WO2021095642A1 - 伝送線路、伝送線路の製造方法及び電子機器 - Google Patents

伝送線路、伝送線路の製造方法及び電子機器 Download PDF

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Publication number
WO2021095642A1
WO2021095642A1 PCT/JP2020/041422 JP2020041422W WO2021095642A1 WO 2021095642 A1 WO2021095642 A1 WO 2021095642A1 JP 2020041422 W JP2020041422 W JP 2020041422W WO 2021095642 A1 WO2021095642 A1 WO 2021095642A1
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WIPO (PCT)
Prior art keywords
resin base
base material
transmission line
ground conductor
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2020/041422
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English (en)
French (fr)
Japanese (ja)
Inventor
伸郎 池本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to CN202090000854.9U priority Critical patent/CN217336036U/zh
Priority to JP2021556063A priority patent/JP7283573B2/ja
Publication of WO2021095642A1 publication Critical patent/WO2021095642A1/ja
Priority to US17/715,987 priority patent/US11956903B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/085—Triplate lines
    • H01P3/087—Suspended triplate lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09336—Signal conductors in same plane as power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout

Definitions

  • the present invention relates to a transmission line for transmitting a high frequency signal, a method for manufacturing the transmission line, and an electronic device.
  • This signal transmission line includes a laminate having a hollow portion, a signal conductor, a plurality of ground conductors, and an interlayer connecting conductor.
  • the laminated body is formed by laminating a plurality of resin base materials.
  • the signal conductor, ground conductor, and interlayer connection conductor are formed in a laminate.
  • the signal conductor is arranged so as to be exposed in the hollow portion.
  • the plurality of ground conductors are conducted by the interlayer connecting conductor.
  • An object of the present invention is to provide a transmission line having a hollow structure, a method for manufacturing a transmission line in which variations in transmission characteristics are reduced, and an electronic device.
  • the transmission line of the present invention A first resin base material having flexibility, and a first structure having a first ground conductor formed on the first resin base material, A second resin base material having flexibility, and a second structure having a first signal line and an interlayer connecting conductor formed on the second resin base material, A first spacer arranged between the first structure and the second structure, A first metal joining material for joining the first structure and the second structure via the first spacer is provided.
  • a first hollow portion is formed between the first structure and the second structure.
  • the first signal line and the first ground conductor face each other in the joining direction via the first hollow portion.
  • the first resin base material and the second resin base material are not in contact with each other.
  • the first metal bonding material is composed of a material having a melting point lower than that of the interlayer connecting conductor.
  • the method for manufacturing a transmission line of the present invention is A step of forming a first structure by forming a first ground conductor on a flexible first resin base material, and A step of forming a second structure by forming a first signal line and an interlayer connecting conductor on a flexible second resin base material.
  • the metal bonding material is composed of a material having a melting point lower than that of the interlayer connecting conductor.
  • FIG. 1 is an external perspective view of a transmission line 10 according to the first embodiment of the present invention.
  • FIG. 2 is a plan view of each layer of the transmission line 10.
  • FIG. 3 is a cross-sectional view taken along the line AA of the transmission line 10.
  • 4 (A) to 4 (F) are cross-sectional views showing a method of manufacturing the transmission line 10.
  • FIG. 5 is a conceptual side view of the mounting structure of the transmission line 10.
  • FIG. 6 is a cross-sectional view of the transmission line 50 according to the second embodiment of the present invention.
  • FIG. 7 is a cross-sectional view of the transmission line 60 according to the third embodiment of the present invention.
  • FIG. 8 is a cross-sectional view of a transmission line 70 according to a modified example of the third embodiment of the present invention.
  • FIG. 9 is a cross-sectional view of the transmission line 80 according to the fourth embodiment of the present invention.
  • FIG. 10 is a cross-sectional view of a transmission line 90 according to a fifth embodiment of the present invention.
  • FIG. 11 is a cross-sectional view of the transmission line 100 according to the sixth embodiment of the present invention.
  • FIG. 12 is a plan view of each layer of the transmission line 110 according to the seventh embodiment of the present invention.
  • FIG. 13 is a cross-sectional view of the transmission line 120 according to the eighth embodiment of the present invention.
  • FIG. 14 is a cross-sectional view of the transmission line 130 according to the ninth embodiment of the present invention.
  • FIG. 15 is a cross-sectional view of the transmission line 140 according to the tenth embodiment of the present invention.
  • FIG. 16 is a cross-sectional view of the transmission line 150 according to the eleventh embodiment of the present invention.
  • FIG. 17 is a side view of the transmission line 160 according to the twelfth embodiment of the present invention.
  • FIG. 18 is a plan view of each layer of the transmission line 180 according to the thirteenth embodiment of the present invention.
  • 19 (A) is a partial plan view of the transmission line 60 according to the embodiment of the present invention, and FIGS. 19 (B) and 19 (C) are cross-sectional views of the transmission line 60.
  • FIG. 20A is a cross-sectional view showing a state in which the connector 21 is mounted on the transmission line 60 having the configuration of the present invention, and FIG. 20B is a state in which the connector 21 is mounted on the transmission line 60X of the comparative example. It is sectional drawing which shows.
  • FIG. 1 is an external perspective view of a transmission line 10 according to the first embodiment of the present invention.
  • FIG. 2 is a plan view of each layer of the transmission line 10.
  • FIG. 3 is a cross-sectional view taken along the line AA of the transmission line 10.
  • the transmission line 10 includes structures 11A and 11B, a bonding electrode 12A, a first metal bonding material 13, and a connector 21.
  • the structure 11A is an example of the "first structure” of the present invention.
  • the structure 11B is an example of the "second structure” of the present invention.
  • the structures 11A and 11B have a planar shape and extend in one direction.
