WO2019237643A1 - 柔性电路板、显示面板以及显示模组 - Google Patents

柔性电路板、显示面板以及显示模组 Download PDF

Info

Publication number
WO2019237643A1
WO2019237643A1 PCT/CN2018/113946 CN2018113946W WO2019237643A1 WO 2019237643 A1 WO2019237643 A1 WO 2019237643A1 CN 2018113946 W CN2018113946 W CN 2018113946W WO 2019237643 A1 WO2019237643 A1 WO 2019237643A1
Authority
WO
WIPO (PCT)
Prior art keywords
display panel
region
circuit board
flexible circuit
guiding structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2018/113946
Other languages
English (en)
French (fr)
Inventor
黄翠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to US16/494,300 priority Critical patent/US11044809B2/en
Publication of WO2019237643A1 publication Critical patent/WO2019237643A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/28—Adhesive materials or arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display

Definitions

  • the invention relates to the field of display technology, in particular to a flexible circuit board, a display panel and a display module.
  • LCD Liquid Crystal Display
  • the liquid crystal display panel needs to be controlled by an external driving chip (Integrate Circuit, IC) in order to quickly and accurately present a picture.
  • COF Chip on Film packaging technology can be used to realize the interconnection between the liquid crystal display panel and the driving chip.
  • an anisotropic conductive adhesive Anisotropic Conductive Film (ACF) presses the driver chip on the liquid crystal display panel.
  • the flexible circuit board 1000 is used to carry the driving chip 2000.
  • the ACF colloid 4000 will flow to the edge region of the display panel 3000, and connect the display panel 3000 and the glass substrate 5000 together. This will cause the display panel 3000 to be difficult to be peeled from the glass substrate 5000, and the yield of the display panel will be reduced.
  • the object of the present invention is to provide a flexible circuit board, a display panel and a display module, so as to improve the yield of the display module.
  • An embodiment of the present invention provides a flexible circuit board for connecting with a display panel, including: a substrate layer and a colloid layer;
  • the substrate layer includes a nip region and a non-compression region, the nip region is used to press-bond the flexible circuit board and the display panel together, wherein the nip region includes a flow guiding structure;
  • the colloid layer is disposed on a side of the base material layer including the flow guiding structure, and the flow guiding structure is used to guide the flow direction of the colloid in the colloid layer when the colloid layer is heated and melted.
  • the colloid layer includes conductive particles
  • the nip region further includes a plurality of pin terminals
  • the flow guiding structure includes a plurality of grooves
  • the plurality of grooves and the plurality of lead wires The pin terminals are arranged at intervals.
  • the width of the groove is greater than the diameter of the conductive particles.
  • the depth of the groove is in the range of 0-200 microns, and the length of the groove is in the range of 0-1000 microns.
  • the flow guiding structure further includes a plurality of through-holes, and the plurality of through-holes are spaced from the plurality of pin terminals.
  • the diameter of the through-holes is larger than the diameter of the conductive particles.
  • the spacing between adjacent vias ranges from 5-15 microns.
  • the diameter of the through hole ranges from 3 to 10 microns.
  • An embodiment of the present invention further provides a display panel for connecting with a flexible circuit board, including:
  • a substrate comprising a crimping region and a non-crimping region, the crimping region is used for crimping the display panel and the flexible circuit board together, and the crimping region includes a flow guiding structure;
  • a colloid layer which is disposed on a side of the substrate including the flow guiding structure, and the flow guiding structure is used for guiding the flow direction of the colloid in the colloid layer when the colloid layer is heated and melted.
  • the crimping region further includes a plurality of conductive pads
  • the flow guiding structure further includes a U-shaped groove.
  • the U-shaped groove half surrounds all the conductive pads.
  • the groove opening faces the display area of the display panel.
  • the depth of the U-shaped groove ranges from 0 to 20 microns
  • the width of the U-shaped groove ranges from 0 to 20 microns.
  • An embodiment of the present invention further provides a display module, which includes a flexible circuit board, a display panel, and a gel layer;
  • the flexible circuit board includes a base material layer, and the base material layer includes a nip region and a non-compression region;
  • the display panel includes a substrate, and the substrate includes a crimping region and a non-crimping region.
  • the crimping region is opposite to the crimping region, and the crimping region and the crimping region are used to combine the A display panel and the flexible circuit board are crimped together;
  • a colloid layer the colloid layer being disposed between the compression region of the flexible circuit board and the non-compression region of the display panel;
  • the crimping area and / or the crimping area includes a flow guiding structure, which is used to guide the flow direction of the liquid colloid in the colloid layer when the colloid layer is heated and melted.
  • the colloid layer includes conductive particles
  • the crimping region further includes a pin terminal
  • the crimping region further includes a conductive pad
  • the conductive particles are used to make the pin terminal and the pin terminal The conductive pad is electrically connected.
  • the flow guiding structure includes a plurality of grooves, the plurality of grooves are disposed in the nip region, the plurality of grooves are spaced from the plurality of pin terminals, and The width of the groove is larger than the diameter of the conductive particles.
  • the depth of the groove is in the range of 0-200 microns, and the length of the groove is in the range of 0-1000 microns.
  • the width of the groove ranges from 3 to 10 microns.
