ATE172210T1 - Allylgruppen enthaltende zusammensetzungen aus epoxyharz und dem copolymer eines ethylenisch ungesättigten anhydrids und einer vinylverbindung - Google Patents
Allylgruppen enthaltende zusammensetzungen aus epoxyharz und dem copolymer eines ethylenisch ungesättigten anhydrids und einer vinylverbindungInfo
- Publication number
- ATE172210T1 ATE172210T1 AT95932007T AT95932007T ATE172210T1 AT E172210 T1 ATE172210 T1 AT E172210T1 AT 95932007 T AT95932007 T AT 95932007T AT 95932007 T AT95932007 T AT 95932007T AT E172210 T1 ATE172210 T1 AT E172210T1
- Authority
- AT
- Austria
- Prior art keywords
- anhydride
- pct
- epoxy resin
- copolymer
- date
- Prior art date
Links
- 239000003822 epoxy resin Substances 0.000 title abstract 4
- 229920000647 polyepoxide Polymers 0.000 title abstract 4
- -1 ALLYL GROUPS Chemical group 0.000 title abstract 3
- 150000008064 anhydrides Chemical class 0.000 title abstract 2
- 229920001577 copolymer Polymers 0.000 title abstract 2
- 229920002554 vinyl polymer Polymers 0.000 title abstract 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 title 1
- 239000005977 Ethylene Substances 0.000 title 1
- 239000000203 mixture Substances 0.000 title 1
- 150000001875 compounds Chemical class 0.000 abstract 3
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 abstract 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 abstract 2
- PYSRRFNXTXNWCD-UHFFFAOYSA-N 3-(2-phenylethenyl)furan-2,5-dione Chemical compound O=C1OC(=O)C(C=CC=2C=CC=CC=2)=C1 PYSRRFNXTXNWCD-UHFFFAOYSA-N 0.000 abstract 1
- 239000004593 Epoxy Substances 0.000 abstract 1
- 208000032225 Proximal spinal muscular atrophy type 1 Diseases 0.000 abstract 1
- 229920000147 Styrene maleic anhydride Polymers 0.000 abstract 1
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 abstract 1
- 239000003431 cross linking reagent Substances 0.000 abstract 1
- 230000009477 glass transition Effects 0.000 abstract 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 239000011342 resin composition Substances 0.000 abstract 1
- 208000032471 type 1 spinal muscular atrophy Diseases 0.000 abstract 1
- 229920006163 vinyl copolymer Polymers 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL9401461 | 1994-09-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE172210T1 true ATE172210T1 (de) | 1998-10-15 |
Family
ID=19864629
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT95932007T ATE172210T1 (de) | 1994-09-08 | 1995-09-07 | Allylgruppen enthaltende zusammensetzungen aus epoxyharz und dem copolymer eines ethylenisch ungesättigten anhydrids und einer vinylverbindung |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US5821305A (de) |
| EP (1) | EP0779902B1 (de) |
| JP (1) | JPH10505376A (de) |
| KR (1) | KR970705590A (de) |
| CN (1) | CN1062874C (de) |
| AT (1) | ATE172210T1 (de) |
| CA (1) | CA2199390A1 (de) |
| DE (1) | DE69505410T2 (de) |
| ES (1) | ES2124588T3 (de) |
| TW (1) | TW290574B (de) |
