ID21997A - Komposisi perekat lebur-panas - Google Patents

Komposisi perekat lebur-panas

Info

Publication number
ID21997A
ID21997A IDW990773A ID990773A ID21997A ID 21997 A ID21997 A ID 21997A ID W990773 A IDW990773 A ID W990773A ID 990773 A ID990773 A ID 990773A ID 21997 A ID21997 A ID 21997A
Authority
ID
Indonesia
Prior art keywords
heat
adhesive composition
hot adhesive
hot
composition
Prior art date
Application number
IDW990773A
Other languages
English (en)
Inventor
Kenichi Morizono
Keiji Okada
Suguru Tokita
Original Assignee
Mitsui Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Chemicals Inc filed Critical Mitsui Chemicals Inc
Publication of ID21997A publication Critical patent/ID21997A/id

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C09J153/025—Vinyl aromatic monomers and conjugated dienes modified
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
    • C09J109/06—Copolymers with styrene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/04—Homopolymers or copolymers of ethene
    • C09J123/08—Copolymers of ethene
    • C09J123/0807—Copolymers of ethene with unsaturated hydrocarbons only containing more than three carbon atoms
    • C09J123/0838—Copolymers of ethene with aromatic monomers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J125/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
    • C09J125/02—Homopolymers or copolymers of hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J125/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
    • C09J125/02—Homopolymers or copolymers of hydrocarbons
    • C09J125/04—Homopolymers or copolymers of styrene
    • C09J125/08—Copolymers of styrene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/06—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/005—Modified block copolymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/06—Polyethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C08L23/0807—Copolymers of ethene with unsaturated hydrocarbons only containing more than three carbon atoms
    • C08L23/0838—Copolymers of ethene with aromatic monomers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/24—Graft or block copolymers according to groups C08L51/00, C08L53/00 or C08L55/02; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/28—Non-macromolecular organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L91/00—Compositions of oils, fats or waxes; Compositions of derivatives thereof
    • C08L91/06—Waxes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S526/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S526/935—Hot melt adhesive
IDW990773A 1997-01-30 1998-01-21 Komposisi perekat lebur-panas ID21997A (id)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1711097 1997-01-30

Publications (1)

Publication Number Publication Date
ID21997A true ID21997A (id) 1999-08-19

Family

ID=11934902

Family Applications (1)

Application Number Title Priority Date Filing Date
IDW990773A ID21997A (id) 1997-01-30 1998-01-21 Komposisi perekat lebur-panas

Country Status (10)

