WO2020019434A1 - 柔性显示装置 - Google Patents

柔性显示装置 Download PDF

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Publication number
WO2020019434A1
WO2020019434A1 PCT/CN2018/105483 CN2018105483W WO2020019434A1 WO 2020019434 A1 WO2020019434 A1 WO 2020019434A1 CN 2018105483 W CN2018105483 W CN 2018105483W WO 2020019434 A1 WO2020019434 A1 WO 2020019434A1
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WO
WIPO (PCT)
Prior art keywords
array substrate
pad
display device
circuit board
flexible display
Prior art date
Application number
PCT/CN2018/105483
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English (en)
French (fr)
Inventor
肖士元
Original Assignee
武汉华星光电技术有限公司
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Application filed by 武汉华星光电技术有限公司 filed Critical 武汉华星光电技术有限公司
Priority to US16/319,341 priority Critical patent/US20200126458A1/en
Publication of WO2020019434A1 publication Critical patent/WO2020019434A1/zh

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Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/17—Passive-matrix OLED displays
    • H10K59/179—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the invention relates to a flexible display device, in particular to a flexible display device which can reduce the length of an array substrate and is suitable for a narrow frame.
  • FIG. 1 is a schematic side sectional view of a conventional flexible display device
  • FIG. 2 is a partially enlarged view of FIG. 1.
  • a conventional flexible display device 10 includes a color filter substrate 11, an array substrate 12 and a flexible circuit board 13.
  • the array substrate 12 is attached to the color filter substrate 11.
  • One end of the array substrate 12 is provided with an array substrate pad 12 a, and the array substrate pad 12 a It is located on a surface facing the color filter substrate 11.
  • One end of the flexible circuit board 13 is provided with a flexible circuit board pad 13 a, and the flexible circuit board pad 13 a is bonded to the array substrate pad 12. And electrically connected.
  • the array substrate 12 requires additional length compared to the length of the color filter substrate 11. Length, which is not conducive to the development direction of the flexible display device 10 toward a narrow frame.
  • the main object of the present invention is to provide a flexible display device, which can further shorten the edge length of the flexible display device, so as to facilitate the development direction of the flexible display device toward a narrow frame.
  • the present invention provides a flexible display device including: a color filter substrate; and an array substrate, which is disposed in close contact with the color filter substrate, and one end of the array substrate is provided with a first An array substrate pad, a second array substrate pad, and a via, wherein the first array substrate pad is located on a surface facing the color filter substrate, and the first array substrate pad and The color filter substrates are bonded, the second array substrate pad is located on another surface opposite to the array substrate, and the via hole is located inside the array substrate and penetrates the array substrate to The first array substrate pad and the second array substrate pad are connected respectively; and a flexible circuit board, one end of which is provided with a flexible circuit board pad, the flexible circuit board pad and the second array substrate Pads are electrically connected, and one end of the flexible circuit board is bonded to the array substrate, so the first array substrate pads are sequentially connected to the via holes, the second array substrate pads, and the flexible substrate. Circuit board Electrically connected to the disc.
  • the flexible circuit board pad and the second array substrate pad are electrically connected by a bonding method.
  • the flexible circuit board pad and the second array substrate pad are bonded through an anisotropic conductive film.
  • the flexible circuit board pad and the second array substrate pad are electrically connected by a wire method.
  • an extending direction of the first array substrate pad and an extending direction of the second array substrate pad are the same direction.
  • an extending direction of the first array substrate pad and an extending direction of the second array substrate pad are opposite directions.
  • the color filter substrate and the array substrate are made of a flexible organic material.
  • the color filter substrate and the array substrate are made of a polyimide material.
  • the length of the array substrate of the present invention does not need to be set longer than the length of the color filter substrate, so the edge length of the flexible display device can be further shortened. In order to facilitate the development direction of the flexible display device toward narrow bezels.
  • the present invention further provides a flexible display device, which includes: a color filter substrate; an array substrate, which is attached to the color filter substrate, and one end of the array substrate is provided with A first array substrate pad, a second array substrate pad, and a via, wherein the first array substrate pad is located on a surface facing the color filter substrate, and the second array substrate pad
  • the via is located on the other surface opposite to the array substrate, and the via is located inside the array substrate and penetrates the array substrate to connect the first array substrate pad and the second array substrate respectively.
