WO2022085584A1 - Composition de résine polyamide, corps moulé formé à partir de celle-ci, et composant pour caméras embarquées - Google Patents

Composition de résine polyamide, corps moulé formé à partir de celle-ci, et composant pour caméras embarquées Download PDF

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Publication number
WO2022085584A1
WO2022085584A1 PCT/JP2021/038212 JP2021038212W WO2022085584A1 WO 2022085584 A1 WO2022085584 A1 WO 2022085584A1 JP 2021038212 W JP2021038212 W JP 2021038212W WO 2022085584 A1 WO2022085584 A1 WO 2022085584A1
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WO
WIPO (PCT)
Prior art keywords
resin composition
filler
polyamide resin
mass
polyamide
Prior art date
Application number
PCT/JP2021/038212
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English (en)
Japanese (ja)
Inventor
聡記 長畑
Original Assignee
ユニチカ株式会社
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Filing date
Publication date
Application filed by ユニチカ株式会社 filed Critical ユニチカ株式会社
Priority to JP2022557477A priority Critical patent/JPWO2022085584A1/ja
Priority to CN202180071575.0A priority patent/CN116323758A/zh
Publication of WO2022085584A1 publication Critical patent/WO2022085584A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/04—Ingredients characterised by their shape and organic or inorganic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids

Abstract

L'invention concerne une composition de résine de polyamide qui contient 100 parties en masse de (A) un polyamide semi-aromatique et de 70 parties en masse à 250 parties en masse de (B) une charge, et qui est caractérisé en ce que le coefficient de dilatation linéaire d'un corps moulé par injection de celui-ci est de 70 × 10-6(1/°C) ou moins à 80 °C dans une direction qui est perpendiculaire à la direction d'écoulement de la résine pendant le moulage par injection.
PCT/JP2021/038212 2020-10-20 2021-10-15 Composition de résine polyamide, corps moulé formé à partir de celle-ci, et composant pour caméras embarquées WO2022085584A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2022557477A JPWO2022085584A1 (fr) 2020-10-20 2021-10-15
CN202180071575.0A CN116323758A (zh) 2020-10-20 2021-10-15 聚酰胺树脂组合物及由其构成的成型体、车载照相机用部件

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2020-176137 2020-10-20
JP2020176137 2020-10-20
JP2021130424 2021-08-10
JP2021-130424 2021-08-10

Publications (1)

Publication Number Publication Date
WO2022085584A1 true WO2022085584A1 (fr) 2022-04-28

Family

ID=81290523

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2021/038212 WO2022085584A1 (fr) 2020-10-20 2021-10-15 Composition de résine polyamide, corps moulé formé à partir de celle-ci, et composant pour caméras embarquées

Country Status (4)

Country Link
JP (1) JPWO2022085584A1 (fr)
CN (1) CN116323758A (fr)
TW (1) TW202227556A (fr)
WO (1) WO2022085584A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024069817A1 (fr) * 2022-09-28 2024-04-04 住友電工ウインテック株式会社 Bobine d'enroulement

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06240132A (ja) * 1993-02-18 1994-08-30 Fujitsu Ltd ポリアミド樹脂組成物および電子機器用筐体
JP2001106908A (ja) * 1999-08-02 2001-04-17 E I Du Pont De Nemours & Co 成形用芳香族ポリアミド組成物
JP2006193727A (ja) * 2004-12-13 2006-07-27 Toray Ind Inc ポリアミド樹脂組成物、成形品および筐体
JP2010168559A (ja) * 2008-12-26 2010-08-05 Toray Ind Inc ポリアミド樹脂組成物およびそれからなる成形品
JP2010534728A (ja) * 2007-07-23 2010-11-11 ディーエスエム アイピー アセッツ ビー．ブイ． ポリアミド組成物およびそれから製造されるボビン
JP2011148997A (ja) * 2009-12-25 2011-08-04 Toray Ind Inc ポリアミド樹脂組成物
JP2011236443A (ja) * 2005-09-22 2011-11-24 Fujitsu Ltd 植物系樹脂含有組成物及びそれを用いた植物系樹脂含有成形体
JP2018051911A (ja) * 2016-09-28 2018-04-05 富士ゼロックス株式会社 樹脂組成物、及び樹脂成形体
WO2019069805A1 (fr) * 2017-10-03 2019-04-11 三菱エンジニアリングプラスチックス株式会社 Composition de résine thermoplastique, article moulé en résine, procédé de fabrication d'un article moulé en résine métallisée, procédé de fabrication d'un article moulé en résine métallisée, et procédé de fabrication d'un composant d'un dispositif électronique portatif
JP2020180280A (ja) * 2019-04-16 2020-11-05 エーエムエス−パテント アクチェンゲゼルシャフト 強化熱可塑性成形用組成物
WO2021149674A1 (fr) * 2020-01-24 2021-07-29 東洋紡株式会社 Procédé de fabrication d'une composition de résine de polyamide

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06240132A (ja) * 1993-02-18 1994-08-30 Fujitsu Ltd ポリアミド樹脂組成物および電子機器用筐体
JP2001106908A (ja) * 1999-08-02 2001-04-17 E I Du Pont De Nemours & Co 成形用芳香族ポリアミド組成物
JP2006193727A (ja) * 2004-12-13 2006-07-27 Toray Ind Inc ポリアミド樹脂組成物、成形品および筐体
JP2011236443A (ja) * 2005-09-22 2011-11-24 Fujitsu Ltd 植物系樹脂含有組成物及びそれを用いた植物系樹脂含有成形体
JP2010534728A (ja) * 2007-07-23 2010-11-11 ディーエスエム アイピー アセッツ ビー．ブイ． ポリアミド組成物およびそれから製造されるボビン
JP2010168559A (ja) * 2008-12-26 2010-08-05 Toray Ind Inc ポリアミド樹脂組成物およびそれからなる成形品
JP2011148997A (ja) * 2009-12-25 2011-08-04 Toray Ind Inc ポリアミド樹脂組成物
JP2018051911A (ja) * 2016-09-28 2018-04-05 富士ゼロックス株式会社 樹脂組成物、及び樹脂成形体
WO2019069805A1 (fr) * 2017-10-03 2019-04-11 三菱エンジニアリングプラスチックス株式会社 Composition de résine thermoplastique, article moulé en résine, procédé de fabrication d'un article moulé en résine métallisée, procédé de fabrication d'un article moulé en résine métallisée, et procédé de fabrication d'un composant d'un dispositif électronique portatif
JP2020180280A (ja) * 2019-04-16 2020-11-05 エーエムエス−パテント アクチェンゲゼルシャフト 強化熱可塑性成形用組成物
WO2021149674A1 (fr) * 2020-01-24 2021-07-29 東洋紡株式会社 Procédé de fabrication d'une composition de résine de polyamide

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024069817A1 (fr) * 2022-09-28 2024-04-04 住友電工ウインテック株式会社 Bobine d'enroulement

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Publication number Publication date
CN116323758A (zh) 2023-06-23
TW202227556A (zh) 2022-07-16
JPWO2022085584A1 (fr) 2022-04-28

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