WO2020105208A1 - Appareil de moulage de résine et procédé de fabrication d'un article moulé en résine - Google Patents

Appareil de moulage de résine et procédé de fabrication d'un article moulé en résine

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Publication number
WO2020105208A1
WO2020105208A1 PCT/JP2019/024506 JP2019024506W WO2020105208A1 WO 2020105208 A1 WO2020105208 A1 WO 2020105208A1 JP 2019024506 W JP2019024506 W JP 2019024506W WO 2020105208 A1 WO2020105208 A1 WO 2020105208A1
Authority
WO
WIPO (PCT)
Prior art keywords
mold
platen
resin molding
resin
plunger
Prior art date
Application number
PCT/JP2019/024506
Other languages
English (en)
Japanese (ja)
Inventor
秀男 市橋
Original Assignee
Ｔｏｗａ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｔｏｗａ株式会社 filed Critical Ｔｏｗａ株式会社
Priority to KR1020217015476A priority Critical patent/KR102580612B1/ko
Priority to CN201980071820.0A priority patent/CN112996644B/zh
Publication of WO2020105208A1 publication Critical patent/WO2020105208A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B29C45/021—Plunger drives; Pressure equalizing means for a plurality of transfer plungers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/64—Mould opening, closing or clamping devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Definitions

  • the present disclosure relates to a resin molding device and a method for manufacturing a resin molded product.
  • Patent Document 1 describes a so-called “single sheet” resin molding device in which an upper die and a lower die are provided only on one side of a plunger.
  • the resin molding apparatus described in Patent Document 1 performs resin molding of a molding target by transferring the resin into the cavity between the upper mold and the lower mold that are clamped.
  • the first platen, the second platen facing away from the first platen, and the first platen and the second platen are movable with respect to the first platen.
  • a movable platen, a first die holder attached to the first platen, a first die held by the first die holder, a second die holder attached to the movable platen, and a second die holder A second mold, a mold clamping mechanism that is arranged between the movable platen and the second platen, and is configured to clamp the first mold and the second mold by a press, and a plunger.
  • a transfer drive mechanism configured to transfer the resin to a cavity formed by the first mold and the second mold, and only on one side of the plunger so that the center axis of the molding target deviates from the center axis of the press. It is possible to provide a resin molding apparatus configured to be able to install a molding target.
  • a method of manufacturing a resin molded article using the above resin molding apparatus the step of placing a molding target between the first mold and the second mold
  • a method for manufacturing a resin-molded product comprising: a step of clamping a first mold and a second mold; a step of resin-molding a molding target; and a step of opening the first mold and the second mold.
  • FIG. 5 is a schematic partial cross-sectional view of a “single sheet” resin molding apparatus of a comparative example. It is a flowchart of the manufacturing method of the resin molded product of embodiment. It is a typical fragmentary sectional view illustrating an example of a process of installing a molding object between the 1st type and the 2nd type.
  • FIG. 7 is a schematic partial perspective view of a resin molding device of Example 2.
  • FIG. It is a typical expanded side view which illustrates a part of simulation conditions.
  • 5 is a simulation result of the resin molding apparatus of the first embodiment.
  • 5 is a simulation result of the resin molding apparatus of the second embodiment.
  • 9 is a simulation result of the resin molding apparatus of the third embodiment.
  • FIG. 1 shows a schematic plan view of a resin molded product manufacturing apparatus according to an embodiment.
  • the apparatus for manufacturing a resin molded product of the embodiment includes a molding module A, an inloader module B, and an outloader module C.
  • the molding module A includes a molding mechanism unit 1000 configured to be capable of resin molding a molding target such as a semiconductor chip mounted on a lead frame.
  • the in-loader module B includes an in-loader 2000 configured to be able to supply a molding target to the molding module A.
  • the outloader module C includes an outloader 3000 configured so that a resin-shaped product can be taken out from the molding module A.
  • the in-loader 2000 and the out-loader 3000 are configured to be movable in the directions indicated by the arrows in FIG.
  • the molding module A and the in-loader module B are detachably connected to each other by a connecting mechanism such as bolts and pins.
  • the molding module A and the outloader module C are also detachably connected to each other by a connecting mechanism such as bolts and pins.
  • the apparatus for manufacturing a resin molded product according to the embodiment illustrated in FIG. 1 includes two molding modules A, but the number of molding modules A can be increased or decreased according to the production amount.