  • Disk and a flexible circuit board, one end of which is provided with a flexible circuit board pad, and the flexible circuit board pad is electrically connected to the second array substrate pad, so the first array substrate pad is sequentially connected with The via hole, the second array substrate pad, and the flexible circuit board pad are electrically connected.
  • the pads of the first array substrate are bonded to the color filter substrate.
  • one end of the flexible circuit board is attached to the array substrate.
  • the flexible circuit board pad and the second array substrate pad are electrically connected by a bonding method.
  • the flexible circuit board pad and the second array substrate pad are bonded through an anisotropic conductive film.
  • the flexible circuit board pad and the second array substrate pad are electrically connected by a wire method.
  • an extending direction of the first array substrate pad and an extending direction of the second array substrate pad are the same direction.
  • an extending direction of the first array substrate pad and an extending direction of the second array substrate pad are opposite directions.
  • the color filter substrate and the array substrate are made of a flexible organic material.
  • the color filter substrate and the array substrate are made of a polyimide material.
  • the length of the array substrate of the present invention does not need to be set longer than the length of the color filter substrate, so the edge length of the flexible display device can be further shortened. In order to facilitate the development direction of the flexible display device toward narrow bezels.
  • FIG. 1 is a schematic side sectional view of a conventional flexible display device.
  • FIG. 2 is a partially enlarged view of FIG. 1.
  • FIG. 3 is a schematic side sectional view of a flexible display device according to the present invention.
  • FIG. 4 is a partially enlarged view of FIG. 3.
  • FIG. 3 is a schematic side sectional view of a flexible display device according to the present invention
  • FIG. 4 is a partially enlarged view of FIG. 3.
  • a flexible display device 20 of the present invention includes a color filter substrate 21, an array substrate 22 and a flexible circuit board 23.
  • the first array substrate pad is bonded to the color filter substrate.
  • the color filter substrate 21 and the array substrate 22 are made of a flexible organic material, for example, a polyimide (PI) material.
  • PI polyimide
  • the array substrate 22 is attached to the color filter substrate 21.
  • One end of the array substrate 22 is provided with a first array substrate pad 22 a and a second array substrate.
  • the first array substrate pad 22a is located on one surface facing the color filter substrate 21, and the second array substrate pad 22b is located on the other surface opposite to the array substrate 22.
  • the hole 22c is located inside the array substrate 22 and penetrates the array substrate 22 to connect the first array substrate pad 22a and the second array substrate pad 22b, respectively.
  • a flexible circuit board pad 23a is disposed at one end of the flexible circuit board 23, and the flexible circuit board pad 23a is electrically connected to the second array substrate pad 22b.
  • one end of the flexible circuit board 23 is bonded to the array substrate 22.
  • the flexible circuit board pads 23a and the second array substrate pads 22b are electrically connected by a bonding method.
  • the flexible circuit board pad 23a and the second array substrate pad 22b are bonded through an anisotropic conductive film (ACF).
  • ACF anisotropic conductive film
  • the flexible circuit board pad 23a and the second array substrate pad 22b may also be electrically connected by a wire.
  • the extending direction of the first array substrate pad 22a and the extending direction of the second array substrate pad 22b are opposite directions.
  • the extending direction of the first array substrate pad 22a and the extending direction of the second array substrate pad 22b are In the same direction.
  • one end of the array substrate 22 is provided with a first array substrate pad 22a, a second array substrate pad 22b, and a via hole 22c.
  • a hole 22c penetrates the array substrate 22, and connects the first array substrate pad 22a and the second array substrate pad 22b, respectively.
  • One end of the flexible circuit board 23 is provided with a flexible circuit board pad 23a.
  • the flexible circuit board pad 23a is electrically connected to the second array substrate pad 22b, so the first array substrate pad 22a is sequentially connected to the via hole 22c and the second array substrate pad 22b. And the flexible circuit board pad 23a is electrically connected.