| WO (1) | WO1996007683A1 (de) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3593347B2 (ja) | 1996-10-29 | 2004-11-24 | アイソラ ラミネート システムズ | エポキシ樹脂組成物と架橋助剤とを含むスチレン及び無水マレイン酸のコポリマー |
| CN1129648C (zh) † | 1997-01-21 | 2003-12-03 | 陶氏环球技术公司 | 用于环氧固化体系的潜伏催化剂 |
| US6613839B1 (en) * | 1997-01-21 | 2003-09-02 | The Dow Chemical Company | Polyepoxide, catalyst/cure inhibitor complex and anhydride |
| US6191952B1 (en) * | 1998-04-28 | 2001-02-20 | International Business Machines Corporation | Compliant surface layer for flip-chip electronic packages and method for forming same |
| KR100792099B1 (ko) * | 2001-01-30 | 2008-01-04 | 히다치 가세고교 가부시끼가이샤 | 열경화성 수지 조성물 및 그의 용도 |
| TWI278481B (en) | 2002-04-16 | 2007-04-11 | Hitachi Chemical Co Ltd | Thermosetting resin composition, prepreg and laminate using the same |
| US6734259B1 (en) * | 2002-10-24 | 2004-05-11 | International Business Machines Corporation | Resin composition with a polymerizing agent and method of manufacturing prepreg and other laminate structures therefrom |
| US20040101689A1 (en) * | 2002-11-26 | 2004-05-27 | Ludovic Valette | Hardener composition for epoxy resins |
| JP4662533B2 (ja) * | 2003-08-26 | 2011-03-30 | 日東電工株式会社 | 電池用セパレータのための反応性ポリマー担持多孔質フィルムとそれを用いる電池の製造方法 |
| US7101933B2 (en) * | 2003-12-10 | 2006-09-05 | Uniplus Electronics Co., Ltd. | Process for producing high speed transmitting dielectric material |
| JP4526352B2 (ja) * | 2004-11-08 | 2010-08-18 | 日東電工株式会社 | 電池用セパレータのための反応性ポリマー担持多孔質フィルムとそれを用いた電池の製造方法 |
| US8941293B2 (en) | 2006-05-11 | 2015-01-27 | Samsung Electronics Co., Ltd. | Solid state lighting devices comprising quantum dots |
| US20080173886A1 (en) * | 2006-05-11 | 2008-07-24 | Evident Technologies, Inc. | Solid state lighting devices comprising quantum dots |
| CN102558505A (zh) | 2006-09-29 | 2012-07-11 | 日立化成工业株式会社 | 热固性树脂组合物及用其形成的预浸料及层叠板 |
| CN101481490B (zh) * | 2009-01-19 | 2014-01-15 | 东莞联茂电子科技有限公司 | 一种热固性树脂组合物及应用 |
| TWI400267B (zh) * | 2009-03-06 | 2013-07-01 | Nanya Plastics Corp | Modified maleic anhydride and epoxy resin |
| CN102803335A (zh) * | 2009-06-22 | 2012-11-28 | 陶氏环球技术有限责任公司 | 环氧树脂的硬化剂组合物 |
| DE102011015071A1 (de) * | 2011-03-24 | 2012-09-27 | Thyssenkrupp Steel Europe Ag | Verbundwerkstoff und Strukturbauteil für ein Kraftfahrzeug |
| TWI449722B (zh) * | 2011-04-12 | 2014-08-21 | Taiwan Union Technology Corp | 樹脂組合物及其應用 |
| CN102492100B (zh) * | 2011-12-05 | 2013-04-17 | 江苏柏鹤涂料有限公司 | 水分散型含氟羟基丙烯酸-环氧酯杂化体树脂及其涂料 |
| PL2847245T3 (pl) | 2012-05-07 | 2019-07-31 | Mercene Labs Ab | Sposób wytwarzania powlekanych wyrobów i powlekane wyroby |
| JP5738261B2 (ja) | 2012-05-16 | 2015-06-17 | 株式会社日立産機システム | エポキシ‐ビニル共重合型液状樹脂組成物、その硬化物、製造方法及び硬化物を用いた絶縁材料、電子・電気機器 |
| CN108957954A (zh) * | 2018-08-03 | 2018-12-07 | 广东泰亚达光电有限公司 | 一种新型激光直描成像干膜及其制备方法 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2707177A (en) * | 1952-11-29 | 1955-04-26 | Gen Electric | Ethoxyline-triallyl cyanurate resinous compositions |