  • the resin molded product manufacturing apparatus of the embodiment may include, for example, one molding module A or four molding modules A added. That is, the resin molded product manufacturing apparatus according to the embodiment can be configured to increase or decrease the number of molding modules A.
  • the molding module A, the in-loader module B, and the out-loader module C are arranged in the order shown in FIG.
  • An apparatus for manufacturing a resin molded product is configured by one master unit in which the molding module A, the in-loader module B, and the outloader module C are integrated, and one or more slave units including only the molding module A. May be. It should be noted that one molding module A can be regarded as a device for manufacturing a resin molded product according to the embodiment.
  • FIG. 2 shows a schematic perspective view of the resin molding apparatus of the embodiment.
  • the resin molding apparatus of the embodiment shown in FIG. 2 is arranged in the molding mechanism section 1000 of the apparatus for manufacturing a resin molded product of the embodiment shown in FIG.
  • the resin molding apparatus includes a first platen 200, a second platen 400, a movable platen 300, and a tie bar 500.
  • the second platen 400 faces away from the first platen 200.
  • the movable platen 300 is located between the first platen 200 and the second platen 400, and is movable between the first platen 200 and the second platen 400 along the tie bar 500 with respect to the first platen 200. Is configured.
  • the tie bar 500 is a rod-shaped member extending between the first platen 200 and the second platen 400. One end of the tie bar 500 is fixed to the first platen 200, and the other end of the tie bar 500 is fixed to the second platen 400.
  • the resin molding apparatus of the embodiment shown in FIG. 2 includes a first mold holder 30 mounted on the first platen 200, a second mold holder mounting block 50 mounted on the movable platen 300, and a second mold holder mounting block.
  • the second mold holder 40 attached to the second mold holder 50, the transfer driving mechanism 60 in the second mold holder mounting block 50, and the mold clamping mechanism 600 between the movable platen 300 and the second platen 400 are further provided.
  • the second die holder 40 is attached to the movable platen 300 via the second die holder attachment block 50.
  • FIG. 3 shows a schematic partial cross-sectional view of the resin molding device of the embodiment.
  • the resin molding apparatus includes a first die 10 held by a first die holder 30 and a second die 20 held by a second die holder 40.
  • the mold clamping mechanism 600 is capable of clamping the first mold 10 and the second mold 20 by moving the movable platen 300 with respect to the first platen 200 and pressing the first mold 10 and the second mold 20. Is configured.
  • the center axis of the press at this time is represented by the one-dot chain line AA in FIG.
  • the first mold holder 30 includes a first plate 31 and a first assist block 32.
  • the first plate 31 is configured to be attachable to the first platen 200, and includes a heat insulating plate and a heater plate in this order from the first platen 200 side.
  • the first plate 31 includes a first die mounting surface 31a to which the first die 10 can be attached.
  • the first assist block 32 is configured to be able to fix the first die 10 under the first plate 31.
  • the second mold holder 40 includes a second assist block 41 and a second plate 42.
  • the second plate 42 has a second die mounting surface 42a to which the second die 20 can be attached, and is configured to be attachable to the second die holder attachment block 50.
  • the second plate 42 includes a heat insulating plate and a heater plate in this order from the second die holder mounting block 50 side.
  • the second assist block 41 is configured to be able to fix the second die 20 on the second plate 42.
  • the first mold 10 includes a first concave portion 11, a cull portion 12, and a first mold plate 13.
  • the first recess 11 may have a shape corresponding to the shape of the molding target after resin molding.
  • the cull portion 12 is used as a resin reservoir before the resin is transferred to the molding target.
  • the first mold plate 13 is configured to be fixed to the first plate 31 of the first mold holder 30.
  • the second mold 20 includes a second recess 21, a pot 22, and a second mold plate 23.
  • the second recess 21 may have a shape corresponding to the shape of the molding target after resin molding.
  • the pot 22 is used as an installation portion for a resin used for resin molding of a molding target.
  • the second mold plate 23 is configured to be fixed to the second plate 42 of the second mold holder 40.
  • FIG. 4 shows a schematic plan view of an example of the second mold 20 used in the resin molding apparatus of the embodiment.
  • the second recess 21 of the second mold 20 is provided only on one side of the pot 22 that is also the passage through which the plunger 64 moves.
  • the shape of the second recess 21 is rectangular and the shape of the pot 22 is circular, but the shape is not limited to these.
  • FIG. 5 shows a schematic side view of an example of the transfer drive mechanism 60 used in the resin molding apparatus of the embodiment.
