WO2022149602A1 - 熱硬化性樹脂組成物及び電子部品装置 - Google Patents
熱硬化性樹脂組成物及び電子部品装置 Download PDFInfo
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- WO2022149602A1 WO2022149602A1 PCT/JP2022/000276 JP2022000276W WO2022149602A1 WO 2022149602 A1 WO2022149602 A1 WO 2022149602A1 JP 2022000276 W JP2022000276 W JP 2022000276W WO 2022149602 A1 WO2022149602 A1 WO 2022149602A1
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- WIPO (PCT)
- Prior art keywords
- thermosetting resin
- resin composition
- mass
- epoxy resin
- phenol
- Prior art date
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- 239000011342 resin composition Substances 0.000 title claims abstract description 129
- 229920005989 resin Polymers 0.000 claims abstract description 72
- 239000011347 resin Substances 0.000 claims abstract description 72
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 67
- 239000011256 inorganic filler Substances 0.000 claims abstract description 49
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 49
- 239000002245 particle Substances 0.000 claims abstract description 42
- 238000009826 distribution Methods 0.000 claims abstract description 16
- 238000002050 diffraction method Methods 0.000 claims abstract description 5
- 230000001186 cumulative effect Effects 0.000 claims abstract description 3
- 239000003822 epoxy resin Substances 0.000 claims description 127
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- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 61
- 239000002904 solvent Substances 0.000 claims description 40
- 239000007787 solid Substances 0.000 claims description 14
- 239000000463 material Substances 0.000 abstract description 8
- 238000005259 measurement Methods 0.000 abstract description 6
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- 238000001723 curing Methods 0.000 description 68
- -1 palliatives Substances 0.000 description 49
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- 238000004898 kneading Methods 0.000 description 32
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- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 28
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 24
- 238000000034 method Methods 0.000 description 24
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- 125000004432 carbon atom Chemical group C* 0.000 description 21
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- 125000000962 organic group Chemical group 0.000 description 19
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- 238000000465 moulding Methods 0.000 description 14
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- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 12
- 239000000126 substance Substances 0.000 description 12
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- 229910000073 phosphorus hydride Inorganic materials 0.000 description 10
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 10
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- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 4
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- 108090000765 processed proteins & peptides Proteins 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 235000021286 stilbenes Nutrition 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000003826 tablet Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- MCZDHTKJGDCTAE-UHFFFAOYSA-M tetrabutylazanium;acetate Chemical compound CC([O-])=O.CCCC[N+](CCCC)(CCCC)CCCC MCZDHTKJGDCTAE-UHFFFAOYSA-M 0.000 description 1
- GTCDARUMAMVCRO-UHFFFAOYSA-M tetraethylazanium;acetate Chemical compound CC([O-])=O.CC[N+](CC)(CC)CC GTCDARUMAMVCRO-UHFFFAOYSA-M 0.000 description 1
- PSEQWFPWQRZBOO-UHFFFAOYSA-M tetrahexylazanium;benzoate Chemical compound [O-]C(=O)C1=CC=CC=C1.CCCCCC[N+](CCCCCC)(CCCCCC)CCCCCC PSEQWFPWQRZBOO-UHFFFAOYSA-M 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- DGQOCLATAPFASR-UHFFFAOYSA-N tetrahydroxy-1,4-benzoquinone Chemical compound OC1=C(O)C(=O)C(O)=C(O)C1=O DGQOCLATAPFASR-UHFFFAOYSA-N 0.000 description 1
- LPSKDVINWQNWFE-UHFFFAOYSA-M tetrapropylazanium;hydroxide Chemical compound [OH-].CCC[N+](CCC)(CCC)CCC LPSKDVINWQNWFE-UHFFFAOYSA-M 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000003325 tomography Methods 0.000 description 1
- IFXORIIYQORRMJ-UHFFFAOYSA-N tribenzylphosphane Chemical compound C=1C=CC=CC=1CP(CC=1C=CC=CC=1)CC1=CC=CC=C1 IFXORIIYQORRMJ-UHFFFAOYSA-N 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- ZYMHKOVQDOFPHH-UHFFFAOYSA-N trimethoxy(oct-1-enyl)silane Chemical compound CCCCCCC=C[Si](OC)(OC)OC ZYMHKOVQDOFPHH-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- QYJYJTDXBIYRHH-UHFFFAOYSA-N trimethoxy-[8-(oxiran-2-ylmethoxy)octyl]silane Chemical compound C(C1CO1)OCCCCCCCC[Si](OC)(OC)OC QYJYJTDXBIYRHH-UHFFFAOYSA-N 0.000 description 1
- DMEUUKUNSVFYAA-UHFFFAOYSA-N trinaphthalen-1-ylphosphane Chemical compound C1=CC=C2C(P(C=3C4=CC=CC=C4C=CC=3)C=3C4=CC=CC=C4C=CC=3)=CC=CC2=C1 DMEUUKUNSVFYAA-UHFFFAOYSA-N 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
Definitions
- thermosetting resin compositions and electronic component devices relate to thermosetting resin compositions and electronic component devices.
- thermosetting resin composition containing a thermosetting resin, a curing agent and an inorganic filler is widely used from the viewpoint of productivity, cost and the like.
- the bump-chip distance in the CSP or the distance between the elements in the SiP is becoming narrower. Therefore, the use of an inorganic filler having a smaller particle size is required.
- the fluidity and filler of the encapsulating material may be deteriorated.
- a method in which the particle size distribution of the filler is devised has been proposed (see, for example, Patent Document 1).
- thermosetting resin composition having excellent filling property and suppressing the occurrence of appearance defects, and the thermosetting resin composition.
- An object of the present invention is to provide an electronic component device using an object.
- thermosetting resin a thermosetting resin
- curing agent a curing agent
- inorganic filler The particle size of the inorganic filler when the cumulative amount from the small diameter side in the volume-based particle size distribution measured by the laser scattering diffraction method particle size distribution measuring device is 90% is 25 ⁇ m or less.
- thermosetting resin composition according to ⁇ 1> or ⁇ 2>, wherein the thermosetting resin contains an epoxy resin, the curing agent contains a phenolic curing agent, and further contains a curing accelerator.
- thermosetting resin composition contains an epoxy resin
- the curing agent contains a phenolic curing agent
- curing accelerator a curing accelerator
- ⁇ 4> The item according to any one of ⁇ 1> to ⁇ 3>, which further contains a solvent and the content of the solvent is 0.1% by mass to 2% by mass of the entire thermosetting resin composition.
- Thermosetting resin composition ⁇ 5>
- An electronic component device comprising an element sealed with the thermosetting resin composition according to any one of ⁇ 1> to ⁇ 4>.
- thermosetting resin composition having excellent filling property and suppressing the occurrence of appearance defects, and an electronic component device using the thermosetting resin composition.
- the term "process” includes, in addition to a process independent of other processes, the process as long as the purpose of the process is achieved even if it cannot be clearly distinguished from the other process. ..
- the numerical range indicated by using "-" includes the numerical values before and after "-" as the minimum value and the maximum value, respectively.
- the upper limit value or the lower limit value described in one numerical range may be replaced with the upper limit value or the lower limit value of the numerical range described in another stepwise description. ..
- the upper limit value or the lower limit value of the numerical range may be replaced with the value shown in the examples.
- each component may contain a plurality of applicable substances.
- the content or content of each component is the total content or content of the plurality of substances present in the composition unless otherwise specified.
- the particles corresponding to each component may contain a plurality of types of particles.
- the particle size of each component means a value for a mixture of the plurality of particles present in the composition, unless otherwise specified.
- the "solid content” means the remaining components obtained by removing volatile components such as a solvent from the mixture or the thermosetting resin composition.
- the thermosetting resin composition of the present disclosure contains a thermosetting resin, a curing agent, and an inorganic filler, and has a volume-based particle size measured by a laser scattering diffraction method particle size distribution measuring device for the inorganic filler.
- the particle size (hereinafter, may be referred to as D90) when the accumulation from the small diameter side in the distribution is 90% or less, and the disk flow at 180 ° C. exceeds 110 mm.
- the thermosetting resin composition of the present disclosure is excellent in filling property and suppresses the occurrence of poor appearance.
- the present inventors have found that the above problems can be solved by using an inorganic filler having a D90 of 25 ⁇ m or less and having a disk flow of more than 110 mm at 180 ° C., and have completed the present invention.
- thermosetting resin composition of the present disclosure contains a thermosetting resin, a curing agent, and an inorganic filler, and if necessary, a curing accelerator, a colorant, an ion exchanger, a mold release agent, a flame retardant, and a stress. Contains other ingredients such as palliatives, coupling agents, solvents, etc.
- thermosetting resin composition of the present disclosure contains a thermosetting resin.
- the type of the thermosetting resin is not particularly limited, and examples thereof include epoxy resin, phenol resin, thiol resin, urea resin, melamine resin, urethane resin, silicone resin, maleimide resin, and unsaturated polyester resin.
- those exhibiting both thermoplastic and thermosetting properties, such as acrylic resins containing epoxy groups are included in "thermosetting resins”.
- the thermosetting resin may be a solid or a liquid under normal temperature and pressure (for example, 25 ° C. and atmospheric pressure), and is preferably a solid.
- the thermosetting resin may be used alone or in combination of two or more.
- the thermosetting resin preferably contains an epoxy resin.
- the type of epoxy resin is not particularly limited as long as it has two or more epoxy groups in one molecule.
- at least one phenol selected from the group consisting of phenol compounds such as phenol, cresol, xylenol, resorcin, catechol, bisphenol A, and bisphenol F and naphthol compounds such as ⁇ -naphthol, ⁇ -naphthol, and dihydroxynaphthalene.
- a novolak type epoxy resin (phenol novolak type epoxy resin, which is an epoxidation of a novolak resin obtained by condensing or cocondensing a sex compound and an aliphatic aldehyde compound such as formaldehyde, acetaldehyde, propionaldehyde, etc. under an acidic catalyst.
- Orthocresol novolak type epoxy resin, etc.) A epoxidized triphenylmethane type phenol resin obtained by condensing or cocondensing the above phenolic compound with an aromatic aldehyde compound such as benzaldehyde or salicylaldehyde under an acidic catalyst.
- Triphenylmethane type epoxide resin a copolymerized epoxy resin obtained by epoxidizing a novolak resin obtained by cocondensing the above phenol compound and naphthol compound with an aldehyde compound under an acidic catalyst; bisphenol A, bisphenol.
- Diphenylmethane type epoxy resin which is a diglycidyl ether such as F; biphenyl type epoxy resin which is an alkyl-substituted or unsubstituted biphenol diglycidyl ether; stillben type epoxy resin which is a diglycidyl ether of a stillben-based phenol compound; bisphenol S and the like.
- Sulfur atom-containing epoxy resin that is a diglycidyl ether epoxy resin that is a glycidyl ether of alcohols such as butanediol, polyethylene glycol, and polypropylene glycol; glycidyl of a polyvalent carboxylic acid compound such as phthalic acid, isophthalic acid, and tetrahydrophthalic acid.
- Glysidyl ester type epoxy resin that is an ester
- Glysidylamine type epoxy resin in which active hydrogen bonded to a nitrogen atom such as aniline, diaminodiphenylmethane, or isocyanuric acid is replaced with a glycidyl group
- a cocondensation resin of dicyclopentadiene and a phenol compound is an ester
- Dicyclopentadiene-type epoxy resin which is an epoxide of (3,4-epoxide) Cyclohexyl-5,5-spiro (3,4-epoxide) 4-Epoxy) Alicyclic epoxy resin such as cyclohexane-m-dioxane; paraxylylene-modified epoxy resin which is a glycidyl ether of paraxylylene-modified phenol resin; metaxylylene-modified epoxy resin which is a glycidyl ether of metaxylylene-modified phenol resin; terpene-modified phenol resin Terpen-modified epoxy resin that is a glycidyl ether; Dicyclopentadiene-modified epoxy resin that is a glycidyl ether of a dicyclopentadiene-modified phenol resin; Cyclopentadiene-modified epoxy resin that is a glycidyl ether of a cyclopentad
- epoxy resins from the viewpoint of the balance between heat resistance and fluidity, biphenyl type epoxy resin, stylben type epoxy resin, diphenylmethane type epoxy resin, sulfur atom-containing epoxy resin, novolak type epoxy resin, dicyclopentadiene type epoxy resin.