  • the structure 11A and the structure 11B are laminated so that their longitudinal directions coincide with each other.
  • the connectors 21 are provided on the upper surface of the structure 11A at both ends in the longitudinal direction of the structure 11A.
  • the terms “upper surface” and “lower surface” are for convenience to distinguish the main surface on one side from the main surface on the other side. Similarly, the terms “upper” and “lower” are for convenience to distinguish one side from the other.
  • the structure 11A and the structure 11B are joined by a metal bonding material 13A via a bonding electrode 12A constituting a spacer.
  • the junction electrode 12A is an example of the "first spacer" of the present invention.
  • the metal bonding material 13A is an example of the "first metal bonding material” of the present invention.
  • the structure 11A has a resin base material 15A and a ground conductor 17A.
  • the resin base material 15A is an example of the "first resin base material” of the present invention.
  • the ground conductor 17A is an example of the "first ground conductor” of the present invention.
  • the structure 11B has a resin base material 15B, a signal line 16, ground conductors 17B1, 17B2, and interlayer connecting conductors 18B1, 18B2.
  • the resin base material 15B is an example of the "second resin base material” of the present invention.
  • the ground conductors 17B1 and 17B2 are examples of the "second ground conductor” of the present invention.
  • the signal line 16 and the ground conductor 17A face each other via the hollow portion 14A in the joining direction (the direction in which the structure 11A and the structure 11B are joined).
  • the resin base material 15A and the resin base material 15B are not in contact with each other.
  • the resin base materials 15A and 15B are flexible and contain, for example, a liquid crystal polymer (LCP) as a main component.
  • the resin base material 15B is composed of integrated resin layers 15B1, 15B2, 15B3.
  • the resin layers 15B1, 15B2, and 15B3 are arranged in this order from the upper side to the lower side.
  • the resin base material 15A of the structure 11A may have a plurality of resin layers in the same manner as the resin base material 15B of the structure 11B.
  • the resin base materials 15A and 15B are made of the same type of material. As a result, the structures 11A and 11B can be integrated in a state in which distortion due to the difference in physical properties of the resin base materials 15A and 15B is unlikely to occur.
  • the resin base material 15A and the resin base material 15B may be made of materials having different characteristics.
  • the resin base material 15A arranged on the outside of the transmission line 10 may be made of a material having excellent weather resistance (environment resistance) or mechanical properties.
  • Weather resistance is a property that is less likely to be deformed, deteriorated, deteriorated, etc. due to changes in temperature, humidity, and the like.
  • Mechanical properties include strength such as bending strength, hardness, toughness, and the like.
  • the resin base material 15B arranged inside the transmission line 10 may be made of a material in which electrical characteristics are emphasized.
  • the resin base material 15B when setting the characteristic impedance of the transmission line 10 to a desired value, if the resin base material 15B is made of a material having a low relative permittivity, the line width of the signal line 16 can be widened, so that the conductor generated by the signal line 16 can be widened. Loss can be reduced.
  • the resin base material 15A and the resin base material 15B may be made of materials having different shades. This facilitates the identification of the base material by image recognition in the manufacturing process of the transmission line 10.
  • the bonding electrode 12A is formed on the upper surface of the resin layer 15B1.
  • the bonding electrode 12A is arranged between the structure 11A and the structure 11B.
  • the junction electrode 12A is formed by including a conductor made of the same material as the conductor constituting the signal line 16.
  • the junction electrode 12A may be formed to include a conductor thicker than the conductor constituting the signal line 16 in order to realize the thickness of the predetermined hollow portion 14A.
  • the bonding electrode 12A extends in the longitudinal direction of the structure 11B at both ends in the width direction of the structure 11B.
  • the ground conductor 17A is formed on substantially the entire lower surface of the resin base material 15A.
  • the signal line 16, the ground conductors 17B1, 17B2, and the interlayer connecting conductors 18B1, 18B2 are formed on the resin base material 15B.
  • the signal line 16 and the ground conductor 17B1 are arranged on the upper surface of the resin layer 15B2.
  • the signal line 16 extends in the longitudinal direction of the structure 11B at the center in the width direction of the structure 11B.
  • the ground conductor 17B1 extends in the longitudinal direction of the structure 11B at both ends in the width direction of the structure 11B.
  • the ground conductor 17B2 is arranged on substantially the entire lower surface of the resin layer 15B3.
  • the bonding electrode 12A, the signal line 16, and the ground conductors 17B1 and 17B2 are conductor patterns formed of, for example, Cu foil.
  • a plurality of bonding electrodes 12A and the ground conductor 17B1 may be arranged at intervals along the longitudinal direction of the structure 11B.
  • a plurality of signal lines 16 may be formed.
  • a ground conductor and an interlayer connecting conductor may be formed between the plurality of signal lines 16 in order to secure isolation between the plurality of signal lines 16.
  • the signal line 16 and the ground conductor 17A face each other via the resin base material 15B in addition to the hollow portion 14A.
  • the signal line 16 and the ground conductor 17A face each other via at least one of the hollow portion 14A and the resin base materials 15A and 15B by appropriately changing the arrangement of the signal line 16 and the ground conductor 17A. May be good.
  • the bonding electrode 12A is bonded and conducted to the ground conductor 17B1 via the interlayer connecting conductor 18B1.
  • the ground conductor 17B1 is joined and conducted to the ground conductor 17B2 via the interlayer connecting conductor 18B2.
  • a plurality of metal bonding materials 13A are arranged at both ends of the transmission line 10 in the width direction at intervals along the longitudinal direction of the transmission line 10.
  • the metal bonding material 13A joins and conducts the bonding electrode 12A and the ground conductor 17A.
  • the metal bonding material 13A joins the structure 11A and the structure 11B via the bonding electrode 12A constituting the spacer.