  • the flow guiding structure further includes a plurality of through-holes, the plurality of through-holes are disposed in the compression region, the plurality of through-holes are spaced apart from the plurality of pin terminals, and The diameter of the through-holes is larger than the diameter of the conductive particles, and the distance between adjacent through-holes ranges from 5-15 microns.
  • the diameter of the through hole ranges from 3 to 10 microns.
  • the flow guiding structure further includes a U-shaped groove, the U-shaped groove half surrounds all the conductive pads, and the U-shaped groove opening faces the display area of the display panel.
  • the depth of the U-shaped groove ranges from 0 to 20 microns
  • the width of the U-shaped groove ranges from 0 to 20 microns.
  • the flexible circuit board, the display panel and the display module according to the embodiments of the present invention are provided with a flow guiding structure, and during the process of pressing the flexible circuit board and the display panel, the flow guiding structure is used to guide the flow of excess liquid colloid, thereby improving the display.
  • the yield of the panel is provided with a flow guiding structure, and during the process of pressing the flexible circuit board and the display panel, the flow guiding structure is used to guide the flow of excess liquid colloid, thereby improving the display. The yield of the panel.
  • FIG. 1 is a schematic diagram of a lamination scene of a conventional flexible circuit board and a display panel.
  • FIG. 2 is a first schematic structural diagram of a flexible circuit board according to an embodiment of the present invention.
  • FIG. 3 is a second schematic structural diagram of a flexible circuit board according to an embodiment of the present invention.
  • FIG. 4 is a third schematic structural diagram of a flexible circuit board according to an embodiment of the present invention.
  • FIG. 5 is a schematic structural diagram of a display panel according to an embodiment of the present invention.
  • FIG. 6 is a schematic diagram of a first structure of a display module according to an embodiment of the present invention.
  • FIG. 7 is a schematic diagram of a second structure of a display module according to an embodiment of the present invention.
  • FIG. 8 is a third structural diagram of a display module according to an embodiment of the present invention.
  • FIG. 9 is a fourth schematic structural diagram of a display module according to an embodiment of the present invention.
  • an embodiment herein means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the invention.
  • the appearances of this phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are they independent or alternative embodiments that are mutually exclusive with other embodiments. It is clearly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.
  • Embodiments of the present invention provide a flexible circuit board, a display panel, and a display module.
  • the flexible circuit board is used for connection with a display panel.
  • FIG. 2 is a schematic structural diagram of a flexible circuit board according to an embodiment of the present invention.
  • the flexible circuit board 1 includes a base material layer 11 and a colloidal layer 12, wherein the base material layer 11 includes a compression region 111 and a non-compression region 112.
  • the base material layer 11 includes a compression region 111 and a non-compression region 112.
  • the compression region 111 is used to press-bond the flexible circuit board 1 and the display panel together.
  • the nip region 111 includes a plurality of pin terminals 1111, and the pin terminals 1111 have a conductive property.
  • the colloid layer 12 includes a substrate and conductive particles, wherein the substrate may be a thermosetting resin, and the conductive particles are wrapped in the substrate. When the colloidal layer 12 is heated and pressed, the conductive particles are released, and the flexible circuit board 1 is electrically connected to the display panel through the electrical connection between the conductive particles and the pin terminal 1111.
  • the composition material of the colloidal layer 12 may be ACF, and the ACF may be formed by a screen printing method, a slit doctor blade method, and an electrostatic spraying method.
  • a diversion structure 1112 may be provided in the nip 111, and a colloid layer 12 may be disposed on a side of the base material layer 11 including the diversion structure 1112. Therefore, when the colloid layer 12 is melted by heat, the flow direction of the liquid colloid in the colloid layer 12 can be guided by the flow guiding structure 1112.
  • the flow guiding structure 1112 includes a plurality of grooves, and the plurality of grooves are spaced from the plurality of pin terminals 1111.
  • the depth of the groove is in the range of 0-200 microns, and the length of the groove is in the range of 0-1000 microns, preferably in the range of 600-800 microns.
  • the width of the groove is smaller than the distance between adjacent pin terminals 1111, and the preferred width is 3-10 microns.
  • the width of the groove can be made larger than the diameter of the conductive particles. Specifically, laser cutting may be performed on the nip 111, and carbonization residues are removed to form grooves.
  • the flow guiding structure 1112 further includes a plurality of through holes, and the plurality of through holes are spaced from the plurality of pin terminals 1111.
  • the diameter of the through hole ranges from 3 to 10 micrometers.
  • the diameter of the through hole is directly larger than the diameter of the conductive particles and smaller than the distance between adjacent pin terminals 1111.
  • the spacing between adjacent vias ranges from 5-15 microns.
  • the flexible circuit board provided by the embodiment of the present invention improves the yield rate of the display panel by providing a flow guiding structure and using the flow guiding structure to guide the flow direction of the excess liquid colloid during the pressing process with the display panel.
  • FIG. 5 is a schematic structural diagram of a display panel according to an embodiment of the present invention.
  • the display panel 2 includes a substrate 21 and a colloid layer 22.
  • the substrate 21 is a flexible substrate.
  • the substrate 21 includes a crimping region 211 and a non-crimping region 212.
  • the crimping region 211 is used to crimp the display panel 2 and the flexible circuit board together.
  • the crimping region 211 includes a plurality of conductive layers.
  • the pad 2111 and the conductive pad 2111 have a conductive property.
  • the colloidal layer 22 includes a substrate and conductive particles.
  • the substrate may be a thermosetting resin, and the conductive particles are wrapped in the substrate.
  • the composition material of the colloid layer 22 may be ACF, and the ACF may be formed by a screen printing method, a slit doctor blade method, and an electrostatic spraying method.
  • a flow-conducting structure 2112 may be provided in the crimping region 211, and the colloidal layer 21 is provided on a side of the substrate 21 including the flow-conducting structure 211.
  • the flow-conducting structure 211 is used for guiding the colloid Flow direction.
  • the diversion structure 2112 further includes a U-shaped groove, which surrounds all the conductive pads 2111.
  • the U-shaped groove opening faces the display area a of the display panel 2. Area a is used for screen display.
  • the U-shaped groove has a depth range of 0-20 micrometers and a width range of 0-20 micrometers. It should be noted that the width can be determined according to the width of the wireless path area around the conductive pad 2111, which is not specifically limited herein.
  • the U-shaped groove is not connected with the short side of the conductive pad 2111 to avoid short circuit of the conductive pad 2111. Specifically, laser cutting can be performed on the crimping region 211 and carbonization residues are removed to form the U-shaped groove.
  • the display panel provided by the embodiment of the present invention improves the yield rate of the display panel by providing a flow-conducting structure on the substrate and using the flow-conducting structure to guide the flow direction of the excess liquid colloid during the process of pressing the flexible circuit board.
  • FIG. 6 is a schematic structural diagram of a display module according to an embodiment of the present invention.
  • the display module 3 includes a flexible circuit board 4, a display panel 5 and a gel layer 6.
  • the flexible circuit board 4 includes a substrate layer 41, and the substrate layer 41 includes a compression region 411 and a non-compression region 412.
  • the nip region 411 includes a plurality of pin terminals 4111, and the pin terminals 4111 have a conductive property.
  • the display panel 5 includes a substrate 51 including a crimping region 511 and a non-crimping region 512.
  • the crimping region 511 includes a plurality of conductive pads 5111, and the conductive pads 5111 have a conductive property.
  • the crimping region 511 is opposite to the crimping region 411, and the crimping region 511 and the crimping region 411 are used to crimp the display panel 5 and the flexible circuit board 4 together.
  • the colloid layer 6 includes a substrate and conductive particles, wherein the substrate may be a thermosetting resin, and the conductive particles are wrapped in the substrate. When the colloid layer 6 is heated and pressed, the conductive particles are released, and the conductive particles are electrically connected to the pin terminals 411 and the conductive pads 5111 respectively, so that the display panel 5 and the flexible circuit board 4 are electrically connected.
  • the composition material of the colloid layer 6 may be ACF, and the ACF may be formed by a screen printing method, a slit doctor blade method, and an electrostatic spraying method.
  • a diversion structure 7 may be provided in the crimping region 511 and / or the crimping region 411. The diversion structure 7 is used to guide the flow direction of the liquid colloid in the colloid layer 6 when the colloid layer 6 is melted by heat.
  • the flow guiding structure 7 includes a plurality of grooves, and the plurality of grooves are disposed in the pressing region 411.
  • the plurality of grooves are spaced from the plurality of pin terminals 4111.
  • the depth of the groove is in the range of 0-200 microns, and the length of the groove is in the range of 0-1000 microns, preferably in the range of 600-800 microns.
  • the width of the groove is smaller than the distance between adjacent pin terminals 4111, and the preferred width is 3-10 microns.
  • the width of the groove can be made larger than the diameter of the conductive particles. Specifically, laser cutting may be performed on the nip region 411, and carbonization residues are removed to form grooves.
  • the flow guiding structure 7 further includes a plurality of through holes, and the plurality of through holes are disposed in the compression region 411.
  • Multiple vias are spaced from multiple pin terminals 4111.
  • the diameter of the vias ranges from 3 to 10 microns.
  • the vias are directly larger than the diameter of the conductive particles and smaller than the distance between adjacent pin terminals 4111. .
  • the spacing between adjacent vias ranges from 5-15 microns.
  • the flow guiding structure 7 further includes a U-shaped groove, and the U-row groove is disposed in the crimping area 511.
  • the U-shaped groove half surrounds all the conductive pads 5111, and the U-shaped groove opening faces the display area b of the display panel 5, where the display area b is used for screen display.
  • the U-shaped groove has a depth range of 0-20 micrometers and a width range of 0-20 micrometers. It should be noted that the width can be determined according to the width of the wireless path area around the conductive pad 5111, which is not specifically limited here.
  • the U-shaped groove is not connected to the short side of the conductive pad 5111 to avoid short circuit of the conductive pad 5111. Specifically, laser cutting can be performed on the crimping region 511, and carbonization residues are removed to form the U-shaped groove.
  • the display module according to the embodiment of the present invention improves the display panel by providing a flow guiding structure on the flexible circuit and / or the display panel, and using the flow guiding structure to guide the flow direction of the excess liquid colloid during the pressing process with the display panel. Yield.

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)

Abstract

提供一种柔性电路板、显示面板以及显示模组，其中柔性电路板（1）包括基材层（11）和胶体层（12）；基材层（11）包括压合区（111）和非压合区（112），压合区（111）用于将柔性电路板（1）与显示面板（2）压接在一起，其中压合区（111）包括导流结构（1112）；胶体层（12），设置在基材层（11）包括导流结构（1112）的一侧，导流结构（1112）用于在胶体层（12）受热融化时，引导胶体层（12）中胶体的流向。

Description

柔性电路板、显示面板以及显示模组 技术领域
本发明涉及显示技术领域，特别是涉及一种柔性电路板、显示面板以及显示模组。
 背景技术
液晶显示器（Liquid Crystal Display，LCD）技术的成熟，推动着智能手机、平板电脑等电子设备的高速发展。
其中，液晶显示面板需要在外部驱动芯片（Integrate Circuit，IC）的控制下，才能快速且精确的呈现画面。可以采用COF（Chip on Film）封装技术，实现液晶显示面板和驱动芯片的互连。具体的，通过各向异方性导电胶( Anisotropic Conductive Film，ACF)将驱动芯片压合在液晶显示面板上。
由于在窄边框显示器中，显示面板与面板边缘的间距越来越小，如图1所示，柔性电路板1000用于承载驱动芯片2000，在柔性电路板1000与显示面板3000压合的过程中，ACF胶体4000受热融化后，会流动至显示面板3000边缘区，将显示面板3000与玻璃基板5000连接在一起。这样会导致显示面板3000难以从玻璃基板5000上剥离，造成显示面板良品率降低。
 技术问题
本发明的目的在于提供一种柔性电路板、显示面板以及显示模组，提高了显示模组的良品率。
 技术解决方案
本发明实施例提供了一种柔性电路板，用于与显示面板连接，包括：基材层和胶体层；
所述基材层包括压合区和非压合区，所述压合区用于将所述柔性电路板与所述显示面板压接在一起，其中所述压合区包括导流结构；
所述胶体层，设置在所述基材层包括所述导流结构的一侧，所述导流结构用于在所述胶体层受热融化时，引导所述胶体层中胶体的流向。
在一些实施例中，所述胶体层包括导电粒子，所述压合区还包括多个引脚端子，所述导流结构包括多个凹槽，所述多个凹槽与所述多个引脚端子间隔设置，所述凹槽的宽度大于所述导电粒子的直径，所述凹槽的深度范围为0-200微米，所述凹槽的长度范围为0-1000微米。
在一些实施例中，所述导流结构还包括多个通孔，所述多个通孔与所述多个引脚端子间隔设置，所述通孔的直径大于所述导电粒子的直径，相邻通孔之间间距的范围为5-15微米。
在一些实施例中，所述通孔的直径范围为3-10微米。
本发明实施例还提供了一种显示面板，用于与柔性电路板连接，包括：
基板，所述基板包括压接区和非压接区，所述压接区用于将所述显示面板和所述柔性电路板压接在一起，所述压接区包括导流结构；
胶体层，所述胶体层设置在所述基板包括所述导流结构的一侧，所述导流结构用于所述胶体层受热融化时，引导所述胶体层中胶体的流向。
在一些实施例中，所述压接区还包括多个导电衬垫，所述导流结构还包括一U型凹槽，所述U型凹槽半包围全部导电衬垫，所述第U型凹槽开口朝向所述显示面板的显示区。
在一些实施例中，所述U型凹槽的深度范围为0-20微米，所述U型凹槽的宽度范围为0-20微米。
本发明实施例还提供了一种显示模组，包括柔性电路板、显示面板以及胶体层；
所述柔性电路板包括基材层，所述基材层包括压合区和非压合区；
所述显示面板包括基板，所述基板包括压接区和非压接区，所述压接区与所述压合区相对设置，所述压接区和所述压合区用于将所述显示面板和所述柔性电路板压接在一起；
胶体层，所述胶体层设置在所述柔性电路板的所述压合区和所述显示面板的所述非压合区之间；
所述压接区和/或所述压合区包括导流结构，所述导流结构用于在所述胶体层受热融化时，引导所述胶体层中液态胶体的流向。
在一些实施例中，所述胶体层包括导电粒子，所述压合区还包括引脚端子，所述压接区还包括导电衬垫，所述导电粒子用于使所述引脚端子和所述导电衬垫电性连接。
在一些实施例中，所述导流结构包括多个凹槽，所述多个凹槽设置在所述压合区，所述多个凹槽与所述多个引脚端子间隔设置，所述凹槽的宽度大于所述导电粒子的直径，所述凹槽的深度范围为0-200微米，所述凹槽的长度范围为0-1000微米。
在一些实施例中，所述凹槽的宽度范围为3-10微米。
在一些实施例中，所述导流结构还包括多个通孔，所述多个通孔设置在所述压合区，所述多个通孔与所述多个引脚端子间隔设置，所述通孔的直径大于所述导电粒子的直径，相邻通孔之间间距的范围为5-15微米。
在一些实施例中，所述通孔的直径范围为3-10微米。
在一些实施例中，所述导流结构还包括一U型凹槽，所述U型凹槽半包围全部导电衬垫，所述第U型凹槽开口朝向所述显示面板的显示区。
在一些实施例中，所述U型凹槽的深度范围为0-20微米，所述U型凹槽的宽度范围为0-20微米。
 有益效果
本发明实施例的柔性电路板、显示面板以及显示模组，通过设置导流结构，并在柔性电路板与显示面板压合的过程中，利用导流结构引导多余液态胶体的流向，提高了显示面板的良品率。
 附图说明
为让本发明的上述内容能更明显易懂，下文特举优选实施例，并配合所附图式，作详细说明如下：
图1为现有的柔性电路板和显示面板的压合场景示意图。
图2为本发明实施例提供的柔性电路板的第一结构示意图。
图3为本发明实施例提供的柔性电路板的第二结构示意图。
图4为本发明实施例提供的柔性电路板的第三结构示意图。
图5为本发明实施例提供的显示面板的结构示意图。
图6为本发明实施例提供的显示模组的第一结构示意图。
图7为本发明实施例提供的显示模组的第二结构示意图。
图8为本发明实施例提供的显示模组的第三结构示意图。
图9为本发明实施例提供的显示模组的第四结构示意图。
 本发明的实施方式
以下各实施例的说明是参考附加的图式，用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语，例如「上」、「下」、「前」、「后」、「左」、「右」、「内」、「外」、「侧面」等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。
在图中，结构相似的单元是以相同标号表示。
在本文中提及“实施例”意味着，结合实施例描述的特定特征、结构或特性可以包含在本发明的至少一个实施例中。在说明书中的各个位置出现该短语并不一定均是指相同的实施例，也不是与其它实施例互斥的独立的或备选的实施例。本领域技术人员显式地和隐式地理解的是，本文所描述的实施例可以与其它实施例相结合。
本发明实施例提供了一种柔性电路板、显示面板以及显示模组。该柔性电路板用于与显示面板连接。请参照图2，图2为本发明实施例提供的柔性电路板的结构示意图。该柔性电路板1包括基材层11和胶体层12，其中基材层11包括压合区111和非压合区112。
其中，基材层11包括压合区111和非压合区112，压合区111用于将柔性电路板1与显示面板压接在一起。压合区111包括多个引脚端子1111，引脚端子1111具有导电性能。胶体层12中包含基材和导电粒子，其中基材可以为热固化树脂，导电粒子被包裹在基材内。当胶体层12受热压后，导电粒子释放，通过导电粒子与引脚端子1111的电性连接，使柔性电路板1与显示面板电性连接。具体的，胶体层12的组成材料可以为ACF,可以采用丝网印刷方式、狭缝刮刀方式以及静电喷塑方式形成ACF。
为了避免如图1所示的在柔性电路板与显示面板压合的过程中，胶体层12中胶体扩散到显示面板边缘区，导致显示面板和玻璃基板连接在一起，显示面板剥离受损的情况。如图2所示，可以在压合区111设置导流结构1112，并将胶体层12设置在基材层11包括导流结构1112的一侧。从而，可以在胶体层12受热融化时，通过导流结构1112引导胶体层12中液态胶体的流向。
如图3所示，导流结构1112包括多个凹槽，多个凹槽与多个引脚端子1111间隔设置。其中，凹槽的深度范围为0-200微米，凹槽的长度范围为0-1000微米，优选长度范围为600-800微米。凹槽的宽度范围小于相邻引脚端子1111之间的间距，优选的宽度范围为3-10微米。为了防止凹槽中的导电粒子串联，可以使凹槽的宽度大于导电粒子的直径。具体的，可以在压合区111上进行激光切割，并去除碳化残余，形成凹槽。
在一些实施例中，如图2和4所示，导流结构1112还包括多个通孔，多个通孔与多个引脚端子1111间隔设置。通孔的直径范围为3-10微米，优选的，该通孔的直接大于所述导电粒子的直径，小于相邻引脚端子1111的间距。相邻通孔之间间距的范围为5-15微米。
本发明实施例提供的柔性电路板，通过设置导流结构，并在与显示面板压合的过程中，利用导流结构引导多余液态胶体的流向，提高了显示面板的良品率。
本发明实施例还提供了一种显示面板，该显示面板用于与柔性电路板连接。请参照图5，图5为本发明实施例提供的显示面板的结构示意图。该显示面板2包括基板21和胶体层22。其中，基板21为柔性基板，该基板21包括压接区211和非压接区212，压接区211用于将显示面板2和柔性电路板压接在一起.压接区211包括多个导电衬垫2111，导电衬垫2111具有导电性能。胶体层22中包含基材和导电粒子，其中基材可以为热固化树脂，导电粒子被包裹在基材内。当胶体层22受热压后，导电粒子释放，通过导电粒子与导电衬垫2111的电性连接，使显示面板2与柔性电路板电性连接。具体的，胶体层22的组成材料可以为ACF,可以采用丝网印刷方式、狭缝刮刀方式以及静电喷塑方式形成ACF。
为了避免如图1所示的在柔性电路板与显示面板压合的过程中，胶体层22中胶体扩散到显示面板边缘区，导致显示面板和玻璃基板连接在一起，显示面板剥离受损的情况。可以在压接区211设置导流结构2112，并将胶体层21设置在基板21包括导流结构211的一侧，导流结构211用于胶体层21受热融化时，引导胶体层21中胶体的流向。
如图5所示，导流结构2112还包括一U型凹槽，该U型凹槽半包围全部导电衬垫2111，所述第U型凹槽开口朝向显示面板2的显示区a，其中显示区a用于画面显示。其中U型凹槽的深度范围为0-20微米，宽度范围为0-20微米，需要说明的是，宽度可以根据导电衬垫2111周围无线路区域的宽度来确定，在此不做具体限定。进一步的，该U型凹槽不与导电衬垫2111的短边相接，以避免导电衬垫2111短路。具体的，可以在压接区211上进行激光切割，并去除碳化残余，形成该U型凹槽。
本发明实施例提供的显示面板，通过在基板上设置导流结构，并在与柔性电路板压合的过程中，利用导流结构引导多余液态胶体的流向，提高了显示面板的良品率。
本发明实施例还提供了一种显示模组。请参照图6，图6为本发明实施例提供的显示模组的结构示意图。该显示模组3包括柔性电路板4、显示面板5以及胶体层6。
该柔性电路板4包括基材层41，基材层41包括压合区411和非压合区412。压合区411包括多个引脚端子4111，引脚端子4111具有导电性能。
显示面板5包括基板51，基板51包括压接区511和非压接区512。压接区511包括多个导电衬垫5111，导电衬垫5111具有导电性能。压接区511与压合区411相对设置，压接区511和压合区411用于将显示面板5和柔性电路板4压接在一起.
胶体层6包含基材和导电粒子，其中基材可以为热固化树脂，导电粒子被包裹在基材内。当胶体层6受热压后，导电粒子释放，通过导电粒子与引脚端子411、导电衬垫5111分别电性连接，使显示面板5与柔性电路板4电性连接。具体的，胶体层6的组成材料可以为ACF,可以采用丝网印刷方式、狭缝刮刀方式以及静电喷塑方式形成ACF。
为了避免如图1所示的在柔性电路板与显示面板压合的过程中，胶体层6中胶体扩散到显示面板边缘区，导致显示面板和玻璃基板连接在一起，显示面板剥离受损的情况。可以在压接区511和/或压合区411设置导流结构7，所述导流结构7用于在胶体层6受热融化时，引导胶体层6中液态胶体的流向。
如图7所示，导流结构7包括多个凹槽，该多个凹槽设置在压合区411。多个凹槽与多个引脚端子4111间隔设置。其中，凹槽的深度范围为0-200微米，凹槽的长度范围为0-1000微米，优选长度范围为600-800微米。凹槽的宽度范围小于相邻引脚端子4111之间的间距，优选的宽度范围为3-10微米。为了防止凹槽中的导电粒子串联，可以使凹槽的宽度大于导电粒子的直径。具体的，可以在压合区411上进行激光切割，并去除碳化残余，形成凹槽。
在一些实施例中，如图8所示，导流结构7还包括多个通孔，该多个通孔设置在压合区411。多个通孔与多个引脚端子4111间隔设置，通孔的直径范围为3-10微米，优选的，该通孔的直接大于所述导电粒子的直径，小于相邻引脚端子4111的间距。相邻通孔之间间距的范围为5-15微米。
如图9所示，导流结构7还包括一U型凹槽，该U行凹槽设置在压接区511。该U型凹槽半包围全部导电衬垫5111，所述第U型凹槽开口朝向显示面板5的显示区b，其中显示区b用于画面显示。其中U型凹槽的深度范围为0-20微米，宽度范围为0-20微米，需要说明的是，宽度可以根据导电衬垫5111周围无线路区域的宽度来确定，在此不做具体限定。进一步的，该U型凹槽不与导电衬垫5111的短边相接，以避免导电衬垫5111短路。具体的，可以在压接区511上进行激光切割，并去除碳化残余，形成该U型凹槽。
本发明实施例的显示模组，通过在柔性电路和/或显示面板上设置导流结构，并在与显示面板压合的过程中，利用导流结构引导多余液态胶体的流向，提高了显示面板的良品率。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。

Claims (15)

  1. 一种柔性电路板，用于与显示面板连接，其包括：基材层和胶体层；
    所述基材层包括压合区和非压合区，所述压合区用于将所述柔性电路板与所述显示面板压接在一起，其中所述压合区包括导流结构；
    所述胶体层，设置在所述基材层包括所述导流结构的一侧，所述导流结构用于在所述胶体层受热融化时，引导所述胶体层中胶体的流向。
  2. 根据权利要求1所述的柔性电路板，其中，所述胶体层包括导电粒子，所述压合区还包括多个引脚端子，所述导流结构包括多个凹槽，所述多个凹槽与所述多个引脚端子间隔设置，所述凹槽的宽度大于所述导电粒子的直径，所述凹槽的深度范围为0-200微米，所述凹槽的长度范围为0-1000微米。
  3. 根据权利要求2所述的柔性电路板，其中，所述导流结构还包括多个通孔，所述多个通孔与所述多个引脚端子间隔设置，所述通孔的直径大于所述导电粒子的直径，相邻通孔之间间距的范围为5-15微米。
  4. 根据权利要求3所述的柔性线路板，其中，所述通孔的直径范围为3-10微米。
  5. 一种显示面板，用于与柔性电路板连接，其包括：
    基板，所述基板包括压接区和非压接区，所述压接区用于将所述显示面板和所述柔性电路板压接在一起，所述压接区包括导流结构；
    胶体层，所述胶体层设置在所述基板包括所述导流结构的一侧，所述导流结构用于所述胶体层受热融化时，引导所述胶体层中胶体的流向。
  6. 根据权利要求5所述的显示面板，其中，所述压接区还包括多个导电衬垫，所述导流结构还包括一U型凹槽，所述U型凹槽半包围全部导电衬垫，所述第U型凹槽开口朝向所述显示面板的显示区。
  7. 根据权利要求6所述的显示面板，其中，所述U型凹槽的深度范围为0-20微米，所述U型凹槽的宽度范围为0-20微米。
  8. 一种显示模组，其包括柔性电路板、显示面板以及胶体层；
    所述柔性电路板包括基材层，所述基材层包括压合区和非压合区；
    所述显示面板包括基板，所述基板包括压接区和非压接区，所述压接区与所述压合区相对设置，所述压接区和所述压合区用于将所述显示面板和所述柔性电路板压接在一起；
    胶体层，所述胶体层设置在所述柔性电路板的所述压合区和所述显示面板的所述非压合区之间；
    所述压接区和/或所述压合区包括导流结构，所述导流结构用于在所述胶体层受热融化时，引导所述胶体层中液态胶体的流向。
  9. 根据权利要求8所述的显示模组，其中，所述胶体层包括导电粒子，所述压合区还包括多个引脚端子，所述压接区还包括导电衬垫，所述导电粒子用于使所述引脚端子和所述导电衬垫电性连接。
  10. 根据权利要求9所述的显示模组，其中，所述导流结构包括多个凹槽，所述多个凹槽设置在所述压合区，所述多个凹槽与所述多个引脚端子间隔设置，所述凹槽的宽度大于所述导电粒子的直径，所述凹槽的深度范围为0-200微米，所述凹槽的长度范围为0-1000微米。
  11. 根据权利要求10所述的显示模组，其中，所述凹槽的宽度范围为3-10微米。
  12. 根据权利要求9所述的显示模组，其中，所述导流结构还包括多个通孔，所述多个通孔设置在所述压合区，所述多个通孔与所述多个引脚端子间隔设置，所述通孔的直径大于所述导电粒子的直径，相邻通孔之间间距的范围为5-15微米。
  13. 根据权利要求12所述的显示模组，其中，所述通孔的直径范围为3-10微米。
  14. 根据权利要求9所述的显示模组，其中，所述导流结构还包括一U型凹槽，所述U型凹槽半包围全部导电衬垫，所述第U型凹槽开口朝向所述显示面板的显示区。
  15. 根据权利要求14所述的显示模组，其中，所述U型凹槽的深度范围为0-20微米，所述U型凹槽的宽度范围为0-20微米。
PCT/CN2018/113946 2018-06-15 2018-11-05 柔性电路板、显示面板以及显示模组 Ceased WO2019237643A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US16/494,300 US11044809B2 (en) 2018-06-15 2018-11-05 Flexible circuit board, display panel, and display module

