DE69808855D1 - Klebstoff - Google Patents

Klebstoff

Info

Publication number
DE69808855D1
DE69808855D1 DE69808855T DE69808855T DE69808855D1 DE 69808855 D1 DE69808855 D1 DE 69808855D1 DE 69808855 T DE69808855 T DE 69808855T DE 69808855 T DE69808855 T DE 69808855T DE 69808855 D1 DE69808855 D1 DE 69808855D1
Authority
DE
Germany
Prior art keywords
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69808855T
Other languages
English (en)
Other versions
DE69808855T2 (de
Inventor
Mikio Kimura
Masayuki Aizawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokuyama Corp
Original Assignee
Tokuyama Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokuyama Corp filed Critical Tokuyama Corp
Publication of DE69808855D1 publication Critical patent/DE69808855D1/de
Application granted granted Critical
Publication of DE69808855T2 publication Critical patent/DE69808855T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dental Preparations (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polymerisation Methods In General (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
DE69808855T 1997-08-06 1998-08-06 Klebstoff Expired - Lifetime DE69808855T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21221797A JP3418778B2 (ja) 1997-08-06 1997-08-06 接着性組成物

Publications (2)

Publication Number Publication Date
DE69808855D1 true DE69808855D1 (de) 2002-11-28
DE69808855T2 DE69808855T2 (de) 2003-06-26

Family

ID=16618886

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69808855T Expired - Lifetime DE69808855T2 (de) 1997-08-06 1998-08-06 Klebstoff

Country Status (6)

Country Link
US (1) US6133338A (de)
EP (1) EP0896043B1 (de)
JP (1) JP3418778B2 (de)
KR (1) KR100549740B1 (de)
DE (1) DE69808855T2 (de)
SG (1) SG71137A1 (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4514848B2 (ja) * 1999-04-09 2010-07-28 サンメディカル株式会社 重合開始剤およびこれを用いた歯科用材料
KR100394368B1 (ko) * 2000-10-04 2003-08-09 (주) 고려물산 유화제가 첨가되지 않는 신발제조용 접착제 및 그 제조방법
KR100394365B1 (ko) * 2000-10-18 2003-08-09 (주) 고려물산 유화제가 첨가되지 않는 점착제 및 그 제조방법
JP4305594B2 (ja) 2000-11-28 2009-07-29 株式会社トクヤマ 歯科用接着キット
US6953832B2 (en) 2001-01-15 2005-10-11 Ivoclar Vivadent Ag Dental materials based on polyfunctional amides
DE10101523B4 (de) * 2001-01-15 2012-07-19 Ivoclar Vivadent Ag Dentalmaterialien auf der Basis polyfunktioneller Amide
US20050009946A1 (en) * 2001-09-21 2005-01-13 Makoto Oguri Radical polymerization catalyst and adhesive kit for dental use
DE60216951T2 (de) * 2001-10-26 2007-06-14 Dentsply Detrey Gmbh Hydrolysestabile selbstätzende und selbstgrundierende dental-einkomponenten-kleberzusammensetzung
WO2003057180A1 (fr) * 2001-12-28 2003-07-17 Tokuyama Corporation Adhesifs pour usage dentaire
WO2003057792A2 (en) 2001-12-29 2003-07-17 3M Innovative Properties Company Composition containing a polymerizable reducing agent, kit, and method
US7173074B2 (en) 2001-12-29 2007-02-06 3M Innovative Properties Company Composition containing a polymerizable reducing agent, kit, and method
US6818680B2 (en) * 2002-09-23 2004-11-16 Corning Incorporated Curable adhesive compositions
US7084182B2 (en) * 2003-03-13 2006-08-01 Tokuyama Corporation Photopolymerization initiator
DE102004025030A1 (de) * 2004-05-18 2005-12-15 S&C Polymer Silicon- und Composite-Spezialitäten GmbH Nano-Apatit-Füllstoffe enthaltende härtbare Restaurationsmaterialien
JP4644456B2 (ja) * 2004-09-09 2011-03-02 株式会社トクヤマ 歯科用修復材料
JP4644464B2 (ja) * 2004-10-19 2011-03-02 株式会社トクヤマ 歯科用修復材料
WO2006086559A1 (en) * 2005-02-08 2006-08-17 Dentsply International Inc. Self-cure activator
JP2006310500A (ja) * 2005-04-27 2006-11-09 Konica Minolta Holdings Inc 配線基板、圧電性セラミック素子及びそれらの製造方法
US20070100019A1 (en) * 2005-08-02 2007-05-03 Fuming Sun Catalyst system for dental compositions
JP4950471B2 (ja) * 2005-10-13 2012-06-13 株式会社トクヤマ チオウラシル誘導体
JP5132066B2 (ja) * 2006-03-17 2013-01-30 株式会社トクヤマ チオウラシル誘導体
US7601480B2 (en) * 2006-12-20 2009-10-13 Az Electronic Materials Usa Corp. Photoactive compounds
KR100896792B1 (ko) * 2007-12-11 2009-05-11 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물　및 이를 이용한반도체 소자
JP5773676B2 (ja) * 2011-02-07 2015-09-02 株式会社トクヤマデンタル 歯科用セメント
US9078815B2 (en) 2011-07-13 2015-07-14 Dentsply International Inc. Self-cure activator
CA2871694A1 (en) * 2012-05-16 2013-11-21 Solvay Sa Manufacture of 1-substituted methylidene compounds
JP6072663B2 (ja) * 2013-10-15 2017-02-01 信越化学工業株式会社 加熱硬化型導電性シリコーン組成物、該組成物からなる導電性接着剤、該組成物からなる導電性ダイボンド材、該ダイボンド材の硬化物を有する光半導体装置。
WO2019189579A1 (ja) * 2018-03-30 2019-10-03 三井化学株式会社 歯科材料用重合性組成物、該組成物から得られた歯科材料

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69713442T2 (de) * 1996-04-18 2003-01-23 Tokuyama Corp Thioürazil-Derivate und diese enthaltende Metall-Oberflächebehandlungsmittel
US5795497A (en) * 1996-04-18 1998-08-18 Tokuyama Corporation Thiouracil derivatives and metal surface-treating agent comprising thereof

Also Published As

Publication number Publication date
JPH1150012A (ja) 1999-02-23
KR100549740B1 (ko) 2006-04-21
EP0896043B1 (de) 2002-10-23
US6133338A (en) 2000-10-17
EP0896043A1 (de) 1999-02-10
KR19990023423A (ko) 1999-03-25
JP3418778B2 (ja) 2003-06-23
DE69808855T2 (de) 2003-06-26
SG71137A1 (en) 2000-03-21

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Legal Events

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