Country Link
US (1) US6235818B1 (id)
EP (1) EP0957147B1 (id)
KR (1) KR100386372B1 (id)
CN (1) CN1104480C (id)
AU (1) AU733854B2 (id)
CA (1) CA2278736A1 (id)
DE (1) DE69822797T2 (id)
ID (1) ID21997A (id)
TW (1) TW513478B (id)
WO (1) WO1998033861A1 (id)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4149577B2 (ja) * 1998-08-25 2008-09-10 日本ポリプロ株式会社 積層体
DE19956422A1 (de) 1999-11-24 2001-06-13 Hella Kg Hueck & Co Lösbare Klebstoffe zum Verbinden von Substraten
JP4785315B2 (ja) 2000-01-21 2011-10-05 ユー．エス．ボラックス インコーポレイテッド ノナボレート組成物およびその製法
FR2816953B1 (fr) * 2000-11-17 2006-11-03 Soplaril Sa Nouvelle composition collante
JP4409121B2 (ja) * 2001-07-11 2010-02-03 株式会社ジーシー マウスガード用組成物
US7013818B2 (en) 2001-10-18 2006-03-21 Guangdong Esquel Textiles Co. Ltd. Wrinkle free garment and method of manufacture
JP3757844B2 (ja) * 2001-10-19 2006-03-22 ソニー株式会社 半導体製造方法
US20030192973A1 (en) * 2002-04-16 2003-10-16 Fuji Photo Film Co., Ltd. Cloth and container for recording material using same
KR101186271B1 (ko) 2002-06-26 2012-09-27 애버리 데니슨 코포레이션 폴리프로필렌/올레핀 탄성체 혼합물을 포함하는 배향된필름
ATE391151T1 (de) * 2002-10-09 2008-04-15 Exxonmobil Chem Patents Inc Heiss-siegelbare harzzusammensetzungen und deren verwendung
US6875500B2 (en) * 2002-10-15 2005-04-05 Mcgrath, Jr. William H. Flexible flooring system
US6846876B1 (en) * 2003-07-16 2005-01-25 Adherent Laboratories, Inc. Low odor, light color, disposable article construction adhesive
GB0411605D0 (en) * 2004-05-25 2004-06-30 Oxford Magnet Tech Reduction of croygen loss during transportation
US20070141373A1 (en) * 2005-12-20 2007-06-21 Sommerfeld Eugene G Segmented copolyesterether adhesive compositions
US8268449B2 (en) * 2006-02-06 2012-09-18 Brewer Science Inc. Thermal- and chemical-resistant acid protection coating material and spin-on thermoplastic adhesive
WO2007146986A1 (en) 2006-06-14 2007-12-21 Avery Dennison Corporation Conformable and die-cuttable machine direction oriented labelstocks and labels, and process for preparing
WO2007149900A2 (en) 2006-06-20 2007-12-27 Avery Dennison Corporation Multilayered polymeric film for hot melt adhesive labeling and label stock and label thereof
JP2008088252A (ja) * 2006-09-29 2008-04-17 Gc Corp マウスガード組成物
US7713835B2 (en) * 2006-10-06 2010-05-11 Brewer Science Inc. Thermally decomposable spin-on bonding compositions for temporary wafer bonding
US20080200011A1 (en) * 2006-10-06 2008-08-21 Pillalamarri Sunil K High-temperature, spin-on, bonding compositions for temporary wafer bonding using sliding approach
US7910794B2 (en) 2007-03-05 2011-03-22 Adherent Laboratories, Inc. Disposable diaper construction and adhesive
US7935780B2 (en) 2007-06-25 2011-05-03 Brewer Science Inc. High-temperature spin-on temporary bonding compositions
KR101096142B1 (ko) * 2008-01-24 2011-12-19 브레우어 사이언스 인코포레이션 캐리어 기판에 디바이스 웨이퍼를 가역적으로 장착하는 방법
US8431642B2 (en) * 2008-06-09 2013-04-30 Exxonmobil Chemical Patents Inc. Polyolefin adhesive compositions and articles made therefrom
US8242198B2 (en) 2008-06-09 2012-08-14 Exxonmobil Chemical Patents Inc. Polyolefin adhesive compositions
US8283400B2 (en) * 2008-06-09 2012-10-09 Exxonmobil Chemical Patents Inc. Polyolefin adhesive compositions
US8092628B2 (en) * 2008-10-31 2012-01-10 Brewer Science Inc. Cyclic olefin compositions for temporary wafer bonding
US8771927B2 (en) * 2009-04-15 2014-07-08 Brewer Science Inc. Acid-etch resistant, protective coatings
US8431643B2 (en) * 2009-05-29 2013-04-30 Exxonmobil Chemical Patents Inc. Polyolefin adhesive compositions and method of making thereof
US8852391B2 (en) 2010-06-21 2014-10-07 Brewer Science Inc. Method and apparatus for removing a reversibly mounted device wafer from a carrier substrate
US9263314B2 (en) 2010-08-06 2016-02-16 Brewer Science Inc. Multiple bonding layers for thin-wafer handling
CN102729683A (zh) * 2012-07-17 2012-10-17 福州茜素喷墨材料有限公司 一种激光打印专用的热转印纸及其制作工艺
US9676532B2 (en) 2012-08-15 2017-06-13 Avery Dennison Corporation Packaging reclosure label for high alcohol content products
EP3015241B1 (en) * 2013-06-28 2018-06-13 Yoshino Kogyosho Co., Ltd. Preform injection molding device
WO2015187646A1 (en) 2014-06-02 2015-12-10 Avery Dennison Corporation Films with enhanced scuff resistance, clarity, and conformability
CN110691834B (zh) 2017-05-22 2021-11-05 H.B.富乐公司 热熔融粘合剂组合物
KR102127128B1 (ko) * 2017-11-30 2020-06-29 현대엔지니어링 주식회사 미관 및 공기단축, 작업환경을 개선한 균열보수공법
EP3848428A4 (en) * 2018-09-06 2022-06-22 Riken Technos Corporation HOT ADHESIVE, REINFORCEMENT TAPE AND FLEXIBLE FLAT CABLE REINFORCED AT CONDUCTIVE END WITH REINFORCEMENT TAPE
KR102101469B1 (ko) * 2018-10-08 2020-04-16 한국생산기술연구원 폴리에틸렌을 포함하는 핫멜트 조성물

