DE69505410D1 - Allylgruppen enthaltende zusammensetzungen aus epoxyharz und dem copolymer eines ethylenisch ungesättigten anhydrids und einer vinylverbindung - Google Patents
Allylgruppen enthaltende zusammensetzungen aus epoxyharz und dem copolymer eines ethylenisch ungesättigten anhydrids und einer vinylverbindungInfo
- Publication number
- DE69505410D1 DE69505410D1 DE69505410T DE69505410T DE69505410D1 DE 69505410 D1 DE69505410 D1 DE 69505410D1 DE 69505410 T DE69505410 T DE 69505410T DE 69505410 T DE69505410 T DE 69505410T DE 69505410 D1 DE69505410 D1 DE 69505410D1
- Authority
- DE
- Germany
- Prior art keywords
- anhydride
- pct
- epoxy resin
- copolymer
- ethylenically unsaturated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Reinforced Plastic Materials (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL9401461 | 1994-09-08 | ||
PCT/EP1995/003523 WO1996007683A1 (en) | 1994-09-08 | 1995-09-07 | Allyl-containing epoxy resin composition comprising a copolymer of an ethylenically unsaturated anhydride and a vinyl compound |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69505410D1 true DE69505410D1 (de) | 1998-11-19 |
DE69505410T2 DE69505410T2 (de) | 1999-05-20 |
Family
ID=19864629
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69505410T Expired - Fee Related DE69505410T2 (de) | 1994-09-08 | 1995-09-07 | Allylgruppen enthaltende zusammensetzungen aus epoxyharz und dem copolymer eines ethylenisch ungesättigten anhydrids und einer vinylverbindung |
Country Status (11)
Country | Link |
---|---|
US (1) | US5821305A (de) |
EP (1) | EP0779902B1 (de) |
JP (1) | JPH10505376A (de) |
KR (1) | KR970705590A (de) |
CN (1) | CN1062874C (de) |
AT (1) | ATE172210T1 (de) |
CA (1) | CA2199390A1 (de) |
DE (1) | DE69505410T2 (de) |
ES (1) | ES2124588T3 (de) |
TW (1) | TW290574B (de) |
WO (1) | WO1996007683A1 (de) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2270208C (en) | 1996-10-29 | 2004-09-14 | Akzo Nobel Nv | Copolymer of styrene and maleic anhydride comprising an epoxy resin composition and a co-cross-linking agent |
US6613839B1 (en) * | 1997-01-21 | 2003-09-02 | The Dow Chemical Company | Polyepoxide, catalyst/cure inhibitor complex and anhydride |
EP0954553B2 (de) † | 1997-01-21 | 2008-12-10 | Dow Global Technologies Inc. | Latente katalysatoren für epoxidharz-härtungssysteme |
US6191952B1 (en) * | 1998-04-28 | 2001-02-20 | International Business Machines Corporation | Compliant surface layer for flip-chip electronic packages and method for forming same |
KR100792099B1 (ko) * | 2001-01-30 | 2008-01-04 | 히다치 가세고교 가부시끼가이샤 | 열경화성 수지 조성물 및 그의 용도 |
TWI278481B (en) | 2002-04-16 | 2007-04-11 | Hitachi Chemical Co Ltd | Thermosetting resin composition, prepreg and laminate using the same |
US6734259B1 (en) * | 2002-10-24 | 2004-05-11 | International Business Machines Corporation | Resin composition with a polymerizing agent and method of manufacturing prepreg and other laminate structures therefrom |
US20040101689A1 (en) * | 2002-11-26 | 2004-05-27 | Ludovic Valette | Hardener composition for epoxy resins |
JP4662533B2 (ja) * | 2003-08-26 | 2011-03-30 | 日東電工株式会社 | 電池用セパレータのための反応性ポリマー担持多孔質フィルムとそれを用いる電池の製造方法 |
US7101933B2 (en) * | 2003-12-10 | 2006-09-05 | Uniplus Electronics Co., Ltd. | Process for producing high speed transmitting dielectric material |
JP4526352B2 (ja) | 2004-11-08 | 2010-08-18 | 日東電工株式会社 | 電池用セパレータのための反応性ポリマー担持多孔質フィルムとそれを用いた電池の製造方法 |
US8941293B2 (en) | 2006-05-11 | 2015-01-27 | Samsung Electronics Co., Ltd. | Solid state lighting devices comprising quantum dots |
US20080173886A1 (en) * | 2006-05-11 | 2008-07-24 | Evident Technologies, Inc. | Solid state lighting devices comprising quantum dots |
CN101522752B (zh) | 2006-09-29 | 2012-01-25 | 日立化成工业株式会社 | 热固性树脂组合物及用其形成的预浸料及层叠板 |
CN101481490B (zh) * | 2009-01-19 | 2014-01-15 | 东莞联茂电子科技有限公司 | 一种热固性树脂组合物及应用 |
TWI400267B (zh) * | 2009-03-06 | 2013-07-01 | Nanya Plastics Corp | Modified maleic anhydride and epoxy resin |
