WO2009072377A1 - 粘着テープの切断装置及び切断方法、粘着テープの貼着装置及び貼着方法 - Google Patents

粘着テープの切断装置及び切断方法、粘着テープの貼着装置及び貼着方法 Download PDF

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Publication number
WO2009072377A1
WO2009072377A1 PCT/JP2008/070610 JP2008070610W WO2009072377A1 WO 2009072377 A1 WO2009072377 A1 WO 2009072377A1 JP 2008070610 W JP2008070610 W JP 2008070610W WO 2009072377 A1 WO2009072377 A1 WO 2009072377A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive tape
cutter
cutting
applying
cut
Prior art date
Application number
PCT/JP2008/070610
Other languages
English (en)
French (fr)
Inventor
Etsuo Minamihama
Haruo Mori
Keigou Hirose
Kazuhito Ikeda
Original Assignee
Shibaura Mechatronics Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corporation filed Critical Shibaura Mechatronics Corporation
Priority to CN2008801185224A priority Critical patent/CN101883729B/zh
Priority to KR1020107014951A priority patent/KR101184132B1/ko
Publication of WO2009072377A1 publication Critical patent/WO2009072377A1/ja

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H35/00—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers
    • B65H35/04—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers from or with transverse cutters or perforators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/08—Making a superficial cut in the surface of the work without removal of material, e.g. scoring, incising
    • B26D3/085—On sheet material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1284—Application of adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H35/00—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers
    • B65H35/0006—Article or web delivery apparatus incorporating cutting or line-perforating devices
    • B65H35/0013—Article or web delivery apparatus incorporating cutting or line-perforating devices and applying the article or the web by adhesive to a surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Adhesive Tape Dispensing Devices (AREA)
  • Details Of Cutting Devices (AREA)
  • Nonmetal Cutting Devices (AREA)
  • Adhesive Tapes (AREA)
  • Wire Bonding (AREA)

Abstract

　粘着テープ（２）に対して接離する方向に駆動され接近方向に駆動されたときに粘着テープを切断するカッタ（２７）と、カッタによって粘着テープを切断するときに粘着テープが離型テープ（８）とともにカッタから受ける押圧力によって撓むのを阻止する保持ブロック（３８）と、カッタに一体に設けられカッタによって粘着テープを切断するときに粘着テープのカッタによって切断される箇所の近傍を押圧して粘着テープが貼着される貼着部（２８）と、粘着テープの貼着部に押圧貼着された部分の近くを弾性的に押圧し、粘着テープがカッタによって切断されてこのカッタが上記粘着テープから離れる方向に駆動されたときに、粘着テープの貼着部に貼着された部分が離型テープから剥離されるまで、粘着テープを弾性的かつ非貼着状態で押圧する押え部材（３３）を具備する。
PCT/JP2008/070610 2007-12-06 2008-11-12 粘着テープの切断装置及び切断方法、粘着テープの貼着装置及び貼着方法 WO2009072377A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2008801185224A CN101883729B (zh) 2007-12-06 2008-11-12 粘着带的粘贴装置及粘贴方法
KR1020107014951A KR101184132B1 (ko) 2007-12-06 2008-11-12 점착 테이프의 접착 장치 및 접착 방법

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-316051 2007-12-06
JP2007316051 2007-12-06
JP2008-050474 2008-02-29
JP2008050474A JP5078672B2 (ja) 2007-12-06 2008-02-29 粘着テープの貼着装置及び貼着方法

Publications (1)

Publication Number Publication Date
WO2009072377A1 true WO2009072377A1 (ja) 2009-06-11

Family

ID=40958845

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/070610 WO2009072377A1 (ja) 2007-12-06 2008-11-12 粘着テープの切断装置及び切断方法、粘着テープの貼着装置及び貼着方法

Country Status (5)