  • the transfer drive mechanism 60 of the example shown in FIG. 5 includes a plunger unit 61, a plunger unit support plate 62, and a transfer drive shaft 63.
  • the plunger unit 61 includes a plunger unit body 65 and a plunger 64 inside the plunger unit body 65.
  • the plunger unit main body 65 is configured such that the rod-shaped plunger 64 can move up and down inside the plunger unit main body 65.
  • the plunger unit support plate 62 is configured to support the plunger unit 61.
  • the transfer drive shaft 63 is configured to be able to move up and down the plunger unit 61 via the plunger unit support plate 62.
  • the molding target is installed between the first mold 10 and the second mold 20, and the molding of the molding target is performed. Therefore, the resin molding device according to the embodiment is a so-called “single sheet” resin molding device configured such that the molding target is installed only on one side of the plunger 64.
  • the alternate long and short dash line BB in FIG. 3 indicates the central axis of the molding object installed between the first mold 10 and the second mold 20 in the resin molding apparatus of the embodiment.
  • FIG. 6 shows a schematic partial cross-sectional view of a “single sheet” resin molding apparatus of a comparative example based on the conventional technique described in Patent Document 1 and the like. Also in the “single sheet” resin molding apparatus of the comparative example shown in FIG. 6, the molding target is placed between the first mold 10 and the second mold 20, and the molding of the molding target is performed.
  • the “single sheet” resin molding apparatus of the comparative example has a relatively wide width D2, and space saving cannot be realized.
  • the object to be molded can be installed on only one side of the plunger 64 so that the center axis of the object to be molded, which is installed between the first mold 10 and the second mold 20 represented by BB, is displaced. ing.
  • the region R1 on the side opposite to the plunger 64 side of the first die 10 and the second die 20 is narrowed as compared with the resin molding apparatus of “single sheet” of the comparative example. be able to.
  • the width D1 of the resin molding apparatus which is narrower than the width D2 of the resin molding apparatus of “single sheet” of the comparative example, is realized by at least the width of the region R1. Therefore, space saving can be realized.
  • FIG. 7 shows a flowchart of the method for manufacturing the resin molded product of the embodiment.
  • the method of manufacturing a resin molded product according to the embodiment includes a step (S10) of placing a molding target between the first mold 10 and the second mold 20, and the first mold 10 and the second mold 20.
  • the process includes a step of clamping the die 20 (S20), a step of resin-molding the molding object (S30), and a step of opening the first die 10 and the second die 20 (S40).
  • S10 a step of placing a molding target between the first mold 10 and the second mold 20, and the first mold 10 and the second mold 20.
  • the process includes a step of clamping the die 20 (S20), a step of resin-molding the molding object (S30), and a step of opening the first die 10 and the second die 20 (S40).
  • a step (S10) of placing a molding object between the first mold 10 and the second mold 20 is performed.
  • the molding target 1 is installed in the recess 21 of the second mold 20, but the invention is not limited to this.
  • the molding object 1 is between the first die 10 and the second die 20, and is formed with the center axis (one-dot chain line AA) of the press in the die clamping between the first die 10 and the second die 20. It may be installed so that the central axis of the object (one-dot chain line BB) is displaced.
  • the molding target 1 for example, a semiconductor chip mounted on a lead frame or the like can be used.
  • a step (S20) of clamping the first die 10 and the second die 20 is performed.
  • the mold clamping mechanism 600 raises the movable platen 300, moves the second mold 20 with respect to the fixed first mold 10, and This can be done by pressing 10 and the second mold 20.
  • the mold clamping between the first mold 10 and the second mold 20 may be performed by moving the first mold 10 with respect to the fixed second mold 20, and the first mold 10 and the second mold 20. It may be performed by moving both.
  • a step (S30) of resin-molding the molding object 1 is performed.
  • the resin molding of the molding target 1 can be performed as follows, for example. First, the transfer drive mechanism 60 shown in FIG. 5 raises the plunger unit 61 via the plunger unit support plate 62. As a result, the plunger 64 rises and pushes the resin supplied into the pot 22 to the outside of the pot 22. Next, the resin extruded to the outside of the pot 22 is melted and accumulated in the cull portion 12. Next, the resin after melting is transferred into the cavity 90 formed by the recess 11 of the first mold 10 and the recess 21 of the second mold 20. After that, the resin is solidified so that the molding target 1 is sealed and the resin molding of the molding target 1 is performed.
  • 11 and 12 are schematic enlarged partial sectional views illustrating the transfer of the resin 70 into the cavity 90 by the movement of the plunger 64 in the resin molding apparatus according to the embodiment.
