WO2022124396A1 - 成形用樹脂組成物及び電子部品装置 - Google Patents
成形用樹脂組成物及び電子部品装置 Download PDFInfo
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- WO2022124396A1 WO2022124396A1 PCT/JP2021/045521 JP2021045521W WO2022124396A1 WO 2022124396 A1 WO2022124396 A1 WO 2022124396A1 JP 2021045521 W JP2021045521 W JP 2021045521W WO 2022124396 A1 WO2022124396 A1 WO 2022124396A1
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- Prior art keywords
- resin composition
- molding resin
- volume
- inorganic filler
- molding
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- WXAZIUYTQHYBFW-UHFFFAOYSA-N tris(4-methylphenyl)phosphane Chemical compound C1=CC(C)=CC=C1P(C=1C=CC(C)=CC=1)C1=CC=C(C)C=C1 WXAZIUYTQHYBFW-UHFFFAOYSA-N 0.000 description 1
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Images
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- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
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- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
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- C—CHEMISTRY; METALLURGY
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- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
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- C—CHEMISTRY; METALLURGY
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- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/40—Radiating elements coated with or embedded in protective material
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
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- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K2200/02—Inorganic compounds
- C09K2200/0239—Oxides, hydroxides, carbonates
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K2200/06—Macromolecular organic compounds, e.g. prepolymers
- C09K2200/0645—Macromolecular organic compounds, e.g. prepolymers obtained otherwise than by reactions involving carbon-to-carbon unsaturated bonds
- C09K2200/0647—Polyepoxides
Definitions
- the present disclosure relates to a resin composition for molding and an electronic component device.
- High dielectric constant resin compositions used for encapsulating semiconductor devices have been proposed from the viewpoint of miniaturization of semiconductor packages and compatibility with high frequencies (for example, JP-A-2015-036410 and JP-A-2017-057268). See Japanese Patent Application Laid-Open No. 2018-141052).
- Examples of the material for encapsulating an electronic component such as a semiconductor element include a molding resin composition containing a curable resin and an inorganic filler. By using a composition that can obtain a cured product having a high dielectric constant as the molding resin composition, it is possible to reduce the size of the semiconductor package.
- materials with a high dielectric constant generally have a high dielectric loss tangent.
- the transmission signal is converted into heat due to the transmission loss, and the communication efficiency tends to decrease.
- the amount of transmission loss generated by heat conversion of radio waves transmitted for communication in a dielectric is expressed as the product of the square root of frequency and relative permittivity and the dielectric loss tangent. That is, the transmitted signal tends to be converted into heat in proportion to the frequency.
- the radio wave used for communication has become high frequency, so that both high dielectric constant and low dielectric loss tangent are achieved in the cured product after molding. There is a demand for a molding resin composition to be used.
- the curing agent is at least one selected from the group consisting of a phenol curing agent, an amine curing agent, an acid anhydride curing agent, a polypeptide curing agent, a polyaminoamide curing agent, an isocyanate curing agent, and a blocked isocyanate curing agent.
- the molding resin composition according to ⁇ 2> or ⁇ 3> which comprises the other curing agent of the above and an active ester compound.
- ⁇ 6> The above-mentioned one of ⁇ 1> to ⁇ 5>, wherein the inorganic filler further contains another inorganic filler which is at least one selected from the group consisting of silica particles and alumina particles.
- Resin composition for molding. ⁇ 7> The molding resin composition according to ⁇ 6>, wherein the volume average particle diameter of the other inorganic filler is 3 ⁇ m or more.
- ⁇ 8> The molding resin composition according to any one of ⁇ 1> to ⁇ 7>, wherein the content of the calcium titanate particles is 30% by volume to 80% by volume with respect to the entire inorganic filler. ..
- ⁇ 9> The molding resin composition according to any one of ⁇ 1> to ⁇ 8>, wherein the relative dielectric constant at 10 GHz in the entire inorganic filler is 80 or less.
- ⁇ 10> The molding resin composition according to any one of ⁇ 1> to ⁇ 9>, wherein the content of the entire inorganic filler is 40% by volume to 85% by volume with respect to the entire molding resin composition. thing.
- ⁇ 11> The molding resin composition according to any one of ⁇ 1> to ⁇ 10>, wherein the calcium titanate particles have a volume average particle size of 0.2 ⁇ m to 80 ⁇ m.
- ⁇ 12> The molding resin composition according to any one of ⁇ 1> to ⁇ 11>, further comprising a curing accelerator containing organic phosphine.
- ⁇ 13> The molding resin composition according to any one of ⁇ 1> to ⁇ 12>, wherein the inorganic filler contains spherical calcium titanate particles.
- ⁇ 14> The molding resin composition according to ⁇ 13>, wherein the content of the entire inorganic filler is 70% by volume to 85% by volume with respect to the entire molding resin composition.
- ⁇ 15> Any one of ⁇ 1> to ⁇ 14>, wherein the cured product of the molding resin composition has a relative permittivity of 9 to 40, and the dielectric loss tangent of the cured product is 0.020 or less.
- the molding resin composition according to. ⁇ 16> The molding resin composition according to any one of ⁇ 1> to ⁇ 15>, which is used for a high frequency device.
- ⁇ 17> The molding resin composition according to ⁇ 16>, which is used for sealing electronic components in a high-frequency device.
- ⁇ 18> The molding resin composition according to any one of ⁇ 1> to ⁇ 17>, which is used for an antenna-in-package.
- ⁇ 19> Support member and Electronic components placed on the support member and The cured product of the molding resin composition according to any one of ⁇ 1> to ⁇ 18>, which seals the electronic component, and the cured product.
- Electronic component equipment equipped with ⁇ 20> The electronic component device according to ⁇ 19>, wherein the electronic component includes an antenna.
- a molding resin composition having both a high dielectric constant and a low dielectric loss tangent in a cured product after molding, and an electronic component device using the same are provided.
- the term "process” includes, in addition to a process independent of other processes, the process as long as the purpose of the process is achieved even if it cannot be clearly distinguished from the other process. ..
- the numerical range indicated by using "-" includes the numerical values before and after "-" as the minimum value and the maximum value, respectively.
- the upper limit value or the lower limit value described in one numerical range may be replaced with the upper limit value or the lower limit value of the numerical range described in another stepwise description. ..
- the upper limit value or the lower limit value of the numerical range may be replaced with the value shown in the examples.
- each component may contain a plurality of applicable substances.
- the content or content of each component is the total content or content of the plurality of substances present in the composition unless otherwise specified.
- a plurality of types of particles corresponding to each component may be contained.
- the particle size of each component means a value for a mixture of the plurality of particles present in the composition unless otherwise specified.
- the term "calcium titanate particles” simply means calcium titanate particles having an arbitrary shape such as spherical, elliptical, and amorphous, or a mixture thereof.
- the molding resin composition according to one embodiment of the present invention includes a curable resin and an inorganic filler containing calcium titanate particles.
- the molding resin composition is required to have both a high dielectric constant and a low dielectric loss tangent in the cured product after molding.
- a material that can obtain a high dielectric constant for example, barium titanate can be considered.
- barium titanate when barium titanate is used, not only the dielectric constant but also the dielectric loss tangent tends to increase.
- the molding resin composition of the present embodiment contains a curable resin and an inorganic filler, and may contain other components as necessary.
- the molding resin composition in the present embodiment contains a curable resin.
- the curable resin may be either a thermosetting resin or a photocurable resin, and is preferably a thermosetting resin from the viewpoint of mass productivity.
- the thermosetting resin include polyimide resins such as epoxy resin, phenol resin, melamine resin, urea resin, unsaturated polyester resin, alkyd resin, urethane resin, and bismaleimide resin, polyamide resin, polyamideimide resin, silicone resin, and acrylic resin. And so on.
- the thermosetting resin is preferably at least one selected from the group consisting of epoxy resin and polyimide resin, and at least selected from the group consisting of epoxy resin and bismaleimide resin, from the viewpoint of moldability and electrical characteristics. It is more preferably one kind, and even more preferably an epoxy resin.
- the molding resin composition may contain only one type of curable resin, or may contain two or more types of curable resin.
- the epoxy resin will be described as an example of the curable resin.
- the molding resin composition preferably contains an epoxy resin as a curable resin.
- the content of the epoxy resin with respect to the entire curable resin is preferably 80% by mass or more, more preferably 90% by mass or more, and 95. It is more preferably mass% or more.
- the content of the epoxy resin with respect to the entire curable resin may be 100% by mass.
- the type of epoxy resin is not particularly limited as long as it has an epoxy group in the molecule.
- the epoxy resin is at least one selected from the group consisting of phenol compounds such as phenol, cresol, xylenol, resorcin, catechol, bisphenol A and bisphenol F, and naphthol compounds such as ⁇ -naphthol, ⁇ -naphthol and dihydroxynaphthalene.
- a novolak type epoxy resin (phenol novolak) which is an epoxidation of a novolak resin obtained by condensing or cocondensing a kind of phenolic compound and an aliphatic aldehyde compound such as formaldehyde, acetaldehyde, propionaldehyde, etc. under an acidic catalyst.
- Diphenylmethane type epoxy resin which is a diglycidyl ether such as bisphenol A and bisphenol F
- Biphenyl type epoxy resin which is an alkyl-substituted or unsubstituted biphenol diglycidyl ether
- Stilben-type epoxy which is a diglycidyl ether of a stilben-based phenol compound.
- Sulfur atom-containing epoxy resin that is a diglycidyl ether such as bisphenol S
- Epoxide resin that is an alcoholic glycidyl ether such as butanediol, polyethylene glycol, polypropylene glycol
- Multivalent such as phthalic acid, isophthalic acid, and tetrahydrophthalic acid.
- a glycidyl ester-type epoxy resin that is a glycidyl ester of a carboxylic acid compound; a glycidylamine-type epoxy resin in which an active hydrogen bonded to a nitrogen atom such as aniline, diaminodiphenylmethane, or isocyanuric acid is replaced with a glycidyl group; dicyclopentadiene and phenol.
- Dicyclopentadiene-type epoxy resin which is an epoxide of a cocondensation resin of a compound
- vinylcyclohexene epoxide which is an epoxide of an olefin bond in a molecule, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane Carboxylate, 2- (3,4-epoxide) cyclohexy Lu-5,5-Spiro (3,4-epoxy) Cyclohexane-m-dioxane and other alicyclic epoxy resins
- paraxylylene-modified epoxy resins that are glycidyl ethers of paraxylylene-modified phenolic resins
- glycidyl ethers of metaxylylene-modified phenolic resins
- Metaxylylene-modified epoxy resin terpene-modified epoxy resin which is a glycidyl ether of a terpene-modified phenol formaldehyde; dicyclopentadiene-modified epoxy resin which is a glycidyl ether of a dicyclopentadiene-modified phenol resin; cyclopentadiene-modified which is a glycidyl ether of a cyclopentadiene-modified phenol resin.
- Epoxy resin Polycyclic aromatic ring-modified epoxy resin which is a glycidyl ether of a polycyclic aromatic ring-modified phenol resin; Naphthalene type epoxy resin which is a glycidyl ether of a naphthalene ring-containing phenol resin; Halogened phenol novolac type epoxy resin; Hydroquinone type epoxy resin ; Trimethylol propane type epoxy resin; Linear aliphatic epoxy resin obtained by oxidizing an olefin bond with a peracid such as peracetic acid; Phenol aralkyl resin, naphthol aralkyl resin and other aralkyl type phenol resins are epoxidized. Phenol formaldehyde resin; etc. may be mentioned. Further, an epoxy resin such as an acrylic resin can also be mentioned as an epoxy resin. These epoxy resins may be used alone or in combination of two or more.
- the epoxy equivalent (molecular weight / number of epoxy groups) of the epoxy resin is not particularly limited. From the viewpoint of balancing various characteristics such as moldability, reflow resistance, and electrical reliability, the epoxy equivalent of the epoxy resin is preferably 100 g / eq to 1000 g / eq, preferably 150 g / eq to 500 g / eq. Is more preferable.
- the epoxy equivalent of the epoxy resin shall be a value measured by a method according to JIS K 7236: 2009.
- the softening point or melting point of the epoxy resin is not particularly limited.
- the softening point or melting point of the epoxy resin is preferably 40 ° C. to 180 ° C. from the viewpoint of moldability and reflow resistance, and 50 ° C. to 130 ° C. from the viewpoint of handleability when preparing the molding resin composition. More preferably, it is ° C.
- the melting point or softening point of the epoxy resin shall be a value measured by differential scanning calorimetry (DSC) or a method according to JIS K 7234: 1986 (ring ball method).
- the mass ratio of the epoxy resin to the total amount of the molding resin composition is 0.5 mass from the viewpoint of strength, fluidity, heat resistance, moldability, etc. It is preferably% to 30% by mass, more preferably 2% by mass to 20% by mass, and even more preferably 3.5% by mass to 13% by mass.
- the molding resin composition may further contain a curing agent.
- the molding resin composition preferably contains a curable resin containing an epoxy resin, a curing agent, and an inorganic filler containing calcium titanate particles.
- the type of curing agent is not particularly limited.
- the curing agent preferably contains an active ester compound.
- the active ester compound may be used alone or in combination of two or more.
- the active ester compound means a compound having one or more ester groups in one molecule that react with an epoxy group and having a curing action of an epoxy resin.
- the curing agent may contain a curing agent other than the active ester compound, or may not contain a curing agent other than the active ester compound.
- the dielectric loss tangent of the cured product can be suppressed to be lower than when a phenol curing agent or an amine curing agent is used as the curing agent.
- the reason is presumed as follows. In the reaction between the epoxy resin and the phenol curing agent or the amine curing agent, a secondary hydroxyl group is generated. On the other hand, in the reaction between the epoxy resin and the active ester compound, an ester group is generated instead of the secondary hydroxyl group.
- the molding resin composition containing an active ester compound as a curing agent contains only a curing agent that generates a secondary hydroxyl group as a curing agent.
- the dielectric positive contact of the cured product can be suppressed to be lower than that of the product.
- the polar groups in the cured product enhance the water absorption of the cured product, and by using the active ester compound as the curing agent, the concentration of polar groups in the cured product can be suppressed, and the water absorption of the cured product can be suppressed. can. Then, by suppressing the water absorption of the cured product, that is, by suppressing the content of H2O , which is a polar molecule, the dielectric loss tangent of the cured product can be further suppressed.
- the type of the active ester compound is not particularly limited as long as it is a compound having one or more ester groups in the molecule that react with the epoxy group.
- Examples of the active ester compound include a phenol ester compound, a thiophenol ester compound, an N-hydroxyamine ester compound, and an esterified product of a heterocyclic hydroxy compound.
- Examples of the active ester compound include ester compounds obtained from at least one of an aliphatic carboxylic acid and an aromatic carboxylic acid and at least one of an aliphatic hydroxy compound and an aromatic hydroxy compound.
- Ester compounds containing an aliphatic compound as a component of polycondensation tend to have excellent compatibility with an epoxy resin due to having an aliphatic chain.
- Ester compounds containing an aromatic compound as a component of polycondensation tend to have excellent heat resistance due to having an aromatic ring.
- the active ester compound include aromatic esters obtained by a condensation reaction between an aromatic carboxylic acid and a phenolic hydroxyl group.
- aromatic carboxylic acid component in which 2 to 4 hydrogen atoms of an aromatic ring such as benzene, naphthalene, biphenyl, diphenylpropane, diphenylmethane, diphenyl ether, and diphenylsulfonic acid are substituted with a carboxy group, and the hydrogen atom of the above-mentioned aromatic ring.
- an aromatic carboxylic acid and a phenolic hydroxyl group are used.
- the aromatic ester obtained by the condensation reaction of the above is preferable. That is, an aromatic ester having a structural unit derived from the aromatic carboxylic acid component, a structural unit derived from the monovalent phenol, and a structural unit derived from the polyhydric phenol is preferable.
- the active ester compound examples include a phenol resin having a molecular structure in which a phenol compound is knotted via an aliphatic cyclic hydrocarbon group described in JP2012-246367, and an aromatic dicarboxylic acid or Examples thereof include an active ester resin having a structure obtained by reacting the halide with an aromatic monohydroxy compound.
- the active ester resin a compound represented by the following structural formula (1) is preferable.
- R 1 is an alkyl group having 1 to 4 carbon atoms
- X is an unsubstituted benzene ring, an unsubstituted naphthalene ring, a benzene ring substituted with an alkyl group having 1 to 4 carbon atoms, or the like. It is a naphthalene ring or a biphenyl group
- Y is a benzene ring, a naphthalene ring, or a benzene ring or a naphthalene ring substituted with an alkyl group having 1 to 4 carbon atoms
- k is 0 or 1
- n is a repetition number. It represents the average of 0.25 to 10.
- T-Bu in the structural formula is a tert-butyl group.
- the compound represented by the following structural formula (2) and the compound represented by the following structural formula (3) described in JP-A-2014-114352 can be used. Can be mentioned.
- R 1 and R 2 are independently hydrogen atoms, an alkyl group having 1 to 4 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms, and Z is an unsubstituted benzoyl group and a non-substituted benzoyl group.
- An ester-forming structural moiety (z1) selected from the group consisting of a substituted naphthoyl group, a benzoyl group or a naphthoyl group substituted with an alkyl group having 1 to 4 carbon atoms, and an acyl group having 2 to 6 carbon atoms, or a hydrogen atom ( z2), and at least one of Z is an ester-forming structural site (z1).
- R 1 and R 2 are independently hydrogen atoms, an alkyl group having 1 to 4 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms, and Z is an unsubstituted benzoyl group and a non-substituted benzoyl group.
- An ester-forming structural moiety (z1) selected from the group consisting of a substituted naphthoyl group, a benzoyl group or a naphthoyl group substituted with an alkyl group having 1 to 4 carbon atoms, and an acyl group having 2 to 6 carbon atoms, or a hydrogen atom ( z2), and at least one of Z is an ester-forming structural site (z1).
- Specific examples of the compound represented by the structural formula (2) include the following exemplary compounds (2-1) to (2-6).
- Specific examples of the compound represented by the structural formula (3) include the following exemplary compounds (3-1) to (3-6).
- active ester compound a commercially available product may be used.
- Commercially available active ester compounds include “EXB9451”, “EXB9460”, “EXB9460S”, “HPC-8000-65T” (manufactured by DIC Co., Ltd.) as active ester compounds containing a dicyclopentadiene-type diphenol structure; aromatics.
- EXB9416-70BK”, “EXB-8”, “EXB-9425” manufactured by DIC Co., Ltd.
- DC808 Mitsubishi Chemical Co., Ltd.
- Examples of the active ester compound containing a benzoylated product of phenol novolac include "YLH1026" (manufactured by Mitsubishi Chemical Co., Ltd.).
- the ester equivalent (molecular weight / number of ester groups) of the active ester compound is not particularly limited. From the viewpoint of balance of various characteristics such as moldability, reflow resistance, and electrical reliability, 150 g / eq to 400 g / eq is preferable, 170 g / eq to 300 g / eq is more preferable, and 200 g / eq to 250 g / eq is preferable. More preferred.
- the ester equivalent of the active ester compound shall be a value measured by a method according to JIS K 0070: 1992.
- the equivalent ratio (ester group / epoxy group) of the epoxy resin to the active ester compound is preferably 0.9 or more, more preferably 0.95 or more, and 0.97 or more from the viewpoint of suppressing the dielectric loss tangent of the cured product to be low. Is even more preferable.
- the equivalent ratio (ester group / epoxy group) of the epoxy resin to the active ester compound is preferably 1.1 or less, more preferably 1.05 or less, from the viewpoint of suppressing the unreacted content of the active ester compound to be small. 03 or less is more preferable.
- the curing agent may contain other curing agents other than the active ester compound.
- the type of other curing agent is not particularly limited and can be selected according to the desired properties of the molding resin composition and the like.
- examples of other curing agents include phenol curing agents, amine curing agents, acid anhydride curing agents, polypeptide curing agents, polyaminoamide curing agents, isocyanate curing agents, blocked isocyanate curing agents and the like.
- phenolic curing agent examples include polyhydric phenol compounds such as resorcin, catechol, bisphenol A, bisphenol F, substituted or unsubstituted biphenol; phenol, cresol, xylenol, resorcin, catechol, bisphenol A, bisphenol F, phenylphenol.
- At least one phenolic compound selected from the group consisting of phenolic compounds such as aminophenol and naphthol compounds such as ⁇ -naphthol, ⁇ -naphthol and dihydroxynaphthalene, and aldehyde compounds such as formaldehyde, acetaldehyde and propionaldehyde are acidic.
- Novolac-type phenolic resin obtained by condensation or co-condensation under a catalyst; phenolic aralkyl resin synthesized from the above phenolic compound, dimethoxyparaxylene, bis (methoxymethyl) biphenyl, etc., naphthol aralkyl resin, etc.
- Phenolic resin Paraxylylene-modified phenolic resin, Metaxylylene-modified phenolic resin; Melamine-modified phenolic resin; Terpen-modified phenolic resin; Dicyclopentadiene-type phenolic resin and dicyclo synthesized from the above phenolic compound and dicyclopentadiene by copolymerization Pentaziene-type naphthol resin; Cyclopentadiene-modified phenolic resin; Polycyclic aromatic ring-modified phenolic resin; Biphenyl-type phenolic resin; The above phenolic compound and aromatic aldehyde compounds such as benzaldehyde and salicylaldehyde are condensed or co-condensed under an acidic catalyst. Triphenylmethane-type phenolic resin obtained by condensation; phenolic resin obtained by copolymerizing two or more of these types can be mentioned. These phenol curing agents may be used alone or in combination of two or more.
- the functional group equivalents of other curing agents are not particularly limited. From the viewpoint of balancing various properties such as moldability, reflow resistance, and electrical reliability, the functional group equivalent of other curing agents is preferably 70 g / eq to 1000 g / eq, and is preferably 80 g / eq to 500 g / eq. Is more preferable.
- the functional group equivalent (in the case of a phenol curing agent, the hydroxyl group equivalent) of other curing agents shall be a value measured by a method according to JIS K 0070: 1992.
- the softening point or melting point of the curing agent is not particularly limited.
- the softening point or melting point of the curing agent is preferably 40 ° C. to 180 ° C. from the viewpoint of moldability and reflow resistance, and 50 ° C. to 180 ° C. from the viewpoint of handleability at the time of manufacturing the molding resin composition. More preferably, it is 130 ° C.
- the melting point or softening point of the curing agent shall be a value measured in the same manner as the melting point or softening point of the epoxy resin.
- Epoxy resin and curing agent (all curing agents when multiple types of curing agents are used), that is, the ratio of the number of functional groups in the curing agent to the number of functional groups in the epoxy resin (number of functional groups in the curing agent / epoxy)
- the number of functional groups in the resin is not particularly limited. From the viewpoint of suppressing each unreacted component to a small amount, it is preferably set in the range of 0.5 to 2.0, and more preferably set in the range of 0.6 to 1.3. From the viewpoint of moldability and reflow resistance, it is more preferable to set it in the range of 0.8 to 1.2.
- the curing agent is at least one other curing selected from the group consisting of a phenol curing agent, an amine curing agent, an acid anhydride curing agent, a polymercaptan curing agent, a polyaminoamide curing agent, an isocyanate curing agent, and a blocked isocyanate curing agent.
- the agent and the active ester compound may be contained.
- the curing agent may contain a phenol curing agent and an active ester compound, and may contain an aralkyl type phenol resin and an active ester compound. You may.
- the other curing agent may be read as a phenol curing agent.
- the mass ratio of the active ester compound to the total amount of the active ester compound and other curing agents is 40% by mass from the viewpoint of keeping the dielectric adjacency of the cured product low.
- the above is preferable, 60% by mass is more preferable, 80% by mass or more is further preferable, 85% by mass or more is particularly preferable, and 90% by mass or more is extremely preferable.
- the total mass ratio of the epoxy resin and the active ester compound to the total amount of the epoxy resin and the curing agent is 40 mass from the viewpoint of keeping the dielectric adjacency of the cured product low. % Or more, more preferably 60% by mass, further preferably 80% by mass or more, particularly preferably 85% by mass or more, and extremely preferably 90% by mass or more. ..
- the mass ratio of the active ester compound to the total amount of the active ester compound and other curing agents is excellent in bending toughness after curing the molding resin composition.
- it is preferably 40% by mass to 90% by mass, more preferably 50% by mass to 80% by mass, and 55% by mass to 70% by mass. Is more preferable.
- the mass ratio of the other curing agent to the total amount of the active ester compound and other curing agents determines the bending toughness after curing the molding resin composition. From the viewpoint of excellent viewpoint and keeping the dielectric adrectity of the cured product low, it is preferably 10% by mass to 60% by mass, more preferably 20% by mass to 50% by mass, and 30% by mass to 45% by mass. Is even more preferable.
- the content of the curable resin other than the epoxy resin may be less than 5% by mass with respect to the total amount of the molding resin composition by 4% by mass. % Or less, or 3% by mass or less.
- the molding resin composition may contain a polyimide resin as a curable resin.
- the polyimide resin is not particularly limited as long as it is a polymer compound having an imide bond.
- Examples of the polyimide resin include bismaleimide resin and the like.
- the bismaleimide resin examples include a copolymer of a compound having two or more N-substituted maleimide groups and a compound having two or more amino groups.
- a compound having two or more N-substituted maleimide groups is also referred to as a "polymaleimide compound”
- a compound having two or more amino groups is also referred to as a "polyamino compound”.
- the bismaleimide resin may be a polymer obtained by polymerizing a composition containing a polymaleimide compound and a polyamino compound, and may contain units derived from the polymaleimide compound and other compounds other than the polyamino compound.
- Examples of other compounds include compounds having a group containing two or more ethylenically unsaturated double bonds.
- a compound having a group containing two or more ethylenically unsaturated double bonds is also referred to as an "ethylenic compound”.
- the polymaleimide compound is not limited as long as it is a compound having two or more N-substituted maleimide groups, and may be a compound having two N-substituted maleimide groups, or a compound having three or more N-substituted maleimide groups. May be. From the viewpoint of availability, the polymaleimide compound is preferably a compound having two N-substituted maleimide groups.
- polymaleimide compound examples include bis (4-maleimidephenyl) methane, bis (3-maleimidephenyl) methane, polyphenylmethanemaleimide, bis (4-maleimidephenyl) ether, and bis (4-maleimidephenyl) sulfone.
- the polyamino compound is not limited as long as it is a compound having two or more amino groups, and may be a compound having two amino groups or a compound having three or more amino groups. From the viewpoint of availability, the polyamino compound is preferably a compound having two amino groups.
- polyamino compound examples include 4,4'-diaminodiphenylmethane, 4,4'-diamino-3,3'-dimethyl-diphenylmethane, 4,4'-diamino-3,3'-diethyl-diphenylmethane, 4, 4'-diaminodiphenyl ether, 4,4'-diaminodiphenylsulfone, 3,3'-diaminodiphenylsulfone, 4,4'-diaminodiphenylketone, 4,4'-diaminobiphenyl, 3,3'-dimethyl-4, 4'-Diaminobiphenyl, 2,2'-dimethyl-4,4'-diaminobiphenyl, 3,3'-dihydroxybenzidine, 2,2-bis (3-amino-4-hydroxyphenyl) propane, 3,3'-Dimethyl-5,5'-diethyl-4,4'-diphenylmethane,
- Examples of the "group containing an ethylenically unsaturated double bond" contained in the ethylenic compound include a vinyl group, an allyl group, a vinyloxy group, an allyloxy group, an acryloyl group, a methacryloyl group and the like.
- the ethylenic compound may have only one type of group containing an ethylenically unsaturated double bond in one molecule, or may have two or more types.
- the ethylenic compound may have other groups in addition to the group containing an ethylenically unsaturated double bond. Examples of other groups include an amino group, an ether group, a sulfide group and the like. Specific examples of the ethylenic compound include diallylamine, diallyl ether, diallyl spheride, triallyl isocyanurate and the like.
- the equivalent ratio (Ta1 / Ta2) of the N-substituted maleimide group number (Ta1) of the polymaleimide compound to the amino group number (Ta2) of the polyamino compound in the bismaleimide resin may be in the range of 1.0 to 10.0. It is preferably in the range of 2.0 to 10.0.
- the bismaleimide resin contains a unit derived from an ethylenic compound, the number of ethylenically unsaturated double bonds (Ta3) of the ethylenic compound with respect to the number of N-substituted maleimide groups (Ta1) of the polymaleimide compound in the bismaleimide resin.
- the equivalent ratio (Ta3 / Ta1) of is, for example, in the range of 0.05 to 0.2.
- the weight average molecular weight of the bismaleimide resin is not particularly limited, and may be, for example, in the range of 800 to 1500, in the range of 800 to 1300, or in the range of 800 to 1100. good.
- the weight average molecular weight of the bismaleimide resin can be determined by gel permeation chromatography (GPC) by converting from a calibration curve using standard polystyrene.
- the calibration curve is standard polystyrene: TSK standard POLYSTYRENE (Type: A-2500, A-5000, F-1, F-2, F-4, F-10, F-20, F-40) [manufactured by Tosoh Corporation] Approximate with a cubic equation using.
