200934631 六、發明說明： 【發明所屬之技術領域】 發明領域 5 ❹ 10 15 ❹ 20 本發明係關於藉由切斷器切斷貼著於離型帶上之黏著 帶的黏著帶之切斷裝置及切斷方法、以及將切斷之黏著帶 貼著於基板的黏著帶之貼著裝置及貼著方法。200934631 VI. Description of the Invention: [Technical Field of the Invention] Field of the Invention 5 ❹ 10 15 ❹ 20 The present invention relates to a cutting device for cutting an adhesive tape attached to an adhesive tape on a release tape by a cutter and The cutting method and the bonding device and the bonding method of the adhesive tape which is attached to the substrate by the cut adhesive tape.
【先前技術;J 發明背景 例如’於以液晶顯示器面板及電漿顯示器面板為代表 之平板顯示器等之製造步驟中，存在於玻璃製基板之側部 上面經由異方性導電性構件構成之黏著帶貼著TCP(Tape Carrier Package)等電子零件之步驟。 將上述電子零件貼著於上述基板之側部上面之前，存 在於基板之側部上面貼著經切斷成特定長度之上述黏著帶 之步驟。黏著帶係貼著於離型帶，其等被卷裝於供給捲筒。 於基板之側部上面藉由黏著帶貼著電子零件之情形， 首先，將與離型帶一同自供給捲筒放出之黏著帶切斷成特 定長度。此時之黏著帶之切斷長度，例如設定成與設於上 述基板之側部上面之複數端子構成之端子部之長度對應之 長度。 接著，將切斷成特定長度之黏著帶例如藉由夾頭等與 上述離型帶一同拉出，以與載置於台座上之基板之側部上 面之上述端子部相對之方式進行定位後，藉由加壓工具將 切斷之黏著帶加壓貼著於基板。 3 200934631 然後，將黏著帶貼著於基板後，藉由離型輥等將離型 帶自該黏著帶剝離。 於專利文獻1中揭示，自供給捲筒將黏著帶與離型帶一 同放出，將該黏著帶之藉由切斷器所切斷之部位與保持塊 5 相對，於此狀態下將切斷器向上升方向驅動，將上述黏著 帶切斷成特定長度。 [專利文獻1]曰本特開2003-51517號公報 上述切斷器之前端部通常形成為越靠近前端越銳利之 楔狀，藉由該前端部如第12A圖所示，將上述黏著帶a以離 10 型帶c為中介，加壓切斷於保持塊b上。此時，為將黏著帶a 確實地切斷，存在有將上述離型帶c切斷至其厚度之大約一 半程度之情形。即，將離型帶c半切斷。 又，將黏著帶a藉由前端銳利之切斷器切斷後而使離型 帶c半切斷時，由於黏著帶a富有黏性，故藉由切斷器之前 15 端部加壓，會殘留於上述離型帶c之半切斷部。黏著帶a之 殘留於半切斷部之殘留部分d，不僅於切斷部分強固附著於 離型帶c之半切斷部，且成為自黏著帶a不分斷地連續狀態。 將於此狀態切斷成特定長度之黏著帶a，如第12B圖所 示加壓貼著於基板e後，欲將上述離型帶c藉由例如剝離用 20 之輥等自貼著於基板e之黏著帶a向箭頭R方向剝離時，存在 因自黏著帶a不分斷地附著殘留於離型帶c之半切斷部之殘 留部分d，而使黏著帶a與離型帶c一同捲起之情形，於此情 形會招致黏著帶a之貼著不良。 再者，如此之黏著帶a之捲起，於開始第12B圖所示離 200934631 . 型帶C之剝離的端部A發生，不於第12A圖所示剝離結束之 端部B發生。[Previous Art; J Background of the Invention For example, in the manufacturing steps of a flat panel display such as a liquid crystal display panel and a plasma display panel, an adhesive tape which is formed on an outer side of a glass substrate via an anisotropic conductive member The procedure for attaching electronic parts such as TCP (Tape Carrier Package). Before attaching the electronic component to the side surface of the substrate, a step of affixing the adhesive tape of a specific length to the side surface of the substrate is attached. The adhesive tape is attached to the release tape, and the tape is wound around the supply roll. In the case where the electronic component is attached to the upper side of the substrate by the adhesive tape, first, the adhesive tape discharged from the supply reel together with the release tape is cut to a specific length. The cut length of the adhesive tape at this time is set, for example, to a length corresponding to the length of the terminal portion formed by the plurality of terminals provided on the upper surface of the side surface of the substrate. Then, the adhesive tape cut into a specific length is pulled out together with the release tape by, for example, a chuck, and is positioned so as to face the terminal portion on the side surface of the substrate placed on the pedestal. The cut adhesive tape is pressed against the substrate by a press tool. 3 200934631 Then, after attaching the adhesive tape to the substrate, the release tape is peeled off from the adhesive tape by a release roll or the like. According to Patent Document 1, the adhesive tape is discharged together with the release tape from the supply reel, and the portion of the adhesive tape that is cut by the cutter is opposed to the holding block 5, and the cutter is cut off in this state. Driven in the ascending direction to cut the adhesive tape into a specific length. [Patent Document 1] Japanese Laid-Open Patent Publication No. 2003-51517 discloses that the end portion of the cutter is generally formed to have a sharper wedge shape toward the front end, and the front end portion is the adhesive tape a as shown in Fig. 12A. The pressure is cut off from the holding block b by the 10-type belt c. At this time, in order to surely cut the adhesive tape a, there is a case where the release tape c is cut to about half of its thickness. That is, the release tape c is half cut. Further, when the adhesive tape a is cut by the sharp end cutter and the release tape c is half-cut, since the adhesive tape a is viscous, it is left to be pressed by the end portion of the cutter 15 before being pressed. The semi-cut portion of the release belt c. The remaining portion d remaining in the half-cut portion of the adhesive tape a is not only firmly adhered to the half-cut portion of the release tape c but also in a continuous state in which the self-adhesive tape a is not separated. In this state, the adhesive tape a of a specific length is cut and pressed against the substrate e as shown in FIG. 12B, and the release tape c is self-adhered to the substrate by, for example, a roller for peeling 20 or the like. When the adhesive tape a of e is peeled off in the direction of the arrow R, the residual portion d remaining in the semi-cut portion of the release tape c is adhered undivided by the self-adhesive tape a, and the adhesive tape a is wound together with the release tape c. In this case, this situation will lead to poor adhesion of the adhesive tape a. Further, the winding of the adhesive tape a is caused by the end portion A of the peeling of the tape C shown in Fig. 12B from the beginning of Fig. 12B, and the end portion B which is not peeled off as shown in Fig. 12A occurs.
【發明内容:J 發明揭示 5 本發明係提供一種可以於將黏著帶切斷、貼著於基板 後將離型帶剝離時，黏著帶之端部不會捲起之方式切斷黏 著帶的黏著帶之切斷裝置、切斷方法、黏著帶之貼著裝置 及貼著方法。 © 為解決上述問題，本發明係提供一種黏著帶之切斷裝 10 置，其特徵在於： 其係切斷貼著於離型帶之黏著帶者，具備： ' 切斷器，係向對上述黏著帶接離之方向被驅動，於向 ' 接近方向被驅動時切斷上述黏著帶； 保持構件，係藉由該切斷器切斷上述黏著帶時，阻止 15 上述黏著帶與上述離型帶一同因承受來自上述切斷器之加 壓力而撓曲； © 貼著部，係一體設置於上述切斷器，於藉由該切斷器 切斷上述黏著帶時按壓該黏著帶之由上述切斷器切斷之位 置附近，貼著上述黏著帶；及 20 按壓構件，係彈性地按壓上述黏著帶之被按壓貼著於 上述貼著部之部分之附近，於上述黏著帶由上述切斷器切 斷、該切斷器向遠離上述黏著帶之方向被驅動時，以彈性 且非貼著狀態按壓該黏著帶，直至上述黏著帶貼著於上述 貼著部之部分自上述離型帶剝離為止。 5 200934631 又，本發明係提供一種黏著帶之切斷裝置，其特徵在 於： 其係切斷貼著於離型帶之黏著帶者； 具有切斷上述黏著帶之切斷器，該切斷器對上述黏著 5 帶之寬度方向以特定角度傾斜配置。 本發明係提供一種黏著帶之切斷裝置，其特徵在於： 其係具備將貼著於離型帶之黏著帶以半切斷上述離型 帶之方式切斷之切斷器者； 上述切斷器形成為一側面為垂直面，另一側面為傾斜 10 面，前端為平坦面； 上述切斷器前進將黏著帶切斷後後退時，藉由上述垂 直面與上述黏著帶之切斷面之接觸阻力，使上述黏著帶之 切斷部分自上述離型帶剝離。 又，本發明係提供一種黏著帶之切斷裝置，其特徵在 15 於： 其係具備將貼著於離型帶之黏著帶切斷之切斷器者； 具備驅動機構，該驅動機構係將上述切斷器向前進方 向驅動、切斷上述黏著帶後，使上述切斷器後退之前，將 該切斷器向與切斷方向交叉之方向驅動。 20 又，本發明係提供一種黏著帶之切斷方法，其特徵在 於： 其係具備將貼著於離型帶之黏著帶切斷之切斷器者； 具備以下步驟： 藉由上述切斷器切斷上述黏著帶之步驟；及 200934631 .將藉由上述切斷器切斷之上述黏著帶之切斷位置之附 近自上述離型帶剝離之步驟。 又，本發明係提供一種黏著帶之貼著裝置，其特徵在 於： 5 其係將貼著於離型帶之黏著帶切斷成特定長度後貼著 於基板上面者，具備： 切斷器，係向對上述黏著帶接離之方向被驅動，且於 向接近方向被驅動時切斷上述黏著帶； 〇 加壓工具，係將藉由該切斷器切斷成特定長度之上述 10 黏著帶與上述離型帶一同加壓貼著於上述基板；及 離型輥，係於相對上述離型帶之寬度方向使其軸線相 " 對以特定角度傾斜之狀態，自貼著於上述基板之黏著帶剝 " 離上述離型帶。 