| GB994484A (en) * | 1960-10-10 | 1965-06-10 | Carborundum Co | Coated abrasive products |
| BE627887A (fr) * | 1962-02-03 | 1963-02-28 | Bayer Ag | Procédé de durcissement de résines époxy. |
| US4056506A (en) * | 1975-06-26 | 1977-11-01 | Gulf Oil Corporation | Homogeneous polyepoxide-polyanhydride compositions |
| SU1165703A1 (ru) * | 1983-06-06 | 1985-07-07 | Научно-производственное объединение "Камень и силикаты" | Клей |
| CA1276358C (en) * | 1984-01-31 | 1990-11-13 | Dieter H. Klein | Epoxy resin for preparing electric laminates |
| JPS612725A (ja) * | 1984-06-15 | 1986-01-08 | Mitsubishi Electric Corp | 熱硬化性樹脂組成物 |
| US4604317A (en) * | 1984-10-05 | 1986-08-05 | The Dow Chemical Company | Curable compositions containing a polyepoxide and a halogenated bisphenol |
| JPS645211A (en) * | 1987-06-29 | 1989-01-10 | Matsushita Electric Industrial Co Ltd | Mixer device |
| US5210157A (en) * | 1989-08-15 | 1993-05-11 | Akzo N.V. | Interpenetrating network of ring-containing allyl polymers and epoxy resin, and a laminate prepared therefrom |
| ES2047244T3 (es) * | 1989-09-15 | 1994-02-16 | Akzo Nv | Reticulo interpenetrante quimicamente enlazado. |
| JP2766373B2 (ja) * | 1990-05-08 | 1998-06-18 | 昭和電工株式会社 | 樹脂組成物 |
| JPH0444287A (ja) * | 1990-06-07 | 1992-02-14 | Showa Denko Kk | フレキシブルプリント基板 |
| CN1036402C (zh) * | 1991-01-11 | 1997-11-12 | 旭化成工业株式会社 | 可固化的聚苯氧树脂组合物及由它制成的薄膜 |
| US5728468A (en) * | 1991-11-27 | 1998-03-17 | Akzo Nobel N.V. | Phosphorous containing resin |
| WO1995006075A1 (en) * | 1993-08-23 | 1995-03-02 | Akzo Nobel N.V. | Allyl-epoxy ipn |
-
1995
- 1995-09-07 AT AT95932007T patent/ATE172210T1/de not_active IP Right Cessation
- 1995-09-07 US US08/776,753 patent/US5821305A/en not_active Expired - Fee Related
- 1995-09-07 DE DE69505410T patent/DE69505410T2/de not_active Expired - Fee Related
- 1995-09-07 CN CN95195558A patent/CN1062874C/zh not_active Expired - Fee Related
- 1995-09-07 EP EP95932007A patent/EP0779902B1/de not_active Expired - Lifetime
- 1995-09-07 CA CA002199390A patent/CA2199390A1/en not_active Abandoned
- 1995-09-07 ES ES95932007T patent/ES2124588T3/es not_active Expired - Lifetime
- 1995-09-07 JP JP8509222A patent/JPH10505376A/ja active Pending
- 1995-09-07 KR KR1019970701482A patent/KR970705590A/ko not_active Ceased
- 1995-09-07 WO PCT/EP1995/003523 patent/WO1996007683A1/en not_active Ceased
- 1995-10-12 TW TW084110736A patent/TW290574B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| DE69505410D1 (de) | 1998-11-19 |
| US5821305A (en) | 1998-10-13 |
| DE69505410T2 (de) | 1999-05-20 |
| JPH10505376A (ja) | 1998-05-26 |
| WO1996007683A1 (en) | 1996-03-14 |
| EP0779902B1 (de) | 1998-10-14 |
| CA2199390A1 (en) | 1996-03-14 |
| TW290574B (de) | 1996-11-11 |
| EP0779902A1 (de) | 1997-06-25 |
| KR970705590A (ko) | 1997-10-09 |
| CN1062874C (zh) | 2001-03-07 |
| ES2124588T3 (es) | 1999-02-01 |
| CN1160407A (zh) | 1997-09-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |