DE69720284D1 - Geformtes klebmittel - Google Patents

Geformtes klebmittel

Info

Publication number
DE69720284D1
DE69720284D1 DE69720284T DE69720284T DE69720284D1 DE 69720284 D1 DE69720284 D1 DE 69720284D1 DE 69720284 T DE69720284 T DE 69720284T DE 69720284 T DE69720284 T DE 69720284T DE 69720284 D1 DE69720284 D1 DE 69720284D1
Authority
DE
Germany
Prior art keywords
molded adhesive
molded
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69720284T
Other languages
English (en)
Inventor
Gary T Boyd
Robert J Devoe
Ilya Gorodisher
David A Ylitalo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
Original Assignee
Minnesota Mining and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co
Application granted granted Critical
Publication of DE69720284D1 publication Critical patent/DE69720284D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/162—Manufacturing of the nozzle plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1637—Manufacturing processes molding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
DE69720284T 1997-04-09 1997-09-23 Geformtes klebmittel Expired - Lifetime DE69720284D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/835,681 US6054007A (en) 1997-04-09 1997-04-09 Method of forming shaped adhesives
PCT/US1997/016861 WO1998045382A1 (en) 1997-04-09 1997-09-23 Shaped adhesives

Publications (1)

Publication Number Publication Date
DE69720284D1 true DE69720284D1 (de) 2003-04-30

Family

ID=25270189

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69720284T Expired - Lifetime DE69720284D1 (de) 1997-04-09 1997-09-23 Geformtes klebmittel

Country Status (7)

Country Link
US (1) US6054007A (de)
EP (1) EP0973840B1 (de)
JP (1) JP2001519845A (de)
KR (1) KR20010006178A (de)
AU (1) AU4492197A (de)
DE (1) DE69720284D1 (de)
WO (1) WO1998045382A1 (de)

Families Citing this family (44)

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US8128856B2 (en) * 1995-11-15 2012-03-06 Regents Of The University Of Minnesota Release surfaces, particularly for use in nanoimprint lithography
US6432511B1 (en) * 1997-06-06 2002-08-13 International Business Machines Corp. Thermoplastic adhesive preform for heat sink attachment
AU1150399A (en) * 1998-10-02 2000-04-26 Minnesota Mining And Manufacturing Company Sealant composition, article and method
US7018496B1 (en) 1999-04-26 2006-03-28 3M Innovative Properties Company Curable mechanical fasteners
DE19961347A1 (de) * 1999-12-17 2001-06-21 S & C Polymer Silicon & Compos Photoinitiatorsystem mit Acylphosphinoxid-Initiatoren
JP2001207150A (ja) * 2000-01-26 2001-07-31 Sony Chem Corp 接着剤組成物
US7381516B2 (en) * 2002-10-02 2008-06-03 3M Innovative Properties Company Multiphoton photosensitization system
US7265161B2 (en) * 2002-10-02 2007-09-04 3M Innovative Properties Company Multi-photon reactive compositions with inorganic particles and method for fabricating structures
US7005229B2 (en) * 2002-10-02 2006-02-28 3M Innovative Properties Company Multiphoton photosensitization method
US7118845B2 (en) * 2000-06-15 2006-10-10 3M Innovative Properties Company Multiphoton photochemical process and articles preparable thereby
CN1555387A (zh) 2000-07-28 2004-12-15 古德里奇公司 制造光学波导管的聚合物组合物、由此制造的光学波导管及制造此波导管的方法
US6593699B2 (en) 2001-11-07 2003-07-15 Axcelis Technologies, Inc. Method for molding a polymer surface that reduces particle generation and surface adhesion forces while maintaining a high heat transfer coefficient
US6750266B2 (en) * 2001-12-28 2004-06-15 3M Innovative Properties Company Multiphoton photosensitization system
CN1656189A (zh) * 2002-05-29 2005-08-17 纳幕尔杜邦公司 适形接触和粘附用原纤维微结构
US7232650B2 (en) * 2002-10-02 2007-06-19 3M Innovative Properties Company Planar inorganic device
US7521115B2 (en) * 2002-12-17 2009-04-21 Intel Corporation Low temperature bumping process
US20050124712A1 (en) * 2003-12-05 2005-06-09 3M Innovative Properties Company Process for producing photonic crystals
DE60328835D1 (de) * 2003-12-05 2009-09-24 3M Innovative Properties Co Prozess zur herstellung von photonischen kristallen
JP4516343B2 (ja) * 2004-03-31 2010-08-04 積水化学工業株式会社 ポリエステル系接着剤組成物
US20060249246A1 (en) * 2005-05-06 2006-11-09 Ealey Mark A Method of fabricating replicated optics
WO2007116818A1 (ja) * 2006-03-30 2007-10-18 Toray Industries, Inc. 樹状ポリエステル、その製造方法および熱可塑性樹脂組成物
US7744803B2 (en) * 2006-08-02 2010-06-29 Shawcor Ltd. Photo-crosslinkable polyolefin compositions
US7530746B2 (en) * 2007-04-13 2009-05-12 Abc Telecommunications, Inc. Field termination connector with shaped adhesive pre-form
US7534050B2 (en) * 2007-04-13 2009-05-19 Adc Telecommunications, Inc. Field terminatable fiber optic connector assembly
WO2009045562A1 (en) * 2007-04-13 2009-04-09 Adc Telecommunications, Inc. Optical fiber field termination kit
US8083416B2 (en) * 2007-11-30 2011-12-27 Adc Telecommunications, Inc. Hybrid fiber/copper connector system and method
KR101023843B1 (ko) * 2008-01-11 2011-03-22 주식회사 엘지화학 점착제 조성물, 상기를 포함하는 편광판 및 액정표시장치
PL2257609T3 (pl) * 2008-02-08 2018-05-30 3M Innovative Properties Company Część kompozytowa zawierająca filmy ochronne z częściowo współprzenikającego się poliuretanu/polimocznika
JP5660631B2 (ja) * 2008-08-20 2015-01-28 エルジー・ケム・リミテッド 粘着剤
EP2368956A1 (de) * 2010-03-26 2011-09-28 Sika Technology AG Formgedächtnis-Material auf Basis eines Strukturklebstoffs
EP2368955A1 (de) 2010-03-26 2011-09-28 Sika Technology AG Formgedächtnis-Material auf Basis eines Strukturklebstoffs
GB201012595D0 (en) 2010-07-27 2010-09-08 Zephyros Inc Oriented structural adhesives
US9464217B2 (en) * 2010-09-01 2016-10-11 The Boeing Company Composite structures using interpenetrating polymer network adhesives
US8882956B2 (en) 2010-09-01 2014-11-11 The Boeing Company Composite structures using interpenetrating polymer network adhesives
JP5876496B2 (ja) 2010-10-05 2016-03-02 ヒューレット−パッカード デベロップメント カンパニー エル．ピー．Ｈｅｗｌｅｔｔ‐Ｐａｃｋａｒｄ Ｄｅｖｅｌｏｐｍｅｎｔ Ｃｏｍｐａｎｙ， Ｌ．Ｐ． インク印刷可能な構成物
WO2012102737A1 (en) * 2011-01-29 2012-08-02 Hewlett-Packard Development Company, L.P. Compositions and their use
US8636425B2 (en) 2011-03-15 2014-01-28 Adc Telecommunications, Inc. Fiber optic connector
RU2619816C2 (ru) 2012-02-07 2017-05-18 Тайко Электроникс Райхем Бвба Кабельное концевое устройство в сборе и способ крепления оптоволоконного кабеля к разъему
US9176285B2 (en) 2012-05-03 2015-11-03 Adc Telecommunications, Inc. Fiber optic connector
US10577523B2 (en) 2013-07-26 2020-03-03 Zephyros, Inc. Relating to thermosetting adhesive films
AU2017315358A1 (en) * 2016-08-23 2019-03-07 The University Of Massachusetts Polymerizing composition, method of manufacture thereof and articles comprising the same
ES2934784T3 (es) 2016-09-20 2023-02-27 Avery Dennison Corp Cinta multicapa
US11059264B2 (en) 2018-03-19 2021-07-13 Avery Dennison Corporation Multilayer constrained-layer damping
WO2019222352A1 (en) 2018-05-17 2019-11-21 Avery Dennison Corporation Partial coverage multilayer damping laminate