- the equipment used for GPC is pump: L-6200 type (manufactured by Hitachi High-Technologies Co., Ltd.), detector: L-3300 type RI (manufactured by Hitachi High-Technologies Co., Ltd.), column oven: L-655A-52 (manufactured by Hitachi High-Technologies Co., Ltd.).
- GPC Hitachi High-Technologies
- Guard column TSK Guardcolum HHR-L (manufactured by Toso Co., Ltd., column size 6.0 x 40 mm)
- Column TSK gel-G4000HHR + gel-G2000HHR (manufactured by Toso Co., Ltd., column size 7.8) ⁇ 300 mm)
- the measurement conditions of GPC include eluent: tetrahydrofuran, sample concentration: 30 mg / 5 mL, injection amount: 20 ⁇ L, flow rate: 1.00 mL / min, and measurement temperature: 40 ° C.
- the mass ratio of the polyimide resin to the total amount of the molding resin composition is, for example, 0.5% by mass to 30% by mass, and 2% by mass. It is preferably from 20% by mass, more preferably from 3.5% by mass to 13% by mass.
- the molding resin composition in the present embodiment may contain a curing accelerator, if necessary.
- the type of the curing accelerator is not particularly limited, and can be selected according to the type of the curable resin, the desired characteristics of the molding resin composition, and the like.
- the curing accelerator used in the molding resin composition containing at least one selected from the group consisting of epoxy resin and polyimide resin as the curable resin is 1,5-diazabicyclo [4.3.0] nonen-5 ( DBN), 1,8-diazabicyclo [5.4.0] Undecene-7 (DBU) and other diazabicycloalkene, 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-ethyl Cyclic amidine compounds such as -4-methylimidazole and 2-heptadecylimidazole; derivatives of the cyclic amidine compounds; phenol novolac salts of the cyclic amidine compounds or derivatives thereof; maleic anhydride, 1,4-benzoquinone, etc.
- Cyclic amidinium compounds such as borate salt, tetraphenylborate salt of 2-ethyl-4-methylimidazole, tetraphenylborate salt of N-methylmorpholin; pyridine, triethylamine, triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol , Tris (dimethylaminomethyl) phenol and other tertiary amine compounds; derivatives of the tertiary amine compound; tetra-n-butylammonium acetate, tetra-n-butylammonium phosphate, tetraethylammonium acetate, tetra-n-benzoate.
- Ammonium salt compounds such as hexylammonium and tetrapropylammonium hydroxide; first phosphine such as ethylphosphine and phenylphosphine, second phosphine such as dimethylphosphine and diphenylphosphine, triphenylphosphine, diphenyl (p-tolyl) phosphine, tris ( Alkylphenyl) phosphin, tris (alkoxyphenyl) phosphin, tris (alkyl / alkoxyphenyl) phosphin, tris (dialkylphenyl) phosphin, tris (trialkylphenyl) phosphin, tris (tetraalkylphenyl) phosphin, tris (dia) Lucoxyphenyl) phosphine, tris (trialkoxyphenyl) phosphine, tris (tetraalkoxypheny
- Organic phosphin; phosphine compound such as a complex of the organic phosphine and organic borons; 2,3-Didimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, phenyl-1,4-benzoquinone, A quinone compound such as anthraquinone, a compound having intramolecular polarization by adding a compound having a ⁇ bond such as diazophenylmethane; the organic phosphine or the phosphine compound and 4-bromophenol, 3-bromophenol, 2-bromo Phenol, 4-chlorophenol, 3-chlorophenol, 2-chlorophenol, 4-iodide phenol, 3-iodide phenol, 2-iodide phenol, 4-bromo-2-methylphenol, 4-bromo-3- Methyl
- Tetra-substituted phosphoniums such as tetraphenylphosphonium, tetra-phenylborate salts of tetra-substituted phosphoniums such as tetra-p-trilborate, tetra-substituted phosphonium compounds such as salts of tetra-substituted phosphoniums and phenolic compounds; Salts of alkylphosphoniums and partial hydrolysates of aromatic carboxylic acid anhydrides; phosphobetaine compounds; adducts of phosphonium compounds and silane compounds; and the like.
- the curing accelerator may be used alone or in combination of two or more.
- the curing accelerator is preferably a curing accelerator containing organic phosphine.
- the curing accelerator containing organic phosphine include the organic phosphine, a phosphine compound such as a complex of the organic phosphine and organic borons, the organic phosphine, or an intramolecule formed by adding a compound having a ⁇ bond to the phosphine compound. Examples thereof include compounds having polarization.
- particularly suitable curing accelerators include triphenylphosphine, an adduct of triphenylphosphine and a quinone compound, an adduct of tributylphosphine and a quinone compound, and an adduct of tri-p-tolylphosphine and a quinone compound. Things etc. can be mentioned.
- the amount thereof is preferably 0.1 part by mass to 30 parts by mass, and 1 part by mass to 15 parts by mass with respect to 100 parts by mass of the resin component. Is more preferable.
- the amount of the curing accelerator is 0.1 part by mass or more with respect to 100 parts by mass of the resin component, it tends to cure well in a short time.
- the amount of the curing accelerator is 30 parts by mass or less with respect to 100 parts by mass of the resin component, the curing rate is not too fast and a good molded product tends to be obtained.
- the resin component means a curable resin and a curing agent used as needed. Further, 100 parts by mass of the resin component means that the total amount of the curable resin and the curing agent used as needed is 100 parts by mass.
- the molding resin composition may contain a curing initiator, if necessary.
- the curing initiator include radical polymerization initiators that generate free radicals by heat.
- Specific examples of the curing initiator include inorganic peroxides, organic peroxides, azo compounds and the like.
- the inorganic peroxide include potassium persulfate (dipotassium peroxosulfate), sodium persulfate, ammonium persulfate and the like.
- organic peroxide examples include ketone peroxides such as methyl ethyl ketone peroxide and cyclohexanone peroxide, 1,1-di (t-butylperoxy) cyclohexane, and 2,2-di (4,4-di (t-butylper)).
- ketone peroxides such as methyl ethyl ketone peroxide and cyclohexanone peroxide, 1,1-di (t-butylperoxy) cyclohexane, and 2,2-di (4,4-di (t-butylper)).
- Cyclohexyl) Peroxyketal such as propane, p-menthan hydroperoxide, diisopropylbenzene hydroperoxide, 1,1,3,3-tetramethylbutylhydroperoxide, cumenehydroperoxide, t-butylhydroperoxide Hydroperoxides such as ⁇ , ⁇ '-di (t-butylperoxy) diisopropylbenzene, dicumyl peroxide, 2,5-dimethyl-2,5-di (t-butylperoxy) hexane, t-butylkumi Dialkyl peroxides such as ruperoxide, di-t-hexyl peroxide, 2,5-dimethyl-2,5-di (t-butylperoxy) hexin-3, di-t-butyl peroxide, and dibenzoylper.
- Diacyl peroxides such as oxides and di (4-methylbenzoyl) peroxides
- peroxydicarbonates such as di-n-propylperoxydicarbonate and diisopropylperoxydicarbonate, 2,5-dimethyl-2,5-di
- peroxyesters such as (benzoylperoxy) hexane, t-hexylperoxybenzoate, t-butylperoxybenzoate, and t-butylperoxy2-ethylhexanonate.
- azo compound examples include azobisisobutyronitrile, azobis-4-methoxy-2,4-dimethylvaleronitrile, azobiscyclohexanone-1-carbonitrile, and azodibenzoyl.
- the content of the curing initiator is 0.1 part by mass to 8.0 parts by mass with respect to 100 parts by mass of the polyimide compound, and from the viewpoint of curability. More preferably, it is 0.5 parts by mass to 6.0 parts by mass.
- the content of the curing initiator is 8.0 parts by mass or less, volatile components are less likely to be generated, and the generation of voids during curing tends to be further suppressed. Further, by setting the content of the curing initiator to 1 part by mass or more, the curing property tends to be better.
- the molding resin composition in the present embodiment contains an inorganic filler containing calcium titanate particles.
- the inorganic filler contains at least calcium titanate particles, and may contain other fillers other than the calcium titanate particles, if necessary.
- the shape of the calcium titanate particles is not particularly limited, and examples thereof include a spherical shape, an elliptical shape, and an amorphous shape. Further, the calcium titanate particles may be crushed. The calcium titanate particles may be surface-treated.
- the inorganic filler may contain spherical calcium titanate particles. Further, the inorganic filler may contain both spherical calcium titanate particles and non-spherical calcium titanate particles (for example, amorphous calcium titanate particles). Since the inorganic filler contains spherical calcium titanate particles, it is possible to obtain both high dielectric constant and low dielectric loss tangent in the cured product after molding while obtaining high fluidity. Specifically, when the inorganic filler contains spherical calcium titanate particles, high fluidity can be obtained even if the proportion of the inorganic filler in the molding resin composition is increased.
- the proportion of the inorganic filler By increasing the proportion of the inorganic filler, the proportion of the curable resin whose dielectric loss tangent is relatively higher than that of the inorganic filler becomes low, and it becomes possible to further suppress the dielectric loss tangent of the entire cured product after molding. .. Therefore, it is considered that it is possible to achieve both a high dielectric constant and a lower dielectric loss tangent while obtaining high fluidity.
- the spherical calcium titanate particles are particles that have been sphericalized by heating and melting.
- FIG. 1 shows an SEM photograph of calcium titanate particles that have been sphericalized.
- FIG. 2 shows an SEM photograph of calcium titanate particles before the spheroidizing treatment.
- the SEM photographs of FIGS. 1 and 2 are photographs obtained by observing with a scanning electron microscope (manufactured by JEOL Ltd., product name: JSM-7800F) at a magnification of 1000 times and under high vacuum conditions.
- the shape of the calcium titanate particles before the spheroidizing treatment is usually irregular as shown in FIG.
- spherical calcium titanate particles can be obtained as shown in FIG.
- the spheroidizing treatment is performed by heating and melting at a temperature of 1000 ° C. or higher and 1400 ° C. or lower for 1 hour or more and 2 hours or less.
- the spheroidizing treatment is different from the firing described later in that heating is performed without adding a dopant compound and the heating time is short. Therefore, when the uncalcined and amorphous calcium titanate particles are spheroidized, the uncalcined and spherical calcium titanate particles are obtained.
- the volume average particle size of the calcium titanate particles is preferably 0.1 ⁇ m to 100 ⁇ m, more preferably 0.2 ⁇ m to 80 ⁇ m, further preferably 0.5 ⁇ m to 30 ⁇ m, and even more preferably 0.5 ⁇ m to 0.5 ⁇ m. It is particularly preferably 10 ⁇ m, and extremely preferably 0.5 ⁇ m to 8 ⁇ m.
- the volume average particle size of the calcium titanate particles can be measured as follows. The molding resin composition is placed in a crucible and left at 800 ° C. for 4 hours to incinerate.
- the obtained ash content can be observed by SEM, separated for each shape, the particle size distribution can be obtained from the observed image, and the volume average particle size of the calcium titanate particles can be obtained as the volume average particle size (D50) from the particle size distribution. Further, the volume average particle size of the calcium titanate particles may be determined by measurement with a laser diffraction / scattering type particle size distribution measuring device (for example, Horiba Seisakusho Co., Ltd., LA920).
- the calcium titanate particles may be a mixture of two or more kinds of calcium titanate particles having different volume average particle diameters.
- the content of calcium titanate particles is preferably 30% by volume to 80% by volume with respect to the entire inorganic filler.
- the content of calcium titanate particles is preferably 30% by volume or more, more preferably 35% by volume or more, more preferably 40% by volume, based on the entire inorganic filler. It is more preferably 50% by volume or more, particularly preferably 60% by volume or more, extremely preferably 63% by volume or more, and most preferably 65% by volume or more.
- the content of calcium titanate particles is preferably 80% by volume or less, more preferably 77% by volume or less, based on the entire inorganic filler. It is more preferably 75% by volume or less, more preferably less than 60% by volume, and extremely preferably 55% by volume or less from the viewpoint of obtaining high fluidity of the molding resin composition. Most preferably, it is 50% by volume or less.
- the content of the calcium titanate particles is preferably 30% by volume to 80% by volume, more preferably 35% by volume to 77% by volume, and 40% by volume to 75% by volume with respect to the entire inorganic filler. Is more preferable.
- the content of calcium titanate particles is 60% by volume to 80% by volume with respect to the entire inorganic filler. It is preferably 63% by volume to 77% by volume, more preferably 65% by volume to 75% by volume.
- the content of calcium titanate particles is 30 volumes with respect to the entire inorganic filler. % Or more and less than 60% by volume, more preferably 35% by volume to 55% by volume, and even more preferably 40% by volume to 50% by volume.
- the inorganic filler contains spherical calcium titanate particles
- the inorganic filler contains spherical calcium titanate particles, high fluidity can be obtained even if the total content of the inorganic filler in the molding resin composition is increased. Therefore, a curable resin having a high content of other fillers having a relatively low dielectric loss tangent and a relatively high dielectric loss tangent without changing the content of calcium titanate particles in the entire molding resin composition.
- By lowering the content of the resin it is possible to lower the dielectric loss tangent while maintaining a high dielectric constant.
- the content (% by volume) of the calcium titanate particles with respect to the entire inorganic filler can be determined by the following method.
- a flaky sample of the cured resin composition for molding is imaged with a scanning electron microscope (SEM).
- SEM scanning electron microscope
- An arbitrary area S is specified in the SEM image, and the total area A of the inorganic filler contained in the area S is obtained.
- SEM-EDX energy dispersive X-ray spectroscope
- the value obtained by dividing the total area B of the calcium titanate particles by the total area A of the inorganic filler is converted into a percentage (%), and this value is taken as the content ratio (volume%) of the calcium titanate particles in the entire inorganic filler. ..
- the area S is a sufficiently large area with respect to the size of the inorganic filler. For example, the size is such that 100 or more inorganic fillers are contained.
- the area S may be the sum of a plurality of cut surfaces.
- the content of calcium titanate particles is preferably 15% by volume to 70% by volume with respect to the entire molding resin composition.
- the content of calcium titanate particles is preferably 15% by volume or more, more preferably 25% by volume or more, based on the entire molding resin composition. , 27% by volume or more, more preferably 40% by volume or more, extremely preferably 42% by volume or more, and most preferably 45% by volume or more.
- the content of calcium titanate particles is preferably 70% by volume or less, preferably 60% by volume or less, based on the entire molding resin composition.