又，本發明係提供一種黏著帶之貼著方法，其特徵在 15 於： 其係將貼著於離型帶之黏著帶切斷成特定長度後貼著 ® 於基板上面者，具備以下步驟： 藉由切斷器切斷上述黏著帶之步驟； 將藉由上述切斷器切斷成特定長度之上述黏著帶與上 20 述離型帶一同加壓貼著於上述基板之步驟；及 藉由相對上述離型帶之寬度方向使其軸線相對以特定 角度傾斜之狀態之離型輥，自貼著於上述基板之黏著帶剝 離上述離型帶之步驟。 圖式簡單說明 7 200934631 第1圖係顯示本發明之第1實施形態之黏著帶之貼著裝 置之概略構成圖。 第2A圖係將切斷成特定長度之黏著帶貼著於基板之一 側部之端子部之狀態之平面圖。 5 第2B圖係於基板之一側部貼著電子零件之平面圖。 第3圖係藉由切斷裝置之切斷器切斷黏著帶時之說明 圖。 第4圖係藉由上述切斷器切斷黏著帶後，切斷器下降時 之說明圖。 10 第5圖係藉由使上述切斷器下降，黏著帶之端部自離型 帶剝離之狀態之說明圖。 第6圖係顯示離型輥之配置狀態之平面圖。 第7 A圖係顯示本發明之第2實施形態之相對離型帶及 黏著帶之切斷器配置之平面圖。 15 第7B圖係藉由切斷器切斷之黏著帶之下視圖。 第7C圖係顯示切斷器之側視圖。 第8A圖係顯示本發明之第3實施形態之切斷器之側視 圖。 第8B圖係黏著帶之切斷部分之放大截面圖。 20 第8C圖係藉由切斷器自離型帶剝離黏著帶之端部之狀 態之說明圖。 第9A圖係顯示本發明之第4實施狀態之切斷器之側視 圖。 第9B圖係顯示切斷器之動作之說明圖。 200934631 • 第9C圖係藉由切斷器剝離黏著帶之端部之狀態之說明 圖。 第10A圖係顯示為將黏著帶切斷成特定長度而形成一 對切斷線之另一實施形態之說明圖。 5 第1〇B圖係顯示同樣為將黏著帶切斷成特定長度而除 去由第10A圖所形成之一對切斷線之部分之另一實施形態 之說明圖。 第11A圖係於基板貼著黏著帶時之平面圖。 第11B圖係貼著黏著帶後，使基板與基台一同以角度冷 旋轉時之平面圖。 第12A圖係顯示先前之黏著帶之切斷部分之放大截面 圖。 第12B圖係將相同黏著帶貼著於基板後剝離離型帶時 之說明圖。 15SUMMARY OF THE INVENTION The present invention provides a method for cutting the adhesive tape in such a manner that the adhesive tape is cut off and attached to the substrate to peel off the release tape, and the end portion of the adhesive tape is not rolled up. The cutting device, the cutting method, the adhesive device of the adhesive tape, and the bonding method. In order to solve the above problems, the present invention provides a cutting device for an adhesive tape, which is characterized in that it is cut and attached to an adhesive tape of a release tape, and has: a cutter, which is directed to the above The direction in which the adhesive tape is detached is driven to cut the adhesive tape when being driven in the approaching direction; and the holding member is used to cut the adhesive tape by the cutter, and the adhesive tape and the release tape are blocked 15 The flexing is performed by receiving the pressing force from the cutter; the affixing portion is integrally provided on the cutter, and the adhesive tape is pressed by the cutter when the adhesive tape is cut by the cutter The adhesive tape is attached to the vicinity of the position where the breaker is cut, and the pressing member elastically presses the vicinity of the adhesive tape to be pressed against the adhesive portion, and the adhesive tape is used by the cutter When the cutter is driven away from the adhesive tape, the adhesive tape is pressed in an elastic and non-sticking state until the adhesive tape is adhered to the adhesive portion from the release tape. . 5 200934631 Further, the present invention provides a cutting device for an adhesive tape, which is characterized in that it is cut by an adhesive tape attached to a release tape; and has a cutter for cutting the adhesive tape, the cutter The width direction of the above-mentioned adhesive tape 5 is inclined at a specific angle. The present invention provides a cutting device for an adhesive tape, comprising: a cutter for cutting an adhesive tape attached to a release tape to cut the release tape halfway; It is formed such that one side is a vertical surface, the other side is inclined by 10 faces, and the front end is a flat surface; when the cutter advances to cut the adhesive tape and then retreats, the contact resistance between the vertical surface and the cut surface of the adhesive tape is formed. The cut portion of the adhesive tape is peeled off from the release tape. Moreover, the present invention provides a cutting device for an adhesive tape, characterized in that: a cutter having a cutter for cutting an adhesive tape attached to a release tape; and a drive mechanism, the drive mechanism After the cutter drives and cuts the adhesive tape in the forward direction, the cutter is driven in a direction intersecting the cutting direction before the cutter is retracted. Further, the present invention provides a method of cutting an adhesive tape, characterized in that it is provided with a cutter for cutting an adhesive tape attached to a release tape; and the following steps are provided: a step of cutting the adhesive tape; and 200934631. A step of peeling the vicinity of the cutting position of the adhesive tape cut by the cutter from the release tape. Moreover, the present invention provides an adhesive tape attachment device, characterized in that: 5, the adhesive tape attached to the release tape is cut into a specific length and attached to the substrate, and has: a cutter, To be driven in the direction in which the adhesive tape is detached, and to cut the adhesive tape when driven in the approaching direction; the 〇 pressurizing tool cuts the 10 adhesive tapes of a specific length by the cutter And the release tape is pressed against the substrate together with the release tape; and the release roller is attached to the substrate in a state of being inclined at a specific angle with respect to the width direction of the release tape. Adhesive stripping " away from the above release belt. Moreover, the present invention provides a method of attaching an adhesive tape, which is characterized in that: the adhesive tape attached to the release tape is cut into a specific length and attached to the substrate, and has the following steps: a step of cutting the adhesive tape by a cutter; a step of pressing the adhesive tape cut into a specific length by the cutter to the substrate with the upper 20 release tape; and The release roller that is inclined in a state in which the axis is inclined at a specific angle with respect to the width direction of the release tape is a step of peeling off the release tape from an adhesive tape attached to the substrate. Brief Description of the Drawings 7 200934631 Fig. 1 is a schematic configuration view showing an attachment device of an adhesive tape according to a first embodiment of the present invention. Fig. 2A is a plan view showing a state in which an adhesive tape cut to a specific length is attached to a terminal portion on one side of a substrate. 5 Figure 2B is a plan view of the electronic component attached to one side of the substrate. Fig. 3 is an explanatory view showing the cutting of the adhesive tape by the cutter of the cutting device. Fig. 4 is an explanatory view showing a state in which the cutter is lowered after the adhesive tape is cut by the cutter. 10 Fig. 5 is an explanatory view showing a state in which the end portion of the adhesive tape is peeled off from the release tape by lowering the cutter. Fig. 6 is a plan view showing the arrangement state of the release roller. Fig. 7A is a plan view showing the arrangement of the cutters of the release belt and the adhesive tape in the second embodiment of the present invention. 