  • the metal bonding material 13A is composed of a material having a melting point lower than that of the interlayer connecting conductors 18B1 and 18B2.
  • the metal bonding material 13A is solder, and the interlayer connecting conductors 18B1 and 18B2 are Cu-Sn alloys.
  • the interlayer connecting conductors 18B1 and 18B2 do not have to overlap with the metal bonding material 13A when viewed in the vertical direction.
  • the hollow portion 14A is defined by the structures 11A and 11B, the bonding electrode 12A, and the first metal bonding material 13 as described above, and extends in the longitudinal direction of the transmission line 10.
  • the hollow portion 14A is surrounded by the lower surface of the ground conductor 17A, the upper surface of the resin base material 15B, and the inner end surface of the bonding electrode 12A.
  • the hollow portion 14A is formed between the signal line 16 and the ground conductor 17A.
  • the characteristic impedance of the transmission line 10 is set to a desired value, the line width of the signal line 16 can be widened, so that the conductor loss generated in the signal line 16 can be reduced.
  • a protective layer 19A is formed on the lower surface of the resin base material 15B.
  • the protective layer 19A is arranged on the entire lower surface of the resin base material 15B so as to cover the ground conductor 17B2.
  • a protective film having conductivity such as Ni / Au having excellent oxidation resistance is formed on the hollow portion 14A of the bonding electrode 12A and the ground conductor 17A or the surface exposed to the outside of the transmission line 10 by, for example, plating treatment. You may.
  • Mounting electrodes 22 are formed on the lower surface side of the resin base material 15A at both ends in the longitudinal direction of the resin base material 15A.
  • the mounting electrode 22 is connected to the end of the signal line 16 via the metal bonding material 23, the internal electrode 24, and the interlayer connecting conductor 25.
  • Openings 26 are formed at both ends of the resin base material 15A in the longitudinal direction so that a part of the ground conductor 17A and the mounting electrode 22 are exposed.
  • the connector 21 conducts to the ground conductor 17A exposed from the opening 26 and the mounting electrode 22.
  • the hollow portion 14A is formed by joining the structure 11A and the structure 11B with the metal bonding material 13A via the bonding electrode 12A. Therefore, it is easy to hold the hollow portion 14A in the joining step between the structure 11A and the structure 11B. As a result, the distance between the ground conductor 17A and the signal line 16 is less likely to fluctuate, and variations in the transmission characteristics of the transmission line 10 are reduced.
  • 4 (A) to 4 (F) are cross-sectional views showing a method of manufacturing the transmission line 10.
  • the ground conductor 17A and the mounting electrode 22 are formed by patterning the metal foil attached to the resin base material 45A by photolithography or the like. Further, an opening 26 (see FIG. 2) is formed in the resin base material 45A by using a laser or the like. As a result, the structure 41A including the plurality of structures 11A is formed.
  • the resin base materials 45B1, 45B2, 45B3 are laminated and heat pressed.
  • the resin base materials 45B1, 45B2, 45B3 are integrated to form the resin base material 45B, and the conductive paste 48 is cured to form the interlayer connecting conductors 18B1, 18B2 and the interlayer connecting conductor 25 (see FIG. 2).
  • the structure 41B including the plurality of structures 11B is formed.
  • the structures 41A and 41B are laminated and heated with the structures 41A and 41B stretched.
  • the structure 41A and the structure 41B are joined by the metal bonding material 13A via the bonding electrode 12A so that the signal line 16 and the ground conductor 17A face each other via the hollow portion 14A.
  • the resin base material 45A and the resin base material 45B are not in contact with each other.
  • the heating temperature at the time of joining is higher than the melting point of the material constituting the metal bonding material 13A and lower than the melting point of the material constituting the interlayer connecting conductors 18B1 and 18B2.
  • a hollow portion 14A can be secured between the signal line 16 and the ground conductor 17A, and the hollow portion can be secured.
  • the variation in height of 14A can be reduced.
  • the protective layer 49A is formed on the lower surface of the structure 41B by printing or the like to form the collective substrate 40 including the plurality of transmission lines 10.
  • the individual transmission lines 10 are obtained by separating the collective substrate 40 into individual pieces.
  • FIG. 5 is a side view of the electronic device 1 provided with the transmission line 10.
  • the electronic device 1 includes a transmission line 10, a circuit board 31, and a connector 32.
  • the transmission line 10 can be mounted on the circuit board 31 having a step.
  • the connector 21 of the transmission line 10 is connected to the connector 32 of the circuit board 31, respectively.
  • the transmission line 10 is bent along a step of the circuit board 31.
  • the metal bonding material 13A arranged at the bent portion BP of the transmission line 10 is bent by plastic deformation.
  • the metal bonding material 13A is plastically deformed by heating. Specifically, the metal bonding material 13A is melted or softened by heating to be deformed, and then the deformed metal bonding material 13A is cured by cooling. As a result, it is possible to obtain a transmission line 10 in which the bent shape is maintained.
  • thermoplastic resin is used as the material of the resin base materials 15A and 15B of the transmission line 10
  • the bent shape of the transmission line 10 can be maintained even by the plastic deformation of the resin base materials 15A and 15B.
  • the hollow portion 14A does not have to be provided in the bent portion BP. In this case, the hollow portion 14A is not deformed in the bent portion BP, and the transmission characteristics of the transmission line 10 are less likely to change.
  • Second Embodiment In the second embodiment, hollow portions are formed on the upper side and the lower side of the signal line.
  • FIG. 6 is a cross-sectional view of the transmission line 50 according to the second embodiment of the present invention.
  • the transmission line 50 includes structures 11A, 51B, 11C.
  • the structure 11C is an example of the "third structure" of the present invention.
  • the structures 11A, 51B, and 11C are arranged in this order from the upper side to the lower side.