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201810622686.6A CN108777910B (zh) 2018-06-15 2018-06-15 柔性电路板、显示面板以及显示模组
CN201810622686.6 2018-06-15

Publications (1)

Publication Number Publication Date
WO2019237643A1 true WO2019237643A1 (zh) 2019-12-19

Family

ID=64026011

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2018/113946 Ceased WO2019237643A1 (zh) 2018-06-15 2018-11-05 柔性电路板、显示面板以及显示模组

Country Status (3)

Country Link
US (1) US11044809B2 (zh)
CN (1) CN108777910B (zh)
WO (1) WO2019237643A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115669234A (zh) * 2021-02-26 2023-01-31 京东方科技集团股份有限公司 柔性电路板及显示装置

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109739037B (zh) * 2018-11-23 2023-12-15 深圳市新盈恒科技有限公司 一种方便维修的液晶显示屏
CN110376806A (zh) * 2019-07-16 2019-10-25 惠州市华星光电技术有限公司 覆晶薄膜结构及显示器
CN110825268B (zh) * 2019-11-12 2022-12-02 业成科技（成都）有限公司 触控模组、触控显示装置及电子设备
TWI860023B (zh) * 2020-07-31 2024-10-21 矽創電子股份有限公司 晶片之導流結構
CN111987132A (zh) * 2020-09-02 2020-11-24 山东傲晟智能科技有限公司 一种显示装置
CN114025469A (zh) * 2021-11-15 2022-02-08 维信诺科技股份有限公司 柔性电路板、柔性电路板组件和显示装置
CN115209654A (zh) * 2022-06-30 2022-10-18 昆山国显光电有限公司 壳体组件、显示装置及显示装置的制作方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003295216A (ja) * 2002-03-29 2003-10-15 Optrex Corp 液晶表示装置
GB2412790A (en) * 2004-04-02 2005-10-05 Univ City Hong Kong Process for the assembly of electronic devices
JP2006210610A (ja) * 2005-01-27 2006-08-10 Sharp Corp 基板、ａｃｆ貼付有無検出方法および電子機器の製造方法
CN105572985A (zh) * 2015-12-23 2016-05-11 南京中电熊猫液晶显示科技有限公司 一种cof基板、以及与该cof基板连接的液晶显示面板
CN205958872U (zh) * 2016-06-30 2017-02-15 上海天马有机发光显示技术有限公司 一种显示面板及其显示装置
CN107565056A (zh) * 2017-08-29 2018-01-09 京东方科技集团股份有限公司 一种封装基板、oled显示面板及其封装方法
CN107613675A (zh) * 2017-08-10 2018-01-19 维沃移动通信有限公司 一种柔性电路板的压合方法、集成电路板及移动终端

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5216192A (en) * 1975-07-30 1977-02-07 Hitachi Ltd Luminous diode and its producing method
JPS58146B2 (ja) * 1980-10-14 1983-01-05 浜松テレビ株式会社 フレ−ミング管
US4755415A (en) * 1985-10-03 1988-07-05 Fuji Photo Film Co., Ltd. Optical shutter array and method for making
US5688574A (en) * 1995-03-14 1997-11-18 Hitachi Maxell, Ltd. Optical recording medium
US6214519B1 (en) * 1995-08-22 2001-04-10 Mitsubishi Chemical Corporation Optical recording medium
US6327289B1 (en) * 1997-09-02 2001-12-04 Matsushita Electric Industrial Co., Ltd. Wavelength-variable semiconductor laser, optical integrated device utilizing the same, and production method thereof
US6329631B1 (en) * 1999-09-07 2001-12-11 Ray Yueh Solder strip exclusively for semiconductor packaging
US6836559B2 (en) * 2000-03-09 2004-12-28 The Regents Of The University Of California Automated video-microscopic imaging and data acquisition system for colloid deposition measurements
US20020123144A1 (en) * 2001-03-02 2002-09-05 Charles Helmstetter Method for producing synchronous cells and the resultant cells
JP2003179148A (ja) * 2001-10-04 2003-06-27 Denso Corp 半導体基板およびその製造方法
TWI261822B (en) * 2003-01-21 2006-09-11 Hitachi Maxell Optical disk and optical disk recording method, optical disk reproduction method, and optical disk driver
JP4548716B2 (ja) * 2004-08-30 2010-09-22 キヤノン株式会社 液体噴射記録ヘッドとその製造方法
US20060146262A1 (en) * 2005-01-03 2006-07-06 Chunghwa Picture Tubes., Ltd Method and the plasma display panel with an improvement of overflow effect of anisotropic conductive adhesive film
US20060207720A1 (en) * 2005-03-18 2006-09-21 Konica Minolta Holdings, Inc. Manufacturing method of inkjet head, and adhesive agent composition
US20070087481A1 (en) * 2005-10-19 2007-04-19 Himax Technologies, Inc. Underfill aiding process for a tape
US20070202560A1 (en) * 2006-02-24 2007-08-30 National Food Research Institute Resin microchannel array, method of manufacturing the same and blood test method using the same
JP4967467B2 (ja) * 2006-06-12 2012-07-04 富士通株式会社 フレキシブル配線基板接着方法および配線基板
JP2010010269A (ja) * 2008-06-25 2010-01-14 Elpida Memory Inc 半導体装置、半導体装置製造用中間体およびそれらの製造方法
JP5776698B2 (ja) * 2010-11-08 2015-09-09 コニカミノルタ株式会社 インクジェットヘッドおよびインクジェットヘッドの製造方法
JP5776401B2 (ja) * 2011-07-21 2015-09-09 セイコーエプソン株式会社 液晶表示装置、電子機器および照明装置
CN103367947A (zh) * 2012-04-10 2013-10-23 宸鸿科技(厦门)有限公司 接合结构
KR20140073646A (ko) * 2012-12-04 2014-06-17 서울바이오시스 주식회사 단결정 질화갈륨 기판 및 그 제조 방법
JP2015040168A (ja) * 2013-08-23 2015-03-02 Hoya株式会社 感光性ガラス基板の製造方法
US20160185653A1 (en) * 2013-09-04 2016-06-30 Hoya Corporation Silicate ceramics, plate-like substrate, and method of producing plate-like substrate
JP6264654B2 (ja) * 2014-03-26 2018-01-24 ブラザー工業株式会社 液体吐出装置、及び、液体吐出装置の製造方法
CN104297963B (zh) * 2014-11-05 2017-03-15 深圳市华星光电技术有限公司 一种用于防止acf胶溢出到显示区的引线结构及方法
KR102332272B1 (ko) * 2014-11-18 2021-12-01 삼성디스플레이 주식회사 이방성 도전 필름 및 이를 갖는 표시장치
JP6392149B2 (ja) * 2015-03-18 2018-09-19 株式会社ジャパンディスプレイ 表示装置、表示装置の製造方法
JP6665466B2 (ja) * 2015-09-26 2020-03-13 日亜化学工業株式会社 半導体発光素子及びその製造方法
US10224304B2 (en) * 2016-09-22 2019-03-05 Apple Inc. Conductive adhesive film structures
JP6784119B2 (ja) * 2016-09-28 2020-11-11 ブラザー工業株式会社 アクチュエータ装置、液体吐出装置
KR102725011B1 (ko) * 2016-11-22 2024-11-01 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조 방법