15 Figure 7B is a view of the underside of the adhesive tape cut by the cutter. Figure 7C shows a side view of the cutter. Fig. 8A is a side elevational view showing the cutter of the third embodiment of the present invention. Fig. 8B is an enlarged cross-sectional view showing a cut portion of the adhesive tape. 20 Fig. 8C is an explanatory view of the state in which the end portion of the adhesive tape is peeled off from the release tape by the cutter. Fig. 9A is a side elevational view showing the cutter of the fourth embodiment of the present invention. Fig. 9B is an explanatory view showing the operation of the cutter. 200934631 • Figure 9C is an illustration of the state in which the end of the adhesive tape is peeled off by the cutter. Fig. 10A is an explanatory view showing another embodiment in which a pair of cutting lines are formed by cutting an adhesive tape into a specific length. 5 Fig. 1B is an explanatory view showing another embodiment in which the adhesive tape is cut into a specific length and a part of the pair of cutting lines formed by Fig. 10A is removed. Fig. 11A is a plan view showing the substrate with the adhesive tape attached thereto. Fig. 11B is a plan view showing the substrate and the base plate rotated together at an angle after being pressed against the adhesive tape. Fig. 12A is an enlarged cross-sectional view showing the cut portion of the previous adhesive tape. Fig. 12B is an explanatory view showing a case where the same adhesive tape is attached to the substrate and the release tape is peeled off. 15
2020
t實施方式；J 用以實施發明之最佳形態 以下，一面參照圖面一面說明本發明之實施形態。 第1圖乃至第6圖係顯示本發明之第1實施狀態之由異 方性導電性構件構成之黏著帶2之貼著裝置，該貼著裝置具 備基板基台5。該基板基台5具有底座6，於該底座6之上面 設有台座7 ’該台座7係藉由X驅動源6a、Y驅動源6b及0驅 動源6c向X、γ及<9方向被驅動。 上述台座7上，如第2A圖所示係供給液晶顯示器面板等 將2片玻璃板貼合之基板w，並吸著保持。於基板W之上面 9 200934631 之一側部，沿基板w之一侧之長向以特定長度設有端子部 1 ’該端子部1以特定間隔形成有複數之端子1&。 於上述端子部1如後所述’貼著有切斷為特定長度之兩 面黏著性之異方性導電構件構成之上述黏著帶2。然後，於 5 貼著有黏著帶2之端子部1，如第2B圖所示壓著一個或複數 個TCP等電子零件3。 如第1圖所示’上述黏著帶2係於其一側面貼著有由透 光性之樹脂帶構成之離型帶8後、卷繞於供給捲筒9，將黏 著帶2朝下，由一對之導引輥u所導引之部分與載置於上述 0 10 台座7之上述基板W之端子部1之上面相對，水平移動。 於上述台座7之上方設有加壓工具π，該加壓工具13係 可藉由上下驅動機構14驅動於圖中箭頭所示之上下方向。 — 黏著帶2，係藉由後述之切斷裝置23切斷成特定長度，該切 - 斷部分被搬送至與載置於台座7上之基板％之端子部丨相對 15 之位置時，於該位置停止。 停止後加壓工具13下降，於上述基板w上贴著黏著帶2 之切斷為特定長度之部分。之後，上述離型帶8藉由以驅動 〇 機構16—體向箭頭_χ方向驅動之第1、第2離型輥1〇a、1〇b 自黏著帶2剝離，卷取於卷取捲筒12。 20 上述第1離型輥l〇a如第1圖所示’配置位於離型帶8之 下面側。第2離型輥i〇b係軸線與上述第丨離型輥1〇a平行地 配置於黏著帶2之送帶方向（第1圖及第6圖中以+X表示）之 上述第1離型輥10a之上游側。此等第卜第2離型輥1〇a，1〇b 如第6圖所示，將軸線〇相對於與上述離型帶8之寬度方向平 10 200934631 • 行之直線L以yS表示之特定角度傾斜配置。 因此，第1、第2離型輥10a、10b藉由驅動機構16向第1 圖所示箭頭-X方向驅動時，離型帶8自位於貼著於基板W之 黏著帶2之送帶方向之上游側的寬度方向之一端（於第6圖 5 以E1表示）向另一端（於第6圖以E2表示）緩緩剝離。 上述黏著帶2與離型帶8之搬送，藉由作為搬送機構之 送帶裝置20進行。該送帶裝置20具有可夾持離型帶8地形成 之失頭21。該夾頭21由未圖示之導引體旋轉不能地導引， 且藉由以伺服馬達22b旋轉驅動之驅動螺桿22a進行直線驅 10 動° 因此，若於上述夾頭21夾持離型帶8之狀態下使上述驅 動螺桿22a旋轉驅動，將該夾頭21朝第1圖中以箭頭+χ所示 方向驅動，可將上述離型帶8及黏著帶2朝+X方向搬送，將 該黏著帶2定位於特定位置，即與基板W之端子部1相對之 15 位置。 _ 上述黏著帶2於基板W之搬送方向上游側，藉由上述切 斷裝置23切斷成特定長度。該切斷裝置23如第3圖及第4圖 所示，具有軸線為垂直之配置於上述黏著帶2下方之作為驅 動機構之氣缸25。於該氣缸25之桿25a上安裝有驅動構件 20 26。該驅動構件26藉由氣缸25而於第1圖中箭頭所示之上下 方向上驅動。 上述驅動構件26之上面的位於上述黏著帶2之搬送方 向下流侧之一端部，立設有切斷器27。該切斷器27具有形 成為前端銳利之楔狀之齒部27a，且於該齒部27a之位於上 11 200934631 述黏著帶2之搬送方向上游側的—側，一體形成有上端為平 坦面28a之貼著部28。該平坦面28a形成於比上述齒部273之 前端低特定尺寸之位置。 上述貼著部28之平坦面28a，如後所述於上述切斷器27 5 之齒部27&切斷上述黏著帶2且半切斷上述離型帶8時，於上 述黏著帶2之藉由切斷器27切斷之部位附近，按壓搬送方向 上游側之部分。 上述平坦面28a為使上述黏著帶2容易貼著，例如形成 為粗面。藉此，上述黏著帶2之藉由上述平坦面28a所按壓 0 10 之部分，貼著於該平坦面28a。 於上述驅動構件26之上面的位於上述黏著帶2之搬送 方向上游側之另一端部，設有支持片31。於該支持片31形 成有保持孔32，於該保持孔32支撐有按壓構件33，該按壓 構件33可於上下方向滑動。 15 上述按壓構件33之上端面33a，形成為如後所述按壓黏 著帶2時不貼著該黏著帶2之非貼著面。非貼著面，例如藉 由塗佈矽樹脂或氟樹脂等具有滑澤性之樹脂而形成。 0 於上述按壓構件33形成有下端面開放之保持孔34。於 該保持孔34收容有彈簧35，該彈簧35將上述按壓構件33向 2〇上升方向賦與勢能。再者，於按壓構件33之下端設有鍔36， 該鍔36係阻止藉由彈簧35向上升方向賦與勢能之上述按壓 構件33自上述保持孔34拔出。 上述按壓構件33藉由彈簧35向上升方向賦與勢能之狀 態下，按壓構件33之上端面33a位於與上述切斷器27之齒部 12 200934631 27a之前端同等或稍 万之位置。本實施形態中設定為梢高 之位置。 ;述切斷裝置23之上方，以夾住上述黏著帶2之方式 配設=為保持構件之保持塊38。貼著於上述黏著帶2上面 5之離型’―面以其上面接觸於上述保持塊38之下面，-面搬送。 於離型帶8接觸於保持塊觀下面之狀態，使上述氣紅 25動作將驅動構件26向上升方向驅動時，黏著帶2藉由上述 按壓構件33之上端面33a被按壓保持於上述保持塊38之下 10 面。 進而，驅動構件26向上升方向驅動，按壓構件33使彈 菁35壓縮變形而相對朝下方位移。接著，設於上述驅動構 件26之切斷器27之齒部27a之前端將黏著帶2切斷。然後， 驅動構件26被驅動至上升極限時，上述切斷器27將黏著帶2 15切斷，且上升至切斷離型帶8之厚度方向之大約一半之半切 斷位置。 上述驅動構件26被驅動至上升極限後，向下降方向驅 動時，切斷器27與驅動構件26 —同下降，按壓構件33則藉 由彈簧35之回復力而以其上端面33a持續按壓黏著帶2。 20 上述切斷器27進一步下降時，由於黏著帶2貼著於與切 斷器27—體成形之貼著部28之平坦面28a，故如第5圖所 示’黏著帶2之由切斷器27切斷之部分之位於搬送方向上游 側的端部自上述離型帶8剝離。 此時，由於黏著帶2之藉由切斷器27切斷之部分之上游 13 200934631 側部分，藉由減構件33彈性保持，故上述黏著帶2之切斷 端部自上述離型帶8確實剝離。 接著’就藉由上賴成之貼著裝置於基板w之側邊部 貼著黏著帶2之情形進行說明。 5 首先，藉由上述切斷裝置23將上述黏著帶2切斷成特定 長度。即’黏著帶2藉由送㈣置2〇輪送並定位後，氣缸25 作動將驅動構件26向上升方向驅動。 ^述切斷器27被驅動至上升極限時，由該切斷器咖 斷黏著帶2 ’且離型帶8被半切斷。與之同時，黏著帶2之藉 1〇由切斷器27切斷之部分之附近，藉由按壓構件狀上端面 33a按壓保持。 上述切斷器27被驅動至上升極限，將黏著帶2切斷完成 後’向下降方向驅動。於上述切斷器27形成有貼著部28 , 於該貼著部28之平坦面28a貼著有上述黏著帶2之由上述切 15斷器27切斷位置之送帶方向之上游侧端部。 因此，切斷黏著帶2後，將切斷器27向下降方向驅動 時，如第5圖所示上述黏著帶2之切斷部分之搬送方向上游 側端部藉由上述貼著部28向下方拉伸，自上述離型 離。 ’ 2〇 藉此，黏著帶2之由切斷器27之切斷位置之搬送方向上 游側之端部，自殘留於離型帶8之半切斷部之上述黏著帶2 之殘留部分2a確實分離。 如此，若將黏著帶2藉由上述切斷裝置23切斷成特定長 度後，藉由送帶裝置20將上述黏著帶2與離型帶8—同進行 200934631 • 搬送定位，使該切斷部分與基板贾之端子部1相對。 黏著帶2定位後，加壓工具13向下降方向驅動，將上述 黏著帶2之切斷為特定長度之部分加壓貼著於基板w之一 側部上面之端子部1。貼著黏著帶2後加壓工具13上升，一 5 對離型輥10a、10b藉由驅動機構16向-X方向驅動，自黏著 帶2剝離離型帶8。 此時，開始剝離離型帶8之黏著帶2之端部，即黏著帶2 之由切斷器27切斷位置之位於搬送方向上游侧之端部，如 © 上所述與殘留於離型帶8之半切斷部之殘留部分23確實分 10 離。 因此，藉由離型輥10a、10b開始剝離離型帶8時，由於 不會產生黏著帶2之端部經由殘留於半切斷部之殘留部分 2a向離型帶8拉伸之事’故可不使上述黏著帶2之端部自基 板W捲起地將上述離型帶8自上述黏著帶2剝離。 15 上述離型輥l〇a、10b相對離型帶8之寬度方向以角度点 傾斜設置。因此’離型親l〇a、l〇b藉由驅動機構16向-X方 ® 向驅動、將離型帶8自黏著帶2剝離時，離型帶8從位於黏著 帶2之送帶方向上游側之寬度方向之一端£1緩緩剝離。 藉此，將離型帶8自黏著帶2剝離時，因為減低離型帶8 20 拉伸黏著帶2之力，故即使有暫時殘留於離型帶8之半切斷 部之殘留部分2a與黏著帶2未確實分斷，亦不會使貼著於基 板W之黏著帶2自基板w捲起，可將上述離型帶8自上述黏 著帶2剝離。 又，將離型帶8自黏著帶2剝離時，由於自寬度方向之 15 200934631 一端El緩緩剝離，故與同時剝離寬度方向全體之情形相 比，施加於黏著帶2之每單位面積之拉伸力增大。 因此’由於伴隨一對離型輥1〇a、l〇b之驅動，黏著帶2 之殘留於離型帶8之殘留部分2a被確實切斷，故藉此可防止 5 黏著帶2自基板W捲起。 第7A圖、第7B圖、第7C圖係顯示本發明之第2實施形 態。本實施形態係構成切斷裝置之切斷器27相對黏著帶2之 寬度方向以角度0傾斜配置。上述切斷器27與第1實施形態 同樣，藉由氣缸25於上下方向驅動。 ❹ 10 如第7B圖中切斷線S所示’藉由上述切斷器27將黏著帶 2斜向切斷時，將黏著帶2貼著於基板w並將離型帶8以離型 輥10a、l〇b剝離之際，黏著帶2之位於搬送方向上游侧之前 端面以角度0傾斜。 因此，殘留於離型帶8半切斷部之黏著帶2之殘留部分 15 2a與開始離型帶8之剝離之黏著帶2之傾斜前端之連接，與 切斷器27對黏著帶2之寬度方向垂直之情形相比非常少，連 接強度亦低，故可不使黏著帶2之端部自基板w捲起地剝離 ® 離型帶8。 再者，亦可將上述第1實施形態所示之切斷器27，如第 2〇 2實施形態之切斷器27般對黏著帶2之寬度方向以角度θ傾 斜配置。 第8A圖、第8B圖、第8C圖係顯示本發明之第3實施形 態。本實施形態係構成切斷裝置之切斷器127之截面形狀之 變形例。如第8A圖所示’該切斷器127其位於黏著帶2之搬 16 200934631 送方向上游側之一側面形成為垂直面㈣，位於下流側之 另一側面形成為傾斜面mb，上端面成為平坦面mc。 然後，上述切斷器127與第i實施形態同樣，藉由作為 驅動機構之氣虹25向第8A圖箭頭所示之上下方向驅動。再 5者，切斷器127之垂直面127a形成為黏著帶2易貼著之粗面。 藉由上述構成之切斷器127切斷黏著帶2時，黏著帶2之 切斷部分由上述切斷器127之平坦面心分斷。而且，上述 切斷器127之位於黏著帶2之搬送方向上游侧之—側面為垂 直面127a，位於下流側之另一側面為傾斜面l27b。 1〇 因此，藉由上述切斷器127切斷之黏著帶2之殘留於離 型帶8之半切斷部之殘留部分23，如第8B圖所示，藉由上述 切斷器127之垂直面127a成與上述黏著帶2之上游側端部分 斷之狀態。 然後，若將離型帶8半切斷、完成切斷黏著帶2後，將 I5切斷H 127如第8C圖箭頭所示向下降方向驅動，由於上述切 斷器127之上升時藉由垂直面127a所切斷之料帶2之上游 侧端面，滑接或貼著於形成粗面之上述垂直面ma被向下 方下壓，故黏著帶2之切斷位置之上游側端部自離型帶8剝 離。 !〇 藉此，即使黏著帶2之切斷位置之上游側端部與殘留於 半切斷部之㈣部分2a連續，亦可自_ ”分2a確實分 斷，故將切斷為特定長度之黏著帶2貼著於基板w後、剝離 離型帶8時’可防止上述黏著帶2之端部gj離型帶8而捲起。 第9A圖、第9B圖、第9C圖係顯示本發明之第4實施形 17 200934631 態。本實施形態之構成切斷裝置之切斷器27之截面形狀， 與第1、第2實施形態同樣為楔形，但驅動切斷器27之驅動 機構與第1、第2實施形態不同。 即’上述驅動機構係將上述切斷器27向第9A圖箭頭X 5 所示之沿黏著帶2之長向之水平方向（X方向）及箭頭Z所示 之上下方向之Z方向驅動的XZ驅動源41。該XZ驅動源41係 將上述切斷器27從第9B圖以S1表示之下降初期位置向S2表 示之+Z方向之上升位置驅動，以半切斷離型帶8之狀態切斷 黏著帶2。 10 接著，向S3表示之-X方向、即黏著帶2之送帶方向之上 游側稍微驅動後，向S4表示之-Z方向之下降方向驅動，向 S1表示之+X方向驅動後返回初期位置。 藉此’上述切斷器27切斷黏著帶2後，向_χ方向驅動 時，黏著帶2之位於切斷位置之上游側之端部藉由上述切斷 15 器27之侧面向-X方向加壓。接著，切斷器27向-Z所示方向 下降。 切斷器27向-Z方向下降時，上述黏著帶2之切斷位置之 上游側之端部，如第9C圖所示，藉由與切斷器27之接觸阻 力自離型帶8剝離，故可對殘留於離型帶8之半切斷部之黏 20 著帶2之殘留部分2a確實分離。 因此，將切斷成固定長度之黏著帶2貼著於基板W後， 自該黏著帶2將離型帶8剝離時，不會有成為剝離端之上述 黏著帶2之切斷時上游側之端部因殘留於離型帶§之半切斷 部之殘留部分2a而捲起’可將離型帶8自黏著帶2剝離。 200934631 於上述各實施形態中，將黏著帶2以特定長度切斷時， 亦可如第10A圖所示，將黏著帶2以狹小間隔於2處形成切斷 線S，將一對切斷線s之間之部分如第10B圖所示除去，於以 特定尺寸切斷之黏著帶2間形成中空部42。 5 於此情形，亦如上述第1乃至第4實施形態所示，藉由 將殘留於離型帶8之半切斷部之黏著帶2之殘留部分2a，與 位於黏著帶2之搬送方向下流侧之端部分離，可確實進行離 型帶8之剝離。 於上述第2乃至第4實施形態中，亦與第丨實施形態同 10 樣，將黏著帶2貼著於基板W後、將離型帶8剝離時，藉由 一對離型輥l〇a、10b相對離型帶8之寬度方向以角度冷傾 斜，可不使貼著於基板W之黏著帶2自基板w捲起地將離型 帶8剝離。 於第1實施形態中將第1 '第2離型輥i〇a、i〇b之軸線〇 15 相對與上述離型帶8之寬度方向平行之直線L·以第ό圖中；3 表示之特定角度傾斜配置，但亦可如第11Α圖所示，將一對 離型輥10a、10b配置成其等之軸線與沿離型帶8之寬度方向 之直線平行。即，將第1、第2離型輥i〇a、i〇b之軸線〇配置 成與沿載置基板W之基座5之Y方向（第11 a圖所示）之移動 20 方向成平行。 然後，將黏著帶2藉由加壓工具13貼著於基板w後，開 始離型帶8之剝離之前，如第11B圖所示藉由0驅動源6c將 基台5與基板W—同水平方向旋轉角度点。 藉此，貼著於黏著帶2之離型帶8相對一對離型棍10a、 19 200934631 10b之軸線0與基板W—同以角度召傾斜。因此，若於該狀 . 態下藉由驅動機構16將離型親l〇a、l〇b向第1圖所示之-X方 向驅動，則由於離型帶8從貼著於基板W之黏著帶2之寬度 方向一端向另一端緩緩剝離，故可不使黏著帶2自基板W捲 5 起地剝離離型帶8。 即，若使離型輥10a' 10b或離型帶8中之任一者傾斜， 即使離型輥10a、10b與離型帶8以相對角度石傾斜，於該狀 態下自黏著帶2剝離離型帶8,則由於可自黏著帶2之寬度方 向之一端向另一端緩緩剝離，故可減低剝離時離型帶8施加 © 10 於黏著帶2之拉伸力，防止黏著帶2之捲起。 又，自黏著帶2剝離離型帶8時，由於自寬度方向之一 端緩緩剝離，故與同時剝離寬度方向全體之情形相比，施 加於黏著帶2之每單位面積之拉伸力增大。 因此，伴隨一對離型輥l〇a、10b之驅動，殘留於黏著 15 帶2之離型帶8之殘留部分2a被確實切斷，故藉此可防止黏 著帶2自基板W捲起。 若預先使離型輥10a、10b與離型帶8以相對角度冷傾 〇 斜’則構成切斷黏著帶2之切斷裝置之切斷器亦可為第1乃 至第4實施形態所示構造外之裝置。即，藉由切斷裝置切斷 20 黏著帶2時，即使黏著帶2與殘留於離型帶8之黏著帶2之殘 留部分2a未確實分斷，亦可不使黏著帶2自基板W捲起地將 離型帶8剝離。 又，藉由將離型輥10a、10b與離型帶6兩者向相反方向 傾斜’亦可使該等兩者相對傾斜。 20 200934631 5 ❹ 10 15 ❹ 20 又，係以切斷黏著帶2時將離型帶6半切斷為例說明， 但即使未半切斷離型帶6之情形，由於將黏著帶切斷時黏著 帶藉由切斷器被強力按壓、其一部份附著殘留於離型帶6 上，故即使如此情形亦藉由適用本發明，可不使貼著於美 板之黏著帶2捲起地剝離離型帶6。 產業之可利用性 根據本發明，藉由切斷器切斷黏著帶後，因為將黏著 帶之切斷位置附近自離型帶剝離，故可不使黏著帶之端部 捲起地剝離離型帶。 又，自貼著於基板之黏著帶剝離離型帶時，由於使離 型輥之轴線相對離型帶之寬度方向相對傾斜地進行剝離， 故離型帶自切斷之黏者帶之寬度方向之一端緩緩剝離。因 此，由於可減低將離型帶自黏著帶剝離時之黏著阻力，故 可不使黏著帶之端部捲起地剝離離型帶。 【圖式簡單說明3 第1圖係顯示本發明之第1實施形態之黏著帶之貼著裝 置之概略構成圖。 第2A圖係將切斷成特定長度之黏著帶貼著於基板之一 侧部之端子部之狀態之平面圖。 第2B圖係於基板之一側部貼著電子零件之平面圖。 第3圖係藉由切斷裝置之切斷器切斷黏著帶時之說明 圖。 第4圖係藉由上述切斷器切斷黏者帶後，切斷器下降時 之說明圖。 21 200934631 第5圖係藉由使上述切斷器下降，黏著帶之端部自離型 . 帶剝離之狀態之說明圖。 第6圖係顯示離型輥之配置狀態之平面圖。 第7 A圖係顯示本發明之第2實施形態之相對離型帶及 5 黏著帶之切斷器配置之平面圖。 第7B圖係藉由切斷器切斷之黏著帶之下視圖。 第7C圖係顯示切斷器之側視圖。 第8A圖係顯示本發明之第3實施形態之切斷器之側視 圖。 ❹ 10 第8B圖係黏著帶之切斷部分之放大截面圖。 第8C圖係藉由切斷器自離型帶剝離黏著帶之端部之狀 態之說明圖。 第9A圖係顯示本發明之第4實施狀態之切斷器之側視 圖。 15 第9B圖係顯示切斷器之動作之說明圖。 第9 C圖係藉由切斷器剝離黏著帶之端部之狀態之說明 圖。 ❹ 第10A圖係顯示為將黏著帶切斷成特定長度而形成一 對切斷線之另一實施形態之說明圖。 20 第10B圖係顯示同樣為將黏著帶切斷成特定長度而除 去由第10A圖所形成之一對切斷線之部分之另一實施形態 之說明圖。 第11A圖係於基板貼著黏著帶時之平面圖。 第11B圖係貼著黏著帶後，使基板與基台一同以角度/5 22 200934631 旋轉時之平面圖。 第12A圖係顯示先前之黏著帶之切斷部分之放大截面 圖。 第12B圖係將相同黏著帶貼著於基板後剝離離型帶時 5 之說明圖。 【主要元件符號說明】BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings. Fig. 1 through Fig. 6 show an attachment device for an adhesive tape 2 composed of an anisotropic conductive member according to a first embodiment of the present invention, the attachment device having a substrate base 5. The substrate base 5 has a base 6 on which a pedestal 7 is provided. The pedestal 7 is driven in the X, γ, and <9 directions by the X driving source 6a, the Y driving source 6b, and the 0 driving source 6c. drive. As shown in Fig. 2A, the pedestal 7 is supplied with a substrate w to which two glass plates are bonded, such as a liquid crystal display panel, and sucked and held. On one side of the substrate W 9 200934631, a terminal portion 1 ' is provided with a specific length along the length direction of one side of the substrate w. The terminal portion 1 is formed with a plurality of terminals 1 & The above-mentioned adhesive tape 2 composed of an anisotropic conductive member which is cut to have a specific length on both sides is attached to the terminal portion 1 as will be described later. Then, the terminal portion 1 having the adhesive tape 2 is attached to the terminal portion 5, and one or a plurality of electronic components 3 such as TCP are pressed as shown in Fig. 2B. As shown in Fig. 1, the adhesive tape 2 is attached to a release tape 8 made of a translucent resin tape on one side thereof, and is wound around a supply reel 9 with the adhesive tape 2 facing downward. The portion guided by the pair of guide rollers u is opposed to the upper surface of the terminal portion 1 of the substrate W placed on the 0 10 pedestal 7, and is horizontally moved. A pressurizing tool π is provided above the pedestal 7, and the pressurizing tool 13 is driven by the up and down drive mechanism 14 in the up and down direction indicated by the arrow in the figure. — the adhesive tape 2 is cut into a specific length by a cutting device 23 to be described later, and the cut-and-break portion is conveyed to a position 15 opposite to the terminal portion 基板 of the substrate placed on the pedestal 7, The position stops. After the stop, the pressurizing tool 13 is lowered, and the portion of the substrate w that is cut by the adhesive tape 2 to a specific length is attached. Thereafter, the release belt 8 is peeled off from the adhesive tape 2 by the first and second release rolls 1A, 1b driven by the drive mechanism 16 in the direction of the arrow _χ, and is taken up by the take-up roll. Cartridge 12. 20 The first release roller 10a is disposed on the lower side of the release belt 8 as shown in Fig. 1. The first release roller i〇b is disposed in parallel with the first release roller 1A, and is disposed in the tape feed direction of the adhesive tape 2 (indicated by +X in FIGS. 1 and 6). The upstream side of the profile roller 10a. The second release rolls 1〇a, 1〇b are as shown in Fig. 6, and the axis 〇 is flat with respect to the width direction of the release belt 8 10 200934631 • The line L is specified by yS Angle tilt configuration. Therefore, when the first and second release rolls 10a and 10b are driven by the drive mechanism 16 in the arrow-X direction shown in Fig. 1, the release belt 8 is oriented from the direction in which the adhesive tape 2 is attached to the substrate W. One end of the upstream side in the width direction (indicated by E1 in Fig. 6) is gradually peeled off toward the other end (indicated by E2 in Fig. 6). The transfer of the adhesive tape 2 and the release tape 8 is carried out by the tape feeding device 20 