  • the structure 11A and the structure 51B are joined by a metal bonding material 13A via a bonding electrode 12A constituting a spacer.
  • the structure 51B and the structure 11C are joined by a metal bonding material 13B via a bonding electrode 12B constituting a spacer.
  • the junction electrode 12B is an example of the "second spacer" of the present invention.
  • the metal bonding material 13B is an example of the "second metal bonding material" of the present invention.
  • the structure 51B has a resin base material 55B, a signal line 16, and an interlayer connecting conductor 18B1.
  • the resin base material 55B has flexibility.
  • the signal line 16 is arranged on the upper surface of the resin base material 55B.
  • the signal line 16 and the ground conductor 17A face each other in the joining direction via the hollow portion 14A.
  • the bonding electrode 12A is formed on the upper surface of the resin base material 55B.
  • the bonding electrode 12A is arranged between the structure 11A and the structure 51B.
  • the bonding electrode 12B is formed on the lower surface of the resin base material 55B.
  • the bonding electrode 12B is arranged between the structure 11B and the structure 11C.
  • the bonding electrodes 12A and 12B extend in the longitudinal direction of the structure 51B at both ends in the width direction of the structure 51B.
  • the bonding electrode 12A is bonded and conducted to the bonding electrode 12B via the interlayer connecting conductor 18B1.
  • the structure 11C has a resin base material 15C and a ground conductor 17C.
  • the resin base material 15C is an example of the "third resin base material” of the present invention.
  • the ground conductor 17C is an example of the "third ground conductor” of the present invention.
  • the resin base material 15C has flexibility.
  • the resin base material 55B and the resin base material 15C may be made of the same type of material or may be made of materials having different characteristics.
  • the ground conductor 17C is arranged on substantially the entire upper surface of the resin base material 15C. In other words, the structure 11C is configured in the same manner as the structure 11A.
  • the structure 11C is arranged below the structure 51B with the surface on which the ground conductor 17C is arranged facing upward.
  • the ground conductor 17A is arranged inside the resin base material 15A, and the ground conductor 17C is arranged inside the resin base material 15C. This eliminates the need for a protective layer to protect the ground conductors 17A and 17C.
  • the hollow portion 14B is formed by joining the structure 51B and the structure 11C via the bonding electrode 12B.
  • the hollow portion 14B is an example of the "second hollow portion" of the present invention.
  • the signal line 16 and the ground conductor 17C face each other in the joining direction via the hollow portion 14B and the resin base material 55B.
  • the resin base material 55B and the resin base material 15C are not in contact with each other.
  • the metal bonding material 13B joins and conducts the bonding electrode 12B and the ground conductor 17C.
  • the metal bonding material 13B is, for example, solder, and is composed of a material having a melting point lower than that of the interlayer connecting conductor 18B1.
  • the hollow portion 14B is also formed between the signal line 16 and the ground conductor 17C. As a result, the transmission loss of the transmission line 10 is further reduced.
  • the hollow portion is formed on the upper side and the lower side of the signal line, and the signal line faces the ground conductor via the resin base material and the hollow portion.
  • FIG. 7 is a cross-sectional view of the transmission line 60 according to the third embodiment of the present invention.
  • the transmission line 60 includes structures 61A, 61B, 61C.
  • the structures 61A, 61B, and 61C are arranged in this order from the upper side to the lower side.
  • the structure 61A and the structure 61B are joined by a metal bonding material 13A via the bonding electrodes 12A and 12C constituting the spacer.
  • the structure 61B and the structure 61C are joined by a metal bonding material 13B via the bonding electrodes 12B and 12D constituting the spacer.
  • the structure 61A has a resin base material 15A, a ground conductor 17A, and an interlayer connecting conductor 18A.
  • the ground conductor 17A is arranged on substantially the entire upper surface of the resin base material 15A.
  • the structure 61B has a resin base material 15B, a signal line 16, a ground conductor 17B1, and interlayer connecting conductors 18B1 and 18B2.
  • the signal line 16 and the ground conductor 17B1 are formed on the inner layer of the resin base material 15B as in the case of the first embodiment.
  • the structure 61C has a resin base material 15C, a ground conductor 17C, and an interlayer connecting conductor 18C.
  • the ground conductor 17C is arranged on substantially the entire lower surface of the resin base material 15C.
  • the structure 61C is configured in the same manner as the structure 61A.
  • the structure 61C is arranged below the structure 61B with the surface on which the ground conductor 17C is arranged facing downward.
  • the bonding electrodes 12A and 12B are formed on the upper surface and the lower surface of the resin base material 15B, respectively.
  • the bonding electrode 12C is formed on the lower surface of the resin base material 15A.
  • the bonding electrode 12D is formed on the upper surface of the resin base material 15C.
  • the bonding electrodes 12A and 12B are bonded and conducted to the ground conductor 17B1 via the interlayer connecting conductors 18B1 and 18B2, respectively.
  • the bonding electrode 12C is bonded and conducted to the ground conductor 17A via the interlayer connecting conductor 18A.
  • the bonding electrode 12D is bonded and conducted to the ground conductor 17C via the interlayer connecting conductor 18C.
  • the bonding electrode 12A and the bonding electrode 12C are bonded and conducted through the metal bonding material 13A.
  • the bonding electrode 12B and the bonding electrode 12D are bonded and conducted via the metal bonding material 13B.
  • the hollow portion 14A is formed by joining the structure 61A and the structure 61B via the bonding electrodes 12A and 12C.
  • the hollow portion 14B is formed by joining the structure 61B and the structure 61C via the bonding electrodes 12B and 12D.
  • the signal line 16 and the ground conductor 17A face each other in the joining direction via the hollow portion 14A and the resin base materials 15A and 15B.
  • the signal line 16 and the ground conductor 17C face each other in the joining direction via the hollow portion 14B and the resin base materials 15B and 15C.
  • Protective layers 19A and 19B are formed on the upper surface of the resin base material 15A and the lower surface of the resin base material 15C.
  • FIG. 8 is a cross-sectional view of a transmission line 70 according to a modified example of the third embodiment of the present invention.
  • the transmission line 70 differs from the transmission line 60 (see FIG. 7) in the following points.
  • the transmission line 70 includes structures 11A and 11B in place of the structures 61A and 61B, the junction electrodes 12C and 12D and the protective layers 19A and 19B.
  • the structures 11A, 61B, and 11C are arranged in this order from the upper side to the lower side.
  • the structure 11A and the structure 61B are joined by a metal bonding material 13A via a bonding electrode 12A constituting a spacer.
  • the structure 61B and the structure 11C are joined by a metal bonding material 13B via a bonding electrode 12B constituting a spacer.
  • the signal line 16 faces the ground conductor 17A via the hollow portion 14A and the resin base material. Therefore, even if the hollow portion 14A is deformed, the resin base material arranged between the signal line 16 and the ground conductor 17A prevents a short circuit between the signal line 16 and the ground conductor 17A.
  • the signal line 16 faces the ground conductor 17C via the hollow portion 14B and the resin base material. Therefore, even if the hollow portion 14B is deformed, the resin base material arranged between the signal line 16 and the ground conductor 17C prevents a short circuit between the signal line 16 and the ground conductor 17C.
  • the structure 11A and the structure 11C are preferably harder than the structure 61B.
  • the Young's modulus of the resin base material 15A of the structure 11A and the resin base material 15C of the structure 11C is preferably higher than the Young's modulus of the resin base material 15B of the structure 61B.
  • the linear expansion coefficient CTE of the resin base material 15A of the structure 11A and the resin base material 15C of the structure 11C is preferably larger than the CTE of the resin base material 15B of the structure 61B.
  • the resin base material 15A of the structure 11A and the resin base material 15C of the structure 11C are preferably made of the same material, whereby the warp of the transmission line 70 can be suppressed.
  • the resin group in which the signal line is formed so that the ratio of the resin portion located between the signal line and the ground conductor decreases in the joining direction at the position where the signal line faces the ground conductor.
  • the thickness of the material is thin.
  • FIG. 9 is a cross-sectional view of the transmission line 80 according to the fourth embodiment of the present invention.
  • the transmission line 80 differs from the transmission line 60 (see FIG. 7) according to the third embodiment in the following points.
  • the transmission line 80 includes a structure 81B having a resin base material 85B instead of the structure 61B having the resin base material 15B.
  • the resin base material 85B has a partial BM at a position where the signal line 16 faces the ground conductors 17A and 17C.
  • the portion BM of the resin base material 85B is thinner than the portion of the resin base material 85B that does not face the hollow portions 14A and 14B, in other words, the end portion of the resin base material 85B in the lateral direction.
  • the partial BM of the resin base material 85B is thinned by forming recesses on the upper surface and the lower surface of the resin base material 85B. That is, in the transmission line 60, the ratio of the resin portion located between the signal line 16 and the ground conductors 17A and 17C decreases in the joining direction at the position where the signal line 16 faces the ground conductors 17A and 17C.
  • the resin base material 85B has a portion where the thickness is reduced.
  • the partial BM of the resin base material 85B extends along the signal line 16.
  • the width of the partial BM of the resin base material 85B may be slightly wider than the width of the signal line 16, may be the same as the width of the signal line 16, or may be slightly narrower than the width of the signal line 16.
  • the partial BM of the resin base material 85B may be formed by digging (sitting) the resin base material by plasma treatment or the like.
  • the partial BM of the resin base material 85B may be formed by laminating a plurality of resin base materials having openings formed in a part thereof.
  • the ratio of the resin portion located between the signal line 16 and the ground conductors 17A and 17C is reduced in the joining direction at the position where the signal line 16 faces the ground conductors 17A and 17C.
  • the thickness of the resin base material 85B is reduced.
  • the relative permittivity between the layer on which the signal line 16 is arranged and the layer on which the ground conductors 17A and 17C are arranged is lowered. Therefore, when the characteristic impedance of the transmission line 60 is set to a desired value, the line width of the signal line 16 can be widened, so that the conductor loss generated in the signal line 16 can be reduced.
  • the junction electrode and the metal block form a spacer.
  • FIG. 10 is a cross-sectional view of the transmission line 90 according to the fifth embodiment of the present invention.
  • the transmission line 90 includes a structure 61A and a structure 11B.
  • the structure 61A and the structure 11B are joined by a metal bonding material 13A via the bonding electrodes 12A and 12C and the metal block 33.
  • Protective layers 19A and 19B are formed on the upper surface of the structure 61A and the lower surface of the structure 11B.
  • the bonding electrodes 12A and 12C and the metal block 33 form a spacer.
  • the metal block 33 is thicker than the signal line 16, the ground conductors 17A, 17B1, 17B2, and the junction electrodes 12A, 12C. That is, the spacer is formed including a conductor thicker than the conductor constituting the signal line 16.
  • the metal block 33 is arranged between the bonding electrode 12A and the bonding electrode 12C.
  • a plurality of metal blocks 33 are arranged at both ends of the transmission line 10 in the width direction at intervals along the longitudinal direction of the transmission line 90.
  • the metal block 33 is bonded and conducted to the bonding electrodes 12A and 12C by the metal bonding material 13A.
  • the junction electrodes 12A and 12C and the metal block 33 form a spacer. Therefore, the hollow portion 14A formed between the structure 61A and the structure 11B can be appropriately thickened.
  • the bonding electrode and the resin base material form a spacer.
  • FIG. 11 is a cross-sectional view of the transmission line 100 according to the sixth embodiment of the present invention.