  • the length of the array substrate 22 of the present invention does not need to be set larger than the length of the color filter substrate 21, that is, in the present invention, the length of the array substrate 22 is equal to
  • the lengths of the color filter substrates 21 are equal, so the length of the edges of the flexible display device 20 can be further shortened to facilitate the development direction of the flexible display device 20 toward a narrower frame.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种柔性显示装置（20），包含一彩色滤光片基板（21）、一阵列基板（22）及一柔性电路板（23）。阵列基板（22）的一端设置有一第一阵列基板焊盘（22a）、一第二阵列基板焊盘（22b）及一过孔（22c），其中第一阵列基板焊盘（22a）依序与过孔（22c）、第二阵列基板焊盘（22b）及柔性电路板焊盘（23a）电性连接。柔性显示装置（20）缩短了边缘长度，有利于实现窄边框化。

Description

柔性显示装置 技术领域
本发明涉及一种柔性显示装置，特别是涉及一种可减少阵列基板长度以适用于窄边框的柔性显示装置。
 背景技术
随着显示技术的进步，许多显示装置都朝向窄边框化的发展方向。然而，由于柔性显示装置的一端需要与柔性电路板连接，因此一般需要具有额外的长度，因此不利于朝向窄边框化的发展方向。
请参照图1及图2所示，图1是现有的一种柔性显示装置的侧剖面示意图，及图2是图1的局部放大图。如图1所示，现有的一种柔性显示装置10包含一彩色滤光片基板11、一阵列基板12及一柔性电路板13。
详细来说，如图2所示，所述阵列基板12与所述彩色滤光片基板11贴合设置，所述阵列基板12的一端设置有一阵列基板焊盘12a，所述阵列基板焊盘12a位于面向所述彩色滤光片基板11的一表面上，所述柔性电路板13的一端设置有一柔性电路板焊盘13a，所述柔性电路板焊盘13a与所述阵列基板焊盘12贴合且电性连接。
然而，为了实现所述柔性电路板焊盘13a与所述阵列基板焊盘12的贴合与电性连接，相较于所述彩色滤光片基板11的长度，所述阵列基板12需要额外的长度，这样不利于所述柔性显示装置10朝向窄边框化的发展方向。
因此，有必要提供一种改良的柔性显示装置，以解决上述技术问题。
 技术问题
本发明的主要目的是提供一种柔性显示装置，其可进一步缩短所述柔性显示装置的边缘长度，以有利于所述柔性显示装置朝向窄边框化的发展方向。
 技术解决方案
为达上述目的，本发明提供一种柔性显示装置，其包含：一彩色滤光片基板；一阵列基板，其与所述彩色滤光片基板贴合设置，所述阵列基板的一端设置有一第一阵列基板焊盘、一第二阵列基板焊盘及一过孔，其中所述第一阵列基板焊盘位于面向所述彩色滤光片基板的一表面上，所述第一阵列基板焊盘与所述彩色滤光片基板贴合，所述第二阵列基板焊盘位于相对于所述阵列基板的另一表面上，所述过孔位于所述阵列基板内部，并且贯穿所述阵列基板，以分别连接所述第一阵列基板焊盘及所述第二阵列基板焊盘；及一柔性电路板，其一端设置有一柔性电路板焊盘，所述柔性电路板焊盘与所述第二阵列基板焊盘电性连接，所述柔性电路板的一端与所述阵列基板贴合，因此所述第一阵列基板焊盘依序与所述过孔、所述第二阵列基板焊盘及所述柔性电路板焊盘电性连接。
在本发明的一实施例中，所述柔性电路板焊盘与所述第二阵列基板焊盘通过贴合方式实现电性连接。
在本发明的一实施例中，所述柔性电路板焊盘与所述第二阵列基板焊盘通过异方性导电膜贴合。
在本发明的一实施例中，所述柔性电路板焊盘与所述第二阵列基板焊盘通过导线方式实现电性连接。