as a conveying mechanism. The tape feeding device 20 has a head loss 21 which can be formed by sandwiching the release tape 8. The chuck 21 is unrotatably guided by a guide body (not shown), and is linearly driven by a drive screw 22a that is rotationally driven by the servo motor 22b. Therefore, if the clip 21 is held by the chuck 21 In the state of 8, the drive screw 22a is rotationally driven, and the chuck 21 is driven in the direction indicated by an arrow + 第 in the first drawing, and the release belt 8 and the adhesive tape 2 can be conveyed in the +X direction. The adhesive tape 2 is positioned at a specific position, that is, 15 positions opposite to the terminal portion 1 of the substrate W. The adhesive tape 2 is cut to a predetermined length by the cutting device 23 on the upstream side in the transport direction of the substrate W. As shown in Figs. 3 and 4, the cutting device 23 has a cylinder 25 as a driving mechanism disposed below the adhesive tape 2 with a vertical axis. A drive member 20 26 is attached to the rod 25a of the cylinder 25. The drive member 26 is driven by the air cylinder 25 in the up-down direction indicated by the arrow in Fig. 1 . The upper surface of the drive member 26 is located at one end of the downstream side of the transfer side of the adhesive tape 2, and a cutter 27 is standing. The cutter 27 has a wedge-shaped tooth portion 27a formed to have a sharp end, and the upper portion is a flat surface 28a integrally formed on the upstream side of the upper portion of the adhesive tape 2 in the upper direction of the upper portion 11 200934631. The part 28 is attached. The flat surface 28a is formed at a position lower than the front end of the tooth portion 273 by a specific size. The flat surface 28a of the attaching portion 28 is used in the toothed portion 27 of the cutter 27, as will be described later, when the adhesive tape 2 is cut and the release tape 8 is half cut, by the adhesive tape 2 In the vicinity of the portion where the cutter 27 is cut, the portion on the upstream side in the conveyance direction is pressed. The flat surface 28a is formed such that the adhesive tape 2 is easily adhered to, for example, a rough surface. Thereby, the portion of the adhesive tape 2 that is pressed by the flat surface 28a by 0 10 is attached to the flat surface 28a. A support piece 31 is provided on the other end portion of the upper surface of the drive member 26 on the upstream side in the transport direction of the adhesive tape 2. A holding hole 32 is formed in the support piece 31, and a pressing member 33 is supported by the holding hole 32, and the pressing member 33 is slidable in the vertical direction. The upper end surface 33a of the pressing member 33 is formed so as not to be in contact with the non-adhesive surface of the adhesive tape 2 when the adhesive tape 2 is pressed as will be described later. The non-adhesive surface is formed, for example, by coating a resin having smoothness such as enamel resin or fluororesin. The holding member 33 is formed with a holding hole 34 having a lower end surface open. A spring 35 is housed in the holding hole 34, and the spring 35 imparts potential energy to the pressing member 33 in the rising direction of the second direction. Further, a cymbal 36 is provided at the lower end of the pressing member 33, and the cymbal 36 prevents the pressing member 33 that imparts potential energy in the upward direction by the spring 35 from being pulled out from the holding hole 34. When the pressing member 33 is biased in the upward direction by the spring 35, the upper end surface 33a of the pressing member 33 is located at the same or slightly higher position than the front end of the tooth portion 12 200934631 27a of the cutter 27. In the present embodiment, the position is set to the tip height. Above the cutting device 23, the holding block 38 is held as a holding member so as to sandwich the adhesive tape 2. The release type surface of the upper surface of the adhesive tape 2 is placed on the lower surface of the holding block 38 and is conveyed on the surface. When the release belt 8 is in contact with the lower surface of the holding block, when the gas red 25 is actuated to drive the driving member 26 in the upward direction, the adhesive tape 2 is pressed and held by the upper end surface 33a of the pressing member 33 to the holding block. 38 below 38. Further, the drive member 26 is driven in the upward direction, and the pressing member 33 compresses and deforms the carcass 35 to be displaced downward. Next, the adhesive tape 2 is cut at the front end of the tooth portion 27a of the cutter 27 of the drive member 26. Then, when the driving member 26 is driven to the rising limit, the cutter 27 cuts the adhesive tape 2 15 and rises to a half of the cutting position in which the thickness direction of the release tape 8 is cut. After the driving member 26 is driven to the rising limit, when the driving member 26 is driven in the descending direction, the cutter 27 is lowered together with the driving member 26, and the pressing member 33 continues to press the adhesive tape with the upper end surface 33a thereof by the restoring force of the spring 35. 2. When the cutter 27 is further lowered, the adhesive tape 2 is attached to the flat surface 28a of the adhering portion 28 formed integrally with the cutter 27, so that the adhesive tape 2 is cut as shown in Fig. 5 The end portion of the portion cut by the device 27 on the upstream side in the conveying direction is peeled off from the release belt 8 described above. At this time, since the side portion of the adhesive tape 2 which is cut by the cutter 27 on the upstream side 13 200934631 is elastically held by the reducing member 33, the cut end portion of the above-mentioned adhesive tape 2 is surely removed from the above-mentioned release tape 8 Stripped. Next, the case where the adhesive tape 2 is attached to the side portion of the substrate w by the bonding device will be described. 5 First, the adhesive tape 2 is cut into a specific length by the above-described cutting device 23. That is, after the adhesive tape 2 is placed and positioned by the feed (four), the cylinder 25 is actuated to drive the drive member 26 in the upward direction. When the cutter 27 is driven to the rising limit, the adhesive tape 2' is broken by the cutter and the release tape 8 is half-cut. At the same time, the vicinity of the portion cut by the cutter 27 by the adhesive tape 2 is pressed and held by the pressing member-like upper end surface 33a. The cutter 27 is driven to the rising limit, and after the adhesive tape 2 is cut, it is driven in the descending direction. The cutter 27 is formed with the abutting portion 28, and the upstream end portion of the adhesive tape 2 in the feeding direction of the cutting position of the cutting tape 2 is attached to the flat surface 28a of the bonding portion 28. . Therefore, when the adhesive tape 2 is cut and the cutter 27 is driven in the downward direction, as shown in Fig. 5, the upstream end portion of the cutting portion of the adhesive tape 2 in the transport direction is downward by the above-mentioned adhering portion 28. Stretching, from the above separation. Therefore, the end portion of the adhesive tape 2 on the upstream side in the transport direction of the cutting position of the cutter 27 is separated from the remaining portion 2a of the adhesive tape 2 remaining in the half cut portion of the release tape 8 . In this manner, when the adhesive tape 2 is cut into a specific length by the cutting device 23, the tape 2 and the release tape 8 are simultaneously conveyed by the tape feeding device 20 to carry out the positioning of the tape. It is opposed to the terminal portion 1 of the substrate. After the adhesive tape 2 is positioned, the pressurizing tool 13 is driven in the descending direction, and the portion of the adhesive tape 2 cut into a specific length is pressed against the terminal portion 1 on the upper side of one side of the substrate w. After the adhesive tape 2 is attached, the pressurizing tool 13 is raised, and a pair of release rolls 10a, 10b are driven in the -X direction by the drive mechanism 16, and the release tape 8 is peeled off from the adhesive tape 2. At this time, the end portion of the adhesive tape 2 of the release tape 8 is peeled off, that is, the end portion of the adhesive tape 2 which is cut at the upstream side in the conveyance direction by the cutter 27, as described in © and remaining in the release type. The residual portion 23 of the cut portion with the half of the strip 8 is indeed divided by 10. Therefore, when the release belt 8 is peeled off by the release rolls 10a and 10b, the end portion of the adhesive tape 2 does not become stretched toward the release belt 8 via the residual portion 2a remaining in the half cut portion. The release tape 8 is peeled off from the adhesive tape 2 by winding the end portion of the adhesive tape 2 from the substrate W. 15 The release rolls l〇a, 10b are inclined at an angular point with respect to the width direction of the release belt 8. Therefore, when the release molds are driven by the drive mechanism 16 to the -X square® and the release belt 8 is peeled off from the adhesive tape 2, the release tape 8 is directed from the feed belt of the adhesive tape 2. One end of the width direction of the upstream side is gradually peeled off by £1. Thereby, when the release tape 8 is peeled off from the adhesive tape 2, since the force of stretching the adhesive tape 2 by the release tape 8 20 is reduced, even the residual portion 2a and the adhesive portion temporarily remaining in the half cut portion of the release tape 8 are adhered. The tape 2 is not surely broken, and the adhesive tape 2 attached to the substrate W is not rolled up from the substrate w, and the release tape 8 can be peeled off from the adhesive tape 2. Further, when the release tape 8 is peeled off from the adhesive tape 2, since one end El is gradually peeled off from the width direction 15 200934631, it is applied to the adhesive tape 2 per unit area as compared with the case where the entire width direction is simultaneously peeled off. The extension is increased. Therefore, the residual portion 2a of the adhesive tape 2 remaining on the release tape 8 is surely cut off by the driving of the pair of release rolls 1a, lb, thereby preventing the 5 adhesive tape 2 from the substrate W. Roll up. Fig. 7A, Fig. 7B, and Fig. 7C show a second embodiment of the present invention. In the present embodiment, the cutter 27 constituting the cutting device is disposed obliquely at an angle of 0 with respect to the width direction of the adhesive tape 2. The cutter 27 is driven in the vertical direction by the air cylinder 25 as in the first embodiment. ❹ 10 As shown by the cutting line S in Fig. 7B, when the adhesive tape 2 is obliquely cut by the cutter 27, the adhesive tape 2 is attached to the substrate w and the release tape 8 is used as a release roll. When 10a and l〇b are peeled off, the end face of the adhesive tape 2 is inclined at an angle of 0 before the upstream side in the conveyance direction. Therefore, the remaining portion 15 2a of the adhesive tape 2 remaining in the semi-cut portion of the release tape 8 is connected to the inclined front end of the adhesive tape 2 which starts the peeling of the release tape 8, and the width direction of the adhesive tape 2 to the cutter 27. Since the case of the vertical is very small and the connection strength is also low, the end of the adhesive tape 2 can be peeled off from the substrate w without peeling off the release tape 8. Further, the cutter 27 shown in the above-described first embodiment may be disposed such that the width direction of the adhesive tape 2 is inclined at an angle θ as in the cutter 27 of the second embodiment. Fig. 8A, Fig. 8B, and Fig. 8C show a third embodiment of the present invention. This embodiment is a modification of the cross-sectional shape of the cutter 127 constituting the cutting device. As shown in Fig. 8A, the cutter 127 is located on the side of the upstream side of the feed belt 2, which is formed as a vertical surface (four), and the other side of the downstream side is formed as an inclined surface mb, and the upper end surface is formed. Flat surface mc. Then, the cutter 127 is driven in the up-and-down direction indicated by the arrow in Fig. 8A by the gas rainbow 25 as the drive mechanism, similarly to the i-th embodiment. Further, the vertical surface 127a of the cutter 127 is formed as a rough surface to which the adhesive tape 2 is easy to adhere. When the adhesive tape 2 is cut by the cutter 127 having the above configuration, the cut portion of the adhesive tape 2 is separated by the flat face of the cutter 127. Further, the side surface of the cutter 127 on the upstream side in the conveying direction of the adhesive tape 2 is a vertical surface 127a, and the other side surface on the downstream side is an inclined surface 127b. Therefore, the residual portion 23 of the