- the content of the calcium titanate particles is preferably 15% by volume to 70% by volume, more preferably 25% by volume to 60% by volume, and 27% by volume to 55% by volume, based on the entire molding resin composition. It is more preferably by volume. From the viewpoint of obtaining a cured product having a high dielectric constant, a low dielectric loss tangent, and suppressed void generation, the content of calcium titanate particles is 40% by volume to 70% by volume with respect to the entire molding resin composition. %, More preferably 42% by volume to 60% by volume, and even more preferably 45% by volume to 55% by volume.
- the content of calcium titanate particles is higher than that of the entire molding resin composition. It is preferably 15% by volume or more and less than 40% by volume, more preferably 25% by volume to 35% by volume, and even more preferably 27% by volume to 33% by volume.
- the mass ratio of calcium titanate particles to the total of epoxy resin and curing agent is from the viewpoint of the balance between relative permittivity and fluidity. Therefore, it is preferably 1 to 10, more preferably 1.5 to 8, further preferably 2 to 6, and particularly preferably 2.5 to 5.
- -Other fillers The types of other fillers are not particularly limited. Specific examples of the material of the other filler include fused silica, crystalline silica, glass, alumina, calcium carbonate, zirconium silicate, calcium silicate, silicon nitride, aluminum nitride, boron nitride, verilia, zirconia, and zircon. Inorganic materials such as fosterite, steatite, spinel, mulite, titania, talc, clay and mica can be mentioned. As another filler, an inorganic filler having a flame-retardant effect may be used.
- Examples of the inorganic filler having a flame-retardant effect include aluminum hydroxide, magnesium hydroxide, a composite metal hydroxide such as a composite hydroxide of magnesium and zinc, and zinc borate.
- the other fillers one type may be used alone, or two or more types may be used in combination.
- the other filler preferably contains at least one selected from the group consisting of silica particles and alumina particles from the viewpoint of reducing dielectric loss tangent.
- the other filler may contain only one of the silica particles and the alumina particles, or may contain both the silica particles and the alumina particles.
- the total content of the silica particles and alumina particles is 20% by volume to 70% by volume based on the total inorganic filler. It is preferably 23% by volume to 65% by volume, more preferably 25% by volume to 60% by volume, and 30% by volume to 60% from the viewpoint of the balance between fluidity and relative dielectric constant. It is particularly preferably by volume%, and very preferably 35% by volume to 50% by volume.
- the other filler preferably contains alumina particles from the viewpoint of increasing the fluidity of the molding resin composition.
- the content of the alumina particles is preferably 20% by volume to 70% by volume, preferably 23% by volume to 65% by volume, based on the entire inorganic filler. It is more preferably 25% by volume to 60% by volume, particularly preferably 30% by volume to 60% by volume, and 35% by volume to 50% by volume from the viewpoint of the balance between fluidity and specific dielectric constant. Is extremely preferable.
- the other filler may contain titanium acid compound particles other than calcium titanate particles.
- the titanate compound particles other than the calcium titanate particles include strontium titanate particles, barium titanate particles, potassium titanate particles, magnesium titanate particles, lead titanate particles, aluminum titanate particles, lithium titanate particles and the like. Be done.
- the content of the barium titanate particles is preferably less than 1% by volume and more preferably less than 0.5% by volume with respect to the entire inorganic filler. It is preferably less than 0.1% by volume, more preferably less than 0.1% by volume. That is, it is preferable that the inorganic filler does not contain barium titanate particles or contains barium titanate particles at the above content.
- the total content of the titanium acid compound particles other than the calcium titanate particles may be less than 1% by volume, less than 0.5% by volume, or 0.1, based on the entire inorganic filler. It may be less than% by volume. That is, the inorganic filler may not contain the titanic acid compound particles other than the calcium titanate particles, and may contain the titanic acid compound particles other than the calcium titanate particles at the above content.
- the volume average particle size of the other fillers is not particularly limited.
- the volume average particle size of the other filler is preferably 0.2 ⁇ m to 100 ⁇ m, and more preferably 0.5 ⁇ m to 50 ⁇ m.
- the volume average particle size of the other filler is 0.2 ⁇ m or more, the increase in the viscosity of the molding resin composition tends to be further suppressed.
- the volume average particle size of the other filler is 100 ⁇ m or less, the filler of the molding resin composition tends to be further improved.
- the molding resin composition is placed in a crucible and left at 800 ° C. for 4 hours to be incinerated.
- the obtained ash content can be observed by SEM, separated for each shape, the particle size distribution can be obtained from the observed image, and the volume average particle size of other fillers can be obtained as the volume average particle size (D50) from the particle size distribution. Further, the volume average particle size of the other filler may be determined by measurement with a laser diffraction / scattering type particle size distribution measuring device (for example, Horiba Seisakusho Co., Ltd., LA920). The other filler may be a mixture of two or more fillers having different volume average particle diameters.
- the volume average particle diameter of the other filler may be 3 ⁇ m or more from the viewpoint of the viscosity of the molding resin composition, or may be 5 ⁇ m or more, and from the viewpoint of the fluidity of the molding resin composition. It may be 10 ⁇ m or more, or 20 ⁇ m or more.
- the volume average particle size of other fillers / volume average particle size of calcium titanate which is the ratio of the volume average particle size ( ⁇ m) of other fillers to the volume average particle size ( ⁇ m) of calcium titanate, is for molding. From the viewpoint of fluidity and filling property of the resin composition, it is preferably larger than 1 and 20 or less, more preferably 1.5 to 15, and further preferably 3 to 10.
- the shape of the other filler is not particularly limited, and examples thereof include a spherical shape, an elliptical shape, and an amorphous shape. Further, the other filler may be crushed. The shape of the other filler is preferably spherical from the viewpoint of improving the fluidity of the molding resin composition.
- the content of the entire inorganic filler contained in the molding resin composition is 40% by volume to 90% by volume of the entire molding resin composition from the viewpoint of controlling the fluidity and strength of the cured product of the molding resin composition. It is preferably 40% by volume to 85% by volume, more preferably 45% by volume to 85% by volume, particularly preferably 50% by volume to 82% by volume, and 55% by volume. It is extremely preferable that the content is% to 80% by volume.
- the inorganic filler contains spherical calcium titanate particles
- high fluidity can be obtained even if the content of the entire inorganic filler contained in the molding resin composition is increased.
- the content of the curable resin contained in the molding resin composition becomes low, and a cured product having a low dielectric loss tangent can be obtained. It will be easier.
- the content of the entire inorganic filler contained in the molding resin composition may be 70% by volume or more of the entire molding resin composition. It is more preferably 73% by volume or more, further preferably 75% by volume or more, and particularly preferably 77% by volume or more.
- the content (volume%) of the inorganic filler in the molding resin composition can be determined by the following method.
- a flaky sample of the cured resin composition for molding is imaged with a scanning electron microscope (SEM).
- An arbitrary area S is specified in the SEM image, and the total area A of the inorganic filler contained in the area S is obtained.
- the value obtained by dividing the total area A of the inorganic filler by the area S is converted into a percentage (%), and this value is taken as the content ratio (volume%) of the inorganic filler in the resin composition for molding.
- the area S is a sufficiently large area with respect to the size of the inorganic filler. For example, the size is such that 100 or more inorganic fillers are contained.
- the area S may be the sum of a plurality of cut surfaces.
- the inorganic filler may have a bias in the abundance ratio in the direction of gravity during curing of the molding resin composition. In that case, when the image is taken by the SEM, the entire gravity direction of the cured product is imaged, and the area S including the entire gravity direction of the cured product is specified.
- the relative permittivity at 10 GHz in the entire inorganic filler is, for example, in the range of 80 or less.
- the relative permittivity at 10 GHz is also simply referred to as “dielectric constant”.
- the dielectric constant of the entire inorganic filler is 80 or less, and the content of calcium titanate particles is 30% by volume or more with respect to the entire inorganic filler.
- unfired titanium as calcium titanate particles for example, unfired titanium as calcium titanate particles.
- a method using calcium acid acid particles can be mentioned.
- the unfired calcium titanate particles refer to calcium titanate particles that have not undergone the following firing steps.
- the above-mentioned “baking step” is a step of adding a dopant compound containing other elements (that is, elements other than titanium and calcium) to calcium titanate particles and heating at a temperature of 1000 ° C. or higher for 3 hours or longer.
- the dielectric constant of the calcium titanate particles greatly increases as a result of the firing step.
- the dielectric constant of uncalcined calcium titanate particles after being calcined at a temperature of 1000 ° C. for 3 hours is several times or more the dielectric constant of calcium titanate before calcining.
- the dielectric constant of the entire inorganic filler is adjusted to 80 or less while using the calcined calcium titanate particles as the calcium titanate particles, the content of the calcium titanate particles in the entire inorganic filler is lowered.
- a cured product having a high dielectric constant can be obtained.
- the unevenness of the dielectric constant in the cured product is likely to occur.
- a high dielectric constant is obtained in a molding resin composition using an inorganic filler containing unfired calcium titanate particles in a content of 30% by volume or more and having an overall dielectric constant of 80 or less.
- a cured product having a high uniformity of dielectric constant can be obtained.
- the dielectric constant of the entire inorganic filler is preferably 50 or less, more preferably 40 or less, and even more preferably 30 or less, from the viewpoint of suppressing dielectric loss. From the viewpoint of miniaturization of electronic components such as antennas, the dielectric constant of the entire inorganic filler is preferably 5 or more, more preferably 10 or more, and further preferably 15 or more. The dielectric constant of the entire inorganic filler is preferably 5 to 50, more preferably 10 to 40, and 15 to 30 from the viewpoint of suppressing dielectric loss and miniaturization of electronic components such as antennas. It is more preferable to have.
- the dielectric constant of the entire inorganic filler is obtained, for example, as follows.
- the inorganic filler containing three or more kinds of measurement resin compositions containing the inorganic filler to be measured and a specific curable resin and having different contents of the inorganic filler, and the specific curable resin are prepared.
- a resin composition for measurement which does not contain.
- the resin composition for measurement containing the inorganic filler to be measured and a specific curable resin include a biphenyl aralkyl type epoxy resin, a phenol curing agent which is a phenol aralkyl type phenol resin, and curing containing organic phosphine.
- Examples thereof include a resin composition for measurement containing an accelerator and an inorganic filler to be measured. Further, as the three or more kinds of resin compositions for measurement having different contents of the inorganic filler, for example, the content of the inorganic filler in the entire measuring resin composition is 10% by volume, 20% by volume, and 30% by volume. Examples of the resin composition for measurement of.
- Each of the prepared resin compositions for measurement is molded by compression molding under the conditions of a mold temperature of 175 ° C., a molding pressure of 6.9 MPa, and a curing time of 600 seconds to obtain a cured product for measurement.
- the relative permittivity at 10 GHz in each of the obtained cured products for measurement is measured, and a graph is created in which the content of the inorganic filler is plotted on the horizontal axis and the measured value of the relative permittivity is plotted on the vertical axis. From the obtained graph, a linear approximation is performed by the least squares method, and the relative permittivity when the content of the inorganic filler is 100% by volume is obtained by extrapolation and used as "the dielectric constant of the entire inorganic filler".
- the molding resin composition in the present embodiment contains various additives such as a coupling agent, an ion exchanger, a mold release agent, a flame retardant, a colorant, and a stress relaxation agent exemplified below. But it may be.
- the molding resin composition in the present embodiment may contain various additives well known in the art, if necessary, in addition to the additives exemplified below.
- the molding resin composition in the present embodiment may contain a coupling agent.
- the molding resin composition preferably contains a coupling agent.
- the coupling agent include known coupling agents such as silane compounds such as epoxysilane, mercaptosilane, aminosilane, alkylsilane, ureidosilane, vinylsilane and disilazane, titanium compounds, aluminum chelate compounds and aluminum / zirconium compounds. Can be mentioned.
- the amount of the coupling agent is preferably 0.05 parts by mass to 5 parts by mass, and 0.1 parts by mass to 5 parts by mass with respect to 100 parts by mass of the inorganic filler. More preferably, it is 2.5 parts by mass.
- the amount of the coupling agent is 0.05 parts by mass or more with respect to 100 parts by mass of the inorganic filler, the adhesiveness with the frame tends to be further improved.
- the amount of the coupling agent is 5 parts by mass or less with respect to 100 parts by mass of the inorganic filler, the moldability of the package tends to be further improved.
- the molding resin composition in the present embodiment may contain an ion exchanger.
- the molding resin composition preferably contains an ion exchanger from the viewpoint of improving the moisture resistance and high temperature standing characteristics of the electronic component device including the electronic component to be sealed.
- the ion exchanger is not particularly limited, and conventionally known ones can be used. Specific examples thereof include hydrotalcite compounds and hydrous oxides of at least one element selected from the group consisting of magnesium, aluminum, titanium, zirconium, and bismuth.
- hydrotalcite represented by the following general formula (A) is preferable.
- the content thereof is not particularly limited as long as it is an amount sufficient to capture ions such as halogen ions.
- the content of the ion exchanger is preferably 0.1 part by mass to 30 parts by mass, and more preferably 1 part by mass to 10 parts by mass with respect to 100 parts by mass of the resin component.
- the molding resin composition in the present embodiment may contain a mold release agent from the viewpoint of obtaining good mold release property from the mold at the time of molding.
- the release agent is not particularly limited, and conventionally known release agents can be used. Specific examples thereof include higher fatty acids such as carnauba wax, montanic acid and stearic acid, ester waxes such as higher fatty acid metal salts and montanic acid esters, and polyolefin waxes such as polyethylene oxide and non-oxidized polyethylene.
- the release agent one type may be used alone or two or more types may be used in combination.
- the amount thereof is preferably 0.01 part by mass to 10 parts by mass, more preferably 0.1 part by mass to 5 parts by mass with respect to 100 parts by mass of the resin component.
- the amount of the mold release agent is 0.01 part by mass or more with respect to 100 parts by mass of the resin component, the mold release property tends to be sufficiently obtained.
- it is 10 parts by mass or less, better adhesiveness tends to be obtained.
- the molding resin composition in the present embodiment may contain a flame retardant.
- the flame retardant is not particularly limited, and conventionally known flame retardants can be used. Specific examples thereof include organic or inorganic compounds containing halogen atoms, antimony atoms, nitrogen atoms or phosphorus atoms, metal hydroxides and the like.
- the flame retardant may be used alone or in combination of two or more.
- the amount thereof is not particularly limited as long as it is sufficient to obtain the desired flame retardant effect.
- the amount of the flame retardant is preferably 1 part by mass to 30 parts by mass, and more preferably 2 parts by mass to 20 parts by mass with respect to 100 parts by mass of the resin component.
- the molding resin composition in the present embodiment may contain a colorant.
