JP7283573B2 - 伝送線路、伝送線路の製造方法及び電子機器 - Google Patents

伝送線路、伝送線路の製造方法及び電子機器 Download PDF

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Publication number
JP7283573B2
JP7283573B2 JP2021556063A JP2021556063A JP7283573B2 JP 7283573 B2 JP7283573 B2 JP 7283573B2 JP 2021556063 A JP2021556063 A JP 2021556063A JP 2021556063 A JP2021556063 A JP 2021556063A JP 7283573 B2 JP7283573 B2 JP 7283573B2
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Japan
Prior art keywords
resin base
base material
transmission line
ground conductor
spacer
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JP2021556063A
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English (en)
Japanese (ja)
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JPWO2021095642A5 (https=
JPWO2021095642A1 (https=
Inventor
伸郎 池本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Publication date
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Publication of JPWO2021095642A5 publication Critical patent/JPWO2021095642A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/085—Triplate lines
    • H01P3/087—Suspended triplate lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09336—Signal conductors in same plane as power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Waveguides (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2021556063A 2019-11-15 2020-11-05 伝送線路、伝送線路の製造方法及び電子機器 Active JP7283573B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2019206607 2019-11-15
JP2019206607 2019-11-15
JP2020059348 2020-03-30
JP2020059348 2020-03-30
PCT/JP2020/041422 WO2021095642A1 (ja) 2019-11-15 2020-11-05 伝送線路、伝送線路の製造方法及び電子機器

Publications (3)

Publication Number Publication Date
JPWO2021095642A1 JPWO2021095642A1 (https=) 2021-05-20
JPWO2021095642A5 JPWO2021095642A5 (https=) 2022-05-31
JP7283573B2 true JP7283573B2 (ja) 2023-05-30

Family

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Family Applications (1)

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JP2021556063A Active JP7283573B2 (ja) 2019-11-15 2020-11-05 伝送線路、伝送線路の製造方法及び電子機器

Country Status (4)

Country Link
US (1) US11956903B2 (https=)
JP (1) JP7283573B2 (https=)
CN (1) CN217336036U (https=)
WO (1) WO2021095642A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN219042063U (zh) * 2020-05-21 2023-05-16 株式会社村田制作所 信号传输线路
US11700689B2 (en) 2021-08-31 2023-07-11 Htc Corporation Circuit board
JP7330241B2 (ja) * 2021-09-09 2023-08-21 宏達國際電子股▲ふん▼有限公司 回路板
JP7286902B1 (ja) * 2022-05-31 2023-06-06 眞一 前田 電子部品の配線構造、電子部品の接続方法
TWI866364B (zh) * 2022-08-02 2024-12-11 仁寶電腦工業股份有限公司 可撓性板材
JP7399402B1 (ja) * 2022-11-10 2023-12-18 眞一 前田 電子部品の配線構造、電子部品の接続方法
DE112024001307T5 (de) * 2023-03-17 2026-01-08 Murata Manufacturing Co., Ltd. Mehrschichtsubstrat und elektronische Vorrichtung

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060288570A1 (en) 2004-04-29 2006-12-28 International Business Machines Corporation Method and structures for implementing customizable dielectric printed circuit card traces
US20080315977A1 (en) 2007-06-22 2008-12-25 Tessera, Inc. Low loss RF transmission lines
WO2017130731A1 (ja) 2016-01-27 2017-08-03 株式会社村田製作所 信号伝送線路

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3083416B2 (ja) 1992-11-06 2000-09-04 進工業株式会社 ディレイライン素子およびその製造方法
JP2007150526A (ja) * 2005-11-25 2007-06-14 Mitsubishi Electric Corp サスペンデット線路及び高周波パッケージ
JP2009094752A (ja) * 2007-10-09 2009-04-30 Nec Corp 高周波伝送線路
JP5546270B2 (ja) 2010-02-01 2014-07-09 三菱電機株式会社 高周波伝送線路
JP2011182311A (ja) * 2010-03-03 2011-09-15 Sony Corp 伝送線路
JP5799237B2 (ja) * 2011-07-20 2015-10-21 パナソニックＩｐマネジメント株式会社 プリント配線板
JP5881400B2 (ja) * 2011-12-13 2016-03-09 三菱電機株式会社 高周波伝送線路
US9270003B2 (en) * 2012-12-06 2016-02-23 Anaren, Inc. Stripline assembly having first and second pre-fired ceramic substrates bonded to each other through a conductive bonding layer
US9954263B2 (en) 2015-08-28 2018-04-24 General Electric Company Radio frequency micro-electromechanical systems having inverted microstrip transmission lines and method of making the same
WO2020130010A1 (ja) * 2018-12-20 2020-06-25 株式会社村田製作所 伝送線路部材

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060288570A1 (en) 2004-04-29 2006-12-28 International Business Machines Corporation Method and structures for implementing customizable dielectric printed circuit card traces
US20080315977A1 (en) 2007-06-22 2008-12-25 Tessera, Inc. Low loss RF transmission lines
WO2017130731A1 (ja) 2016-01-27 2017-08-03 株式会社村田製作所 信号伝送線路

Also Published As

Publication number Publication date
WO2021095642A1 (ja) 2021-05-20
US11956903B2 (en) 2024-04-09
US20220232708A1 (en) 2022-07-21
JPWO2021095642A1 (https=) 2021-05-20
CN217336036U (zh) 2022-08-30

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