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07116419B2 (ja) * 1987-02-28 1995-12-13 東亞合成株式会社 ポリプロピレン用ホットメルト接着剤
JPH01144483A (ja) * 1987-12-01 1989-06-06 Mitsui Toatsu Chem Inc ホットメルト接着剤組成物
JP3039792B2 (ja) * 1990-04-18 2000-05-08 三井化学株式会社 ホットメルト接着剤
CA2062749C (en) * 1990-04-18 2002-07-02 Mitsui Petrochemical Industries, Ltd. Hot-melt adhesive
JP2977292B2 (ja) * 1991-02-06 1999-11-15 三井化学株式会社 ホットメルト接着剤組成物
JP3560006B2 (ja) * 1995-12-08 2004-09-02 東レ合成フィルム株式会社 表面保護フィルム
NZ332447A (en) * 1997-01-27 1999-08-30 Mitsui Chemicals Inc Adhesive resin composition containing a graft modified alpha olefin/aromatic vinyl random copolymer and laminate made using the same as adhesive layer

Also Published As

Publication number Publication date
TW513478B (en) 2002-12-11
AU733854B2 (en) 2001-05-31
CN1244889A (zh) 2000-02-16
WO1998033861A1 (fr) 1998-08-06
KR20000070535A (ko) 2000-11-25
DE69822797D1 (de) 2004-05-06
CN1104480C (zh) 2003-04-02
DE69822797T2 (de) 2005-03-10
EP0957147A1 (en) 1999-11-17
EP0957147A4 (en) 2000-09-13
US6235818B1 (en) 2001-05-22
EP0957147B1 (en) 2004-03-31
KR100386372B1 (ko) 2003-06-02
AU5574898A (en) 1998-08-25
CA2278736A1 (en) 1998-08-06

Similar Documents

Publication Publication Date Title
ID21997A (id) Komposisi perekat lebur-panas
DE69816227D1 (de) Klebstoffzusammensetzungen
DE69840831D1 (de) Härtbare klebstoffzusammensetzung
ID22970A (id) Komposisi perekat
DK0819749T3 (da) Klæbemiddelsammensætning
IS5430A (is) Ný samsetning
ATA900198A (de) Strahlungshärtbares cyanoacrylat-enthaltende zusammensetzung
DE69808855T2 (de) Klebstoff
DE59707990D1 (de) Adhäsive
ID25508A (id) Komposisi dematologis
DE69702768D1 (de) Wässerige klebstoffzusammensetzung
DE69833249D1 (de) Harzzusammensetzung
DE69806561T2 (de) Silikon-Klebstoffzusammensetzungen
ID21009A (id) Komposisi untuk supositori
FI970158A0 (fi) Uusi kuitulevyliima
DE69602711D1 (de) Klebstoffzusammensetzung
DE69936140D1 (de) Klebstoffzusammensetzung
DE69811141D1 (de) Klebstoffzusammensetzung
DE69819655T2 (de) Klebstoffzusammensetzung
DE69827335D1 (de) Härtbare Zusammensetzung
ID23250A (id) Komposisi paroksetin
DE69503941T2 (de) Klebstoffzusammensetzung
DE69830875D1 (de) Klebefolie
FR2749762B1 (fr) Composition desodorisante adhesive
FI19992526A (fi) Sahakokoonpano