED ON AN ELECTROLESS COPPER PLATING SOLUTION COMPRISING A COPPER ION, A COMPLEXING AGENT, A HYPOPHOSPHOROUS ACID COMPOUND AS A REDUCING AGENT, AND A METALLIC CATALYST FOR INITIATING A REDUCTIVE REACTION, AS CHARACTERIZED BY FURTHER COMPRISING A LITHIUM ION OR BOTH A LITHIUM ION AND A POLYOXYETHYLENE TYPE SURFACTANT, AND A METHOD FOR ELECTROLESS COPPER PLATING USING THE SAME, AS WELL AS A PLATED PRODUCT MADE BY SUCH A PROCESS. THE ELECTROLESS COPPER PLATING SOLUTION IN THE PRESENT INVENTION ENABLES A UNIFORM AND ACICULAR COPPER FILM TO BE DEPOSITED ON THE SURFACE OF A PLATING OBJECT, AND THEREFORE CAN BE USED FOR IMPROVING THE STRENGTH OF ADHESION BETWEEN VARIOUS METALS AND RESINS, INCLUDING BONDING OF A COPPER FOIL TO A RESIN AS APPLIED IN A CONDUCTIVE CIRCUIT SUCH AS A MULTI-LAYER PRINTED CIRCUIT BOARD OR IN A COPPER-PLATED LAMINATE.
MYPI97057691997-12-011997-12-01Electroless copper plating solution and method of electroless copper plating
MY122145A
(en)