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US4154634A (en) * 1977-09-22 1979-05-15 Plas/Steel Products, Inc. Method for fabricating improved fiber reinforced plastic rods having a smooth surface
JPS559549A (en) * 1978-07-06 1980-01-23 Canon Inc Projector
US4576850A (en) * 1978-07-20 1986-03-18 Minnesota Mining And Manufacturing Company Shaped plastic articles having replicated microstructure surfaces
JPS5817239B2 (ja) * 1978-12-29 1983-04-05 日東電工株式会社 接着性樹脂成形品
JPS5626951A (en) * 1979-08-08 1981-03-16 Mitsubishi Gas Chem Co Inc Curable resin composition
JPS5649780A (en) * 1979-09-29 1981-05-06 Nitto Electric Ind Co Ltd Resin molded bondable article
EP0142463B1 (de) * 1983-08-24 1989-09-20 Ciba-Geigy Ag Verfahren zur Herstellung von Prepregs und die damit erhältlichen verstärkten Verbundstoffe
US4952342A (en) * 1987-07-02 1990-08-28 Loctite Corproration Dual cure method for making a rotted electrical/mechanical device
US4950696A (en) * 1987-08-28 1990-08-21 Minnesota Mining And Manufacturing Company Energy-induced dual curable compositions
US5086086A (en) * 1987-08-28 1992-02-04 Minnesota Mining And Manufacturing Company Energy-induced curable compositions
US4831070A (en) * 1987-11-02 1989-05-16 Dow Corning Corporation Moldable elastomeric pressure sensitive adhesives
EP0358768B1 (de) * 1987-12-24 1995-11-15 Asahi Glass Company Ltd. Struktur und verfahren zum aufbringen einer spiegelbasis auf ein glasblatt
US5317067A (en) * 1988-01-25 1994-05-31 Tokyo Tire & Rubber Company Limited Molding and punching out melt-mixed epoxy resin-thermoplastic resin composition with hardener
US4985340A (en) * 1988-06-01 1991-01-15 Minnesota Mining And Manufacturing Company Energy curable compositions: two component curing agents
JPH0428724A (ja) * 1990-05-24 1992-01-31 Toyo Tire & Rubber Co Ltd 接着性高形状保持性成形体
JP3351436B2 (ja) * 1991-08-21 2002-11-25 セイコーエプソン株式会社 細孔を有する２部材の接着用シ−ト材
US5252694A (en) * 1992-01-22 1993-10-12 Minnesota Mining And Manufacturing Company Energy-polymerization adhesive, coating, film and process for making the same
JPH0655572A (ja) * 1992-08-06 1994-03-01 Fujitsu Ltd インモールド成形方法
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Also Published As

Publication number Publication date
EP0973840A1 (de) 2000-01-26
KR20010006178A (ko) 2001-01-26
AU4492197A (en) 1998-10-30
US6054007A (en) 2000-04-25
EP0973840B1 (de) 2003-03-26
WO1998045382A1 (en) 1998-10-15
JP2001519845A (ja) 2001-10-23

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Legal Events

Date Code Title Description
8332 No legal effect for de