adhesive tape 2 cut by the cutter 127 remaining in the half cut portion of the release tape 8 is as shown in Fig. 8B, by the vertical face of the cutter 127 127a is in a state of being disconnected from the upstream side end portion of the above-mentioned adhesive tape 2. Then, when the release tape 8 is half-cut and the adhesive tape 2 is cut, the I5 cut H 127 is driven in the downward direction as indicated by the arrow in Fig. 8C, because the cutter 127 rises by the vertical plane. The upstream end surface of the strip 2 cut by 127a is pressed downward or pressed against the vertical surface ma forming the rough surface, and is pressed downward, so that the upstream end end of the adhesive tape 2 is separated from the release belt. 8 peeling. Therefore, even if the upstream end portion of the cutting position of the adhesive tape 2 is continuous with the (4) portion 2a remaining in the half-cut portion, the portion can be separated from the _" 2a, so that the cutting is cut to a specific length. When the tape 2 is attached to the substrate w and the release tape 8 is peeled off, the end portion gj of the adhesive tape 2 can be prevented from being lifted off from the tape 8 . FIGS. 9A, 9B, and 9C show the present invention. In the fourth embodiment, the cross-sectional shape of the cutter 27 constituting the cutting device of the present embodiment is wedge-shaped as in the first and second embodiments, but the driving mechanism for driving the cutter 27 is the first. The second embodiment is different. That is, the drive mechanism is such that the cutter 27 is oriented in the horizontal direction (X direction) along the longitudinal direction of the adhesive tape 2 and the upward direction of the arrow Z as indicated by an arrow X5 in the 9th AA. The ZZ drive source 41 driven in the Z direction. The XZ drive source 41 drives the cutter 27 from the initial position of the drop shown by S1 in Fig. 9B to the rising position of the +Z direction indicated by S2, and cuts off the split by half. In the state of the belt 8, the adhesive tape 2 is cut. 10 Next, the direction of the -X direction, that is, the direction of the tape of the adhesive tape 2 is indicated to S3. After the upstream side is slightly driven, it is driven in the descending direction of the -Z direction indicated by S4, and is driven to the initial position after being driven in the +X direction indicated by S1. Thus, the cutter 27 cuts the adhesive tape 2, and then _χ When the direction is driven, the end portion of the adhesive tape 2 on the upstream side of the cutting position is pressurized in the -X direction by the side surface of the cutting device 27. Then, the cutter 27 is lowered in the direction indicated by -Z. When the breaker 27 is lowered in the -Z direction, the end portion on the upstream side of the cutting position of the adhesive tape 2 is peeled off from the release tape 8 by the contact resistance with the cutter 27 as shown in Fig. 9C. The residual portion 2a of the adhesive tape 2 remaining in the half-cut portion of the release tape 8 can be surely separated. Therefore, after the adhesive tape 2 cut to a fixed length is attached to the substrate W, the adhesive tape 2 will be When the release tape 8 is peeled off, the upstream end portion of the adhesive tape 2 which is the peeling end is not rolled up due to the remaining portion 2a remaining in the half cut portion of the release tape, and can be released. The tape 8 is peeled off from the adhesive tape 2. In the above embodiments, when the adhesive tape 2 is cut at a specific length, As shown in Fig. 10A, the adhesive tape 2 is formed at two intervals at two intervals to form a cutting line S, and the portion between the pair of cutting lines s is removed as shown in Fig. 10B, and the adhesive tape is cut at a specific size. In the second embodiment, as shown in the first to fourth embodiments, the remaining portion 2a of the adhesive tape 2 remaining in the half-cut portion of the release tape 8 is adhered to the adhesive portion 2 The end portion of the downstream side in the transport direction of the belt 2 is separated, and the release of the release belt 8 can be surely performed. In the second and fourth embodiments described above, the adhesive tape 2 is attached to the same as the third embodiment. After the substrate W is peeled off, the pair of release rolls 10a, 10b are obliquely inclined at an angle with respect to the width direction of the release tape 8, so that the adhesive tape 2 attached to the substrate W is not allowed to be self-substrate. w peels off the release tape 8 . In the first embodiment, the axis L of the first 'second release roller i〇a, i〇b is parallel to the line L· parallel to the width direction of the release tape 8 in the third diagram; The specific angle is inclined, but as shown in Fig. 11 , the pair of release rolls 10a, 10b may be arranged such that their axes are parallel to a line along the width direction of the release belt 8. In other words, the axis 〇 of the first and second release rollers i〇a and i〇b is arranged in parallel with the movement 20 direction in the Y direction (shown in FIG. 11a) of the susceptor 5 on which the substrate W is placed. . Then, after the adhesive tape 2 is attached to the substrate w by the pressing tool 13, before the peeling of the release tape 8 is started, the base 5 and the substrate W are level by the 0 driving source 6c as shown in FIG. 11B. Direction the angle of rotation. Thereby, the release tape 8 attached to the adhesive tape 2 is inclined with respect to the axis 0 of the pair of release wraps 10a, 19 200934631 10b and the substrate W. Therefore, if the release mechanism l is driven in the -X direction shown in FIG. 1 by the drive mechanism 16 in this state, the release tape 8 is attached to the substrate W. Since one end of the adhesive tape 2 in the width direction is gradually peeled off from the other end, the adhesive tape 2 can be peeled off from the substrate W 5 without peeling off the release tape 8. That is, if either of the release rolls 10a' 10b or the release belt 8 is inclined, even if the release rolls 10a, 10b and the release belt 8 are inclined at a relative angle, the self-adhesive tape 2 is peeled off in this state. The belt 8 can be slowly peeled off from one end of the width direction of the adhesive tape 2 to the other end, so that the tensile force of the release tape 8 applied to the adhesive tape 2 at the time of peeling can be reduced, and the roll of the adhesive tape 2 can be prevented. Start. Moreover, when