  • the solid resin 70a is installed in the pot 22 and the plunger 64 is located under the solid resin 70a.
  • the plunger 64 pushes the solid resin 70a in the pot 22 toward the cull portion 12 of the first die 10,
  • the solid resin 70a is melted by a heater plate (not shown) of the 1st type 10, and the melted resin 70 is accumulated inside the cull portion 12.
  • the molten resin 70 is transferred onto the molding target 1 in the cavity 90 through the resin passage 14 by the pressure generated by the movement of the plunger 64.
  • the molten resin 70 is solidified, and the resin molding of the molding target 1 is completed.
  • a step (S40) of opening the first die 10 and the second die 20 is performed.
  • the mold clamping mechanism 600 lowers the movable platen 300, moves the second mold 20 with respect to the fixed first mold 10, and This can be done by releasing the press between the 10 and the second mold 20.
  • the mold opening between the first mold 10 and the second mold 20 may also be performed by moving the first mold 10 with respect to the fixed second mold 20, and the first mold 10 and the second mold 20. It may be performed by moving both.
  • the resin molded product is taken out of the resin molding device. With the above, the production of the resin molded product by the method for producing a resin molded product of the embodiment is completed.
  • the center axis of the press represented by the one-dot chain line AA in FIG. 3 and the center axis of the molding object 1 represented by the one-dot chain line BB are displaced from each other. There is. Therefore, the pressure by the press at the time of mold clamping between the first mold 10 and the second mold 20 is applied to the plunger 64 side more than the molding target 1 side of the first mold 10 and the second mold 20. During mold clamping, the first mold mounting surface 31a of the first mold holder 30 or the second mold mounting surface 42a of the second mold holder 40 may be deformed.
  • the rigidity of the first platen 200 may be locally changed in order to suppress the deformation of the first mold mounting surface 31a or the second mold mounting surface 42a during mold clamping.
  • a portion thinner than the center thickness T1 of the first platen 200 on the center axis of the press represented by the one-dot chain line AA in FIG. May be included in the region R2.
  • the portion where the thickness of the first platen 200 is thin can be bent and the pressure can be released. It is possible to suppress deformation of the surface 31a or the second mold mounting surface 42a during mold clamping.
  • the rigidity of the second mold holder mounting block 50 may be locally changed in order to suppress the deformation of the first mold mounting surface 31a or the second mold mounting surface 42a during mold clamping.
  • the second mold holder mounting block 50 has a portion thinner than the center thickness T2 of the second mold holder mounting block 50 on the center axis of the press represented by the one-dot chain line AA in FIG. It may be provided in the region R2 on the arrangement side of the plunger 64. Further, for example, a through hole may be provided in the region R2 of the second die holder mounting block 50 on the side where the plunger 64 is disposed.
  • the plunger 64 is set to the center axis of the press represented by the one-dot chain line AA in FIG.
  • the rigidity of the region R2 on the arrangement side of the plunger 64 is lower than that of the region on the non-arrangement side. This is, for example, for locally changing the rigidity of the first platen 200 or the second die holder mounting block 50, with respect to the center axis of the press represented by the one-dot chain line AA in FIG.
  • the rigidity of the region R2 on the side where the central axis of the molding target 1 is not located is lower than that of the region on the side where the central axis of the molding target 1 is represented by the one-dot chain line BB of 3 It can also be expressed as
  • the resin molding apparatus of the embodiment is movable as shown in a schematic partial sectional view of FIG.
  • a bush 80 fixed to the platen 300 and connected to the tie bar 500 so as to be movable along the tie bar 500 may be provided.
  • the bushes 80 may be fixed to the ends of the movable platen 300, for example, each of the four corners.
  • the bush 80 is fixed to the end portion of the movable platen 300, for example, to the second mold holder mounting block 50 side and the second platen 400 side of each of the four corners. May be.
  • the bush 80 when the mold 80 is clamped, the bush 80 firmly supports the movable platen 300 and suppresses the bending of the movable platen 300. Deformation can be suppressed.
  • the bush 80 is fixed to the movable platen 300 via a mounting member 81.
  • the length of the bush 80 shown in FIG. 14 can be made longer than the length of the bush 80 shown in FIG. 13, for example.
  • the bush 80 shown in FIG. 14 has an end portion of the movable platen 300, for example, a quadrangular shape. It is preferably fixed to the second mold holder mounting block 50 side and the second platen 400 side, respectively.