- Epoxy resins selected from the group consisting of triphenylmethane type epoxy resins, copolymerized epoxy resins and aralkyl type epoxy resins are preferable.
- the specific epoxy resin may be used alone or in combination of two or more.
- the content thereof is preferably 30% by mass or more, more preferably 50% by mass or more, from the viewpoint of exhibiting the performance of the specific epoxy resin. ..
- biphenyl type epoxy resin, stillben type epoxy resin, diphenylmethane type epoxy resin or sulfur atom-containing epoxy resin are more preferable from the viewpoint of fluidity, and dicyclopentadiene type epoxy from the viewpoint of heat resistance.
- a resin, a triphenylmethane type epoxy resin or an aralkyl type epoxy resin is preferable.
- preferable epoxy resins will be shown.
- the biphenyl type epoxy resin is not particularly limited as long as it is an epoxy resin having a biphenyl skeleton.
- an epoxy resin represented by the following general formula (II) is preferable.
- the 3,3', 5,5'positions of R8 where the oxygen atom is substituted are the methyl groups at the 4 and 4'positions.
- R 8 represents a hydrogen atom, an alkyl group having 1 to 12 carbon atoms or an aromatic group having 4 to 18 carbon atoms, all of which may be the same or different.
- n is an average value and indicates a number from 0 to 10.
- the stilbene type epoxy resin is not particularly limited as long as it is an epoxy resin having a stilbene skeleton.
- an epoxy resin represented by the following general formula (III) is preferable.
- the 3,3', 5,5'positions of R9 where the oxygen atom is substituted are the methyl groups at the 4 and 4'positions.
- the other cases where R 9 is a hydrogen atom and all of R 10 are hydrogen atoms, and three of the 3, 3', 5, and 5'positions of R 9 are methyl groups.
- R 9 and R 10 represent hydrogen atoms or monovalent organic groups having 1 to 18 carbon atoms, all of which may be the same or different.
- n is an average value and indicates a number from 0 to 10.
- the diphenylmethane type epoxy resin is not particularly limited as long as it is an epoxy resin having a diphenylmethane skeleton.
- an epoxy resin represented by the following general formula (IV) is preferable.
- all of R 11 are hydrogen atoms, and the positions of R 12 where the oxygen atom is substituted are set to the 4 and 4'positions 3,3.
- YSLV-80XY Nittetsu Chemical & Materials Co., Ltd., trade name
- the like in which the', 5, 5'position is a methyl group and the other R 12 is a hydrogen atom is available as a commercially available product.
- R 11 and R 12 represent hydrogen atoms or monovalent organic groups having 1 to 18 carbon atoms, all of which may be the same or different.
- n is an average value and indicates a number from 0 to 10.
- the sulfur atom-containing epoxy resin is not particularly limited as long as it is an epoxy resin containing a sulfur atom.
- an epoxy resin represented by the following general formula (V) can be mentioned.
- the 3,3'position of R13 when the position where the oxygen atom is substituted is the 4th and 4'positions is the t-butyl group.
- YSLV-120TE Nitetsu Chemical & Materials Co., Ltd., trade name
- the 6 and 6'positions are methyl groups and the other R13 is a hydrogen atom, is available as a commercially available product.
- R 13 represents a hydrogen atom or a monovalent organic group having 1 to 18 carbon atoms, all of which may be the same or different.
- n is an average value and indicates a number from 0 to 10.
- the novolak type epoxy resin is not particularly limited as long as it is an epoxy resin obtained by epoxidizing a novolak type phenol resin.
- an epoxy resin obtained by epoxidizing a novolak-type phenol resin such as a phenol novolak resin, a cresol novolak resin, or a naphthol novolak resin by a method such as glycidyl etherification is preferable, and an epoxy represented by the following general formula (VI) is preferable. Resin is more preferred.
- a benzyl group-modified cresol novolak type epoxy resin having the above is available as a commercially available product.
- R 14 represents a hydrogen atom or a monovalent organic group having 1 to 18 carbon atoms, all of which may be the same or different.
- R 15 represents a monovalent organic group having 1 to 18 carbon atoms, all of which may be the same or different.
- i independently represents an integer of 0 to 3.
- n is an average value and indicates a number from 0 to 10.
- R 16 represents a monovalent organic group having 1 to 18 carbon atoms, all of which may be the same or different.
- i independently represents an integer of 0 to 3.
- n is an average value and indicates a number from 0 to 10.
- the triphenylmethane type epoxy resin is not particularly limited as long as it is an epoxy resin made from a compound having a triphenylmethane skeleton.
- an epoxy resin obtained by glycidyl etherifying a triphenylmethane-type phenol resin obtained from an aromatic aldehyde compound and a phenolic compound is preferable, and an epoxy resin represented by the following general formula (VIII) is more preferable.
- the epoxy resins represented by the following general formula (VIII) 1032H60 (Mitsubishi Chemical Corporation, trade name) and EPPN-502H (Nippon Kayaku Co., Ltd., trade name) in which i is 0 and k is 0. Etc. are available as commercial products.
- R 17 and R 18 represent monovalent organic groups having 1 to 18 carbon atoms, all of which may be the same or different.
- i indicates an integer of 0 to 3 independently
- k indicates an integer of 0 to 4 independently.
- n is an average value and indicates a number from 0 to 10.
- the copolymerized epoxy resin obtained by epoxidizing a novolak resin obtained from a naphthol compound and a phenol compound and an aldehyde compound is not particularly limited as long as it is an epoxy resin made from a compound having a naphthol skeleton and a compound having a phenol skeleton. ..
- an epoxy resin obtained by glycidyl etherifying a novolak-type phenol resin using a compound having a naphthol skeleton and a compound having a phenol skeleton is preferable, and an epoxy resin represented by the following general formula (IX) is more preferable.
- R 19 to R 21 represent monovalent organic groups having 1 to 18 carbon atoms, all of which may be the same or different.
- i is an integer of 0 to 3 independently
- j is an integer of 0 to 2 independently
- k is an integer of 0 to 4 independently.
- l and m are average values, respectively, and are numbers from 0 to 10, and (l + m) indicate numbers from 0 to 10.
- the end of the epoxy resin represented by the formula (IX) is either one of the following formulas (IX-1) or (IX-2).
- R 19 to R 21 , i, j and k are the same as the definitions of R 19 to R 21 , i, j and k in formula (IX). .. n is 1 (when bonded via a methylene group) or 0 (when not bonded via a methylene group).
- the epoxy resin represented by the above general formula (IX) includes a random copolymer randomly containing l structural units and m structural units, an alternating copolymer containing alternately, and a copolymer containing regularly.
- n and m are average values and are numbers from 0 to 10
- n + m are numbers from 0 to 10
- n and m are average values and 1 to 9 respectively.
- N + m is a number of 2 to 10.
- the aralkyl type epoxy resin is composed of at least one selected from the group consisting of phenol compounds such as phenol and cresol and naphthol compounds such as naphthol and dimethylnaphthol, and dimethoxyparaxylene, bis (methoxymethyl) biphenyl or derivatives thereof.
- the epoxy resin is not particularly limited as long as it is an epoxy resin made from a synthesized phenol resin.
- the epoxy resin obtained by glycidyl etherification is preferable, and the epoxy resin represented by the following general formulas (X) and (XI) is more preferable.
- epoxy resins represented by the following general formula (X) i is 0, R 38 is a hydrogen atom NC-3000S (Nippon Kayaku Co., Ltd., trade name), i is 0, and R 38 .
- CER-3000 Nippon Kayaku Co., Ltd., trade name
- CER-3000 which is a mixture of an epoxy resin in which is a hydrogen atom and an epoxy resin in which all R8s of the general formula (II) are hydrogen atoms at a mass ratio of 80:20, is commercially available. It is available as an item.
- epoxy resins represented by the following general formula (XI) ESN-175 (Nittetsu Chemical & Materials Co., Ltd., trade name) in which l is 0, j is 0, and k is 0, etc. Is available as a commercial product.
- R 38 represents a hydrogen atom or a monovalent organic group having 1 to 18 carbon atoms, all of which may be the same or different.
- R 37 and R 39 to R 41 represent monovalent organic groups having 1 to 18 carbon atoms, and all of them may be the same or different.
- i is an integer of 0 to 3 independently
- j is an integer of 0 to 2 independently
- k is an integer of 0 to 4 independently
- l is an integer of 0 to 4 independently.
- n is an average value, and each is independently a number from 0 to 10.
- R8 to R21 and R37 to R41 in the general formulas ( II) to (XI) “all may be the same or different” means, for example, 8 to 8 in the formula (II). It means that all 88 R8s may be the same or different. It also means that the other R 9 to R 21 and R 37 to R 41 may all be the same or different for each number included in the equation. Further, R 8 to R 21 and R 37 to R 41 may be the same or different from each other. For example, all of R 9 and R 10 may be the same or different. Further, the monovalent organic group having 1 to 18 carbon atoms in the general formulas (III) to (XI) is preferably an alkyl group or an aryl group.
- N in the above general formulas (II) to (XI) is an average value, and it is preferable that each is independently in the range of 0 to 10.
- n is 10 or less, the melt viscosity of the resin component does not become too high, the viscosity of the thermosetting resin composition at the time of melt molding decreases, filling failure, and bonding wire (gold wire connecting the element and the lead). The occurrence of deformation and the like tends to be suppressed. It is more preferable that n is set in the range of 0 to 4.
- thermosetting resin composition The specific examples of the preferable epoxy resin that can be used in the thermosetting resin composition have been described above according to the above general formulas (II) to (XI), but as a more specific preferable epoxy resin, from the viewpoint of heat resistance. , 4,4'-bis (2,3-epoxypropoxy) -3,3', 5,5'-tetramethylbiphenyl, and from the viewpoint of moldability and heat resistance, 4,4'-bis (2,3-Epoxy propoxy) -biphenyl can be mentioned.
- the epoxy equivalent of the epoxy resin is not particularly limited. From the viewpoint of balancing various characteristics such as moldability, heat resistance, and electrical reliability, the epoxy equivalent of the epoxy resin is preferably 60 g / eq to 1000 g / eq, and is preferably 80 g / eq to 500 g / eq. Is more preferable.
- the epoxy resin may be liquid or solid.
- the softening point or melting point of the epoxy resin is not particularly limited. From the viewpoint of moldability and heat resistance, the temperature is preferably 40 ° C. to 180 ° C., and from the viewpoint of handleability when preparing the thermosetting resin composition, the temperature is more preferably 50 ° C. to 130 ° C.
- the softening point refers to a value measured by the ring ball method of JIS K 7234: 1986.
- the melting point refers to a value measured according to the visual method of JIS K 0064: 1992.
- the content of the epoxy resin in the thermosetting resin composition is preferably 0.5% by mass to 60% by mass, preferably 2% by mass to 50% by mass, from the viewpoints of strength, fluidity, heat resistance, moldability and the like. % Is more preferable.
- the thermosetting resin composition of the present disclosure contains a curing agent.
- the type of the curing agent is not particularly limited, and is not particularly limited as long as it is a compound that causes a curing reaction with the thermosetting resin used in combination.
- a phenol-based curing agent, an amine-based curing agent, an acid anhydride-based curing agent, a polypeptide-based curing agent, a polyaminoamide-based curing agent, an isocyanate-based curing agent, and a blocked isocyanate-based curing agent are used as the epoxy resin.
- a phenol-based curing agent an amine-based curing agent, an acid anhydride-based curing agent, a polypeptide-based curing agent, a polyaminoamide-based curing agent, an isocyanate-based curing agent, and a blocked isocyanate-based curing agent are used.
- Agents and the like can be mentioned.
- the curing agent one type may be used alone or two or
- the curing agent may be a solid or a liquid under normal temperature and pressure (for example, 25 ° C. and atmospheric pressure), and is preferably a solid.
- the thermosetting resin is an epoxy resin
- the curing agent is preferably a phenol-based curing agent or an amine-based curing agent from the viewpoint of heat resistance.
- the phenolic curing agent include phenolic resins having two or more phenolic hydroxyl groups in one molecule and polyvalent phenolic compounds.
- polyhydric phenol compounds such as resorcin, catechol, bisphenol A, bisphenol F, substituted or unsubstituted biphenol; phenol, cresol, xylenol, resorcin, catechol, bisphenol A, bisphenol F, phenylphenol, aminophenol and the like.
- At least one phenolic compound selected from the group consisting of the phenolic compounds of the above and naphthol compounds such as ⁇ -naphthol, ⁇ -naphthol and dihydroxynaphthalene, and aldehyde compounds such as formaldehyde, acetaldehyde and propionaldehyde are condensed or condensed under an acidic catalyst.
- Novorak-type phenolic resin obtained by co-condensation Phenolic aralkyl resin synthesized from the above-mentioned phenolic compound and dimethoxyparaxylene, bis (methoxymethyl) biphenyl, etc., naphthol aralkyl resin and other aralkyl-type phenolic resins; paraxylylene-modified phenol Resin; Metaxylylene-modified phenolic resin; Melamine-modified phenolic resin; Terpen-modified phenolic resin; Dicyclopentadiene-type phenolic resin and dicyclopentadiene-type naphthol resin synthesized by copolymerization of the above-mentioned phenolic compound and dicyclopentadiene; cyclopentadiene.
- Modified phenol resin Polycyclic aromatic ring modified phenol resin; Biphenyl type phenol resin; Triphenylmethane obtained by condensing or co-condensing the above phenolic compound with aromatic aldehyde compounds such as benzaldehyde and salicylaldehyde under an acidic catalyst.
- Type phenolic resin examples thereof include phenolic resins obtained by copolymerizing two or more of these types. These phenolic curing agents may be used alone or in combination of two or more.
- phenol-based curing agents from the viewpoint of heat resistance, aralkyl-type phenol resin, dicyclopentadiene-type phenol resin, triphenylmethane-type phenol resin, triphenylmethane-type phenol resin and aralkyl-type phenol resin copolymerized phenol resin. , And at least one selected from the group consisting of novolak-type phenolic resins (these are referred to as "specific phenol-based curing agents”) are preferable.
- the specific phenolic curing agent may be used alone or in combination of two or more.
- the content of the specific phenolic curing agent is preferably 30% by mass or more of the total amount of the phenolic curing agent from the viewpoint of fully exerting their performance. It is more preferably 50% by mass or more.
- aralkyl-type phenol resin examples include a phenol aralkyl resin synthesized from a phenolic compound, dimethoxyparaxylene, bis (methoxymethyl) biphenyl and the like, a naphthol aralkyl resin and the like.
- the aralkyl type phenol resin may be further copolymerized with another phenol resin.
- Examples of the copolymerized aralkyl type phenol resin include a copolymerized phenol resin of a triphenylmethane type phenol resin and an aralkyl type phenol resin, a copolymerized phenol resin of a salicylaldehyde type phenol resin and an aralkyl type phenol resin, and a novolak type phenol. Examples thereof include a copolymer formaldehyde resin in which a resin and an aralkyl type phenol resin are used.
- the aralkyl-type phenol resin is not particularly limited as long as it is a phenol resin synthesized from at least one selected from the group consisting of phenol compounds and naphthol compounds, and dimethoxyparaxylene, bis (methoxymethyl) biphenyl or derivatives thereof. ..
- phenolic resins represented by the following general formulas (XII) to (XIV) are preferable.
- R 23 represents a hydrogen atom or a monovalent organic group having 1 to 18 carbon atoms, all of which may be the same or different.
- R 22 , R 24 , R 25 and R 28 represent monovalent organic groups having 1 to 18 carbon atoms, all of which may be the same or different.
- R 26 and R 27 represent a hydroxyl group or a monovalent organic group having 1 to 18 carbon atoms, and all of them may be the same or different.
- i is an integer of 0 to 3 independently
- j is an integer of 0 to 2 independently
- k is an integer of 0 to 4 independently
- p is an integer of 0 to 4 independently.
- n is an average value, and each is independently a number from 0 to 10.
- phenolic resins represented by the above general formula (XIII), XL-225, XLC (Mitsui Chemicals, Inc., trade name), MEH-7800 (Meiwa Kasei Co., Ltd.) in which i is 0 and k is 0. Product name) etc. are available as commercial products.
- phenolic resins represented by the above general formula (XIV) SN-170 (Nittetsu Chemical & Materials Co., Ltd., trade name) and j in which j is 0, k is 0, and p is 0 are SN-395 (Nittetsu Chemical & Materials Co., Ltd., trade name) and the like, which are 0, k is 1, R 27 is a hydroxyl group, and p is 0, are available as commercial products.
- the dicyclopentadiene-type phenol resin is not particularly limited as long as it is a phenol resin obtained from a compound having a dicyclopentadiene skeleton as a raw material.
- a phenol resin represented by the following general formula (XV) is preferable.
- the phenolic resins represented by the following general formula (XV) the phenolic resin in which i is 0 is available as a commercially available product.
- R 29 represents a monovalent organic group having 1 to 18 carbon atoms, all of which may be the same or different.
- i independently represents an integer of 0 to 3.
- n is an average value and indicates a number from 0 to 10.
- the triphenylmethane type phenol resin is not particularly limited as long as it is a phenol resin obtained from an aromatic aldehyde compound as a raw material.
- a phenol resin represented by the following general formula (XVI) is preferable.
- phenolic resins represented by the following general formula (XVI), MEH-7500 (Meiwa Kasei Co., Ltd., trade name) in which i is 0 and k is 0 is available as a commercially available product.
- R 30 and R 31 represent monovalent organic groups having 1 to 18 carbon atoms, all of which may be the same or different.
- i is an integer of 0 to 3 independently
- k is an integer of 0 to 4 independently.
- n is an average value and is a number from 0 to 10.
- the copolymerized phenol resin of the triphenylmethane type phenol resin and the aralkyl type phenol resin is not particularly limited as long as it is a copolymerized phenol resin of the phenol resin obtained from the compound having a benzaldehyde skeleton as a raw material and the aralkyl type phenol resin. ..
- a phenol resin represented by the following general formula (XVII) is preferable.
- phenolic resins represented by the following general formula (XVII), HE-510 (Air Water Chemical Co., Ltd., trade name) in which i is 0, k is 0, and q is 0 are commercially available. It is available as a product.
- R 32 to R 34 represent monovalent organic groups having 1 to 18 carbon atoms, all of which may be the same or different.
- i is an integer of 0 to 3 independently
- k is an integer of 0 to 4 independently
- q is an integer of 0 to 5 independently.
- l and m are average values, respectively, and are independently numbers from 0 to 11. However, the total of l and m is a number of 1 to 11.
- the novolak-type phenol resin is not particularly limited as long as it is a phenol resin obtained by condensing or co-condensing an aldehyde compound with at least one phenolic compound selected from the group consisting of a phenol compound and a naphthol compound. ..
- a phenol resin represented by the following general formula (XVIII) is preferable.
- phenolic resins represented by the following general formula (XVIII), Tamanol 758, 759 (Arakawa Chemical Industry Co., Ltd., trade name), H-4 (Meiwa Kasei) in which i is 0 and R35 is all hydrogen atoms. Co., Ltd., product name) etc. are available as commercial products.
- R35 represents a hydrogen atom or a monovalent organic group having 1 to 18 carbon atoms, all of which may be the same or different.
- R 36 represents a monovalent organic group having 1 to 18 carbon atoms, all of which may be the same or different.
- i independently represents an integer of 0 to 3.
- n is an average value and indicates a number from 0 to 10.
- R 22 to R 36 in the above general formulas (XII) to (XVIII) is, for example, that all i R 22s in the formula (XII) are the same. But it means that they can be different from each other. It means that all of the other R 23 to R 36 may be the same or different from each other for each number included in the equation. Further, R 22 to R 36 may be the same or different from each other. For example, all of R 22 and R 23 may be the same or different, and all of R 30 and R 31 may be the same or different.
- N in the above general formulas (XII) to (XVIII) is preferably in the range of 0 to 10.
- the melt viscosity of the resin component does not become too high, the viscosity of the thermosetting resin composition at the time of melt molding also becomes low, filling failure, deformation of the bonding wire (gold wire connecting the element and the lead), etc. Is less likely to occur.
- the average n in one molecule is preferably set in the range of 0 to 4.
- amine-based curing agent examples include aliphatic amine compounds such as diethylenetriamine, triethylenetetramine, n-propylamine, 2-hydroxyethylaminopropylamine, cyclohexylamine, and 4,4'-diamino-dicyclohexylmethane.
- Aromatic amine compounds such as diethyltoluenediamine, 3,3'-diethyl-4,4'-diaminodiphenylmethane, dimethylthiotoludiamine, 2-methylaniline, imidazole, 2-methylimidazole, 2-ethylimidazole, 2-isopropyl
- imidazole compounds such as imidazole
- imidazoline compounds such as imidazoline, 2-methylimidazoline, and 2-ethylimidazolin.
- aromatic amine compounds are preferable, and diethyltoluenediamine, 3,3'-diethyl-4,4'-diaminodiphenylmethane and dimethylthiotoluenediamine are more preferable from the viewpoint of storage stability.
- the functional group equivalent of the curing agent (hydroxyl equivalent in the case of a phenol curing agent, active hydrogen equivalent in the case of an amine-based curing agent) is not particularly limited. From the viewpoint of balance of various characteristics such as moldability, heat resistance, and electrical reliability, it is preferably 10 g / eq to 1000 g / eq, and more preferably 30 g / eq to 500 g / eq.
- the hydroxyl group equivalent in the case of a phenol curing agent means a value calculated based on the hydroxyl group value measured in accordance with JIS K0070: 1992.
- the active hydrogen equivalent in the case of an amine-based curing agent is a value calculated based on the amine value measured in accordance with JIS K7237: 1995.
- the softening point or melting point is not particularly limited.
- the temperature is preferably 40 ° C. to 180 ° C., and from the viewpoint of handleability during production of the thermosetting resin composition, the temperature is more preferably 50 ° C. to 130 ° C.
- the thermosetting resin composition of the present disclosure contains an inorganic filler.
- the D90 of the inorganic filler is 25 ⁇ m or less, preferably 20 ⁇ m or less, more preferably 15 ⁇ m or less, still more preferably 10 ⁇ m or less. D90 may be 3 ⁇ m or more.
- D90 for the inorganic filler is a value measured by a laser scattering diffraction method particle size distribution measuring device, and is inorganically filled from a thermosetting resin composition or a cured product using, for example, an organic solvent, nitric acid, royal water, or the like. The material is extracted and sufficiently dispersed with an ultrasonic disperser or the like to prepare a dispersion liquid.
- the D90 of the inorganic filler can be measured from the volume-based particle size distribution measured by the laser diffraction / scattering method particle size distribution measuring device.