Country Link
JP (1) JP5078672B2 (ja)
KR (1) KR101184132B1 (ja)
CN (1) CN101883729B (ja)
TW (1) TWI462815B (ja)
WO (1) WO2009072377A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102172918A (zh) * 2011-01-06 2011-09-07 硕方科技（北京）有限公司 半切控制设备及方法
JP2018104152A (ja) * 2016-12-27 2018-07-05 スリーエム イノベイティブ プロパティズ カンパニー テープ切断装置
EP3351361A1 (en) * 2017-01-19 2018-07-25 3M Innovative Properties Company Apparatus for scoring a layer adhesively placed on a substrate and method of separating such a layer
CN110682336A (zh) * 2019-09-19 2020-01-14 无锡先导智能装备股份有限公司 一种贴胶装置及其切胶机构
CN111448040A (zh) * 2017-12-13 2020-07-24 Lts洛曼治疗系统股份公司 含粘合剂的复合材料的分离设备及分离方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009037506B4 (de) * 2009-08-17 2011-09-15 Karl Eugen Fischer Gmbh Schneideinrichtung zum Schneiden eines dünnen und klebrigen Bandes, insbesondere eines Cordbandes
JP5408177B2 (ja) * 2011-04-18 2014-02-05 パナソニック株式会社 Ａｃｆ貼着装置
TWI618131B (zh) * 2013-08-30 2018-03-11 半導體能源研究所股份有限公司 剝離起點形成裝置及形成方法、疊層體製造裝置
JP6431256B2 (ja) * 2013-10-11 2018-11-28 デクセリアルズ株式会社 接着フィルム、フィルム巻装体、接続構造体の製造方法、接続方法、接続構造体
JP6086883B2 (ja) * 2014-09-01 2017-03-01 株式会社シーティーケイ 長尺材料切断装置
JP6622461B2 (ja) * 2015-02-05 2019-12-18 リンテック株式会社 シート製造装置
JP6463160B2 (ja) * 2015-02-05 2019-01-30 リンテック株式会社 シート製造装置
CN106477377B (zh) * 2016-12-12 2018-05-11 深圳市欣中大自动化技术有限公司 一种覆盖膜半切装置
JP6901122B2 (ja) * 2017-05-11 2021-07-14 マルゴ工業株式会社 テープ貼付ユニット及びテープ貼付装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08133560A (ja) * 1994-11-09 1996-05-28 Toshiba Corp 粘着性テープ片の貼着装置および貼着方法
JP2002255434A (ja) * 2001-02-28 2002-09-11 Canon Ntc Inc 印字テープの半切り装置
JP2003051517A (ja) * 2001-08-02 2003-02-21 Shibaura Mechatronics Corp テープ部材貼着装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11160695A (ja) * 1997-11-28 1999-06-18 Optrex Corp 偏光膜剥離方法およびその装置
JP4461753B2 (ja) * 2003-09-24 2010-05-12 セイコーエプソン株式会社 液晶装置及び電子機器
JP2006121035A (ja) * 2004-09-27 2006-05-11 Ngk Spark Plug Co Ltd フィルム剥離装置、配線基板の製造方法
JP5076292B2 (ja) * 2005-08-08 2012-11-21 パナソニック株式会社 異方導電膜貼付装置及び方法
JP4417893B2 (ja) * 2005-08-10 2010-02-17 芝浦メカトロニクス株式会社 粘着性テープの貼着装置及び貼着方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08133560A (ja) * 1994-11-09 1996-05-28 Toshiba Corp 粘着性テープ片の貼着装置および貼着方法
JP2002255434A (ja) * 2001-02-28 2002-09-11 Canon Ntc Inc 印字テープの半切り装置
JP2003051517A (ja) * 2001-08-02 2003-02-21 Shibaura Mechatronics Corp テープ部材貼着装置

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102172918A (zh) * 2011-01-06 2011-09-07 硕方科技（北京）有限公司 半切控制设备及方法
JP2018104152A (ja) * 2016-12-27 2018-07-05 スリーエム イノベイティブ プロパティズ カンパニー テープ切断装置
EP3351361A1 (en) * 2017-01-19 2018-07-25 3M Innovative Properties Company Apparatus for scoring a layer adhesively placed on a substrate and method of separating such a layer
WO2018134751A1 (en) * 2017-01-19 2018-07-26 3M Innovative Properties Company Apparatus for scoring a layer adhesively placed on a substrate and method of separating such a layer
CN111448040A (zh) * 2017-12-13 2020-07-24 Lts洛曼治疗系统股份公司 含粘合剂的复合材料的分离设备及分离方法
CN111448040B (zh) * 2017-12-13 2022-03-08 Lts洛曼治疗系统股份公司 含粘合剂的复合材料的分离设备及分离方法
US11465311B2 (en) 2017-12-13 2022-10-11 Lts Lohmann Therapie-Systeme Ag Separating apparatus and separating method for adhesive-containing composite material
CN110682336A (zh) * 2019-09-19 2020-01-14 无锡先导智能装备股份有限公司 一种贴胶装置及其切胶机构

Also Published As

Publication number Publication date
JP5078672B2 (ja) 2012-11-21
CN101883729A (zh) 2010-11-10
KR20100090303A (ko) 2010-08-13
KR101184132B1 (ko) 2012-09-18
TW200934631A (en) 2009-08-16
CN101883729B (zh) 2013-06-12
JP2009154284A (ja) 2009-07-16
TWI462815B (zh) 2014-12-01

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