  • FIG. 15 shows a schematic partial perspective view of the resin molding apparatus of the first embodiment.
  • two recesses 93 are provided on the surface of the region R2 of the first platen 200 on which the plunger 64 is arranged, and the region of the second die holder mounting block 50 on the plunger 64 is arranged.
  • a through hole (not shown) is provided in R2, bushes 80 as shown in FIG. 13 are fixed to each of the four corners of the movable platen 300, and are connected to the tie bar 500 so as to be movable along the tie bar 500.
  • the resin molding apparatus has the same configuration as the resin molding apparatus of the embodiment shown in FIGS. 2 and 3.
  • FIG. 16 shows a schematic partial perspective view of the resin molding apparatus of the second embodiment.
  • the concave portion 93 is not provided on the surface of the region R2 of the first platen 200 on the side where the plunger 64 is arranged, and the region R2 of the second die holder mounting block 50 on the side where the plunger 64 is arranged.
  • the resin molding apparatus has the same configuration as that of the resin molding apparatus according to the first embodiment except that the through hole is not provided in the.
  • the bushes 80 shown in FIG. 14, which are longer than those of the resin molding apparatus of the first embodiment, are fixed to each of the four corners of the movable platen 300 and are movably connected to the tie bar 500 along the tie bar 500.
  • the resin molding apparatus has the same configuration as that of the resin molding apparatus according to the first embodiment except that it is provided.
  • a load of 120 tons is applied to the contacted portion of the second-type lead frame 92 or the like where pressure is applied.
  • the mold clamping mechanism 600 for raising and lowering the movable platen 300 has a configuration in which the toggle link mechanism is driven by a ball screw, and the toggle link mechanism and one ball screw are configured as two sets, and two sets are provided. Load 6.27 tons on each ball screw.
  • the distance d between the first mold side lead frame 91 and the second mold side lead frame 92 is set to 1 mm.
  • FIG. 18 shows the simulation result of the resin molding apparatus of Example 1
  • FIG. 19 shows the simulation result of the resin molding apparatus of Example 2.
  • FIG. 20 shows the simulation result of the resin molding apparatus of the third embodiment.
  • the numerical value below UZ (mm) means the amount of displacement with respect to the position before pressing, and the value with a minus on the left indicates the amount of displacement toward the movable platen 300 side. Meaning, a numerical value without a minus on the left means a displacement amount to the first platen 200 side.
  • Table 1 also shows the maximum displacement values [mm] of the first mold side lead frame 91 and the second mold side lead frame 92 after pressing in the resin molding apparatuses of Examples 1 to 3 as compared with before displacement.
  • a minimum value [mm] and a difference [mm] that is a value obtained by subtracting the minimum value from the maximum value of the displacement amount.
  • the numbers with “+” on the left side are the first platen 200 side.
  • the numerical value with “ ⁇ ” attached to the left means the amount to the movable platen 300 side.
  • the numerical value in the column of “total difference [mm]” of the displacement amount in Table 1 is the same as the numerical value in the column of “difference [mm]” of the first mold mounting surface 31a of Table 1 and the second mold mounting surface 42a. It is a numerical value obtained by adding the numerical value in the "difference [mm]" column.
  • the deformation amount of this lead frame It can be considered that the result of the simulation corresponds to the amount of deformation of the die mounting surface.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

L'invention concerne un appareil de moulage de résine comprenant : un premier moule (10) qui est maintenu par un premier support de moule (30) fixé à un premier plateau (200) ; un second moule (20) qui est maintenu par un second support de moule (40) fixé à un plateau mobile (300) ; un mécanisme de serrage (600) conçu pour serrer le premier moule (10) et le second moule (20) au moyen d'une presse ; et un mécanisme d'entraînement de transfert (60) ayant un plongeur (64). L'appareil de moulage de résine est conçu de telle sorte qu'un objet (1) à mouler puisse être installé uniquement sur un côté du plongeur (64), l'axe central de l'objet (1) à mouler étant déplacé à partir de l'axe central de la presse.
PCT/JP2019/024506 2018-11-20 2019-06-20 Appareil de moulage de résine et procédé de fabrication d'un article moulé en résine WO2020105208A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020217015476A KR102580612B1 (ko) 2018-11-20 2019-06-20 수지 성형 장치 및 수지 성형품의 제조 방법
CN201980071820.0A CN112996644B (zh) 2018-11-20 2019-06-20 树脂成形装置及树脂成形品的制造方法

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