- the D90 of the inorganic filler may be measured by performing the above measurement on the obtained inorganic filler.
- the type of inorganic filler is not particularly limited. Specifically, silica such as spherical silica and crystalline silica, glass, alumina, calcium carbonate, zirconium silicate, calcium silicate, silicon nitride, aluminum nitride, boron nitride, aluminum nitride, boehmite, verilia, magnesium oxide, zirconia, Inorganic materials such as zircone, fosterite, steatite, spinel, mulite, titania, talc, clay, mica and titanate can be mentioned. An inorganic filler having a flame-retardant effect may be used.
- Examples of the inorganic filler having a flame-retardant effect include aluminum hydroxide, magnesium hydroxide, a composite metal hydroxide such as a composite hydroxide of magnesium and zinc, and zinc borate. Of these, spherical silica is preferable from the viewpoint of reducing the coefficient of linear expansion, and alumina is preferable from the viewpoint of high thermal conductivity.
- the inorganic filler may be used alone or in combination of two or more. Examples of the state of the inorganic filler include powder, beads made by spheroidizing the powder, fibers and the like.
- the average particle size of the inorganic filler is not particularly limited.
- the volume average particle diameter is preferably 15 ⁇ m or less, more preferably 0.1 ⁇ m to 15 ⁇ m, further preferably 0.2 ⁇ m to 12 ⁇ m, and particularly preferably 0.5 ⁇ m to 10 ⁇ m. ..
- the volume average particle diameter is 15 ⁇ m, the filling property into a narrow gap tends to be improved.
- the volume average particle diameter is 0.1 ⁇ m or more, the increase in the viscosity of the thermosetting resin composition tends to be further suppressed.
- the volume average particle size of the inorganic filler can be measured as the volume average particle size (D50) by a laser diffraction scattering method particle size distribution measuring device.
- the particle shape of the inorganic filler is preferably spherical rather than square, and the particle size distribution of the inorganic filler is preferably widely distributed.
- the content of the inorganic filler in the thermosetting resin composition is not particularly limited. From the viewpoint of fluidity and strength, it is preferably 60% by volume or more, more preferably 60% by volume to 90% by volume, and 65% by volume to 88% by volume of the total solid content of the thermosetting resin composition. % Is more preferable.
- the content of the inorganic filler is 60% by volume or more of the total solid content of the thermosetting resin composition, the properties such as the thermal expansion coefficient, thermal conductivity, and elastic modulus of the cured product tend to be further improved.
- the content of the inorganic filler is 90% by volume or less of the total solid content of the thermosetting resin composition
- the increase in the viscosity of the thermosetting resin composition is suppressed, the fluidity is further improved, and the moldability is improved. It tends to be better.
- diazabicycloalkenes such as 1,5-diazabicyclo [4.3.0] nonen-5 (DBN) and 1,8-diazabicyclo [5.4.0] undecene-7 (DBU), 2 -Cyclic amidine compounds such as methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-heptadecylimidazole; derivatives of the cyclic amidin compounds; phenol novolac salts of the cyclic amidin compounds or derivatives thereof; Compounds include maleic anhydride, 1,4-benzoquinone, 2,5-turquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1, A quinone compound such as 4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, phenyl-1,4
- Cyclic amidinium compounds such as DBU tetraphenylborate salt, DBN tetraphenylborate salt, 2-ethyl-4-methylimidazole tetraphenylborate salt, N-methylmorpholin tetraphenylborate salt; pyridine, triethylamine, triethylenediamine , A tertiary amine compound such as benzyldimethylamine, triethanolamine, dimethylaminoethanol, tris (dimethylaminomethyl) phenol; a derivative of the tertiary amine compound; tetra-n-butylammonium acetate, tetra-n-butyl phosphate.
- Ammonium salt compounds such as ammonium, tetraethylammonium acetate, tetra-n-hexylammonium benzoate, tetrapropylammonium hydroxide; Phosphin, diphenyl (p-tolyl) phosphin, tris (alkylphenyl) phosphin, tris (alkoxyphenyl) phosphin, tris (alkylalkoxyphenyl) phosphin, tris (dialkylphenyl) phosphin, tris (trialkylphenyl) phosphin, tris (tetra) Alkylphenyl) phosphine, tris (dialkenylphenyl) phosphine, tris (trialkoxyphenyl) phosphine, tris (tetraalkoxyphenyl) phosphine, trialkylphosphine, dialkylally Organic phosphines such as rup
- a compound having intramolecular polarization, which is obtained through the process of dehalogenation after the reaction of Examples thereof include tetra-substituted phosphonium compounds; phosphobetaine compounds; adducts
- examples of the curing accelerator particularly suitable include triphenylphosphine, an adduct of triphenylphosphine and a quinone compound, and the like.
- an epoxy resin is used as a thermosetting resin
- a curing accelerator capable of low-temperature curing an adduct of tributylphosphine and 1,4-benzoquinone, dimethylaminopyridine, 2-ethyl-4-methylimidazole is used.
- the curing accelerator may be used alone or in combination of two or more.
- thermosetting resin composition contains a curing accelerator
- the content thereof is preferably 0.1% by mass to 8% by mass with respect to the total amount of the thermosetting resin and the curing agent. It is more preferably 0.3% by mass to 6% by mass, and further preferably 0.5% by mass to 5% by mass.
- thermosetting resin composition of the present disclosure may contain a colorant.
- the colorant include known colorants such as carbon black, black titanium oxide, organic dyes, organic pigments, lead tan, and red iron oxide.
- the content of the colorant can be appropriately selected according to the purpose and the like.
- the colorant one type may be used alone or two or more types may be used in combination.
- thermosetting resin composition contains a colorant
- the content thereof is preferably 0.01% by mass to 5% by mass, more preferably 0.05% by mass to 3% by mass.
- the thermosetting resin composition of the present disclosure may contain an ion exchanger.
- an ion exchanger is not particularly limited, and conventionally known ones can be used.
- a hydrotalcite compound and a hydrous oxide of at least one element selected from the group consisting of magnesium, aluminum, titanium, zirconium and bismuth can be mentioned.
- the ion exchanger one type may be used alone or two or more types may be used in combination. Of these, hydrotalcite represented by the following general formula (A) is preferable.
- thermosetting resin composition contains an ion exchanger
- the content thereof is not particularly limited as long as it is an amount sufficient to capture ions such as halogen ions.
- it is preferably 0.1 part by mass to 30 parts by mass, and more preferably 1 part by mass to 5 parts by mass with respect to 100 parts by mass of the thermosetting resin.
- the thermosetting resin composition of the present disclosure may contain a mold release agent from the viewpoint of obtaining good mold release from the mold at the time of molding.
- the release agent is not particularly limited, and conventionally known release agents can be used. Specific examples thereof include higher fatty acids such as carnauba wax, montanic acid and stearic acid, ester waxes such as higher fatty acid metal salts and montanic acid esters, and polyolefin waxes such as polyethylene oxide and non-oxidized polyethylene.
- the release agent one type may be used alone or two or more types may be used in combination.
- the content thereof is preferably 0.01 part by mass to 15 parts by mass, and 0.1 part by mass to 10 parts by mass with respect to 100 parts by mass of the thermosetting resin. Is more preferable.
- the amount of the mold release agent is 0.01 part by mass or more with respect to 100 parts by mass of the thermosetting resin, the mold release property tends to be sufficiently obtained.
- the amount of the mold release agent is 15 parts by mass or less with respect to 100 parts by mass of the thermosetting resin, better adhesiveness tends to be obtained.
- the thermosetting resin composition of the present disclosure may contain a flame retardant.
- the flame retardant is not particularly limited, and conventionally known flame retardants can be used. Specific examples thereof include organic or inorganic compounds containing halogen atoms, antimony atoms, nitrogen atoms or phosphorus atoms, metal hydroxides and the like.
- the flame retardant may be used alone or in combination of two or more.
- thermosetting resin composition contains a flame retardant
- the content thereof is not particularly limited as long as it is sufficient to obtain the desired flame retardant effect.
- it is preferably 1 part by mass to 30 parts by mass, and more preferably 2 parts by mass to 20 parts by mass with respect to 100 parts by mass of the thermosetting resin.
- the thermosetting resin composition of the present disclosure may contain a stress relaxation agent such as silicone oil and silicone rubber particles.
- a stress relaxation agent such as silicone oil and silicone rubber particles.
- the stress relaxation agent include commonly used known stress relaxation agents (flexible agents).
- thermoplastic elastomers such as silicone-based, styrene-based, olefin-based, urethane-based, polyester-based, polyether-based, polyamide-based, and polybutadiene-based, NR (natural rubber), NBR (acrylonitrile-butadiene rubber), and acrylic.
- Rubber particles such as rubber, urethane rubber, silicone powder, core-shell such as methyl methacrylate-styrene-butadiene copolymer (MBS), methyl methacrylate-silicone copolymer, methyl methacrylate-butyl acrylate copolymer, etc.
- Examples include rubber particles having a structure.
- the stress relaxation agent one type may be used alone or two or more types may be used in combination. Of these, a silicone-based stress relaxant is preferable.
- the silicone-based stress relieving agent include those having an epoxy group, those having an amino group, and those obtained by modifying these with a polyether.
- thermosetting resin composition contains a stress relieving agent
- the content thereof is preferably 0.1 part by mass to 30 parts by mass with respect to 100 parts by mass of the thermosetting resin, and 1 part by mass to 5 parts by mass. It is more preferably by mass.
- the thermosetting resin composition of the present disclosure may contain a coupling agent.
- the type of the coupling agent is not particularly limited, and a known coupling agent can be used.
- Examples of the coupling agent include a silane coupling agent and a titanium coupling agent.
- One type of coupling agent may be used alone, or two or more types may be used in combination.
- silane coupling agent examples include 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, and 3-glycidoxy.
- Titanium coupling agents include isopropyltriisostearoyl titanate, isopropyltris (dioctylpyrophosphate) titanate, isopropyltri (N-aminoethyl-aminoethyl) titanate, tetraoctylbis (ditridecylphosphite) titanate, tetra (2,).
- the content of the coupling agent is set with respect to 100 parts by mass of the inorganic filler from the viewpoint of the adhesion of the interface between the thermosetting resin and the inorganic filler. , 0.001 part by mass to 10 parts by mass, more preferably 0.01 part by mass to 8 parts by mass, and further preferably 0.05 part by mass to 5 parts by mass.
- thermosetting resin composition of the present disclosure may contain a solvent.
- the solvent contained in the thermosetting resin composition may or may not dissolve one of the thermosetting resin and the curing agent.
- the thermosetting resin composition contains a solvent, the dispersibility of the inorganic filler is further improved, and poor appearance (particularly, the sealed element can be seen through (chip see-through)) is further suppressed. There is a tendency.
- the boiling point of the solvent at normal pressure is preferably 50 ° C. to 180 ° C., more preferably 60 ° C. to 170 ° C., further preferably 70 ° C. to 160 ° C., and 70 ° C. to 140 ° C. It is particularly preferable that the temperature is 70 ° C to 120 ° C, and it is extremely preferable that the temperature is 70 ° C to 120 ° C.
- the solvent one type may be used alone or two or more types may be used in combination. When two or more kinds of solvents are used in combination, it is preferable that the boiling point of the solvent having the highest boiling point at normal pressure is within the above range.
- the solvent examples include methyl ethyl ketone, methyl isobutyl ketone, toluene, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, cyclohexanone and the like.
- methyl isobutyl ketone or methyl ethyl ketone is preferable.
- the content of the solvent in the entire thermosetting resin composition is preferably 0.1% by mass to 2% by mass, preferably 0.1% by mass to 0. It is more preferably 5.5% by mass.