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003295216A (ja) * 2002-03-29 2003-10-15 Optrex Corp 液晶表示装置
GB2412790A (en) * 2004-04-02 2005-10-05 Univ City Hong Kong Process for the assembly of electronic devices
JP2006210610A (ja) * 2005-01-27 2006-08-10 Sharp Corp 基板、ａｃｆ貼付有無検出方法および電子機器の製造方法
CN105572985A (zh) * 2015-12-23 2016-05-11 南京中电熊猫液晶显示科技有限公司 一种cof基板、以及与该cof基板连接的液晶显示面板
CN205958872U (zh) * 2016-06-30 2017-02-15 上海天马有机发光显示技术有限公司 一种显示面板及其显示装置
CN107613675A (zh) * 2017-08-10 2018-01-19 维沃移动通信有限公司 一种柔性电路板的压合方法、集成电路板及移动终端
CN107565056A (zh) * 2017-08-29 2018-01-09 京东方科技集团股份有限公司 一种封装基板、oled显示面板及其封装方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115669234A (zh) * 2021-02-26 2023-01-31 京东方科技集团股份有限公司 柔性电路板及显示装置

Also Published As

Publication number Publication date
US20200236776A1 (en) 2020-07-23
CN108777910B (zh) 2020-05-12
US11044809B2 (en) 2021-06-22
CN108777910A (zh) 2018-11-09

Similar Documents

Publication Publication Date Title
WO2019237643A1 (zh) 柔性电路板、显示面板以及显示模组
CN104619799B (zh) 各向异性导电膜、各向异性导电膜的制造方法、连接体的制造方法及连接方法
WO2020258459A1 (zh) 显示面板及其制备方法
WO2021103354A1 (zh) 一种显示装置
WO2021138985A1 (zh) 显示面板的侧缘绑定结构及其制造方法
KR20110090332A (ko) 이방성 전도 필름을 이용하여 기판이 접합된 반도체 소자 및 기판 접합방법
WO2020103292A1 (zh) 液晶显示装置
US10276592B2 (en) Display substrate, method of fabricating the same, display panel and pressure welding device
JP6006955B2 (ja) 接続体の製造方法、接続方法
CN101217135A (zh) 薄膜覆晶封装结构
US10178771B2 (en) Circuit board, manufacturing method thereof and display apparatus
CN100458508C (zh) 信号传输组件及应用其的显示装置
CN101840080A (zh) 液晶显示器
CN100416343C (zh) 增加金属连线可靠度的结构
JP2018538561A (ja) フレキシブルディスプレイモジュールのボンディング方法
WO2016107094A1 (zh) 电路板及其制造方法，和显示装置
WO2020019434A1 (zh) 柔性显示装置
CN114143986A (zh) 显示模组及其制作方法
CN101236313B (zh) 显示器及其制造方法
CN100480786C (zh) 玻璃覆晶结构和采用该玻璃覆晶结构的液晶显示器
CN2735377Y (zh) 覆晶结构
CN100371808C (zh) 玻璃覆晶结构
WO2019127161A1 (zh) 触控显示屏及其制作方法以及显示设备
CN101988994B (zh) 焊垫、晶片-基板接合的封装构造及液晶显示面板
JP2005121757A (ja) 基板接続構造、電子部品、液晶表示装置および電子部品の製造方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18922675

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18922675

Country of ref document: EP

Kind code of ref document: A1