  • the transmission line 100 differs from the transmission line 90 (see FIG. 10) according to the fifth embodiment in the following points.
  • the transmission line 100 includes a flexible resin base material 15D and a metal bonding material 103A instead of the metal block 33 and the metal bonding material 13A.
  • the bonding electrodes 12A and 12C and the resin base material 15D form a spacer.
  • the resin base material 15D is arranged between the bonding electrode 12A and the bonding electrode 12C.
  • the resin base material 15D extends in the longitudinal direction of the transmission line 100 at both ends in the width direction of the transmission line 100.
  • the resin base material 15D has a plurality of through holes formed at intervals along the longitudinal direction of the resin base material 15D.
  • the through holes of the resin base material 15D are filled with, for example, a metal bonding material 103A which is solder.
  • the metal bonding material 103A joins and conducts the bonding electrode 12A and the bonding electrode 12C.
  • the metal bonding material 103A joins the structure 61A and the structure 11B via the bonding electrodes 12A and 12C and the resin base material 15D.
  • the position of the metal bonding material 103A is fixed by filling the through hole of the resin base material 15D with the metal bonding material 103A.
  • a metal bonding material having a relatively low melting point such as solder is used.
  • the interlayer connection conductor and the bonding electrodes 12A and 12C may be bonded to each other.
  • the transmission line 100 may not be provided with the junction electrodes 12A and 12C.
  • the metal bonding material 103A is bonded to the interlayer connecting conductors 18A and 18B1.
  • a bonding electrode may be further provided on the resin base material 15D.
  • the bonding electrode on the resin base material 15D is bonded to the bonding electrode 12C via a metal bonding material.
  • a bonding electrode may be further provided under the resin base material 15D.
  • the bonding electrode under the resin base material 15D is bonded to the bonding electrode 12A via a metal bonding material.
  • a slit SL is provided in the ground conductor 17A, and the junction electrode 12A is divided into a plurality of parts.
  • FIG. 12 is a plan view of each layer of the transmission line 110 according to the seventh embodiment of the present invention.
  • the junction electrode 12A is divided into a plurality of rectangular small junction electrodes 112A (plurality of small spacers).
  • the ground conductor 17A is provided with a plurality of slits SL.
  • a plurality of rectangular connection regions A1 are provided.
  • Each of the plurality of connection regions A1 overlaps with the plurality of small junction electrodes 112A when viewed in the vertical direction.
  • the metal bonding material 13A is prevented from getting wet and spreading on the bonding electrode 12A and the ground conductor 17A. This makes it easy to keep the thickness of the metal bonding material 13A uniform, and suppresses the thickness of the hollow portion 14A from fluctuating.
  • the metal sphere 113A exists in the metal bonding material 13A.
  • FIG. 13 is a cross-sectional view of the transmission line 120 according to the eighth embodiment of the present invention.
  • the transmission line 120 includes a plurality of metal balls 113A.
  • the plurality of metal spheres 113A are spheres. Further, the sizes of the plurality of metal spheres 113 are uniform.
  • the plurality of metal balls 113A are provided in the metal bonding material 13A.
  • the metal ball 113A is made of Ni, which has a melting point higher than that of the metal bonding material 13A (that is, solder). Thereby, the thickness of the metal bonding material 13A can be made larger than the thickness of the bonding electrode 12A. As a result, the hollow portion 14A can be enlarged.
  • the protective film 300 is provided on the transmission line 50.
  • FIG. 14 is a cross-sectional view of the transmission line 130 according to the ninth embodiment of the present invention.
  • the transmission line 130 further includes a protective film 300.
  • the protective film 300 covers the surfaces of the resin base material 15A and the resin base material 55B facing each other. Specifically, the protective film 300 is provided on the lower surface of the resin base material 15A, the upper surface of the resin base material 55B, the lower surface of the resin base material 55B, and the upper surface of the resin base material 15C.
  • the thickness of the protective film 300 is reduced.
  • the thickness of the protective film 300 is, for example, thinner than the thickness of the resin base material 55B. Since the protective film 300 covers the bonding electrodes 12A and 12B, it is possible to prevent the metal bonding materials 13A and 13B from getting wet and spreading.
  • the transmission line 10 has a multi-core structure.
  • FIG. 15 is a cross-sectional view of the transmission line 140 according to the tenth embodiment of the present invention.
  • the transmission line 140 further includes a signal line 116.
  • the signal line 116 is provided on the resin base material 15B so as to extend parallel to the signal line 16.
  • a bonding electrode 12A, a ground conductor 17B1 and an interlayer connecting conductor 18B1.18B2 are provided between the signal lines 116. As a result, isolation between the signal line 16 and the signal line 116 is ensured.
  • the transmission line 10 has a multi-core structure.
  • FIG. 16 is a cross-sectional view of the transmission line 150 according to the eleventh embodiment of the present invention.
  • the transmission line 150 further includes a signal line 116.
  • the signal line 116 is provided on the resin base material 15B so as to extend parallel to the signal line 16.
  • the bonding electrode 12A, the ground conductor 17B1 and the interlayer connecting conductor 18B1.18B2 are not provided between the signal lines 116.
  • the signal line 16 and the signal line 116 form a differential transmission line.
  • the connector 21 is mounted on the surface of the two surfaces of the transmission line 160 that is separated from the hollow portion 14A.
  • FIG. 17 is a side view of the transmission line 160 according to the twelfth embodiment of the present invention.
  • the connector 21 is mounted on the surface of the two surfaces of the transmission line 160 that is separated from the hollow portion 14A.
  • the surface of the transmission line 160 that is separated from the hollow portion 14A is less likely to be deformed than the surface of the transmission line 160 that is closer to the hollow portion 14A. Therefore, the connector 21 is stably mounted on the transmission line 160.