- the colorant include known colorants such as carbon black, organic dyes, organic pigments, titanium oxide, lead tan, and red iron oxide.
- the content of the colorant can be appropriately selected depending on the purpose and the like.
- the colorant one type may be used alone or two or more types may be used in combination.
- the molding resin composition in the present embodiment may contain a stress relaxation agent.
- a stress relaxation agent By containing a stress relaxation agent, it is possible to further reduce the warpage deformation of the package and the occurrence of package cracks.
- the stress relaxation agent include commonly used known stress relaxation agents (flexible agents). Specifically, thermoplastic elastomers such as silicone-based, styrene-based, olefin-based, urethane-based, polyester-based, polyether-based, polyamide-based, and polybutadiene-based, NR (natural rubber), NBR (acrylonitrile-butadiene rubber), and acrylic.
- Rubber particles such as rubber, urethane rubber, silicone powder, core-shell such as methyl methacrylate-styrene-butadiene copolymer (MBS), methyl methacrylate-silicone copolymer, methyl methacrylate-butyl acrylate copolymer, etc.
- Examples include rubber particles having a structure.
- the stress relaxation agent one type may be used alone or two or more types may be used in combination.
- silicone-based stress relaxation agents are preferable.
- the silicone-based stress relieving agent include those having an epoxy group, those having an amino group, those obtained by modifying these with a polyether, and the like, and silicone compounds such as a silicone compound having an epoxy group and a polyether silicone compound are more suitable. preferable.
- the amount thereof is preferably 1 part by mass to 30 parts by mass and 2 parts by mass to 20 parts by mass with respect to 100 parts by mass of the resin component, for example. Is more preferable.
- the method for preparing the molding resin composition is not particularly limited.
- a method of sufficiently mixing a predetermined blending amount of components with a mixer or the like, then melt-kneading with a mixing roll, an extruder or the like, cooling and pulverizing can be mentioned. More specifically, for example, a method in which a predetermined amount of the above-mentioned components is stirred and mixed, kneaded with a kneader, a roll, an extruder or the like previously heated to 70 ° C. to 140 ° C., cooled and pulverized. be able to.
- the molding resin composition in the present embodiment is preferably solid at normal temperature and pressure (for example, 25 ° C. and atmospheric pressure).
- the shape is not particularly limited, and examples thereof include powder, granules, and tablets.
- the molding resin composition is in the shape of a tablet, it is preferable that the dimensions and mass are suitable for the molding conditions of the package from the viewpoint of handleability.
- the relative permittivity of the cured product at 10 GHz is preferably 10 to 35, more preferably 13 to 30, from the viewpoint of miniaturization of electronic components such as antennas.
- the relative permittivity is measured at a temperature of 25 ⁇ 3 ° C. using a dielectric constant measuring device (for example, Agilent Technologies, product name “Network Analyzer N5227A”).
- the molding resin composition according to this embodiment is molded by compression molding under the conditions of a mold temperature of 175 ° C., a molding pressure of 6.9 MPa, and a curing time of 600 seconds.
- a mold temperature of 175 ° C.
- a molding pressure of 6.9 MPa
- a curing time 600 seconds.
- the dielectric loss tangent at 10 GHz of the cured product is preferably 0.018 or less, more preferably 0.015 or less, and even more preferably 0.010 or less from the viewpoint of reducing transmission loss.
- the lower limit of the dielectric loss tangent at 10 GHz of the cured product is not particularly limited, and examples thereof include 0.005.
- the measurement of the dielectric loss tangent is performed at a temperature of 25 ⁇ 3 ° C. using a dielectric constant measuring device (for example, Agilent Technologies, product name “Network Analyzer N5227A”).
- the flow distance when the resin composition for molding is molded under the conditions of a mold temperature of 175 ° C., a molding pressure of 6.9 MPa, and a curing time of 90 seconds using a mold for measuring spiral flow according to EMMI-1-66 is , 80 cm or more, more preferably 100 cm or more, and even more preferably 120 cm or more.
- the above flow distance is also referred to as "spiral flow".
- the upper limit of the spiral flow is not particularly limited, and examples thereof include 200 cm.
- the gel time of the molding resin composition at 175 ° C. is preferably 30 seconds to 100 seconds, more preferably 40 seconds to 70 seconds.
- the gel time at 175 ° C. is measured as follows. Specifically, for 3 g of a sample of the resin composition for molding, measurement using a curast meter of JSR Trading Co., Ltd. is carried out at a temperature of 175 ° C., and the time until the rise of the torque curve is defined as the gel time (sec). ..
- the molding resin composition in the present embodiment can be applied to, for example, the production of electronic component devices described later, particularly high frequency devices.
- the molding resin composition in the present embodiment may be used for sealing electronic components in a high frequency device.
- the semiconductor package (PKG) used for electronic component devices has become more sophisticated and smaller.
- an antenna-in-package (AiP, Antenna in Package) which is a PKG having an antenna function, is also underway.
- the radio waves used for communication are becoming higher in frequency in order to cope with the increase in the number of channels due to the diversification of information, and the sealing material has both a high dielectric constant and a low dielectric loss tangent. Is required.
- the molding resin composition in the present embodiment a cured product having both a high dielectric constant and a low dielectric loss tangent can be obtained. Therefore, it is particularly suitable for an antenna-in-package (AiP) application in which an antenna arranged on a support member is sealed with a molding resin composition in a high-frequency device.
- the electronic component device includes a support member, an electronic component arranged on the support member, and a cured product of the above-mentioned molding resin composition sealing the electronic component.
- Electronic component devices include lead frames, pre-wired tape carriers, wiring boards, glass, silicon wafers, organic substrates, and other support members, as well as electronic components (semiconductor chips, transistors, diodes, active elements such as thyristors, capacitors, and resistors. Examples thereof include an electronic component region obtained by mounting a body, a passive element such as a coil, an antenna, etc., and sealed with a molding resin composition (for example, a high frequency device).
- the type of the support member is not particularly limited, and a support member generally used for manufacturing an electronic component device can be used.
- the electronic component may include an antenna, and may include an antenna and an element other than the antenna.
- the antenna is not limited as long as it plays the role of an antenna, and may be an antenna element or wiring.
- other electronic components may be arranged on the surface of the support member opposite to the surface on which the electronic components are arranged, if necessary.
- the other electronic components may be sealed with the above-mentioned molding resin composition, may be sealed with another resin composition, or may not be sealed.
- the method for manufacturing an electronic component device includes a step of arranging the electronic component on a support member and a step of sealing the electronic component with the above-mentioned molding resin composition.
- the method for carrying out each of the above steps is not particularly limited, and can be carried out by a general method. Further, the types of support members and electronic components used in the manufacture of electronic component devices are not particularly limited, and support members and electronic components generally used in the manufacture of electronic component devices can be used.
- Examples of the method for sealing an electronic component using the above-mentioned molding resin composition include a low-pressure transfer molding method, an injection molding method, a compression molding method, and the like. Among these, the low pressure transfer molding method is common.
- Epoxy resin 1 Triphenylmethane type epoxy resin, epoxy equivalent 167 g / eq (Mitsubishi Chemical Corporation, product name "1032H60”)
- Epoxy resin 2 Biphenyl aralkyl type epoxy resin, epoxy equivalent 274 g / eq (Nippon Kayaku Co., Ltd., product name "NC-3000”)
- Epoxy resin 3 Biphenyl type epoxy resin, epoxy equivalent 192 g / eq (Mitsubishi Chemical Corporation, product name "YX-4000”)
- -Curing agent 1 Active ester compound, DIC Corporation, product name "EXB-8"
- -Curing agent 2 Phenol curing agent, aralkyl type phenol resin, hydroxyl group equivalent 170 g / eq (Meiwa Kasei Co., Ltd., product name "MEH7800 series”)
- -Inorganic filler 1 Silica particles, other fillers, volume average particle size: 11 ⁇ m, shape: spherical / inorganic filler 2: alumina particles, other fillers, volume average particle size: 45 ⁇ m, shape: spherical / inorganic Filler 3: Alumina particles, other fillers, volume average particle size: 7 ⁇ m, shape: spherical / inorganic filler 4: unbaked calcium titanate particles, volume average particle size: 6 ⁇ m, shape: amorphous / inorganic filling Material 5: Unfired calcium titanate particles, volume average particle size: 0.2 ⁇ m, shape: amorphous / inorganic filler 6: unfired barium titanate particles, volume average particle size: 6.6 ⁇ m, shape: spherical -Inorganic filler 7: Unfired calcium titanate particles Volume average particle size: 9 ⁇ m, shape: spherical
- -Curing accelerator triphenylphosphine / 1,4-benzoquinone adduct-Coupling agent: N-phenyl-3-aminopropyltrimethoxysilane (Shin-Etsu Chemical Co., Ltd., product name "KBM-573”)
- -Release agent Montanic acid ester wax (Clariant Japan Co., Ltd., product name "HW-E”)
- -Colorant Carbon black (Mitsubishi Chemical Corporation, product name "MA600”)
- -Silicone 1 Polyester-based silicone compound (Momentive Performance Materials, Inc., product name "SIM768E”)
- -Silicone 2 Silicone compound having an epoxy group (Dow Toray Co., Ltd., product name "AY42-119")
- the volume average particle diameter of each of the above-mentioned inorganic fillers is a value obtained by the following measurement. Specifically, first, an inorganic filler was added to the dispersion medium (water) in the range of 0.01% by mass to 0.1% by mass, and the mixture was dispersed in a bath-type ultrasonic cleaner for 5 minutes. 5 ml of the obtained dispersion was injected into a cell, and the particle size distribution was measured at 25 ° C. with a laser diffraction / scattering type particle size distribution measuring device (HORIBA, Ltd., LA920). The particle size at an integrated value of 50% (volume basis) in the obtained particle size distribution was defined as the volume average particle size.
- a dielectric constant measuring device (Agilent Technologies, Inc., product name "Network Analyzer N5227A") is used to measure the relative permittivity and dielectric loss tangent at 10 GHz at a temperature of 25 ⁇ 3 ° C. did.
- the results are shown in Tables 1 to 3 (“relative permittivity” and “dielectric loss tangent” in the table).
- the molding resin composition of the example has both a high relative permittivity and a low dielectric loss tangent in the cured product after molding as compared with the molding resin composition of the comparative example. ing.
- Example 15 and 16 The molding resin compositions of Examples 15 and 16 were prepared by mixing at the blending ratios (parts by mass) shown in Table 4. This molding resin composition was a solid under normal temperature and pressure.
- the curing agent 1 and the curing agent 3 are used in combination, and in Examples 15 and 16, silicone is not used.
- the blank means that the component is not included.
- each item in Table 4 is the same as each item in Tables 1 to 3.
- the curing agent 3 used in Example 15 is as follows.
- -Curing agent 3 Phenol curing agent, aralkyl type phenol resin, hydroxyl group equivalent 202 g / eq (Meiwa Kasei Co., Ltd., product name "MEH7851SS”))
- the molding resin compositions of Examples 15 and 16 have a higher relative permittivity and a lower dielectric constant in the cured product after molding as compared with the molding resin compositions of Comparative Examples shown in Table 3. It is compatible with the straight contact.
- the bending toughness was evaluated by measuring the fracture toughness value (MPa ⁇ m 1/2 ) of the cured product.
- a test piece for evaluation of bending toughness was prepared by cutting a cured product into a rectangular parallelepiped having a size of 4.0 mm ⁇ 10.0 mm ⁇ 80 mm.
- the size of the crack defect of the test piece for evaluation of bending toughness was 4.0 mm ⁇ 2.0 mm ⁇ 1.0 mm.
- the fracture toughness value was calculated by three-point bending measurement using a Tensilon universal material tester (Instron 5948, Instron) and a test piece for evaluation of bending toughness based on ASTM D5045.
- Table 5 shows the measurement results of bending strength and fracture toughness in each example and each comparative example.
- the molding resin compositions of Examples 7, 9 and 15 have a better evaluation of bending toughness after curing than the molding resin compositions of Each Example and each Comparative Example. rice field.
- Table 5 when only the active ester compound was used as the curing agent, the evaluation of bending toughness tended to be worse than when only the phenol curing agent was used as the curing agent.
- the molding resin composition of Example 15 by using the active ester compound and the phenol curing agent in combination as the curing agent, the evaluation of the bending toughness after curing is better than the case where only the phenol curing agent is used. became.
- Example 15 it was confirmed that the bending toughness after curing was synergistically improved by using the active ester compound and the phenol curing agent in combination as the curing agent. By improving the bending toughness, the generation of cracks in the cured product tends to be suppressed.
- Example 17 to 19 The molding resin compositions of Examples 17 to 19 were prepared by mixing at the blending ratios (parts by mass) shown in Table 6. This molding resin composition was solid under normal temperature and pressure. In Table 6, blanks mean that the components are not contained. Further, each item in Table 6 is the same as each item in Tables 1 to 4.
- the inorganic filler 7 used in Examples 17 to 19 is as follows. -Inorganic filler 7: Unfired calcium titanate particles, volume average particle size: 8.9 ⁇ m, shape: spherical, amorphous calcium titanate particles subjected to spheroidizing treatment at 1200 ° C. for 2 hours.
- the molding resin compositions of Examples 17 to 19 have a higher relative permittivity and a lower dielectric constant in the cured product after molding as compared with the molding resin compositions of Comparative Examples shown in Table 3. It is compatible with the straight contact. Further, the molding resin compositions of Examples 18 to 19 have the same content of the inorganic filler in the entire molding resin composition and do not contain spherical calcium titanate particles. The flow distance is longer than that of the composition, and the high relative permittivity and the low dielectric loss tangent are compatible as in Examples 1 and 2.