- the content of the solvent in the entire thermosetting resin composition is 2% by mass or less, blocking of the thermosetting resin composition is unlikely to occur, and the thermosetting resin composition is supplied to a molding machine such as a press machine. However, it tends to be easier.
- the content of the solvent in the entire thermosetting resin composition is 0.1% by mass or more, the fluidity at the time of molding tends to be further improved.
- the solvent content is calculated based on the mass change before and after heating the thermosetting resin composition at 175 ° C. for 1 hour.
- thermosetting resin composition is more preferable, 100 Pa ⁇ s or less is further preferable, 70 Pa ⁇ s or less is particularly preferable, and 50 Pa ⁇ s or less is extremely preferable.
- the lower limit of the viscosity of the thermosetting resin composition is not particularly limited, and may be, for example, 2 Pa ⁇ s or more at 175 ° C.
- the viscosity of the thermosetting resin composition can be measured by a high-grade flow tester (for example, manufactured by Shimadzu Corporation).
- the disk flow of the thermosetting resin composition at 180 ° C. is preferably 115 mm or more, and more preferably 120 mm or more, from the viewpoint of reducing the wire flow.
- the disk flow of the thermosetting resin composition at 180 ° C. may be 200 mm or less.
- the disk flow is a flat plate mold for measuring disk flow having an upper mold of 200 mm (W) ⁇ 200 mm (D) ⁇ 25 mm (H) and a lower mold of 200 mm (W) ⁇ 200 mm (D) ⁇ 15 mm (H). 5 g of the thermosetting resin composition weighed on a precision balance was placed on the center of the lower mold heated to 180 ° C., and after 5 seconds, the upper mold heated to 180 ° C.
- thermosetting resin composition of the present disclosure may be produced through any process.
- a predetermined blending amount of a component is sufficiently mixed with a mixer or the like to form a mixture, and then the mixture is melt-kneaded with a mixing roll, an extruder or the like and cooled.
- the method of crushing can be mentioned. More specifically, for example, a method of uniformly stirring and mixing a predetermined amount of the above-mentioned components, kneading with a kneading device described later which has been preheated to 70 ° C. to 140 ° C., cooling, and pulverizing will be mentioned. Can be done.
- a solvent may be added to the mixture.
- the content of the solvent contained in the mixture and the content of the solvent contained in the thermosetting resin composition obtained through kneading may be the same or different.
- thermosetting resin composition of the present disclosure is produced by kneading a mixture of a thermosetting resin, a curing agent, a slurry containing an inorganic filler and a solvent, while removing the solvent. It may be a thing. By kneading the mixture while removing the solvent, the disk flow of the thermosetting resin composition of the present disclosure at 180 ° C. tends to exceed 110 mm.
- the solvent described above may be derived from the solvent contained in the slurry.
- the mixture When the mixture is kneaded while removing the solvent to produce a thermosetting resin composition, the mixture contains a curing accelerator, a stress relieving agent, which are contained in the thermosetting resin composition as needed. Other components such as ion exchangers may be included.
- the mixture is a mixture of a slurry containing a thermosetting resin, a curing agent, an inorganic filler and a solvent, and other components such as a curing accelerator, a stress relieving agent, and an ion exchanger used as necessary. It can be obtained by mixing using a machine, a mixer such as a planetary mixer, an ultrasonic disperser, a wet disperser such as a jet mill, or the like. The mixing conditions when preparing the mixture are appropriately set according to the types of components contained in the mixture, the ratio of the components, and the like.
- the kneading device for kneading the mixture is not particularly limited.
- the kneading device include a single-screw kneader, a double-screw kneader, a screw-type kneader such as a multi-screw kneader with three or more shafts, and a roll mill such as a two-roll mill and a three-roll mill.
- the stirring blade included in the screw type kneader may be supported by the root and the tip, or may be supported only by the root.
- the stirring blade is supported only at the root.
- a screw type kneader which is an example of a closed-type kneader capable of removing a solvent by depressurization, is preferable, and a twin-screw kneader is more preferable from the viewpoint of easily controlling the shearing force.
- the thermosetting resin composition contains a curing accelerator
- the curing accelerator is added to the first kneaded product obtained by kneading the mixture containing no curing accelerator at the first kneading temperature, and the process is continued.
- the thermosetting resin composition may be produced by further kneading the first kneaded product to which the curing accelerator is added at the second kneading temperature lower than the first kneading temperature.
- the kneading temperature of the mixture is not particularly limited, and is preferably a temperature near the melting point or softening point of the thermosetting resin from the viewpoint of suppressing uneven distribution of the thermosetting resin.
- the kneading temperature of the mixture is preferably a temperature near the melting point or softening point of the thermosetting resin having the highest melting point or softening point.
- the kneading temperature of the mixture is 70 ° C. lower than the melting point or softening point of the thermosetting resin (the thermosetting resin having the highest melting point or softening point when a plurality of types of thermosetting resins are used in combination).
- the temperature is preferably in the range of ° C.
- the kneading temperature of the mixture is preferably 30 ° C to 150 ° C, more preferably 50 ° C to 140 ° C, still more preferably 60 ° C to 130 ° C.
- the "kneading temperature of the mixture” means the temperature of the heated part of the kneading device when the mixture is kneaded by the kneading device.
- the method for removing at least a part of the solvent contained in the mixture when kneading the mixture is not particularly limited.
- a screw type kneader is used as the kneading device, it is preferable to reduce the pressure inside the screw type kneader to remove the solvent.
- the pressure in the screw type kneader is preferably 0.001 MPa to 0.08 MPa, more preferably 0.003 MPa to 0.06 MPa, and 0. It is more preferably 005 MPa to 0.05 MPa.
- thermosetting resin composition obtained through kneading may be cooled and pulverized to obtain a powdery thermosetting resin composition. Further, the thermosetting resin composition obtained by kneading may be formed into granules, tablets, pellets or granules (cylindrical granules or the like).
- the method for pulverizing or molding the thermosetting resin composition is not particularly limited, and conventionally known methods can be used.
- thermosetting resin composition of the present disclosure is not particularly limited, and it can be used in various mounting techniques, for example, as a sealing material for electronic component devices. Further, the thermosetting resin composition of the present disclosure has good fluidity such as a resin molded body for various modules, a resin molded body for a motor, a resin molded body for an automobile, a sealing material for an electronic circuit protective material, and the like. And can be used in various applications where it is desirable to have curability.
- the electronic component apparatus of the present disclosure includes an element sealed with the thermosetting resin composition of the present disclosure.
- Electronic component devices include lead frames, pre-wired tape carriers, wiring boards, glass, silicon wafers, organic substrates, and other support members, as well as elements (semiconductor chips, transistors, diodes, active elements such as thyristors, capacitors, and resistors. , A passive element such as a coil, etc.), and the element portion obtained by mounting the element portion is sealed with a thermosetting resin composition. More specifically, after fixing the element on the lead frame and connecting the terminal part and the lead part of the element such as a bonding pad by wire bonding, bumps, etc., transfer molding or the like using a thermosetting resin composition or the like.
- DIP Device Inline Package
- PLCC Physical Readed Chip Carrier
- QFP Quad Flat Package
- SOP Small Outline Package
- SOJ SmallOdlinePack
- TCP Teape Carrier Package having a structure in which an element connected to a tape carrier with a bump is sealed with a thermosetting resin composition.
- a COB Chip On Board
- a hybrid IC or a multi having a structure in which an element connected by wire bonding, flip chip bonding, solder, or the like to a wiring formed on a support member is sealed with a thermosetting resin composition.
- thermosetting resin composition examples thereof include BGA (Ball Grid Array), CSP, MCP (Multi Chip Package), and SiP having a structure in which an element is sealed with an object. Further, the thermosetting resin composition can also be preferably used in the printed wiring board.
- thermosetting resin composition examples include a low-pressure transfer molding method, an injection molding method, a compression molding method, and the like.
- thermosetting resin composition Each component shown below was prepared.
- the components shown in Table 1 were mixed in a container and stirred with a stirrer for 1 hour. Then, using a twin-screw kneader (biaxial extruder), melt-kneading was performed at 100 ° C. under a reduced pressure of 0.02 MPa. Then, the melt was cooled by a press roll circulated with cold water at 10 ° C., and the sheet was pulverized to prepare a powdery thermosetting resin composition.
- the numerical values of each component represent parts by mass.
- the "filler amount” means the volume-based content of the inorganic filler contained in the thermosetting resin composition.
- "-" indicates that the corresponding component was not used.
- the "solvent content” in Table 1 represents the solvent content of the mixture before kneading with the twin-screw kneader.
- thermosetting resin composition was dissolved in acetone to extract an inorganic filler.
- the D90 of the extracted inorganic filler was measured using a laser diffraction / scattering method particle size distribution measuring device (HORIBA, Ltd., LA-920). The results obtained are shown in Table 1.
- Residual solvent ratio after kneading (mass%) ((mass before heat treatment-mass after heat treatment) / mass before heat treatment) x 100 A; Residual solvent ratio is 0.5% by mass or less B; Residual solvent ratio is more than 0.5% by mass and 2% by mass or less C; Residual solvent ratio is more than 2% by mass
- thermosetting resin composition is molded by a transfer molding machine using a mold for measuring spiral flow according to EMMI-1-66 under the conditions of a mold temperature of 180 ° C., a molding pressure of 6.9 MPa, and a curing time of 120 seconds. Then, the flow distance (inch) was obtained. The results are shown in Table 1. (Evaluation of disk flow (DF)) Using a disk flow measuring flat plate mold having a 200 mm (W) x 200 mm (D) x 25 mm (H) upper mold and a 200 mm (W) x 200 mm (D) x 15 mm (H) lower mold, the upper mold is used.
- thermosetting resin composition The thermal hardness of the thermosetting resin composition was evaluated as follows. A test piece (diameter 50 mm ⁇ thickness 3 mm) for measuring thermal hardness of a thermosetting resin composition by a transfer molding machine under the conditions of a mold temperature of 175 ° C to 180 ° C, a molding pressure of 6.9 MPa, and a curing time of 90 seconds. Disk) was molded. Immediately after molding, the thermal hardness (shore D) of the test piece was measured using a shore D type hardness tester. The results are shown in Table 1.
- thermosetting resin composition was heated and melted, and the melt viscosity ( ⁇ FT) at 175 ° C. was measured using a high-grade flow tester. The results are shown in Table 1.
- the gel time (GT) of the thermosetting resin composition was measured using a curast meter manufactured by JSR Trading Co., Ltd. Measurement using a curast meter of JSR Trading Co., Ltd. was carried out for 3 g of the thermosetting resin composition at 180 ° C., and the time until the rise of the torque curve was defined as the gel time (seconds). The results are shown in Table 1.
- thermosetting resin composition was cut into a rectangular cuboid having a size of 2.0 mm ⁇ 5.0 mm ⁇ 40 mm to prepare a test piece for evaluating bending strength.
- a bending test was performed with a Tensilon universal material tester (Instron 5948, Instron) under the conditions of a distance between fulcrums of 32 mm and a crosshead speed of 1 mm / min.
- a bending stress ( ⁇ ) -displacement curve was created from Eq. (1), and the maximum stress was taken as the bending strength.
- a base material for compression molding in which chips were arranged on one surface of the substrate was prepared.
- a substrate having a size of 240 mm in width ⁇ 74 mm in length ⁇ 0.45 mm in thickness was used.
- the silicon chip one having a size of 10 mm in width ⁇ 8 mm in length ⁇ 0.4 mm in thickness and a material of silicon was used.
- the compression molding substrate was obtained by arranging a total of 12 chips (3 horizontal ⁇ 4 vertical) at the center of one surface of the substrate in a state of being separated from each other at a separation distance of 8 mm.
- thermosetting resin composition to be measured was compression-molded on the surface of the compression-molding substrate on which the chips were arranged by a compression molding apparatus.