the release tape 8 is peeled off from the adhesive tape 2, since the one end from the width direction is gradually peeled off, the tensile force per unit area applied to the adhesive tape 2 is increased as compared with the case where the entire width direction is simultaneously peeled off. . Therefore, with the driving of the pair of release rolls 10a, 10b, the residual portion 2a of the release tape 8 remaining on the adhesive 15 tape 2 is surely cut, whereby the adhesive tape 2 can be prevented from being wound up from the substrate W. When the release rolls 10a and 10b and the release belt 8 are tilted at a relative angle in advance, the cutters constituting the cutting device for cutting the adhesive tape 2 may be the structures shown in the first to fourth embodiments. External device. That is, when the adhesive tape 2 is cut by the cutting device, even if the adhesive tape 2 and the remaining portion 2a of the adhesive tape 2 remaining on the release tape 8 are not surely separated, the adhesive tape 2 can be prevented from being rolled up from the substrate W. The release tape 8 is peeled off. Further, by tilting both of the release rolls 10a, 10b and the release belt 6 in opposite directions, the two can be relatively inclined. 20 200934631 5 ❹ 10 15 ❹ 20 In addition, when the adhesive tape 2 is cut, the release tape 6 is half-cut as an example, but even if the release tape 6 is not partially cut, the adhesive tape is cut off when the adhesive tape is cut. Since the cutter is strongly pressed and a part of the adhesion remains on the release belt 6, even in this case, by applying the present invention, the adhesive tape 2 attached to the US sheet can be peeled off and peeled off. With 6. INDUSTRIAL APPLICABILITY According to the present invention, after the adhesive tape is cut by the cutter, since the vicinity of the cutting position of the adhesive tape is peeled off from the release tape, the release tape can be peeled off without rolling up the end portion of the adhesive tape. . Further, when the release tape is peeled off from the adhesive tape attached to the substrate, the axis of the release roller is peeled off relative to the width direction of the release tape, so that the release tape is self-cut in the width direction of the adhesive tape. One end is slowly peeled off. Therefore, since the adhesive resistance when the release tape is peeled off from the adhesive tape can be reduced, the release tape can be peeled off without rolling up the end portion of the adhesive tape. [Brief Description of the Drawings] Fig. 1 is a schematic view showing a configuration of an adhering device for an adhesive tape according to a first embodiment of the present invention. Fig. 2A is a plan view showing a state in which an adhesive tape cut to a specific length is attached to a terminal portion on one side of a substrate. Fig. 2B is a plan view showing the electronic component attached to one side of the substrate. Fig. 3 is an explanatory view showing the cutting of the adhesive tape by the cutter of the cutting device. Fig. 4 is an explanatory view showing a state in which the cutter is lowered after the cutter is cut by the cutter. 21 200934631 Fig. 5 is an explanatory view of the state in which the tape is peeled off by lowering the cutter and the end portion of the adhesive tape. Fig. 6 is a plan view showing the arrangement state of the release roller. Fig. 7A is a plan view showing the arrangement of the cutters of the opposing release belt and the 5 adhesive tape according to the second embodiment of the present invention. Figure 7B is a view of the underside of the adhesive tape cut by the cutter. Figure 7C shows a side view of the cutter. Fig. 8A is a side elevational view showing the cutter of the third embodiment of the present invention. ❹ 10 Figure 8B is an enlarged cross-sectional view of the cut portion of the adhesive tape. Fig. 8C is an explanatory view showing the state in which the end portion of the adhesive tape is peeled off from the release tape by the cutter. Fig. 9A is a side elevational view showing the cutter of the fourth embodiment of the present invention. 15 Fig. 9B is an explanatory view showing the operation of the cutter. Fig. 9C is an explanatory view showing a state in which the end portion of the adhesive tape is peeled off by the cutter. ❹ Fig. 10A is an explanatory view showing another embodiment in which a pair of cutting lines are formed by cutting an adhesive tape into a specific length. 20 Fig. 10B is an explanatory view showing another embodiment in which the adhesive tape is cut into a specific length and a part of the pair of cutting lines formed by Fig. 10A is removed. Fig. 11A is a plan view showing the substrate with the adhesive tape attached thereto. Figure 11B is a plan view of the substrate with the base plate rotated at an angle of /5 22 200934631 after the adhesive tape is attached. Fig. 12A is an enlarged cross-sectional view showing the cut portion of the previous adhesive tape. Fig. 12B is an explanatory view of the case where the same adhesive tape is attached to the substrate and the release tape is peeled off. [Main component symbol description]
1.. .端子部 la...端子 2.. .黏著帶 2a...殘留部分 3.. .電子零件 5.. .基板基台 6.. .底座 6a.. .X驅動源 6b... Y驅動源 6c... 0驅動源 7.. .台座 8.. .離型帶 9.. .供給捲筒 10a...第1離型輥 10b…第2離型輥 11.. .導引棍 12.. .卷取捲筒 13.. .加壓工具 14.. .上下驅動機構 16.. .驅動機構 20.. .送帶裝置 21…夾頭 22a...驅動螺桿 22b...伺服馬達 23.. .切斷裝置 25.. .氣缸 25a··.桿 26.. .驅動構件 27.. .切斷器 27a...齒部 28.. .貼著部 28a...平坦面 31.. .支持片 32.. .保持孔 33.. .按壓構件 33a—L端面 23 200934631 34.. .保持孔 35…彈簧 36···鍔 38.. .保持塊 41.. .XY驅動源 127.. .切斷器 127a...垂直面 127b...傾斜面 127c…平坦面 S...切斷線 W...基板1.. Terminal part la... Terminal 2: Adhesive tape 2a... Residual part 3.. Electronic part 5.. Substrate abutment 6... Base 6a.. X drive source 6b. .. Y drive source 6c... 0 drive source 7.. . pedestal 8.. release belt 9.. supply reel 10a... first release roller 10b... second release roller 11... Guide rod 12.. Rolling reel 13.. Pressing tool 14.. Up and down drive mechanism 16.. Drive mechanism 20.. Feeding device 21... Chuck 22a... Drive screw 22b ...servo motor 23..cutting device 25...cylinder 25a··.rod 26.. drive member 27.. cutter 27a...tooth 28.. affixing portion 28a. .. flat surface 31.. support piece 32.. holding hole 33.. pressing member 33a-L end face 23 200934631 34.. holding hole 35... spring 36···锷 38.. holding block 41. .XY drive source 127.. cutter 127a...vertical surface 127b...inclined surface 127c...flat surface S...cut line W...substrate
24twenty four