JPWO2021095642A5 - - Google Patents
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- Publication number
- JPWO2021095642A5 JPWO2021095642A5 JP2021556063A JP2021556063A JPWO2021095642A5 JP WO2021095642 A5 JPWO2021095642 A5 JP WO2021095642A5 JP 2021556063 A JP2021556063 A JP 2021556063A JP 2021556063 A JP2021556063 A JP 2021556063A JP WO2021095642 A5 JPWO2021095642 A5 JP WO2021095642A5
- Authority
- JP
- Japan
- Prior art keywords
- resin base
- base material
- transmission line
- joining
- signal line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims description 327
- 229920005989 resin Polymers 0.000 claims description 222
- 239000011347 resin Substances 0.000 claims description 222
- 239000004020 conductor Substances 0.000 claims description 218
- 230000005540 biological transmission Effects 0.000 claims description 170
- 239000002184 metal Substances 0.000 claims description 108
- 239000011229 interlayer Substances 0.000 claims description 66
- 238000005304 joining Methods 0.000 claims description 56
- 125000006850 spacer group Chemical group 0.000 claims description 48
- 238000002844 melting Methods 0.000 claims description 27
- 230000008018 melting Effects 0.000 claims description 27
- 230000001681 protective effect Effects 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- 238000005452 bending Methods 0.000 claims description 3
- 230000008569 process Effects 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 16
- 229910000679 solder Inorganic materials 0.000 description 14
- 239000011241 protective layer Substances 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 230000008054 signal transmission Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 229910017755 Cu-Sn Inorganic materials 0.000 description 2
- 229910017927 Cu—Sn Inorganic materials 0.000 description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 230000007480 spreading Effects 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Images
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019206607 | 2019-11-15 | ||
| JP2019206607 | 2019-11-15 | ||
| JP2020059348 | 2020-03-30 | ||
| JP2020059348 | 2020-03-30 | ||
| PCT/JP2020/041422 WO2021095642A1 (ja) | 2019-11-15 | 2020-11-05 | 伝送線路、伝送線路の製造方法及び電子機器 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021095642A1 JPWO2021095642A1 (https=) | 2021-05-20 |
| JPWO2021095642A5 true JPWO2021095642A5 (https=) | 2022-05-31 |
| JP7283573B2 JP7283573B2 (ja) | 2023-05-30 |
Family
ID=75912950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021556063A Active JP7283573B2 (ja) | 2019-11-15 | 2020-11-05 | 伝送線路、伝送線路の製造方法及び電子機器 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US11956903B2 (https=) |
| JP (1) | JP7283573B2 (https=) |
| CN (1) | CN217336036U (https=) |
| WO (1) | WO2021095642A1 (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN219042063U (zh) * | 2020-05-21 | 2023-05-16 | 株式会社村田制作所 | 信号传输线路 |
| US11700689B2 (en) | 2021-08-31 | 2023-07-11 | Htc Corporation | Circuit board |
| JP7330241B2 (ja) * | 2021-09-09 | 2023-08-21 | 宏達國際電子股▲ふん▼有限公司 | 回路板 |
| JP7286902B1 (ja) * | 2022-05-31 | 2023-06-06 | 眞一 前田 | 電子部品の配線構造、電子部品の接続方法 |
| TWI866364B (zh) * | 2022-08-02 | 2024-12-11 | 仁寶電腦工業股份有限公司 | 可撓性板材 |
| JP7399402B1 (ja) * | 2022-11-10 | 2023-12-18 | 眞一 前田 | 電子部品の配線構造、電子部品の接続方法 |
| DE112024001307T5 (de) * | 2023-03-17 | 2026-01-08 | Murata Manufacturing Co., Ltd. | Mehrschichtsubstrat und elektronische Vorrichtung |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3083416B2 (ja) | 1992-11-06 | 2000-09-04 | 進工業株式会社 | ディレイライン素子およびその製造方法 |
| US7129417B2 (en) * | 2004-04-29 | 2006-10-31 | International Business Machines Corporation | Method and structures for implementing customizable dielectric printed circuit card traces |
| JP2007150526A (ja) * | 2005-11-25 | 2007-06-14 | Mitsubishi Electric Corp | サスペンデット線路及び高周波パッケージ |
| US7855623B2 (en) | 2007-06-22 | 2010-12-21 | Tessera, Inc. | Low loss RF transmission lines having a reference conductor with a recess portion opposite a signal conductor |
| JP2009094752A (ja) * | 2007-10-09 | 2009-04-30 | Nec Corp | 高周波伝送線路 |
| JP5546270B2 (ja) | 2010-02-01 | 2014-07-09 | 三菱電機株式会社 | 高周波伝送線路 |
| JP2011182311A (ja) * | 2010-03-03 | 2011-09-15 | Sony Corp | 伝送線路 |
| JP5799237B2 (ja) * | 2011-07-20 | 2015-10-21 | パナソニックＩｐマネジメント株式会社 | プリント配線板 |
| JP5881400B2 (ja) * | 2011-12-13 | 2016-03-09 | 三菱電機株式会社 | 高周波伝送線路 |
| US9270003B2 (en) * | 2012-12-06 | 2016-02-23 | Anaren, Inc. | Stripline assembly having first and second pre-fired ceramic substrates bonded to each other through a conductive bonding layer |
| US9954263B2 (en) | 2015-08-28 | 2018-04-24 | General Electric Company | Radio frequency micro-electromechanical systems having inverted microstrip transmission lines and method of making the same |
| CN208608339U (zh) * | 2016-01-27 | 2019-03-15 | 株式会社村田制作所 | 信号传输线路 |
| WO2020130010A1 (ja) * | 2018-12-20 | 2020-06-25 | 株式会社村田製作所 | 伝送線路部材 |
-
2020
- 2020-11-05 CN CN202090000854.9U patent/CN217336036U/zh active Active
- 2020-11-05 JP JP2021556063A patent/JP7283573B2/ja active Active
- 2020-11-05 WO PCT/JP2020/041422 patent/WO2021095642A1/ja not_active Ceased
-
2022
- 2022-04-08 US US17/715,987 patent/US11956903B2/en active Active
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