AT508318A3 - Verfahren für eine vorübergehende montage eines bausteinwafers auf einem trägersubstrat - Google Patents

Verfahren für eine vorübergehende montage eines bausteinwafers auf einem trägersubstrat Download PDF

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Publication number
AT508318A3
AT508318A3 ATA9035/2009A AT90352009A AT508318A3 AT 508318 A3 AT508318 A3 AT 508318A3 AT 90352009 A AT90352009 A AT 90352009A AT 508318 A3 AT508318 A3 AT 508318A3
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Austria
Prior art keywords
supporting substrate
building unit
package
methods
wafer
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ATA9035/2009A
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English (en)
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AT508318B1 (de
AT508318A2 (de
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Brewer Science Inc
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Application filed by Brewer Science Inc filed Critical Brewer Science Inc
Priority to ATGM514/2010U priority Critical patent/AT12755U1/de
Publication of AT508318A2 publication Critical patent/AT508318A2/de
Publication of AT508318A3 publication Critical patent/AT508318A3/de
Application granted granted Critical
Publication of AT508318B1 publication Critical patent/AT508318B1/de

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    • H10P72/74—
    • H10P72/7402—
    • H10P72/7448—
    • H10P72/7412—
    • H10P72/7416—
    • H10P72/7422—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Micromachines (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Junction Field-Effect Transistors (AREA)

Abstract

Es werden neue Verfahren für ein vorübergehendes Bonden und Gegenstände, die aus diesen Verfahren gebildet sind, zur Verfügung gestellt. Die Verfahren umfassen das Bonden eines Bausteinwafers an einen Trägerwafer oder ein Substrat nur an deren äußeren Umfangen, um beim Schutz des Bausteinwafers und der Bausteinorte während der nachfolgenden Bearbeitung und Handhabung zu helfen. Die mit Hilfe dieses Verfahrens gebildeten Randbonds sind chemisch und thermisch widerstandsfähig, können jedoch auch aufgeweicht, aufgelöst oder mechanisch zerbrochen werden, um es zu ermöglichen, die Wafer leicht mit Hilfe von sehr geringen Kräften und bei oder in der Nähe ihrer Raumtemperatur beim geeigneten Schritt des Herstellungsprozesses zu trennen.
ATA9035/2009A 2008-01-24 2009-01-23 Verfahren für eine vorübergehende montage eines bausteinwafers auf einem trägersubstrat AT508318B1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
ATGM514/2010U AT12755U1 (de) 2008-01-24 2009-01-23 Verfahren für eine vorübergehende montage eines bausteinwafers auf einem trägersubstrat

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US2337908P 2008-01-24 2008-01-24
PCT/US2009/031862 WO2009094558A2 (en) 2008-01-24 2009-01-23 Method for reversibly mounting a device wafer to a carrier substrate

Publications (3)

Publication Number Publication Date
AT508318A2 AT508318A2 (de) 2010-12-15
AT508318A3 true AT508318A3 (de) 2015-12-15
AT508318B1 AT508318B1 (de) 2022-07-15

Family

ID=40901639

Family Applications (2)

Application Number Title Priority Date Filing Date
ATA9035/2009A AT508318B1 (de) 2008-01-24 2009-01-23 Verfahren für eine vorübergehende montage eines bausteinwafers auf einem trägersubstrat
ATGM514/2010U AT12755U1 (de) 2008-01-24 2009-01-23 Verfahren für eine vorübergehende montage eines bausteinwafers auf einem trägersubstrat

Family Applications After (1)

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ATGM514/2010U AT12755U1 (de) 2008-01-24 2009-01-23 Verfahren für eine vorübergehende montage eines bausteinwafers auf einem trägersubstrat

Country Status (13)

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US (2) US9111981B2 (de)
EP (1) EP2238618B1 (de)
JP (2) JP5111620B2 (de)
KR (1) KR101096142B1 (de)
CN (1) CN101925996B (de)
AT (2) AT508318B1 (de)
CA (1) CA2711266A1 (de)
DE (2) DE202009018064U1 (de)
IL (1) IL206872A (de)
PT (1) PT2238618E (de)
RU (1) RU2010129076A (de)
TW (1) TWI439526B (de)
WO (1) WO2009094558A2 (de)

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US20090218560A1 (en) 2009-09-03
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JP5111620B2 (ja) 2013-01-09
TWI439526B (zh) 2014-06-01
JP2011510518A (ja) 2011-03-31
EP2238618B1 (de) 2015-07-29
US9111981B2 (en) 2015-08-18
TW200946628A (en) 2009-11-16
AT508318B1 (de) 2022-07-15
IL206872A (en) 2015-07-30
DE202009018064U1 (de) 2010-12-02
JP5558531B2 (ja) 2014-07-23
AT508318A2 (de) 2010-12-15
AT12755U1 (de) 2012-11-15
DE112009000140T5 (de) 2010-11-18
IL206872A0 (en) 2010-12-30
PT2238618E (pt) 2015-09-03
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DE112009000140B4 (de) 2022-06-15
EP2238618A4 (de) 2011-03-09
KR20100095021A (ko) 2010-08-27
KR101096142B1 (ko) 2011-12-19
CN101925996B (zh) 2013-03-20
CA2711266A1 (en) 2009-07-30
US9099512B2 (en) 2015-08-04
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CN101925996A (zh) 2010-12-22

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