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Abstract
Description
<1> 硬化性樹脂と、
チタン酸カルシウム粒子を含有する無機充填材と、
を含む成形用樹脂組成物。
<2> 前記硬化性樹脂がエポキシ樹脂を含有し、かつ、前記成形用樹脂組成物が硬化剤をさらに含む、<1>に記載の成形用樹脂組成物。
<3> 前記硬化剤は、活性エステル化合物を含む、<2>に記載の成形用樹脂組成物。
<4> 前記硬化剤は、フェノール硬化剤、アミン硬化剤、酸無水物硬化剤、ポリメルカプタン硬化剤、ポリアミノアミド硬化剤、イソシアネート硬化剤、及びブロックイソシアネート硬化剤からなる群より選択される少なくとも一種のその他の硬化剤と、活性エステル化合物と、を含む、<2>又は<3>に記載の成形用樹脂組成物。
<5> 前記硬化剤は、アラルキル型フェノール樹脂及び活性エステル化合物を含む、<2>又は<3>に記載の成形用樹脂組成物。
<6> 前記無機充填材は、シリカ粒子及びアルミナ粒子からなる群より選択される少なくとも一種であるその他の無機充填材をさらに含有する、<1>~<5>のいずれか1つに記載の成形用樹脂組成物。
<7> 前記その他の無機充填材の体積平均粒径は、3μm以上である、<6>に記載の成形用樹脂組成物。
<8> 前記チタン酸カルシウム粒子の含有率は、前記無機充填材全体に対し30体積%~80体積%である、<1>~<7>のいずれか1つに記載の成形用樹脂組成物。
<9> 前記無機充填材全体における10GHzでの比誘電率が80以下である、<1>~<8>のいずれか1つに記載の成形用樹脂組成物。
<10> 前記無機充填材全体の含有率は、成形用樹脂組成物全体に対し40体積%~85体積%である、<1>~<9>のいずれか1つに記載の成形用樹脂組成物。
<11> 前記チタン酸カルシウム粒子の体積平均粒径は、0.2μm~80μmである、<1>~<10>のいずれか1つに記載の成形用樹脂組成物。
<12> 有機ホスフィンを含有する硬化促進剤をさらに含む、<1>~<11>のいずれか1つに記載の成形用樹脂組成物。
<13> 前記無機充填材は、球形のチタン酸カルシウム粒子を含む、<1>~<12>のいずれか1項に記載の成形用樹脂組成物。
<14> 前記無機充填材全体の含有率は、成形用樹脂組成物全体に対し70体積%~85体積%である、<13>に記載の成形用樹脂組成物。
<15> 成形用樹脂組成物の硬化物における比誘電率が9~40であり、かつ、前記硬化物における誘電正接が0.020以下である、<1>~<14>のいずれか1項に記載の成形用樹脂組成物。
<16> 高周波デバイスに用いられる、<1>~<15>のいずれか1つに記載の成形用樹脂組成物。
<17> 高周波デバイスにおける電子部品の封止に用いられる、<16>に記載の成形用樹脂組成物。
<18> アンテナ・イン・パッケージに用いられる、<1>~<17>のいずれか1つに記載の成形用樹脂組成物。
<19> 支持部材と、
前記支持部材上に配置された電子部品と、
前記電子部品を封止している<1>~<18>のいずれか1つに記載の成形用樹脂組成物の硬化物と、
を備える電子部品装置。
<20> 前記電子部品がアンテナを含む<19>に記載の電子部品装置。
本開示において「~」を用いて示された数値範囲には、「~」の前後に記載される数値がそれぞれ最小値及び最大値として含まれる。
本開示中に段階的に記載されている数値範囲において、一つの数値範囲で記載された上限値又は下限値は、他の段階的な記載の数値範囲の上限値又は下限値に置き換えてもよい。また、本開示中に記載されている数値範囲において、その数値範囲の上限値又は下限値は、実施例に示されている値に置き換えてもよい。
本開示において各成分は該当する物質を複数種含んでいてもよい。組成物中に各成分に該当する物質が複数種存在する場合、各成分の含有率又は含有量は、特に断らない限り、組成物中に存在する当該複数種の物質の合計の含有率又は含有量を意味する。
本開示において各成分に該当する粒子は複数種含んでいてもよい。組成物中に各成分に該当する粒子が複数種存在する場合、各成分の粒子径は、特に断らない限り、組成物中に存在する当該複数種の粒子の混合物についての値を意味する。
本開示において、単に「チタン酸カルシウム粒子」と記載されている場合は、球形、楕円形、不定形等の任意の形状を有するチタン酸カルシウム粒子、又はこれらの混合物を意味する。
本発明の一実施形態に係る成形用樹脂組成物は、硬化性樹脂と、チタン酸カルシウム粒子を含有する無機充填材と、を含む。
本実施形態における成形用樹脂組成物は、硬化性樹脂を含む。
硬化性樹脂は、熱硬化性樹脂及び光硬化性樹脂のいずれであってもよく、量産性の観点からは、熱硬化性樹脂であることが好ましい。
熱硬化性樹脂としては、エポキシ樹脂、フェノール樹脂、メラミン樹脂、尿素樹脂、不飽和ポリエステル樹脂、アルキド樹脂、ウレタン樹脂、ビスマレイミド樹脂等のポリイミド樹脂、ポリアミド樹脂、ポリアミドイミド樹脂、シリコーン樹脂、アクリル樹脂などが挙げられる。熱硬化性樹脂は、成形性及び電気特性の観点から、エポキシ樹脂及びポリイミド樹脂からなる群より選択される少なくとも1種であることが好ましく、エポキシ樹脂及びビスマレイミド樹脂からなる群より選択される少なくとも1種であることがより好ましく、エポキシ樹脂であることがさらに好ましい。
成形用樹脂組成物は、硬化性樹脂を1種のみ含んでもよく、2種以上含んでもよい。
以下、硬化性樹脂の一例として、エポキシ樹脂について説明する。
成形用樹脂組成物は、硬化性樹脂としてエポキシ樹脂を含むことが好ましい。
成形用樹脂組成物が硬化性樹脂としてエポキシ樹脂を含む場合、硬化性樹脂全体に対するエポキシ樹脂の含有率は、80質量%以上であることが好ましく、90質量%以上であることがより好ましく、95質量%以上であることがさらに好ましい。硬化性樹脂全体に対するエポキシ樹脂の含有率は、100質量%であってもよい。
エポキシ樹脂は、分子中にエポキシ基を有するものであればその種類は特に制限されない。
エポキシ樹脂のエポキシ当量は、JIS K 7236:2009に準じた方法で測定される値とする。
エポキシ樹脂の融点又は軟化点は、示差走査熱量測定(DSC)又はJIS K 7234:1986に準じた方法(環球法)で測定される値とする。
成形用樹脂組成物が硬化性樹脂としてエポキシ樹脂を含む場合、成形用樹脂組成物はさらに硬化剤を含んでもよい。成形用樹脂組成物は、エポキシ樹脂を含有する硬化性樹脂と、硬化剤と、チタン酸カルシウム粒子を含有する無機充填材と、を含むことが好ましい。硬化剤の種類は特に制限されない。
エポキシ樹脂とフェノール硬化剤又はアミン硬化剤との反応においては、2級水酸基が発生する。これに対して、エポキシ樹脂と活性エステル化合物との反応においては、2級水酸基のかわりにエステル基が生じる。エステル基は、2級水酸基に比べて極性が低い故、硬化剤として活性エステル化合物を含有する成形用樹脂組成物は、硬化剤として2級水酸基を発生させる硬化剤のみを含有する成形用樹脂組成物に比べて、硬化物の誘電正接を低く抑えることができる。
また、硬化物中の極性基は硬化物の吸水性を高めるところ、硬化剤として活性エステル化合物を用いることによって硬化物の極性基濃度を抑えることができ、硬化物の吸水性を抑制することができる。そして、硬化物の吸水性を抑制すること、つまりは極性分子であるH2Oの含有量を抑制することにより、硬化物の誘電正接をさらに低く抑えることができる。
活性エステル化合物のエステル当量は、JIS K 0070:1992に準じた方法により測定される値とする。
エポキシ樹脂と活性エステル化合物との当量比(エステル基/エポキシ基)は、活性エステル化合物の未反応分を少なく抑える観点からは、1.1以下が好ましく、1.05以下がより好ましく、1.03以下がさらに好ましい。
その他の硬化剤の官能基当量(フェノール硬化剤の場合は水酸基当量)は、JIS K 0070:1992に準じた方法により測定される値とする。
硬化剤の融点又は軟化点は、エポキシ樹脂の融点又は軟化点と同様にして測定される値とする。
以下、その他の硬化剤は、フェノール硬化剤と読み替えてもよい。
成形用樹脂組成物は、硬化性樹脂としてポリイミド樹脂を含んでもよい。
ポリイミド樹脂は、イミド結合を有する高分子化合物であれば特に限定されるものではない。ポリイミド樹脂としては、ビスマレイミド樹脂等が挙げられる。
ビスマレイミド樹脂は、ポリマレイミド化合物とポリアミノ化合物とを含有する組成物を重合させた重合体であればよく、ポリマレイミド化合物及びポリアミノ化合物以外のその他の化合物に由来する単位を含んでもよい。その他の化合物としては、2以上のエチレン性不飽和二重結合を含む基を有する化合物等が挙げられる。以下、2以上のエチレン性不飽和二重結合を含む基を有する化合物を「エチレン性化合物」ともいう。
これらのポリマレイミド化合物は、1種類を単独で用いてもよく、2種類以上を併用してもよい。
これらのポリアミノ化合物は、1種類を単独で用いてもよく、2種類以上を併用してもよい。
エチレン性化合物は、エチレン性不飽和二重結合を含む基のほかに、さらに他の基を有してもよい。他の基としては、アミノ基、エーテル基、スルフィド基等が挙げられる。
エチレン性化合物の具体例としては、ジアリルアミン、ジアリルエーテル、ジアリルスフィド、トリアリルイソシアヌレート等が挙げられる。
また、ビスマレイミド樹脂がエチレン性化合物に由来する単位を含む場合、ビスマレイミド樹脂中におけるポリマレイミド化合物のN-置換マレイミド基数(Ta1)に対するエチレン性化合物のエチレン性不飽和二重結合数(Ta3)の当量比(Ta3/Ta1)としては、例えば、0.05~0.2の範囲が挙げられる。
検量線は、標準ポリスチレン:TSKstandard POLYSTYRENE(Type:A-2500、A-5000、F-1、F-2、F-4、F-10、F-20、F-40)[東ソー株式会社製]を用いて3次式で近似する。
GPCに用いる装置としては、ポンプ:L-6200型(株式会社日立ハイテクノロジーズ製)、検出器:L-3300型RI(株式会社日立ハイテクノロジーズ製)、カラムオーブン:L-655A-52(株式会社日立ハイテクノロジーズ製)、ガードカラム:TSK Guardcolumn HHR-L(東ソー製株式会社製、カラムサイズ6.0×40mm)、カラム:TSK gel-G4000HHR+gel-G2000HHR(東ソー製株式会社製、カラムサイズ7.8×300mm)
GPCの測定条件としては、溶離液:テトラヒドロフラン、試料濃度:30mg/5mL、注入量:20μL、流量:1.00mL/分、測定温度:40℃が挙げられる。
本実施形態における成形用樹脂組成物は、必要に応じて硬化促進剤を含んでもよい。硬化促進剤の種類は特に制限されず、硬化性樹脂の種類、成形用樹脂組成物の所望の特性等に応じて選択できる。
硬化促進剤は1種を単独で用いても2種以上を組み合わせて用いてもよい。
これらの中でも、特に好適な硬化促進剤としては、トリフェニルホスフィン、トリフェニルホスフィンとキノン化合物との付加物、トリブチルホスフィンとキノン化合物との付加物、トリ-p-トリルホスフィンとキノン化合物との付加物等が挙げられる。
ここで、樹脂成分とは、硬化性樹脂及び必要に応じて用いられる硬化剤を意味する。また、樹脂成分100質量部とは、硬化性樹脂と、必要に応じて用いられる硬化剤と、の合計量が100質量部であることを意味する。
成形用樹脂組成物が硬化性樹脂としてポリイミド樹脂を含む場合、成形用樹脂組成物は、必要に応じて硬化開始剤を含んでもよい。
硬化開始剤としては、熱により遊離ラジカルを発生させるラジカル重合開始剤等が挙げられる。硬化開始剤としては、具体的には、無機過酸化物、有機過酸化物、アゾ化合物等が挙げられる。
無機過酸化物としては、過硫酸カリウム(ペルオキソ硫酸二カリウム)、過硫酸ナトリウム、過硫酸アンモニウム等が挙げられる。
有機過酸化物としては、メチルエチルケトンパーオキサイド、シクロヘキサノンパーオキサイド等のケトンパーオキサイド、1,1-ジ(t-ブチルパーオキシ)シクロヘキサン、2,2-ジ(4,4-ジ(t-ブチルパーオキシ)シクロヘキシル)プロパン等のパーオキシケタール、p-メンタンハイドロパーオキサイド、ジイソプロピルベンゼンハイドロパーオキサイド、1,1,3,3-テトラメチルブチルハイドロパーオキサイド、クメンハイドロパーオキサイド、t-ブチルハイドロパーオキサイド等のハイドロパーオキサイド、α、α’-ジ(t-ブチルペルオキシ)ジイソプロピルベンゼン、ジクミルパーオキサイド、2,5-ジメチル-2,5-ジ(t-ブチルパーオキシ)ヘキサン、t-ブチルクミルパーオキサイド、ジ-t-へキシルパーオキサイド、2,5-ジメチル-2,5-ジ(t-ブチルパーオキシ)ヘキシン-3、ジ-t-ブチルパーオキサイド等のジアルキルパーオキサイド、ジベンゾイルパーオキサイド、ジ(4-メチルベンゾイル)パーオキサイド等のジアシルパーオキサイド、ジ-n-プロピルパーオキシジカーボネート、ジイソプロピルパーオキシジカーボネート等のパーオキシジカーボネート、2,5-ジメチル-2,5-ジ(ベンゾイルパーオキシ)ヘキサン、t-へキシルパーオキシベンゾエート、t-ブチルパーオキシベンゾエート、t-ブチルパーオキシ2-エチルヘキサノネート等のパーオキシエステルなどが挙げられる。
アゾ化合物としては、アゾビスイソブチロニトリル、アゾビス-4-メトキシ-2,4-ジメチルバレロニトリル、アゾビスシクロヘキサノン-1-カルボニトリル、アゾジベンゾイル等が挙げられる。
本実施形態における成形用樹脂組成物は、チタン酸カルシウム粒子を含有する無機充填材を含む。
無機充填材は、少なくともチタン酸カルシウム粒子を含有し、必要に応じてチタン酸カルシウム粒子以外のその他の充填材を含有してもよい。
チタン酸カルシウム粒子の形状としては、特に限定されず、球形、楕円形、不定形等が挙げられる。また、チタン酸カルシウム粒子は、破砕されたものであってもよい。
チタン酸カルシウム粒子は、表面処理されたものであってもよい。