- the molding conditions at the time of compression molding were: mold temperature: 175 ° C., molding pressure: about 10 MPa, curing time: 120 seconds, vacuum holding time: 3 seconds.
- the thickness of the cured product of the thermosetting resin composition in the compression molded product obtained by the above compression molding is 0.8 mm in the region where the chips are not arranged (that is, the region where the cured product is provided on the substrate). It was set to 0.08 mm on the chip.
- the obtained compression molded product was visually observed for the presence or absence of chip see-through and evaluated according to the following criteria. The results are shown in Table 1. A: The chip see-through cannot be visually confirmed. B; Chip see-through is slightly confirmed. C; Chip see-through is confirmed.
- a test piece for evaluating the filling property under the chip was prepared by the method for producing the compression molded product used for the chip see-through evaluation. At that time, the chip used was changed to a chip having a tunnel structure with a 0.08 mm gap. The width of the tunnel was 1.0 mm in this case.
- the evaluation method was based on the filling rate of the tunnel portion when the volume inside the tunnel structure having a width of 1.0 mm, a height of 0.08 mm, and a length of 6 mm was 100%.
- the evaluation criteria are as follows.
- the filling factor was determined by SAT (Scanning Acoustic Tomography). The results are shown in Table 1.
- thermosetting resin composition of the example has excellent filling property and suppresses the occurrence of chip see-through.
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Abstract
Description
流動性及び充填性に優れた樹脂組成物を開発するため、充填材の粒度分布を工夫した方法が提案されている(例えば、特許文献1参照)。
さらに、小粒子径の無機充填材を使用すると封止樹脂層中に無機充填材の凝集体が発生しやすくなる。その結果、素子を封止する封止樹脂層の薄型化に伴い、封止された素子が透けやすくなり、封止樹脂層により素子が十分に隠蔽されず、電子部品装置の外観不良が生じやすくなることがある。
<1> 熱硬化性樹脂と硬化剤と無機充填材とを含有し、
前記無機充填材についての、レーザー散乱回折法粒度分布測定装置により測定された体積基準の粒度分布における小径側からの累積が90%となるときの粒子径が、25μm以下であり、
180℃における円板フローが、110mmを超える熱硬化性樹脂組成物。
<2> 前記無機充填材の含有率が、熱硬化性樹脂組成物の固形分全体の60体積%以上である<1>に記載の熱硬化性樹脂組成物。
<3> 前記熱硬化性樹脂がエポキシ樹脂を含み、前記硬化剤がフェノール系硬化剤を含み、さらに硬化促進剤を含有する<1>又は<2>に記載の熱硬化性樹脂組成物。
<4> さらに溶剤を含有し、前記溶剤の含有率が、熱硬化性樹脂組成物全体の0.1質量%~2質量%である<1>~<3>のいずれか1項に記載の熱硬化性樹脂組成物。
<5> <1>~<4>のいずれか1項に記載の熱硬化性樹脂組成物により封止された素子を備える電子部品装置。
本開示において「~」を用いて示された数値範囲には、「~」の前後に記載される数値がそれぞれ最小値及び最大値として含まれる。
本開示中に段階的に記載されている数値範囲において、一つの数値範囲で記載された上限値又は下限値は、他の段階的な記載の数値範囲の上限値又は下限値に置き換えてもよい。また、本開示中に記載されている数値範囲において、その数値範囲の上限値又は下限値は、実施例に示されている値に置き換えてもよい。
本開示において、各成分には、該当する物質が複数種含まれていてもよい。組成物中に各成分に該当する物質が複数種存在する場合、各成分の含有率又は含有量は、特に断らない限り、組成物中に存在する当該複数種の物質の合計の含有率又は含有量を意味する。
本開示において、各成分に該当する粒子には、複数種の粒子が含まれていてもよい。組成物中に各成分に該当する粒子が複数種存在する場合、各成分の粒子径は、特に断らない限り、組成物中に存在する当該複数種の粒子の混合物についての値を意味する。
本開示において「固形分」とは、混合物又は熱硬化性樹脂組成物から、溶剤等の揮発性成分を除いた残りの成分を意味する。
本開示の熱硬化性樹脂組成物は、熱硬化性樹脂と硬化剤と無機充填材とを含有し、前記無機充填材についての、レーザー散乱回折法粒度分布測定装置により測定された体積基準の粒度分布における小径側からの累積が90%となるときの粒子径(以下、D90と称することがある。)が、25μm以下であり、180℃における円板フローが、110mmを超えるものである。
本開示の熱硬化性樹脂組成物は、充填性に優れ外観不良の発生が抑制される。本発明者等は、D90が25μm以下の無機充填材を使用し、且つ、180℃における円板フローが110mmを超えることで、上記課題が解決されることを見出し、本発明を完成させた。
以下、本開示の熱硬化性樹脂組成物に含有される各成分について、詳細に説明する。
本開示の熱硬化性樹脂組成物は、熱硬化性樹脂を含有する。
熱硬化性樹脂の種類は特に制限されず、エポキシ樹脂、フェノール樹脂、チオール樹脂、ユリア樹脂、メラミン樹脂、ウレタン樹脂、シリコーン樹脂、マレイミド樹脂、不飽和ポリエステル樹脂等が挙げられる。本開示では、エポキシ基を含有するアクリル樹脂等の、熱可塑性と熱硬化性の両方の性質を示すものは「熱硬化性樹脂」に含めるものとする。熱硬化性樹脂は、常温常圧下(例えば、25℃、大気圧下)で固体であっても液体であってもよく、固体であることが好ましい。熱硬化性樹脂は1種類を単独で用いても2種類以上を組み合わせて用いてもよい。
エポキシ樹脂は、1分子中に2個以上のエポキシ基を有するものであればその種類は特に制限されない。
具体的には、フェノール、クレゾール、キシレノール、レゾルシン、カテコール、ビスフェノールA、ビスフェノールF等のフェノール化合物及びα-ナフトール、β-ナフトール、ジヒドロキシナフタレン等のナフトール化合物からなる群より選ばれる少なくとも1種のフェノール性化合物と、ホルムアルデヒド、アセトアルデヒド、プロピオンアルデヒド等の脂肪族アルデヒド化合物とを酸性触媒下で縮合又は共縮合させて得られるノボラック樹脂をエポキシ化したものであるノボラック型エポキシ樹脂(フェノールノボラック型エポキシ樹脂、オルソクレゾールノボラック型エポキシ樹脂等);上記フェノール性化合物と、ベンズアルデヒド、サリチルアルデヒド等の芳香族アルデヒド化合物とを酸性触媒下で縮合又は共縮合させて得られるトリフェニルメタン型フェノール樹脂をエポキシ化したものであるトリフェニルメタン型エポキシ樹脂;上記フェノール化合物及びナフトール化合物と、アルデヒド化合物とを酸性触媒下で共縮合させて得られるノボラック樹脂をエポキシ化したものである共重合型エポキシ樹脂;ビスフェノールA、ビスフェノールF等のジグリシジルエーテルであるジフェニルメタン型エポキシ樹脂;アルキル置換又は非置換のビフェノールのジグリシジルエーテルであるビフェニル型エポキシ樹脂;スチルベン系フェノール化合物のジグリシジルエーテルであるスチルベン型エポキシ樹脂;ビスフェノールS等のジグリシジルエーテルである硫黄原子含有型エポキシ樹脂;ブタンジオール、ポリエチレングリコール、ポリプロピレングリコール等のアルコール類のグリシジルエーテルであるエポキシ樹脂;フタル酸、イソフタル酸、テトラヒドロフタル酸等の多価カルボン酸化合物のグリシジルエステルであるグリシジルエステル型エポキシ樹脂;アニリン、ジアミノジフェニルメタン、イソシアヌル酸等の窒素原子に結合した活性水素をグリシジル基で置換したものであるグリシジルアミン型エポキシ樹脂;ジシクロペンタジエンとフェノール化合物の共縮合樹脂をエポキシ化したものであるジシクロペンタジエン型エポキシ樹脂;分子内のオレフィン結合をエポキシ化したものであるビニルシクロヘキセンジエポキシド、3,4-エポキシシクロヘキシルメチル-3,4-エポキシシクロヘキサンカルボキシレート、2-(3,4-エポキシ)シクロヘキシル-5,5-スピロ(3,4-エポキシ)シクロヘキサン-m-ジオキサン等の脂環型エポキシ樹脂;パラキシリレン変性フェノール樹脂のグリシジルエーテルであるパラキシリレン変性エポキシ樹脂;メタキシリレン変性フェノール樹脂のグリシジルエーテルであるメタキシリレン変性エポキシ樹脂;テルペン変性フェノール樹脂のグリシジルエーテルであるテルペン変性エポキシ樹脂;ジシクロペンタジエン変性フェノール樹脂のグリシジルエーテルであるジシクロペンタジエン変性エポキシ樹脂;シクロペンタジエン変性フェノール樹脂のグリシジルエーテルであるシクロペンタジエン変性エポキシ樹脂;多環芳香環変性フェノール樹脂のグリシジルエーテルである多環芳香環変性エポキシ樹脂;ナフタレン環含有フェノール樹脂のグリシジルエーテルであるナフタレン型エポキシ樹脂;ハロゲン化フェノールノボラック型エポキシ樹脂;ハイドロキノン型エポキシ樹脂;トリメチロールプロパン型エポキシ樹脂;オレフィン結合を過酢酸等の過酸で酸化して得られる線状脂肪族エポキシ樹脂;フェノールアラルキル樹脂、ナフトールアラルキル樹脂等のアラルキル型フェノール樹脂をエポキシ化したものであるアラルキル型エポキシ樹脂;などが挙げられる。さらにはシリコーン樹脂のエポキシ化物、アミノフェノールのグリシジルエーテルであるアミノフェノール型エポキシ樹脂等もエポキシ樹脂として挙げられる。これらのエポキシ樹脂は、1種類を単独で用いても2種類以上を組み合わせて用いてもよい。
また、一般式(III)~(XI)における炭素数1~18の1価の有機基はアルキル基又はアリール基であることが好ましい。
本開示において、軟化点は、JIS K 7234:1986の環球法により測定された値をいう。
本開示において、融点は、JIS K 0064:1992の目視による方法に則って測定された値をいう。
本開示の熱硬化性樹脂組成物は、硬化剤を含有する。
硬化剤の種類は特に制限されず、併用する熱硬化性樹脂と硬化反応を生じる化合物であれば特に制限されない。例えば、エポキシ樹脂と併用する硬化剤としては、フェノール系硬化剤、アミン系硬化剤、酸無水物系硬化剤、ポリメルカプタン系硬化剤、ポリアミノアミド系硬化剤、イソシアネート系硬化剤、ブロックイソシアネート系硬化剤等が挙げられる。硬化剤は、1種類を単独で用いても2種類以上を組み合わせて用いてもよい。硬化剤は、常温常圧下(例えば、25℃、大気圧下)で固体であっても液体であってもよく、固体であることが好ましい。
熱硬化性樹脂がエポキシ樹脂である場合、硬化剤は、耐熱性の観点から、フェノール系硬化剤又はアミン系硬化剤が好ましい。
フェノール系硬化剤としては、例えば、1分子中に2個以上のフェノール性水酸基を有するフェノール樹脂及び多価フェノール化合物が挙げられる。具体的には、レゾルシン、カテコール、ビスフェノールA、ビスフェノールF、置換又は非置換のビフェノール等の多価フェノール化合物;フェノール、クレゾール、キシレノール、レゾルシン、カテコール、ビスフェノールA、ビスフェノールF、フェニルフェノール、アミノフェノール等のフェノール化合物及びα-ナフトール、β-ナフトール、ジヒドロキシナフタレン等のナフトール化合物からなる群より選ばれる少なくとも一種のフェノール性化合物と、ホルムアルデヒド、アセトアルデヒド、プロピオンアルデヒド等のアルデヒド化合物とを酸性触媒下で縮合又は共縮合させて得られるノボラック型フェノール樹脂;上記フェノール性化合物と、ジメトキシパラキシレン、ビス(メトキシメチル)ビフェニル等とから合成されるフェノールアラルキル樹脂、ナフトールアラルキル樹脂等のアラルキル型フェノール樹脂;パラキシリレン変性フェノール樹脂;メタキシリレン変性フェノール樹脂;メラミン変性フェノール樹脂;テルペン変性フェノール樹脂;上記フェノール性化合物と、ジシクロペンタジエンとから共重合により合成されるジシクロペンタジエン型フェノール樹脂及びジシクロペンタジエン型ナフトール樹脂;シクロペンタジエン変性フェノール樹脂;多環芳香環変性フェノール樹脂;ビフェニル型フェノール樹脂;上記フェノール性化合物と、ベンズアルデヒド、サリチルアルデヒド等の芳香族アルデヒド化合物とを酸性触媒下で縮合又は共縮合させて得られるトリフェニルメタン型フェノール樹脂;これら2種以上を共重合して得たフェノール樹脂などが挙げられる。これらのフェノール系硬化剤は、1種類を単独で用いても2種類以上を組み合わせて用いてもよい。
フェノール硬化剤の場合における水酸基当量は、JIS K0070:1992に準拠して測定された水酸基価に基づいて算出された値をいう。また、アミン系硬化剤の場合における活性水素当量は、JIS K7237:1995に準拠して測定されたアミン価に基づいて算出された値をいう。
本開示の熱硬化性樹脂組成物は、無機充填材を含有する。無機充填材についてのD90は、25μm以下とされ、20μm以下が好ましく、15μm以下がより好ましく、10μm以下がさらに好ましい。D90は、3μm以上であってもよい。
無機充填材についてのD90は、レーザー散乱回折法粒度分布測定装置により測定された値であり、例えば、有機溶剤、硝酸、王水等を用いて、熱硬化性樹脂組成物又は硬化物から無機充填材を抽出し、超音波分散機等で充分に分散して分散液を調製する。この分散液を用いて、レーザー回折散乱法粒度分布測定装置により測定される体積基準の粒度分布から、無機充填材のD90を測定することができる。
無機充填材を別途入手可能な場合、入手した無機充填材に対して上記測定を行うことで無機充填材のD90を測定してもよい。
無機充填材の体積平均粒子径は、レーザー回折散乱法粒度分布測定装置により、体積平均粒子径(D50)として測定することができる。
本開示の熱硬化性樹脂組成物において熱硬化性樹脂がエポキシ樹脂を含み、硬化剤がフェノール系硬化剤を含む場合、本開示の熱硬化性樹脂組成物は、硬化促進剤を含んでもよい。
硬化促進剤の種類は特に制限されず、熱硬化性樹脂の種類、熱硬化性樹脂組成物の所望の特性等に応じて選択できる。
例えば熱硬化性樹脂としてエポキシ樹脂を用いる場合に特に好適な硬化促進剤としては、トリフェニルホスフィン、トリフェニルホスフィンとキノン化合物との付加物等が挙げられる。
また、例えば熱硬化性樹脂としてエポキシ樹脂を用いる場合において、低温硬化が可能な硬化促進剤としては、トリブチルホスフィンと1,4-ベンゾキノンの付加物、ジメチルアミノピリジン、2-エチル-4-メチルイミダゾール、2-メチルイミダゾール、1-ベンジル-2-メチルイミダゾール等が挙げられる。
硬化促進剤は1種類を単独で用いても2種類以上を組み合わせて用いてもよい。
本開示の熱硬化性樹脂組成物は、着色剤を含有してもよい。
着色剤としてはカーボンブラック、黒色酸化チタン、有機染料、有機顔料、鉛丹、ベンガラ等の公知の着色剤を挙げることができる。着色剤の含有率は目的等に応じて適宜選択できる。着色剤は、1種類を単独で用いても2種類以上を組み合わせて用いてもよい。
本開示の熱硬化性樹脂組成物は、イオン交換体を含有してもよい。
特に、半導体装置の耐湿性及び高温放置特性を向上させる観点から、イオン交換体を含有することが好ましい。イオン交換体は特に制限されず、従来公知のものを用いることができる。具体的には、例えば、ハイドロタルサイト化合物、並びに、マグネシウム、アルミニウム、チタン、ジルコニウム及びビスマスからなる群より選ばれる少なくとも1種の元素の含水酸化物が挙げられる。イオン交換体は、1種類を単独で用いても2種類以上を組み合わせて用いてもよい。中でも、下記一般式(A)で表されるハイドロタルサイトが好ましい。
(0<X≦0.5、mは正の数)
本開示の熱硬化性樹脂組成物は、成形時における金型との良好な離型性を得る観点から、離型剤を含有してもよい。離型剤は特に制限されず、従来公知のものを用いることができる。具体的には、カルナバワックス、モンタン酸、ステアリン酸等の高級脂肪酸、高級脂肪酸金属塩、モンタン酸エステル等のエステル系ワックス、酸化ポリエチレン、非酸化ポリエチレン等のポリオレフィン系ワックスなどが挙げられる。離型剤は、1種類を単独で用いても2種類以上を組み合わせて用いてもよい。
本開示の熱硬化性樹脂組成物は、難燃剤を含有してもよい。難燃剤は特に制限されず、従来公知のものを用いることができる。具体的には、ハロゲン原子、アンチモン原子、窒素原子又はリン原子を含む有機又は無機の化合物、金属水酸化物等が挙げられる。難燃剤は、1種類を単独で用いても2種類以上を組み合わせて用いてもよい。
本開示の熱硬化性樹脂組成物は、シリコーンオイル、シリコーンゴム粒子等の応力緩和剤を含有してもよい。熱硬化性樹脂組成物が応力緩和剤を含有することにより、パッケージの反り変形及びパッケージクラックの発生をより低減させることができる。応力緩和剤としては、一般に使用されている公知の応力緩和剤(可とう剤)が挙げられる。具体的には、シリコーン系、スチレン系、オレフィン系、ウレタン系、ポリエステル系、ポリエーテル系、ポリアミド系、ポリブタジエン系等の熱可塑性エラストマー、NR(天然ゴム)、NBR(アクリロニトリル-ブタジエンゴム)、アクリルゴム、ウレタンゴム、シリコーンパウダー等のゴム粒子、メタクリル酸メチル-スチレン-ブタジエン共重合体(MBS)、メタクリル酸メチル-シリコーン共重合体、メタクリル酸メチル-アクリル酸ブチル共重合体等のコア-シェル構造を有するゴム粒子などが挙げられる。応力緩和剤は、1種類を単独で用いても2種類以上を組み合わせて用いてもよい。中でも、シリコーン系応力緩和剤が好ましい。シリコーン系応力緩和剤としては、エポキシ基を有するもの、アミノ基を有するもの、これらをポリエーテル変性したもの等が挙げられる。
本開示の熱硬化性樹脂組成物は、カップリング剤を含有してもよい。カップリング剤の種類は特に制限されず、公知のカップリング剤を使用することができる。カップリング剤としては、シランカップリング剤、チタンカップリング剤等が挙げられる。カップリング剤は、1種類を単独で使用しても、2種類以上を併用してもよい。
本開示の熱硬化性樹脂組成物は、溶剤を含有してもよい。
熱硬化性樹脂組成物中に含有される溶剤は、熱硬化性樹脂及び硬化剤の一方を溶解するものであってもよいし溶解しないものであってもよい。
熱硬化性樹脂組成物が溶剤を含有することで、無機充填材の分散性がより向上し、外観不良(特に、封止された素子が透けて見えること(チップ透け))がさらに抑制される傾向にある。
溶剤は、1種類を単独で用いても2種類以上を組み合わせて用いてもよい。
2種類以上の溶剤が併用される場合、最も沸点の高い溶剤についての常圧での沸点が、上述の範囲内であることが好ましい。
溶剤の含有率は、熱硬化性樹脂組成物を175℃にて1時間の条件で加熱し、加熱前後の質量変化に基づいて算出される。
熱硬化性樹脂組成物の粘度は、特に制限されない。成形方法、熱硬化性樹脂組成物の組成等に応じて所望の粘度となるよう調整することが好ましい。熱硬化性樹脂組成物を封止材用途で使用する場合には、成形時のワイヤ流れの起こりやすさに応じて熱硬化性樹脂組成物の粘度を調整することが好ましい。
例えば、熱硬化性樹脂組成物を封止材用途で使用する場合、ワイヤ流れの低減等の観点から、熱硬化性樹脂組成物の粘度は175℃で200Pa・s以下であることが好ましく、150Pa・s以下であることがより好ましく、100Pa・s以下であることがさらに好ましく、70Pa・s以下であることが特に好ましく、50Pa・s以下であることが極めて好ましい。熱硬化性樹脂組成物の粘度の下限値は特に限定されず、例えば、175℃で2Pa・s以上であってもよい。
熱硬化性樹脂組成物の粘度は、高化式フローテスター(例えば、株式会社島津製作所製)によって測定することができる。
円板フローは、200mm(W)×200mm(D)×25mm(H)の上型と200mm(W)×200mm(D)×15mm(H)の下型を有する円板フロー測定用平板金型を用いて、上皿天秤にて秤量した熱硬化性樹脂組成物5gを、180℃に加熱した下型の中心部にのせ、5秒後に、180℃に加熱した上型を閉じて、荷重78N、硬化時間90秒の条件で圧縮成形し、ノギスで成形品の長径(mm)及び短径(mm)を測定して、その平均値(mm)として得られた値である。
本開示の熱硬化性樹脂組成物は、いかなる工程を経て製造されたものであってもよい。
熱硬化性樹脂組成物の製造方法の一般的な手法としては、所定の配合量の成分をミキサー等によって十分混合して混合物とした後、ミキシングロール、押出機等によって混合物を溶融混練し、冷却し、粉砕する方法を挙げることができる。より具体的には、例えば、上述した成分の所定量を均一に撹拌及び混合し、予め70℃~140℃に加熱してある後述の混練装置で混練し、冷却し、粉砕する方法を挙げることができる。
混合物には溶剤が添加されてもよい。混合物に含まれる溶剤の含有率と混練を経て得られた熱硬化性樹脂組成物に含まれる溶剤の含有率とは、同じであっても異なっていてもよい。
無機充填材と溶剤とを含むスラリーを用いて熱硬化性樹脂組成物を製造する場合、既述の溶剤は、スラリーに含まれる溶剤由来であってもよい。
混合物を溶剤を除去しながら混練して熱硬化性樹脂組成物を製造する場合、当該混合物には、熱硬化性樹脂組成物中に必要に応じて含有される、硬化促進剤、応力緩和剤、イオン交換体等のその他の成分が含まれてもよい。
混合物は、熱硬化性樹脂と、硬化剤と、無機充填材と溶剤とを含むスラリーと、必要に応じて用いられる硬化促進剤、応力緩和剤、イオン交換体等のその他の成分とを、撹拌機、プラネタリミキサー等の混合機、超音波分散機、ジェットミル等の湿式の分散機などを用いて混合することで得られる。混合物を準備する際の混合条件は、混合物に含まれる成分の種類、成分の比率等によって適宜設定される。
スクリュー式混練機が有する撹拌羽根は、根本及び先端で支持されていても、根本のみで支持されていてもよい。混合性及び生産性を向上する観点から、撹拌羽根は根本のみで支持されていることが好ましい。
これらの中でも、減圧による溶剤の除去が可能となる密閉系の混練装置の一例である、スクリュー式混練機が好ましく、せん断力を容易に制御可能な観点から二軸混練機がより好ましい。
また、熱硬化性樹脂組成物が硬化促進剤を含有する場合、第一の混練温度で硬化促進剤を含まない混合物を混練して得られた第一の混練物に硬化促進剤を加え、引き続き第一の混練温度よりも低温の第二の混練温度で硬化促進剤を加えた第一の混練物をさらに混練して熱硬化性樹脂組成物を製造してもよい。
混合物の混練温度は、熱硬化性樹脂(複数種の熱硬化性樹脂を併用する場合には、融点又は軟化点が最も高い熱硬化性樹脂)の融点又は軟化点よりも10℃低い温度から70℃高い温度の範囲であることが好ましく、8℃低い温度から60℃高い温度の範囲であることがより好ましく、6℃低い温度から30℃高い温度の範囲であることがさらに好ましい。かかる温度で混練を行うことにより、熱硬化性樹脂を溶融させて流動性を維持することができるため、撹拌混合を良好に行うことができる。
ある態様では、混合物の混練温度は、30℃~150℃が好ましく、50℃~140℃がより好ましく、60℃~130℃がさらに好ましい。
本開示において、「混合物の混練温度」とは、混合物を混練装置により混練するときにおける混練装置の加熱部温度をいう。
混練装置としてスクリュー式混練機を用いる場合、溶剤の留去の観点から、スクリュー式混練機内の圧力は、0.001MPa~0.08MPaが好ましく、0.003MPa~0.06MPaがより好ましく、0.005MPa~0.05MPaがさらに好ましい。
本開示の熱硬化性樹脂組成物の用途は特に制限されず、例えば電子部品装置の封止材として種々の実装技術に用いることができる。また、本開示の熱硬化性樹脂組成物は、各種モジュール用樹脂成形体、モーター用樹脂成形体、車載用樹脂成形体、電子回路保護材用封止材等、樹脂組成物が良好な流動性及び硬化性を有することが望ましい種々の用途に用いることができる。
本開示の電子部品装置は、本開示の熱硬化性樹脂組成物により封止された素子を備える。
より具体的には、リードフレーム上に素子を固定し、ボンディングパッド等の素子の端子部とリード部とをワイヤボンディング、バンプ等で接続した後、熱硬化性樹脂組成物を用いてトランスファー成形等によって封止した構造を有するDIP(Dual Inline Package)、PLCC(Plastic Leaded Chip Carrier)、QFP(Quad Flat Package)、SOP(Small Outline Package)、SOJ(Small Outline J-lead package)、TSOP(Thin Small Outline Package)、TQFP(Thin Quad Flat Package)等の一般的な樹脂封止型IC;テープキャリアにバンプで接続した素子を熱硬化性樹脂組成物で封止した構造を有するTCP(Tape Carrier Package);支持部材上に形成した配線に、ワイヤボンディング、フリップチップボンディング、はんだ等で接続した素子を、熱硬化性樹脂組成物で封止した構造を有するCOB(Chip On Board)モジュール、ハイブリッドIC、マルチチップモジュール等;裏面に配線板接続用の端子を形成した支持部材の表面に素子を搭載し、バンプ又はワイヤボンディングにより素子と支持部材に形成された配線とを接続した後、熱硬化性樹脂組成物で素子を封止した構造を有するBGA(Ball Grid Array)、CSP、MCP(Multi Chip Package)、SiPなどが挙げられる。また、プリント配線板においても熱硬化性樹脂組成物を好適に使用することができる。
下記に示す各成分を準備した。
・エポキシ樹脂1:ジフェニルメタン型エポキシ樹脂(ビスフェノール型エポキシ樹脂、エポキシ当量190g/eq)
・エポキシ樹脂2:ビフェニレンアラルキル型エポキシ樹脂(エポキシ当量277g/eq)
・硬化剤:水酸基当量199g/eq、軟化点89℃のビフェニル骨格型フェノールアラルキル樹脂
・硬化促進剤:リン系硬化促進剤
・カップリング剤:N-フェニル-3-アミノプロピルトリメトキシシラン
・離型剤:カルナバワックス
・着色剤:カーボンブラック
・イオン交換体: ハイドロタルサイト
・溶剤1:メチルエチルケトン
・溶剤2:メチルイソブチルケトン
・無機充填材1:D90が20μmで体積平均粒子径が11μmのシリカ粒子
・無機充填材2:D90が4μmで体積平均粒子径が2μmのシリカ粒子
・無機充填材3:D90が31μmで体積平均粒子径が20μmのシリカ粒子
表1において、各成分の数値は質量部を表す。表1において「フィラ-量」は、熱硬化性樹脂組成物に含まれる無機充填材の体積基準の含有率を意味する。
なお、表1において「-」は、該当する成分を用いなかったことを表す。また、表1の「溶剤含有率」は、二軸混練機による混練前の、混合物の溶剤含有率を表す。
調製した熱硬化性樹脂組成物をアセトンに溶解し、無機充填材を抽出した。抽出された無機充填材についてのD90を、レーザー回折散乱法粒度分布測定装置(株式会社堀場製作所、LA-920)を用いて測定した。得られた結果を表1に示す。
熱硬化性樹脂組成物5gに対して、防爆乾燥機を用いて175℃/1時間で処理し、下記式から混練後残溶剤率を算出し、成形後のボイド発生の観点から下記基準で評価した。結果を表1に示す。なお、「-」は、該当する比較例について評価を行わなかったことを表す。
混練後残溶剤率(質量%)=((熱処理前の質量-熱処理後の質量)/熱処理前の質量)×100
A;残溶剤率が0.5質量%以下
B;残溶剤率が0.5質量%を超え2質量%以下
C;残溶剤率が2質量%を超える
(スパイラルフロー(SF)の評価)
EMMI-1-66に準じたスパイラルフロー測定用金型を用いて、熱硬化性樹脂組成物をトランスファー成形機により、金型温度180℃、成形圧力6.9MPa、硬化時間120秒間の条件で成形して流動距離(inch)を求めた。結果を表1に示す。
(円板フロー(DF)の評価)
200mm(W)×200mm(D)×25mm(H)の上型と200mm(W)×200mm(D)×15mm(H)の下型を有する円板フロー測定用平板金型を用いて、上皿天秤にて秤量した熱硬化性樹脂組成物5gを、180℃に加熱した下型の中心部にのせ、5秒後に、180℃に加熱した上型を閉じて、荷重78N、硬化時間120秒の条件で圧縮成形し、ノギスで成形品の長径(mm)及び短径(mm)を測定して、その平均値(mm)を円板フローとした。結果を表1に示す。
熱硬化性樹脂組成物の熱時硬度の評価を以下のようにして行った。
熱硬化性樹脂組成物を、トランスファー成形機により、金型温度175℃~180℃、成形圧力6.9MPa、硬化時間90秒の条件で熱時硬度測定用の試験片(直径50mm×厚さ3mmの円板)を成形した。成形後直ちにショアD型硬度計を用いて試験片の熱時硬度(ショアD)を測定した。結果を表1に示す。
熱硬化性樹脂組成物を加熱して溶融させ、高化式フローテスターを用いて175℃における溶融粘度(ηFT)を測定した。結果を表1に示す。
熱硬化性樹脂組成物のゲルタイム(GT)は、JSRトレーディング株式会社のキュラストメータを用いて測定した。熱硬化性樹脂組成物3gに対し、JSRトレーディング株式会社のキュラストメータを用いた測定を180℃で実施し、トルク曲線の立ち上がりまでの時間をゲルタイム(秒)とした。結果を表1に示す。
熱硬化性樹脂組成物の硬化物を2.0mm×5.0mm×40mmの直方体に切り出し、曲げ強さ評価用の試験片を作製した。この試験片を用いて、テンシロン万能材料試験機(インストロン5948、インストロン社)で支点間距離32mm・クロスヘッド速度1mm/minの条件で曲げ試験を行った。測定した結果を用いて、式(1)から曲げ応力(σ)-変位カーブを作成し、その最大応力を曲げ強さとした。また、曲げ応力-変位カーブにおける応力と変位とが線形性を示す箇所の傾きから、弾性率を求めた。
σ(MPa)=(3PL/2bh2)/9.8・・・式(1)
同じく、以下の式(2)をのび(ε)と定義した。
ε(%)=(6h/L)・Ymax・100・・・式(2)
P:曲げ荷重(kgf)
L:支点間距離(mm)
b:試験片幅(mm)
h:試験片厚さ(mm)
Y:たわみ(mm)
Ymax:破断時のたわみ
基板の一方の面にチップを配置した圧縮成形用基材を準備した。基板としては、大きさが横240mm×縦74mm×厚み0.45mmのものを用いた。シリコンチップとしては、1つあたりの大きさが横10mm×縦8mm×厚み0.4mm、材質がシリコンのものを用いた。圧縮成形用基材は、基板の一方の面の中央部に、計12個(横3個×縦4個)のチップを8mmの離間距離で互いに離間した状態で配置して得た。
次に、上記圧縮成形用基材におけるチップが配置された面に、測定対象の熱硬化性樹脂組成物をコンプレッションモールド装置にて圧縮成形した。
圧縮成形時の成形条件は、金型温度:175℃、成形圧力:約10MPa、硬化時間:120秒、真空保持時間:3秒とした。
また、上記圧縮成形により得る圧縮成形体における熱硬化性樹脂組成物の硬化物の厚みは、チップが配置されていない領域(すなわち、基板に硬化物が設けられている領域)において0.8mm、チップ上において0.08mmとした。
得られた圧縮成形体について、チップ透けの有無を目視により観察し、下記基準で評価した。結果を表1に示す。
A;目視にてチップ透けを確認できない。
B;わずかにチップ透けが確認される。
C;チップ透けが確認される。
チップ透け評価に使用した圧縮成形体の作成方法により、チップ下充填性の評価用試験片を作成した。その際、用いるチップを0.08mmギャップのトンネル構造を有するチップに変更した。トンネルの横幅は、本件では1.0mmとした。評価方法としては、幅1.0mm、高さ0.08mm、長さ6mmのトンネル構造内部の容積を100%としたときのトンネル部の充填率に基づいて評価した。評価基準は以下のとおりである。充填率は、SAT(Scanning Acoustic Tomography)により求めた。結果を表1に示す。
A;充填率が100%
B;充填率が95%以上100%未満
C;充填率が90%以上95%未満
D;充填率が90%未満
本明細書に記載された全ての文献、特許出願、及び技術規格は、個々の文献、特許出願、及び技術規格が参照により取り込まれることが具体的かつ個々に記された場合と同程度に、本明細書中に援用されて取り込まれる。
Claims (5)
- 熱硬化性樹脂と硬化剤と無機充填材とを含有し、
前記無機充填材についての、レーザー散乱回折法粒度分布測定装置により測定された体積基準の粒度分布における小径側からの累積が90%となるときの粒子径が、25μm以下であり、
180℃における円板フローが、110mmを超える熱硬化性樹脂組成物。 - 前記無機充填材の含有率が、熱硬化性樹脂組成物の固形分全体の60体積%以上である請求項1に記載の熱硬化性樹脂組成物。
- 前記熱硬化性樹脂がエポキシ樹脂を含み、前記硬化剤がフェノール系硬化剤を含み、さらに硬化促進剤を含有する請求項1又は請求項2に記載の熱硬化性樹脂組成物。
- さらに溶剤を含有し、前記溶剤の含有率が、熱硬化性樹脂組成物全体の0.1質量%~2質量%である請求項1~請求項3のいずれか1項に記載の熱硬化性樹脂組成物。
- 請求項1~請求項4のいずれか1項に記載の熱硬化性樹脂組成物により封止された素子を備える電子部品装置。
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