CN217336036U - 传输线路以及电子设备 - Google Patents

传输线路以及电子设备 Download PDF

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Publication number
CN217336036U
CN217336036U CN202090000854.9U CN202090000854U CN217336036U CN 217336036 U CN217336036 U CN 217336036U CN 202090000854 U CN202090000854 U CN 202090000854U CN 217336036 U CN217336036 U CN 217336036U
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CN
China
Prior art keywords
resin base
transmission line
base material
ground conductor
signal line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202090000854.9U
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English (en)
Chinese (zh)
Inventor
池本伸郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
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Publication of CN217336036U publication Critical patent/CN217336036U/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/085—Triplate lines
    • H01P3/087—Suspended triplate lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09336—Signal conductors in same plane as power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Waveguides (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CN202090000854.9U 2019-11-15 2020-11-05 传输线路以及电子设备 Active CN217336036U (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2019206607 2019-11-15
JP2019-206607 2019-11-15
JP2020-059348 2020-03-30
JP2020059348 2020-03-30
PCT/JP2020/041422 WO2021095642A1 (ja) 2019-11-15 2020-11-05 伝送線路、伝送線路の製造方法及び電子機器

Publications (1)

Publication Number Publication Date
CN217336036U true CN217336036U (zh) 2022-08-30

Family

ID=75912950

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202090000854.9U Active CN217336036U (zh) 2019-11-15 2020-11-05 传输线路以及电子设备

Country Status (4)

Country Link
US (1) US11956903B2 (https=)
JP (1) JP7283573B2 (https=)
CN (1) CN217336036U (https=)
WO (1) WO2021095642A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN219042063U (zh) * 2020-05-21 2023-05-16 株式会社村田制作所 信号传输线路
US11700689B2 (en) 2021-08-31 2023-07-11 Htc Corporation Circuit board
JP7330241B2 (ja) * 2021-09-09 2023-08-21 宏達國際電子股▲ふん▼有限公司 回路板
JP7286902B1 (ja) * 2022-05-31 2023-06-06 眞一 前田 電子部品の配線構造、電子部品の接続方法
TWI866364B (zh) * 2022-08-02 2024-12-11 仁寶電腦工業股份有限公司 可撓性板材
JP7399402B1 (ja) * 2022-11-10 2023-12-18 眞一 前田 電子部品の配線構造、電子部品の接続方法
DE112024001307T5 (de) * 2023-03-17 2026-01-08 Murata Manufacturing Co., Ltd. Mehrschichtsubstrat und elektronische Vorrichtung

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3083416B2 (ja) 1992-11-06 2000-09-04 進工業株式会社 ディレイライン素子およびその製造方法
US7129417B2 (en) * 2004-04-29 2006-10-31 International Business Machines Corporation Method and structures for implementing customizable dielectric printed circuit card traces
JP2007150526A (ja) * 2005-11-25 2007-06-14 Mitsubishi Electric Corp サスペンデット線路及び高周波パッケージ
US7855623B2 (en) 2007-06-22 2010-12-21 Tessera, Inc. Low loss RF transmission lines having a reference conductor with a recess portion opposite a signal conductor
JP2009094752A (ja) * 2007-10-09 2009-04-30 Nec Corp 高周波伝送線路
JP5546270B2 (ja) 2010-02-01 2014-07-09 三菱電機株式会社 高周波伝送線路
JP2011182311A (ja) * 2010-03-03 2011-09-15 Sony Corp 伝送線路
JP5799237B2 (ja) * 2011-07-20 2015-10-21 パナソニックＩｐマネジメント株式会社 プリント配線板
JP5881400B2 (ja) * 2011-12-13 2016-03-09 三菱電機株式会社 高周波伝送線路
US9270003B2 (en) * 2012-12-06 2016-02-23 Anaren, Inc. Stripline assembly having first and second pre-fired ceramic substrates bonded to each other through a conductive bonding layer
US9954263B2 (en) 2015-08-28 2018-04-24 General Electric Company Radio frequency micro-electromechanical systems having inverted microstrip transmission lines and method of making the same
CN208608339U (zh) * 2016-01-27 2019-03-15 株式会社村田制作所 信号传输线路
WO2020130010A1 (ja) * 2018-12-20 2020-06-25 株式会社村田製作所 伝送線路部材

Also Published As

Publication number Publication date
WO2021095642A1 (ja) 2021-05-20
US11956903B2 (en) 2024-04-09
JP7283573B2 (ja) 2023-05-30
US20220232708A1 (en) 2022-07-21
JPWO2021095642A1 (https=) 2021-05-20

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