  • the metal bonding material 13A has a rectangular shape in the transmission line 10.
  • FIG. 18 is a plan view of each layer of the transmission line 180 according to the thirteenth embodiment of the present invention.
  • the metal bonding material 13A has a rectangular shape having a long side extending in the extending direction of the signal line 16. As a result, the metal bonding material 13A effectively functions as a shield. Further, the deformation of the transmission line 180 can be suppressed more effectively.
  • 19 (A) is a partial plan view of the transmission line 60 according to the embodiment of the present invention
  • FIGS. 19 (B) and 19 (C) are cross-sectional views of the transmission line 60.
  • 19 (B) is a sectional view taken along line BB shown in FIG. 19 (A)
  • FIG. 19 (C) is a sectional view taken along the line CC shown in FIG. 19 (A).
  • the terminal portion of the transmission line 60 includes a bonding electrode 12A, a bonding electrode 12B, a bonding electrode 12C, a bonding electrode 12D, and a metal bonding material 13A.
  • each set in the thickness direction of the transmission line 60, from the ground conductor 17A to the ground conductor 17C, the interlayer connecting conductor 18A, the bonding electrode 12C, the metal bonding material 13A, the bonding electrode 12A, the interlayer connecting conductor 18B1, and the ground conductor 17B1 ,
  • the interlayer connecting conductor 18B2, the bonding electrode 12B, the metal bonding material 13B, the bonding electrode 12D, and the interlayer connecting conductor 18C are arranged in this order, and these are overlapped in a plan view. That is, these components form a columnar body having a predetermined strength.
  • these four columnar bodies have a hollow portion 14A between the structure 61A and the structure 61B, and between the structure 61B and the structure 61C. Holds a structure having a hollow portion 14B. Then, these four columnar bodies are arranged so as to form a rectangle in the region Re22 in a plan view.
  • the mounting electrode 22, the mounting auxiliary electrode 22A, and the interlayer connection conductor 25A are formed on the resin base material 15A. Further, an opening 171 is formed in the ground conductor 17A formed on the resin base material 15A.
  • the opening 171 is a region on the lower surface of the resin base material 15A where no conductor is formed in the ground conductor 17A.
  • the opening 171 is arranged in the above-mentioned region Re22.
  • the mounting auxiliary electrode 22A is arranged on the upper surface side of the resin base material 15A and is arranged in the opening 171. Therefore, the mounting auxiliary electrode 22A is arranged in the region Re22. Further, the mounting auxiliary electrode 22A is arranged at a position overlapping the mounting electrode 22 in a plan view.
  • the mounting auxiliary electrode 22A is connected to the mounting electrode 22 via an interlayer connection conductor 25A.
  • the mounting electrode 22 is connected to the internal electrode 24 via the metal bonding material 23, and the internal electrode 24 is connected to the signal line 16 via the interlayer connecting conductor 25.
  • solder bump 170 when the connector 21 is mounted on the transmission line 60, an opening is provided in a part of the mounting auxiliary electrode 22A and a part of the ground conductor 17A in the protective layer 19B to form a solder bump 170.
  • the forming position of the solder bump 170 on the ground conductor 17A is a position overlapping the four columnar bodies. Then, by using the solder bump 170, the mounting auxiliary electrode 22A and the ground conductor 17A are joined to each terminal of the connector 21.
  • FIG. 20A is a cross-sectional view showing a state in which the connector 21 is mounted on the transmission line 60 having the configuration of the present invention.
  • FIG. 20B is a cross-sectional view showing a state in which the connector 21 is mounted on the transmission line 60X of the comparative example.
  • the transmission line 60X of the comparative example does not include the above-mentioned columnar body connecting the ground conductor 17A and the ground conductor 17C on the central side of the mounting electrode 22 in the longitudinal direction of the transmission line 60X.
  • the connector 21 is mounted on a portion supported by four columnar bodies.
  • the connector 21 is mounted, even if the connector 21 is mounted on the transmission line 60 while applying a predetermined pressure, the connector 21 is supported by the four columnar bodies. Therefore, even if the transmission line 60 has the hollow portion 14A, the deformation of the transmission line 60, more specifically, the deformation of the structure 61A (see FIG. 20B) can be suppressed.
  • the connector 21 pushes the structure 61A at the connection portion with the ground conductor 17A on the center side of the mounting auxiliary electrode 22A. There is a high possibility that the structure 61A will be dented and deformed. Then, when the structure 61A is recessed, the connector 21 is tilted, and there is a high possibility that a joining failure will occur.
  • the connector 21 can be reliably mounted even if the transmission line 60 has a hollow portion 14A.
  • the columnar body is realized by a structure connecting the ground conductor 17A and the ground conductor 17C. Therefore, the shape of the terminal portion of the transmission line 60 can be made smaller than that of separately forming a columnar body only for supporting the connector 21. Further, by using the ground conductor 17A and the ground conductor 17C, which have a larger area than other conductors, as a part of the columnar body, the strength of the columnar body can be increased, which is better.
  • the mounting electrode 22, the mounting auxiliary electrode 22A, and the internal electrode 24 are arranged in the center of the region Re22 surrounded by the four columnar bodies.
  • the mounting electrode 22, the mounting auxiliary electrode 22A, and the internal electrode 24 are preferably included in the region Re22, and at least a part of the mounting electrode 22, the mounting auxiliary electrode 22A, and the internal electrode 24. Is included in the region Re22.
  • the area Re22 is rectangular. It is not limited to a rectangle, and may be composed of polygons of triangles or more.
  • the melting point of the solder forming the solder bump 170 preferably has the following relationship with respect to the melting point of the metal bonding material and the melting point of the interlayer connecting conductor.