JP5684804B2 (ja) * | 2009-06-22 | 2015-03-18 | ダウ グローバル テクノロジーズ エルエルシー | エポキシ樹脂のためのハードナー組成物 |
DE102011015071A1 (de) * | 2011-03-24 | 2012-09-27 | Thyssenkrupp Steel Europe Ag | Verbundwerkstoff und Strukturbauteil für ein Kraftfahrzeug |
TWI449722B (zh) * | 2011-04-12 | 2014-08-21 | Taiwan Union Technology Corp | 樹脂組合物及其應用 |
CN102492100B (zh) * | 2011-12-05 | 2013-04-17 | 江苏柏鹤涂料有限公司 | 水分散型含氟羟基丙烯酸-环氧酯杂化体树脂及其涂料 |
WO2013167576A2 (en) | 2012-05-07 | 2013-11-14 | Mercene Labs Ab | Method and formulations for the manufacture of coated articles and composites |
JP5738261B2 (ja) | 2012-05-16 | 2015-06-17 | 株式会社日立産機システム | エポキシ‐ビニル共重合型液状樹脂組成物、その硬化物、製造方法及び硬化物を用いた絶縁材料、電子・電気機器 |
CN108957954A (zh) * | 2018-08-03 | 2018-12-07 | 广东泰亚达光电有限公司 | 一种新型激光直描成像干膜及其制备方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2707177A (en) * | 1952-11-29 | 1955-04-26 | Gen Electric | Ethoxyline-triallyl cyanurate resinous compositions |
GB994484A (en) * | 1960-10-10 | 1965-06-10 | Carborundum Co | Coated abrasive products |
BE627887A (fr) * | 1962-02-03 | 1963-02-28 | Bayer Ag | Procédé de durcissement de résines époxy. |
US4056506A (en) * | 1975-06-26 | 1977-11-01 | Gulf Oil Corporation | Homogeneous polyepoxide-polyanhydride compositions |
SU1165703A1 (ru) * | 1983-06-06 | 1985-07-07 | Научно-производственное объединение "Камень и силикаты" | Клей |
CA1276358C (en) * | 1984-01-31 | 1990-11-13 | Dieter H. Klein | Epoxy resin for preparing electric laminates |
JPS612725A (ja) * | 1984-06-15 | 1986-01-08 | Mitsubishi Electric Corp | 熱硬化性樹脂組成物 |
US4604317A (en) * | 1984-10-05 | 1986-08-05 | The Dow Chemical Company | Curable compositions containing a polyepoxide and a halogenated bisphenol |
JPS645211A (en) * | 1987-06-29 | 1989-01-10 | Matsushita Electric Ind Co Ltd | Mixer device |
US5210157A (en) * | 1989-08-15 | 1993-05-11 | Akzo N.V. | Interpenetrating network of ring-containing allyl polymers and epoxy resin, and a laminate prepared therefrom |
ES2047244T3 (es) * | 1989-09-15 | 1994-02-16 | Akzo Nv | Reticulo interpenetrante quimicamente enlazado. |
JP2766373B2 (ja) * | 1990-05-08 | 1998-06-18 | 昭和電工株式会社 | 樹脂組成物 |
JPH0444287A (ja) * | 1990-06-07 | 1992-02-14 | Showa Denko Kk | フレキシブルプリント基板 |
EP0494722B1 (de) * | 1991-01-11 | 1995-09-13 | Asahi Kasei Kogyo Kabushiki Kaisha | Eine härtbare Polyphenylenetherharzzusammensetzung und eine daraus herstellbare gehärtete Harzzusammensetzung |
CA2124465A1 (en) * | 1991-11-27 | 1993-06-10 | Jan A. J. Schutyser | Phosphorus containing resin |
WO1995006075A1 (en) * | 1993-08-23 | 1995-03-02 | Akzo Nobel N.V. | Allyl-epoxy ipn |
-
1995
- 1995-09-07 ES ES95932007T patent/ES2124588T3/es not_active Expired - Lifetime
- 1995-09-07 CN CN95195558A patent/CN1062874C/zh not_active Expired - Fee Related
- 1995-09-07 US US08/776,753 patent/US5821305A/en not_active Expired - Fee Related
- 1995-09-07 EP EP95932007A patent/EP0779902B1/de not_active Expired - Lifetime
- 1995-09-07 WO PCT/EP1995/003523 patent/WO1996007683A1/en not_active Application Discontinuation
- 1995-09-07 KR KR1019970701482A patent/KR970705590A/ko not_active Application Discontinuation
- 1995-09-07 DE DE69505410T patent/DE69505410T2/de not_active Expired - Fee Related
- 1995-09-07 JP JP8509222A patent/JPH10505376A/ja active Pending
- 1995-09-07 CA CA002199390A patent/CA2199390A1/en not_active Abandoned
- 1995-09-07 AT AT95932007T patent/ATE172210T1/de not_active IP Right Cessation
- 1995-10-12 TW TW084110736A patent/TW290574B/zh active
Also Published As
Publication number | Publication date |
---|---|
WO1996007683A1 (en) | 1996-03-14 |
TW290574B (de) | 1996-11-11 |
EP0779902A1 (de) | 1997-06-25 |
EP0779902B1 (de) | 1998-10-14 |
DE69505410T2 (de) | 1999-05-20 |
US5821305A (en) | 1998-10-13 |
ES2124588T3 (es) | 1999-02-01 |
KR970705590A (ko) | 1997-10-09 |
CN1062874C (zh) | 2001-03-07 |
ATE172210T1 (de) | 1998-10-15 |
CA2199390A1 (en) | 1996-03-14 |
CN1160407A (zh) | 1997-09-24 |
JPH10505376A (ja) | 1998-05-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |