WO2008093408A1 - 粘着チャック装置 - Google Patents

粘着チャック装置 Download PDF

Info

Publication number
WO2008093408A1
WO2008093408A1 PCT/JP2007/051556 JP2007051556W WO2008093408A1 WO 2008093408 A1 WO2008093408 A1 WO 2008093408A1 JP 2007051556 W JP2007051556 W JP 2007051556W WO 2008093408 A1 WO2008093408 A1 WO 2008093408A1
Authority
WO
WIPO (PCT)
Prior art keywords
peeling
work
adhesive member
force
chuck device
Prior art date
Application number
PCT/JP2007/051556
Other languages
English (en)
French (fr)
Inventor
Yoshikazu Ohtani
Michiya Yokota
Original Assignee
Shin-Etsu Engineering Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin-Etsu Engineering Co., Ltd. filed Critical Shin-Etsu Engineering Co., Ltd.
Priority to JP2007520608A priority Critical patent/JP4125776B1/ja
Priority to PCT/JP2007/051556 priority patent/WO2008093408A1/ja
Priority to CN200780000138XA priority patent/CN101379606B/zh
Priority to KR1020077018635A priority patent/KR101255867B1/ko
Priority to TW097102249A priority patent/TWI415777B/zh
Publication of WO2008093408A1 publication Critical patent/WO2008093408A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/068—Stacking or destacking devices; Means for preventing damage to stacked sheets, e.g. spaces
    • B65G49/069—Means for avoiding damage to stacked plate glass, e.g. by interposing paper or powder spacers in the stack
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups

Abstract

　剥離手段による剥離進行方向にはワークを容易に剥離する。 　剥離手段３の作動に伴う粘着部材２に対するワークＡの剥離進行方向へ単位面積当たりの粘着力が増加するように粘着部材２を配置することにより、剥離手段３の作動に伴い粘着部材２から小さな剥離力でワークＡが剥がれ始め、その剥離がスムーズに進行し、この剥離進行方向と異なる方向へ剥がす場合には、該剥離手段３の作動による剥離力に比べて遙かに大きな力が必要となる。
PCT/JP2007/051556 2007-01-31 2007-01-31 粘着チャック装置 WO2008093408A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2007520608A JP4125776B1 (ja) 2007-01-31 2007-01-31 粘着チャック装置
PCT/JP2007/051556 WO2008093408A1 (ja) 2007-01-31 2007-01-31 粘着チャック装置
CN200780000138XA CN101379606B (zh) 2007-01-31 2007-01-31 粘接卡盘装置
KR1020077018635A KR101255867B1 (ko) 2007-01-31 2007-01-31 점착 척 장치
TW097102249A TWI415777B (zh) 2007-01-31 2008-01-21 Adhesive chuck device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/051556 WO2008093408A1 (ja) 2007-01-31 2007-01-31 粘着チャック装置

Publications (1)

Publication Number Publication Date
WO2008093408A1 true WO2008093408A1 (ja) 2008-08-07

Family

ID=39673728

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/051556 WO2008093408A1 (ja) 2007-01-31 2007-01-31 粘着チャック装置

Country Status (5)

Country Link
JP (1) JP4125776B1 (ja)
KR (1) KR101255867B1 (ja)
CN (1) CN101379606B (ja)
TW (1) TWI415777B (ja)
WO (1) WO2008093408A1 (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101066603B1 (ko) * 2009-01-20 2011-09-22 에이피시스템 주식회사 기판 지지 유닛 및 이를 구비하는 기판 접합 장치
EP2398040A1 (en) * 2010-06-21 2011-12-21 Brewer Science, Inc. Method and apparatus for removing a reversibly mounted device wafer from a carrier substrate
JP4903906B1 (ja) * 2011-04-07 2012-03-28 信越エンジニアリング株式会社 ワーク粘着チャック装置及びワーク貼り合わせ機
KR101328886B1 (ko) 2011-05-07 2013-11-13 주식회사 야스 링 모양 점착부를 이용한 기판 탈부착 장치
US9099512B2 (en) 2008-01-24 2015-08-04 Brewer Science Inc. Article including a device wafer reversibly mountable to a carrier substrate
US9263314B2 (en) 2010-08-06 2016-02-16 Brewer Science Inc. Multiple bonding layers for thin-wafer handling

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0718678U (ja) * 1993-04-05 1995-04-04 清彦 迫田 延命十句観音経入交通安全祈念観音画像
JP4785995B1 (ja) * 2011-02-28 2011-10-05 信越エンジニアリング株式会社 ワーク粘着チャック装置及びワーク貼り合わせ機
KR101317790B1 (ko) * 2011-06-07 2013-10-15 주식회사 에스에프에이 점착척 및 그 제조방법
CN104904004B (zh) * 2013-01-09 2017-05-31 信越工程株式会社 工件粘附卡盘装置及工件贴合机
JP6021687B2 (ja) * 2013-02-25 2016-11-09 株式会社ディスコ 積層ウェーハの加工方法
JP5422767B1 (ja) * 2013-05-09 2014-02-19 信越エンジニアリング株式会社 貼り合わせ分離方法及び分離装置
JP6419635B2 (ja) * 2014-04-23 2018-11-07 株式会社アルバック 保持装置、真空処理装置
KR101838681B1 (ko) * 2014-07-07 2018-03-14 에이피시스템 주식회사 지지척 및 기판 처리 장치
KR102570345B1 (ko) * 2017-07-17 2023-08-28 주식회사 탑 엔지니어링 패널 합착용 인덱스 유닛 및 이를 포함하는 패널 합착 장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005134687A (ja) * 2003-10-31 2005-05-26 Hitachi Industries Co Ltd 基板の組立方法およびその装置
JP2005286114A (ja) * 2004-03-30 2005-10-13 Koko Tei 平板型基板ホルダー
JP2006273578A (ja) * 2005-03-03 2006-10-12 Norio Kojima 平板状パネルの保持装置
JP3882004B2 (ja) * 2004-04-09 2007-02-14 信越エンジニアリング株式会社 粘着チャック装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3003279U (ja) * 1994-04-04 1994-10-18 富士写真フイルム株式会社 包装体
JP3398535B2 (ja) * 1995-11-08 2003-04-21 ティーディーケイ株式会社 開封性を改良したフィルム包装体
JP3979792B2 (ja) * 2000-05-25 2007-09-19 株式会社巴川製紙所 静電チャック装置用接着シート及び静電チャック装置
JP2001354276A (ja) 2000-06-09 2001-12-25 Nippon Process:Kk 飲食品用パッケージの圧力調整弁
JP2005019525A (ja) * 2003-06-24 2005-01-20 Disco Abrasive Syst Ltd 半導体チップの製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005134687A (ja) * 2003-10-31 2005-05-26 Hitachi Industries Co Ltd 基板の組立方法およびその装置
JP2005286114A (ja) * 2004-03-30 2005-10-13 Koko Tei 平板型基板ホルダー
JP3882004B2 (ja) * 2004-04-09 2007-02-14 信越エンジニアリング株式会社 粘着チャック装置
JP2006273578A (ja) * 2005-03-03 2006-10-12 Norio Kojima 平板状パネルの保持装置

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9099512B2 (en) 2008-01-24 2015-08-04 Brewer Science Inc. Article including a device wafer reversibly mountable to a carrier substrate
US9111981B2 (en) 2008-01-24 2015-08-18 Brewer Science Inc. Method for reversibly mounting a device wafer to a carrier substrate
KR101066603B1 (ko) * 2009-01-20 2011-09-22 에이피시스템 주식회사 기판 지지 유닛 및 이를 구비하는 기판 접합 장치
CN101783311B (zh) * 2009-01-20 2012-09-05 Ap系统股份有限公司 衬底固持单元和具有其的衬底组装设备
EP2398040A1 (en) * 2010-06-21 2011-12-21 Brewer Science, Inc. Method and apparatus for removing a reversibly mounted device wafer from a carrier substrate
US8852391B2 (en) 2010-06-21 2014-10-07 Brewer Science Inc. Method and apparatus for removing a reversibly mounted device wafer from a carrier substrate
US9263314B2 (en) 2010-08-06 2016-02-16 Brewer Science Inc. Multiple bonding layers for thin-wafer handling
US9472436B2 (en) 2010-08-06 2016-10-18 Brewer Science Inc. Multiple bonding layers for thin-wafer handling
JP4903906B1 (ja) * 2011-04-07 2012-03-28 信越エンジニアリング株式会社 ワーク粘着チャック装置及びワーク貼り合わせ機
KR101328886B1 (ko) 2011-05-07 2013-11-13 주식회사 야스 링 모양 점착부를 이용한 기판 탈부착 장치

Also Published As

Publication number Publication date
TW200844019A (en) 2008-11-16
JPWO2008093408A1 (ja) 2010-05-20
CN101379606B (zh) 2012-04-18
KR20090109595A (ko) 2009-10-21
CN101379606A (zh) 2009-03-04
TWI415777B (zh) 2013-11-21
JP4125776B1 (ja) 2008-07-30
KR101255867B1 (ko) 2013-04-17

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