  • a protective film may be patterned on the bonding electrode in order to facilitate fixing the position of the metal bonding material.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Waveguides (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
PCT/JP2020/041422 2019-11-15 2020-11-05 伝送線路、伝送線路の製造方法及び電子機器 Ceased WO2021095642A1 (ja)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2021235263A1 (https=) * 2020-05-21 2021-11-25
JP2023039599A (ja) * 2021-09-09 2023-03-22 宏達國際電子股▲ふん▼有限公司 回路板
US11700689B2 (en) 2021-08-31 2023-07-11 Htc Corporation Circuit board
WO2023233893A1 (ja) * 2022-05-31 2023-12-07 眞一 前田 電子部品の配線構造、電子部品の接続方法
JP7399402B1 (ja) 2022-11-10 2023-12-18 眞一 前田 電子部品の配線構造、電子部品の接続方法
WO2024195375A1 (ja) * 2023-03-17 2024-09-26 株式会社村田製作所 多層基板及び電子機器

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI866364B (zh) * 2022-08-02 2024-12-11 仁寶電腦工業股份有限公司 可撓性板材

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06152208A (ja) * 1992-11-06 1994-05-31 Susumu Kogyo Kk ディレイライン素子およびその製造方法
US20060288570A1 (en) * 2004-04-29 2006-12-28 International Business Machines Corporation Method and structures for implementing customizable dielectric printed circuit card traces
JP2007150526A (ja) * 2005-11-25 2007-06-14 Mitsubishi Electric Corp サスペンデット線路及び高周波パッケージ
US20080315977A1 (en) * 2007-06-22 2008-12-25 Tessera, Inc. Low loss RF transmission lines
JP2009094752A (ja) * 2007-10-09 2009-04-30 Nec Corp 高周波伝送線路
JP2011182311A (ja) * 2010-03-03 2011-09-15 Sony Corp 伝送線路
JP2013126029A (ja) * 2011-12-13 2013-06-24 Mitsubishi Electric Corp 高周波伝送線路
US20140159836A1 (en) * 2012-12-06 2014-06-12 Anaren, Inc. Laminated Ceramic RF Assembly
WO2017130731A1 (ja) * 2016-01-27 2017-08-03 株式会社村田製作所 信号伝送線路

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5546270B2 (ja) 2010-02-01 2014-07-09 三菱電機株式会社 高周波伝送線路
JP5799237B2 (ja) * 2011-07-20 2015-10-21 パナソニックＩｐマネジメント株式会社 プリント配線板
US9954263B2 (en) 2015-08-28 2018-04-24 General Electric Company Radio frequency micro-electromechanical systems having inverted microstrip transmission lines and method of making the same
WO2020130010A1 (ja) * 2018-12-20 2020-06-25 株式会社村田製作所 伝送線路部材

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06152208A (ja) * 1992-11-06 1994-05-31 Susumu Kogyo Kk ディレイライン素子およびその製造方法
US20060288570A1 (en) * 2004-04-29 2006-12-28 International Business Machines Corporation Method and structures for implementing customizable dielectric printed circuit card traces
JP2007150526A (ja) * 2005-11-25 2007-06-14 Mitsubishi Electric Corp サスペンデット線路及び高周波パッケージ
US20080315977A1 (en) * 2007-06-22 2008-12-25 Tessera, Inc. Low loss RF transmission lines
JP2009094752A (ja) * 2007-10-09 2009-04-30 Nec Corp 高周波伝送線路
JP2011182311A (ja) * 2010-03-03 2011-09-15 Sony Corp 伝送線路
JP2013126029A (ja) * 2011-12-13 2013-06-24 Mitsubishi Electric Corp 高周波伝送線路
US20140159836A1 (en) * 2012-12-06 2014-06-12 Anaren, Inc. Laminated Ceramic RF Assembly
WO2017130731A1 (ja) * 2016-01-27 2017-08-03 株式会社村田製作所 信号伝送線路

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2021235263A1 (https=) * 2020-05-21 2021-11-25
WO2021235263A1 (ja) * 2020-05-21 2021-11-25 株式会社村田製作所 信号伝送線路
JP7205667B2 (ja) 2020-05-21 2023-01-17 株式会社村田製作所 信号伝送線路
US12341233B2 (en) 2020-05-21 2025-06-24 Murata Manufacturing Co., Ltd. Signal transmission line
US11700689B2 (en) 2021-08-31 2023-07-11 Htc Corporation Circuit board
JP2023039599A (ja) * 2021-09-09 2023-03-22 宏達國際電子股▲ふん▼有限公司 回路板
JP7330241B2 (ja) 2021-09-09 2023-08-21 宏達國際電子股▲ふん▼有限公司 回路板
WO2023233893A1 (ja) * 2022-05-31 2023-12-07 眞一 前田 電子部品の配線構造、電子部品の接続方法
WO2024101348A1 (ja) * 2022-11-10 2024-05-16 眞一 前田 電子部品の配線構造、電子部品の接続方法
JP2024070155A (ja) * 2022-11-10 2024-05-22 眞一 前田 電子部品の配線構造、電子部品の接続方法
JP7531147B2 (ja) 2022-11-10 2024-08-09 眞一 前田 電子部品の配線構造、電子部品の接続方法
JP7531146B2 (ja) 2022-11-10 2024-08-09 眞一 前田 電子部品の配線構造、電子部品の接続方法
JP7598123B2 (ja) 2022-11-10 2024-12-11 眞一 前田 電子部品の配線構造、電子部品の接続方法
JP7598122B2 (ja) 2022-11-10 2024-12-11 眞一 前田 電子部品の配線構造、電子部品の接続方法
JP7399402B1 (ja) 2022-11-10 2023-12-18 眞一 前田 電子部品の配線構造、電子部品の接続方法
WO2024195375A1 (ja) * 2023-03-17 2024-09-26 株式会社村田製作所 多層基板及び電子機器

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