無機充填材が球形のチタン酸カルシウム粒子を含むことで、高い流動性を得つつ、成形後の硬化物における高い誘電率と低い誘電正接とを両立することができる。具体的には、無機充填材が球形のチタン酸カルシウム粒子を含むと、成形用樹脂組成物における無機充填材の割合を多くしても高い流動性が得られるようになる。無機充填材の割合を多くすることで、誘電正接が無機充填材よりも相対的に高い硬化性樹脂の割合が低くなり、成形後の硬化物全体の誘電正接をさらに低く抑えることが可能になる。そのため、高い流動性を得つつ、高い誘電率と、さらに低い誘電正接と、の両立が実現可能となると考えられる。
球形化処理を行う前のチタン酸カルシウム粒子の形状は、通常、図2に示すように不定形である。そして、不定形のチタン酸カルシウム粒子を球形化処理することで、図1に示すように、球形のチタン酸カルシウム粒子が得られる。
上記球形化処理は、1000℃以上1400℃以下の温度で、1時間以上2時間以下の間、加熱溶融することで行われる。なお、上記球形化処理は、後述する焼成と比べて、ドーパント化合物を添加しないで加熱を行う点及び加熱時間が短い点で異なる処理である。そのため、未焼成で不定形のチタン酸カルシウム粒子の球形化処理を行うと、未焼成で球形のチタン酸カルシウム粒子が得られる。
チタン酸カルシウム粒子の体積平均粒径は、以下のようにして測定することができる。成形用樹脂組成物をるつぼに入れ、800℃で4時間放置し、灰化させる。得られた灰分をSEMで観察し、形状ごと分離し観察画像から粒度分布を求め、その粒度分布から体積平均粒径(D50)としてチタン酸カルシウム粒子の体積平均粒径を求めることができる。また、チタン酸カルシウム粒子の体積平均粒径は、レーザー回折/散乱式粒子径分布測定装置(例えば株式会社堀場製作所、LA920)による測定により求めてもよい。
なお、チタン酸カルシウム粒子は、体積平均粒径の異なる2種以上のチタン酸カルシウム粒子の混合物であってもよい。
成形用樹脂組成物の硬化物の薄片試料を走査型電子顕微鏡(SEM)にて撮像する。SEM画像において任意の面積Sを特定し、面積Sに含まれる無機充填材の総面積Aを求める。次に、SEM-EDX(エネルギー分散型X線分光器)を用い、無機充填材の元素を特定することで、無機充填材の総面積Aの中に含まれるチタン酸カルシウム粒子の総面積Bを求める。チタン酸カルシウム粒子の総面積Bを無機充填材の総面積Aで除算した値を百分率(%)に換算し、この値を無機充填材全体に対するチタン酸カルシウム粒子の含有率(体積%)とする。
面積Sは、無機充填材の大きさに対して十分大きい面積とする。例えば、無機充填材が100個以上含まれる大きさとする。面積Sは、複数個の切断面の合計でもよい。
その他の充填材の種類は、特に制限されない。その他の充填材の材質としては、具体的には、溶融シリカ、結晶シリカ、ガラス、アルミナ、炭酸カルシウム、ケイ酸ジルコニウム、ケイ酸カルシウム、窒化珪素、窒化アルミニウム、窒化ホウ素、ベリリア、ジルコニア、ジルコン、フォステライト、ステアタイト、スピネル、ムライト、チタニア、タルク、クレー、マイカ等の無機材料が挙げられる。
その他の充填材として、難燃効果を有する無機充填材を用いてもよい。難燃効果を有する無機充填材としては、水酸化アルミニウム、水酸化マグネシウム、マグネシウムと亜鉛の複合水酸化物等の複合金属水酸化物、硼酸亜鉛などが挙げられる。
その他の充填材は、1種を単独で用いてもよく、2種以上を組み合わせて用いてもよい。
その他の充填材がシリカ粒子及びアルミナ粒子からなる群より選択される少なくとも一種を含有する場合、シリカ粒子及びアルミナ粒子の合計含有率は、無機充填材全体に対し、20体積%~70体積%であることが好ましく、23体積%~65体積%であることがより好ましく、25体積%~60体積%であることがさらに好ましく、流動性及び比誘電率のバランスの観点から、30体積%~60体積%であることが特に好ましく、35体積%~50体積%であることが極めて好ましい。
その他の充填材がアルミナ粒子を含有する場合、アルミナ粒子の含有率は、無機充填材全体に対し、20体積%~70体積%であることが好ましく、23体積%~65体積%であることがより好ましく、25体積%~60体積%であることがさらに好ましく、流動性及び比誘電率のバランスの観点から、30体積%~60体積%であることが特に好ましく、35体積%~50体積%であることが極めて好ましい。
ただし、硬化物の誘電正接を低く抑える観点から、チタン酸バリウム粒子の含有率は、無機充填材全体に対し、1体積%未満であることが好ましく、0.5体積%未満であることがより好ましく、0.1体積%未満であることがさらに好ましい。つまり、無機充填材は、チタン酸バリウム粒子を含まないか、又はチタン酸バリウム粒子を上記含有率で含むことが好ましい。
また、チタン酸カルシウム粒子以外のチタン酸化合物粒子の合計含有率は、無機充填材全体に対し、1体積%未満であってもよく、0.5体積%未満であってもよく、0.1体積%未満であってもよい。つまり、無機充填材は、チタン酸カルシウム粒子以外のチタン酸化合物粒子を含まなくてもよく、チタン酸カルシウム粒子以外のチタン酸化合物粒子を上記含有率で含んでもよい。
その他の無機充填材の平均粒径は、成形用樹脂組成物をるつぼに入れて800℃で4時間放置し灰化させる。得られた灰分をSEMで観察し、形状ごと分離し観察画像から粒度分布を求め、その粒度分布から体積平均粒径(D50)としてその他の充填材の体積平均粒径を求めることができる。また、その他の充填材の体積平均粒径は、レーザー回折/散乱式粒子径分布測定装置(例えば株式会社堀場製作所、LA920)による測定により求めてもよい。
なお、その他の充填材は、体積平均粒径の異なる2種以上の充填材の混合物であってもよい。
その他の充填材の形状は、成形用樹脂組成物の流動性向上の観点から、球形であることが好ましい。
成形用樹脂組成物に含まれる無機充填材全体の含有率は、成形用樹脂組成物の硬化物の流動性および強度を制御する観点から、成形用樹脂組成物全体の40体積%~90体積%であることが好ましく、40体積%~85体積%であることがより好ましく、45体積%~85体積%であることがさらに好ましく、50体積%~82体積%であることが特に好ましく、55体積%~80体積%であることが極めて好ましい。
その観点から、無機充填材が球形のチタン酸カルシウム粒子を含む場合、成形用樹脂組成物に含まれる無機充填材全体の含有率は、成形用樹脂組成物全体の70体積%以上であることが好ましく、73体積%超えであることがより好ましく、75体積%以上であることがさらに好ましく、77体積%以上であることが特に好ましい。
成形用樹脂組成物の硬化物の薄片試料を走査型電子顕微鏡(SEM)にて撮像する。SEM画像において任意の面積Sを特定し、面積Sに含まれる無機充填材の総面積Aを求める。無機充填材の総面積Aを面積Sで除算した値を百分率(%)に換算し、この値を成形用樹脂組成物に占める無機充填材の含有率(体積%)とする。
面積Sは、無機充填材の大きさに対して十分大きい面積とする。例えば、無機充填材が100個以上含まれる大きさとする。面積Sは、複数個の切断面の合計でもよい。
無機充填材は、成形用樹脂組成物の硬化時の重力方向において存在割合に偏りが生じることがある。その場合、SEMにて撮像する際、硬化物の重力方向全体を撮像し、硬化物の重力方向全体が含まれる面積Sを特定する。
また、無機充填材においては、無機充填材全体における誘電率が80以下であり、かつ、チタン酸カルシウム粒子の含有量が無機充填材全体に対し30体積%以上であることが好ましい。
チタン酸カルシウム粒子の含有率を無機充填材全体に対して30体積%以上とし、かつ、無機充填材全体における誘電率を80以下とする方法としては、例えば、チタン酸カルシウム粒子として未焼成のチタン酸カルシウム粒子を用いる方法が挙げられる。ここで、未焼成のチタン酸カルシウム粒子とは、下記焼成工程を経ていないチタン酸カルシウム粒子をいう。
チタン酸カルシウム粒子は、上記焼成工程を経ることで、誘電率が大きく上昇する。例えば、未焼成のチタン酸カルシウム粒子を1000℃の温度で3時間焼成した後における誘電率は、焼成前のチタン酸カルシウムにおける誘電率の数倍以上の値となる。
そのため、チタン酸カルシウム粒子として焼成されたチタン酸カルシウム粒子を用いつつ無機充填材全体における誘電率を80以下に調整する場合、無機充填材全体に対するチタン酸カルシウム粒子の含有率を低くする。そして、焼成されたチタン酸カルシウム粒子を低い含有率で含有し全体における誘電率が80以下である無機充填材を用いた成形用樹脂組成物においては、高い誘電率を有する硬化物が得られるものの、硬化物における誘電率のムラが生じやすくなる。これに対して、未焼成のチタン酸カルシウム粒子を30体積%以上の含有率で含有し全体における誘電率が80以下である無機充填材を用いた成形用樹脂組成物においては、高い誘電率を有し、かつ、誘電率の均一性が高い硬化物が得られる。
具体的には、測定対象の無機充填材と特定の硬化性樹脂とを含み、無機充填材の含有率が異なる測定用樹脂組成物3種以上と、前記特定の硬化性樹脂を含み無機充填材を含まない測定用樹脂組成物と、を準備する。測定対象の無機充填材と特定の硬化性樹脂とを含む測定用樹脂組成物としては、例えば、ビフェニルアラルキル型エポキシ樹脂と、フェノールアラルキル型フェノール樹脂であるフェノール硬化剤と、有機ホスフィンを含有する硬化促進剤と、測定対象の無機充填材と、を含む測定用樹脂組成物が挙げられる。また、無機充填材の含有量が異なる3種以上の測定用樹脂組成物としては、例えば、測定用樹脂組成物全体に対する無機充填材の含有率が10体積%、20体積%、及び30体積%の測定用樹脂組成物が挙げられる。
準備した各測定用樹脂組成物を、圧縮成形により、金型温度175℃、成形圧力6.9MPa、硬化時間600秒の条件で成形し、それぞれ測定用硬化物を得る。得られた各測定用硬化物における10GHzでの比誘電率を測定し、無機充填材の含有率を横軸、比誘電率の測定値を縦軸としてプロットしたグラフを作成する。得られたグラフから、最小二乗法により直線近似を行い、無機充填材の含有率が100体積%のときの比誘電率を外挿により求め、「無機充填材全体における誘電率」とする。
本実施形態における成形用樹脂組成物は、上述の成分に加えて、以下に例示するカップリング剤、イオン交換体、離型剤、難燃剤、着色剤、応力緩和剤等の各種添加剤を含んでもよい。本実施形態における成形用樹脂組成物は、以下に例示する添加剤以外にも必要に応じて当技術分野で周知の各種添加剤を含んでもよい。
本実施形態における成形用樹脂組成物は、カップリング剤を含んでもよい。樹脂成分と無機充填材との接着性を高める観点からは、成形用樹脂組成物はカップリング剤を含むことが好ましい。カップリング剤としては、エポキシシラン、メルカプトシラン、アミノシラン、アルキルシラン、ウレイドシラン、ビニルシラン、ジシラザン等のシラン系化合物、チタン系化合物、アルミニウムキレート系化合物、アルミニウム/ジルコニウム系化合物などの公知のカップリング剤が挙げられる。
本実施形態における成形用樹脂組成物は、イオン交換体を含んでもよい。成形用樹脂組成物は、封止される電子部品を備える電子部品装置の耐湿性及び高温放置特性を向上させる観点から、イオン交換体を含むことが好ましい。イオン交換体は特に制限されず、従来公知のものを用いることができる。具体的には、ハイドロタルサイト化合物、並びにマグネシウム、アルミニウム、チタン、ジルコニウム、及びビスマスからなる群より選ばれる少なくとも1種の元素の含水酸化物等が挙げられる。イオン交換体は、1種を単独で用いても2種以上を組み合わせて用いてもよい。中でも、下記一般式(A)で表されるハイドロタルサイトが好ましい。
(0<X≦0.5、mは正の数)
本実施形態における成形用樹脂組成物は、成形時における金型との良好な離型性を得る観点から、離型剤を含んでもよい。離型剤は特に制限されず、従来公知のものを用いることができる。具体的には、カルナバワックス、モンタン酸、ステアリン酸等の高級脂肪酸、高級脂肪酸金属塩、モンタン酸エステル等のエステル系ワックス、酸化ポリエチレン、非酸化ポリエチレン等のポリオレフィン系ワックスなどが挙げられる。離型剤は、1種を単独で用いても2種以上を組み合わせて用いてもよい。
本実施形態における成形用樹脂組成物は、難燃剤を含んでもよい。難燃剤は特に制限されず、従来公知のものを用いることができる。具体的には、ハロゲン原子、アンチモン原子、窒素原子又はリン原子を含む有機又は無機の化合物、金属水酸化物等が挙げられる。難燃剤は、1種を単独で用いても2種以上を組み合わせて用いてもよい。
本実施形態における成形用樹脂組成物は、着色剤を含んでもよい。着色剤としては、カーボンブラック、有機染料、有機顔料、酸化チタン、鉛丹、ベンガラ等の公知の着色剤を挙げることができる。着色剤の含有量は、目的等に応じて適宜選択できる。着色剤は、1種を単独で用いても2種以上を組み合わせて用いてもよい。
本実施形態における成形用樹脂組成物は、応力緩和剤を含んでもよい。応力緩和剤を含むことにより、パッケージの反り変形及びパッケージクラックの発生をより低減させることができる。応力緩和剤としては、一般に使用されている公知の応力緩和剤(可とう剤)が挙げられる。具体的には、シリコーン系、スチレン系、オレフィン系、ウレタン系、ポリエステル系、ポリエーテル系、ポリアミド系、ポリブタジエン系等の熱可塑性エラストマー、NR(天然ゴム)、NBR(アクリロニトリル-ブタジエンゴム)、アクリルゴム、ウレタンゴム、シリコーンパウダー等のゴム粒子、メタクリル酸メチル-スチレン-ブタジエン共重合体(MBS)、メタクリル酸メチル-シリコーン共重合体、メタクリル酸メチル-アクリル酸ブチル共重合体等のコア-シェル構造を有するゴム粒子などが挙げられる。応力緩和剤は、1種を単独で用いても2種以上を組み合わせて用いてもよい。
応力緩和剤の中でも、シリコーン系応力緩和剤が好ましい。シリコーン系応力緩和剤としては、エポキシ基を有するもの、アミノ基を有するもの、これらをポリエーテル変性したもの等が挙げられ、エポキシ基を有するシリコーン化合物、ポリエーテル系シリコーン化合物等のシリコーン化合物がより好ましい。
成形用樹脂組成物の調製方法は、特に制限されない。一般的な手法としては、所定の配合量の成分をミキサー等によって十分混合した後、ミキシングロール、押出機等によって溶融混練し、冷却し、粉砕する方法を挙げることができる。より具体的には、例えば、上述した成分の所定量を攪拌及び混合し、予め70℃~140℃に加熱してあるニーダー、ロール、エクストルーダー等で混練し、冷却し、粉砕する方法を挙げることができる。
本実施形態における成形用樹脂組成物を、圧縮成形により、金型温度175℃、成形圧力6.9MPa、硬化時間600秒の条件で成形することで得られる硬化物の10GHzでの比誘電率としては、例えば9~40が挙げられる。前記硬化物の10GHzでの比誘電率は、アンテナ等の電子部品の小型化の観点から10~35であることが好ましく、13~30であることがより好ましい。
上記比誘電率の測定は、誘電率測定装置(例えば、アジレント・テクノロジー社、品名「ネットワークアナライザN5227A」)を用いて、温度25±3℃下で行う。
上記誘電正接の測定は、誘電率測定装置(例えば、アジレント・テクノロジー社、品名「ネットワークアナライザN5227A」)を用いて、温度25±3℃下で行う。
175℃におけるゲルタイムの測定は、以下のようにして行う。具体的には、成形用樹脂組成物の試料3gに対し、JSRトレーディング株式会社のキュラストメータを用いた測定を温度175℃で実施し、トルク曲線の立ち上がりまでの時間をゲルタイム(sec)とする。
本実施形態における成形用樹脂組成物は、例えば、後述する電子部品装置、その中でも特に高周波デバイスの製造に適用することができる。本実施形態における成形用樹脂組成物は、高周波デバイスにおける電子部品の封止に用いてもよい。
特に、近年、第5世代移動通信システム(5G)の普及に伴い、電子部品装置に使用される半導体パッケージ(PKG)の高機能化及び小型化が進んでいる。そして、PKGの小型化及び高機能化に伴い、アンテナ機能を有するPKGであるアンテナ・イン・パッケージ(AiP、Antenna in Package)の開発も進められている。AiPでは、情報の多様化に伴うチャンネル数増加等に対応するため、通信に使用される電波が高周波化されるようになっており、封止材料において、高い誘電率と低い誘電正接との両立が求められている。
本実施形態における成形用樹脂組成物は、前記の通り、高い誘電率と低い誘電正接と両立した硬化物が得られる。そのため、高周波デバイスにおいて、支持部材上に配置されたアンテナを成形用樹脂組成物で封止したアンテナ・イン・パッケージ(AiP)用途に特に好適である。
本開示の一実施形態である電子部品装置は、支持部材と、前記支持部材上に配置された電子部品と、前記電子部品を封止している前述の成形用樹脂組成物の硬化物と、を備える。
電子部品装置としては、リードフレーム、配線済みのテープキャリア、配線板、ガラス、シリコンウエハ、有機基板等の支持部材に、電子部品(半導体チップ、トランジスタ、ダイオード、サイリスタ等の能動素子、コンデンサ、抵抗体、コイル等の受動素子、アンテナなど)を搭載して得られた電子部品領域を成形用樹脂組成物で封止したもの(例えば高周波デバイス)が挙げられる。
上記電子部品は、アンテナを含んでもよく、アンテナ及びアンテナ以外の素子を含んでもよい。上記アンテナは、アンテナの役割を果たすものであれば限定されるものではなく、アンテナ素子であってもよく、配線であってもよい。
本実施形態に係る電子部品装置の製造方法は、電子部品を支持部材上に配置する工程と、前記電子部品を前述の成形用樹脂組成物で封止する工程と、を含む。
上記各工程を実施する方法は特に制限されず、一般的な手法により行うことができる。また、電子部品装置の製造に使用する支持部材及び電子部品の種類は特に制限されず、電子部品装置の製造に一般的に用いられる支持部材及び電子部品を使用できる。
下記に示す成分を表1~表3に示す配合割合(質量部)で混合し、実施例と比較例の成形用樹脂組成物を調製した。この成形用樹脂組成物は、常温常圧下において固体であった。
なお、表1~表3中、空欄はその成分を含まないことを意味する。
また、用いた無機充填材全体に対するチタン酸カルシウム粒子の含有率(表中の「粒子割合(体積%)」、成形用樹脂組成物全体に対する無機充填材の含有率(表中の「含有率(体積%)」、無機充填材全体における10GHzでの比誘電率(表中の「充填材誘電率」)を前述の方法により求めた結果も併せて表1~表3に示す。
・エポキシ樹脂2:ビフェニルアラルキル型エポキシ樹脂、エポキシ当量274g/eq(日本化薬株式会社、品名「NC-3000」)
・エポキシ樹脂3:ビフェニル型エポキシ樹脂、エポキシ当量192g/eq
(三菱ケミカル株式会社、品名「YX―4000」)
・硬化剤2:フェノール硬化剤、アラルキル型フェノール樹脂、水酸基当量170g/eq(明和化成株式会社、品名「MEH7800シリーズ」)
・無機充填材2:アルミナ粒子、その他の充填材、体積平均粒径:45μm、形状:球形
・無機充填材3:アルミナ粒子、その他の充填材、体積平均粒径:7μm、形状:球形
・無機充填材4:未焼成のチタン酸カルシウム粒子、体積平均粒径:6μm、形状:不定形
・無機充填材5:未焼成のチタン酸カルシウム粒子、体積平均粒径:0.2μm、形状:不定形
・無機充填材6:未焼成のチタン酸バリウム粒子、体積平均粒径:6.6μm、形状:球形
・無機充填材7:未焼成のチタン酸カルシウム粒子 体積平均粒径:9μm、形状:球形
・カップリング剤:N-フェニル-3-アミノプロピルトリメトキシシラン(信越化学工業社、品名「KBM-573」)
・離型剤:モンタン酸エステルワックス(クラリアントジャパン株式会社、品名「HW-E」)
・着色剤:カーボンブラック(三菱ケミカル株式会社、品名「MA600」)
・シリコーン1:ポリエーテル系シリコーン化合物(モメンティブ・パフォーマンス・マテリアルズ社、品名「SIM768E」)
・シリコーン2:エポキシ基を有するシリコーン化合物(ダウ・東レ株式会社、品名「AY42-119」)
具体的には、まず、分散媒(水)に、無機充填材を0.01質量%~0.1質量%の範囲で添加し、バス式の超音波洗浄機で5分間分散した。
得られた分散液5mlをセルに注入し、25℃で、レーザー回折/散乱式粒子径分布測定装置(株式会社堀場製作所、LA920)にて粒度分布を測定した。
得られた粒度分布における積算値50%(体積基準)での粒径を体積平均粒径とした。
(比誘電率及び誘電正接)
成形用樹脂組成物を真空ハンドプレス機に仕込み、金型温度175℃、成形圧力6.9MPa、硬化時間600秒の条件で成形し、後硬化を175℃で6時間行い、板状の硬化物(縦12.5mm、横25mm、厚さ0.2mm)を得た。この板状の硬化物を試験片として、誘電率測定装置(アジレント・テクノロジー社、品名「ネットワークアナライザN5227A」)を用いて、温度25±3℃下、10GHzでの比誘電率と誘電正接を測定した。結果を表1~表3(表中の「比誘電率」及び「誘電正接」)に示す。
EMMI-1-66に準じたスパイラルフロー測定用金型を用いて、成形用樹脂組成物を金型温度180℃、成形圧力6.9MPa、硬化時間120秒の条件で成形し、流動距離(cm)を求めた。結果を表1~表3(表中の「流動距離(cm)」)に示す。
成形用樹脂組成物3gに対し、JSRトレーディング株式会社のキュラストメータを用いた測定を温度175℃で実施し、トルク曲線の立ち上がりまでの時間をゲルタイム(秒)とした。結果を表1~表3(表中の「ゲルタイム(秒)」)に示す。
なお、表中において「不可」とは、トルク曲線の立ち上がりが観測できないほどゲルタイムが短いことを意味する。
表4に示す配合割合(質量部)で混合し、実施例15及び16の成形用樹脂組成物を調製した。この成形用樹脂組成物は、常温常圧下において固体であった。実施例15では、硬化剤1及び硬化剤3を併用しており、実施例15及び16では、シリコーンは使用していない。
なお、表4中、空欄はその成分を含まないことを意味する。また、表4中の各項目は、表1~表3の各項目と同様である。
なお、実施例15で使用した硬化剤3は、以下の通りである。
・硬化剤3:フェノール硬化剤、アラルキル型フェノール樹脂、水酸基当量202g/eq(明和化成株式会社、品名「MEH7851SS」))
(曲げ強度)
各実施例及び各比較例で得られた成形用樹脂組成物を用い、(比誘電率及び誘電正接)
と同様の条件により成形用樹脂組成物の硬化物を得た。硬化物を4.0mm×10.0mm×80mmの直方体に切り出し、曲げ強度評価用の試験片を作製した。この試験片を用いて、テンシロン万能材料試験機(インストロン5948、インストロン社)で支点間距離64mm・クロスヘッド速度10mm/min、温度25℃の条件で曲げ試験を行った。測定した結果を用いて、式(A)から曲げ応力-変位カーブを作成し、その最大応力を曲げ強度とした。
σ=3FL/2bh2 ・・・ 式(A)
σ:曲げ応力(MPa)
F:曲げ荷重(N)
L:支点間距離(mm)
b:試験片幅(mm)
h:試験片厚さ(mm)
硬化物の破壊靭性値(MPa・m1/2)を測定することで曲げ靭性を評価した。硬化物を4.0mm×10.0mm×80mmの直方体に切り出した曲げ靭性評価用の試験片を作製した。曲げ靭性評価用の試験片のき裂欠陥の大きさは、4.0mm×2.0mm×1.0mmとした。破壊靭性値は、ASTM D5045に基づいて、テンシロン万能材料試験機(インストロン5948、インストロン社)及び曲げ靭性評価用の試験片を用いて3点曲げ測定により算出した。
表5では、硬化剤として活性エステル化合物のみを使用した場合に、硬化剤としてフェノール硬化剤のみを使用した場合と比較して曲げ靭性の評価が悪化する傾向がみられた。一方、実施例15の成形用樹脂組成物では、硬化剤として活性エステル化合物及びフェノール硬化剤を併用することで、フェノール硬化剤のみを使用した場合よりも硬化後の曲げ靭性の評価がより良好となった。これにより、実施例15では、硬化剤として活性エステル化合物及びフェノール硬化剤を併用することで硬化後の曲げ靭性が相乗的に向上したことが確認された。曲げ靭性が向上することで硬化物のクラックの発生等が抑制される傾向にある。
表6に示す配合割合(質量部)で混合し、実施例17~19の成形用樹脂組成物を調製した。この成形用樹脂組成物は、常温常圧下において固体であった
なお、表6中、空欄はその成分を含まないことを意味する。また、表6中の各項目は、表1~表4の各項目と同様である。
なお、実施例17~19で使用した無機充填材7は、以下の通りである。
・無機充填材7:未焼成のチタン酸カルシウム粒子、体積平均粒径:8.9μm、形状:球形、不定形のチタン酸カルシウム粒子に対し1200℃で2時間球形化処理を行ったもの
本明細書に記載された全ての文献、特許出願、および技術規格は、個々の文献、特許出願、および技術規格が参照により取り込まれることが具体的かつ個々に記された場合と同程度に、本明細書中に援用されて取り込まれる。
Claims (20)
- 硬化性樹脂と、
チタン酸カルシウム粒子を含有する無機充填材と、
を含む成形用樹脂組成物。 - 前記硬化性樹脂がエポキシ樹脂を含有し、かつ、前記成形用樹脂組成物が硬化剤をさらに含む、請求項1に記載の成形用樹脂組成物。
- 前記硬化剤は、活性エステル化合物を含む、請求項2に記載の成形用樹脂組成物。
- 前記硬化剤は、フェノール硬化剤、アミン硬化剤、酸無水物硬化剤、ポリメルカプタン硬化剤、ポリアミノアミド硬化剤、イソシアネート硬化剤、及びブロックイソシアネート硬化剤からなる群より選択される少なくとも一種のその他の硬化剤と、活性エステル化合物と、を含む、請求項2又は請求項3に記載の成形用樹脂組成物。
- 前記硬化剤は、アラルキル型フェノール樹脂及び活性エステル化合物を含む、請求項2又は請求項3に記載の成形用樹脂組成物。
- 前記無機充填材は、シリカ粒子及びアルミナ粒子からなる群より選択される少なくとも一種であるその他の無機充填材をさらに含有する、請求項1~請求項5のいずれか1項に記載の成形用樹脂組成物。
- 前記その他の無機充填材の体積平均粒径は、3μm以上である、請求項6に記載の成形用樹脂組成物。
- 前記チタン酸カルシウム粒子の含有率は、前記無機充填材全体に対し30体積%~80体積%である、請求項1~請求項7のいずれか1項に記載の成形用樹脂組成物。
- 前記無機充填材全体における10GHzでの比誘電率が80以下である、請求項1~請求項8のいずれか1項に記載の成形用樹脂組成物。
- 前記無機充填材全体の含有率は、成形用樹脂組成物全体に対し40体積%~85体積%である、請求項1~請求項9のいずれか1項に記載の成形用樹脂組成物。
- 前記チタン酸カルシウム粒子の体積平均粒径は、0.2μm~80μmである、請求項1~請求項10のいずれか1項に記載の成形用樹脂組成物。
- 有機ホスフィンを含有する硬化促進剤をさらに含む、請求項1~請求項11のいずれか1項に記載の成形用樹脂組成物。
- 前記無機充填材は、球形のチタン酸カルシウム粒子を含む、請求項1~請求項12のいずれか1項に記載の成形用樹脂組成物。
- 前記無機充填材全体の含有率は、成形用樹脂組成物全体に対し70体積%~85体積%である、請求項13に記載の成形用樹脂組成物。
- 成形用樹脂組成物の硬化物における比誘電率が9~40であり、かつ、前記硬化物における誘電正接が0.020以下である、請求項1~請求項14のいずれか1項に記載の成形用樹脂組成物。
- 高周波デバイスに用いられる、請求項1~請求項15のいずれか1項に記載の成形用樹脂組成物。
- 高周波デバイスにおける電子部品の封止に用いられる、請求項16に記載の成形用樹脂組成物。
- アンテナ・イン・パッケージに用いられる、請求項1~請求項17のいずれか1項に記載の成形用樹脂組成物。
- 支持部材と、
前記支持部材上に配置された電子部品と、
前記電子部品を封止している請求項1~請求項18のいずれか1項に記載の成形用樹脂組成物の硬化物と、
を備える電子部品装置。 - 前記電子部品がアンテナを含む請求項19に記載の電子部品装置。
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