在本发明的一实施例中，相对于所述过孔的位置，所述第一阵列基板焊盘的延伸方向与所述第二阵列基板焊盘的延伸方向为同方向。
在本发明的一实施例中，相对于所述过孔的位置，所述第一阵列基板焊盘的延伸方向与所述第二阵列基板焊盘的延伸方向为反方向。
在本发明的一实施例中，所述彩色滤光片基板与所述阵列基板由柔性有机材料制成。
在本发明的一实施例中，所述彩色滤光片基板与所述阵列基板由聚酰亚胺材料制成。
在本发明中，相较于现有的柔性显示装置，本发明的所述阵列基板的长度不需要设置大于所述彩色滤光片基板的长度，因此可进一步缩短所述柔性显示装置的边缘长度，以有利于所述柔性显示装置朝向窄边框化的发展方向。
为达上述目的，本发明另提供一种柔性显示装置，其包含：一彩色滤光片基板；一阵列基板，其与所述彩色滤光片基板贴合设置，所述阵列基板的一端设置有一第一阵列基板焊盘、一第二阵列基板焊盘及一过孔，其中所述第一阵列基板焊盘位于面向所述彩色滤光片基板的一表面上，所述第二阵列基板焊盘位于相对于所述阵列基板的另一表面上，所述过孔位于所述阵列基板内部，并且贯穿所述阵列基板，以分别连接所述第一阵列基板焊盘及所述第二阵列基板焊盘；及一柔性电路板，其一端设置有一柔性电路板焊盘，所述柔性电路板焊盘与所述第二阵列基板焊盘电性连接，因此所述第一阵列基板焊盘依序与所述过孔、所述第二阵列基板焊盘及所述柔性电路板焊盘电性连接。
在本发明的一实施例中，所述第一阵列基板焊盘与所述彩色滤光片基板贴合。
在本发明的一实施例中，所述柔性电路板的一端与所述阵列基板贴合。
在本发明的一实施例中，所述柔性电路板焊盘与所述第二阵列基板焊盘通过贴合方式实现电性连接。
在本发明的一实施例中，所述柔性电路板焊盘与所述第二阵列基板焊盘通过异方性导电膜贴合。
在本发明的一实施例中，所述柔性电路板焊盘与所述第二阵列基板焊盘通过导线方式实现电性连接。
在本发明的一实施例中，相对于所述过孔的位置，所述第一阵列基板焊盘的延伸方向与所述第二阵列基板焊盘的延伸方向为同方向。
在本发明的一实施例中，相对于所述过孔的位置，所述第一阵列基板焊盘的延伸方向与所述第二阵列基板焊盘的延伸方向为反方向。
在本发明的一实施例中，所述彩色滤光片基板与所述阵列基板由柔性有机材料制成。
在本发明的一实施例中，所述彩色滤光片基板与所述阵列基板由聚酰亚胺材料制成。
 有益效果
在本发明中，相较于现有的柔性显示装置，本发明的所述阵列基板的长度不需要设置大于所述彩色滤光片基板的长度，因此可进一步缩短所述柔性显示装置的边缘长度，以有利于所述柔性显示装置朝向窄边框化的发展方向。
 附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面对实施例中所需要使用的附图作简单的介绍。下面描述中的附图仅为本申请的部分实施例，对于本领域普通技术人员而言，在不付出创造性劳动的前提下，还可以根据这些附图获取其他的附图。
图1：现有的一种柔性显示装置的侧剖面示意图。
图2：图1的局部放大图。
图3：本发明的一种柔性显示装置的侧剖面示意图。
图4：图3的局部放大图。
 本发明的实施方式
为让本发明上述目的、特征及优点更明显易懂，下文特举本发明较佳实施例，并配合附图，作详细说明。再者，本发明所提到的方向用语，例如「上」、「下」、「前」、「后」、「左」、「右」、「内」、「外」、「侧面」等，仅是参照附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。
请参照图3及图4所示，图3是本发明的一种柔性显示装置的侧剖面示意图，及图4是图3的局部放大图。如图3所示，本发明的一种柔性显示装置20包含一彩色滤光片基板21、一阵列基板22及一柔性电路板23。
优选地，所述第一阵列基板焊盘与所述彩色滤光片基板贴合。
优选地，所述彩色滤光片基板21与所述阵列基板22由柔性有机材料制成，例如由聚酰亚胺(Polyimide，PI)材料制成。
详细来说，如图4所示，所述阵列基板22与所述彩色滤光片基板21贴合设置，所述阵列基板22的一端设置有一第一阵列基板焊盘22a、一第二阵列基板焊盘22b及一过孔22c。所述第一阵列基板焊盘22a位于面向所述彩色滤光片基板21的一表面上，所述第二阵列基板焊盘22b位于相对于所述阵列基板22的另一表面上，所述过孔22c位于所述阵列基板22内部，并且贯穿所述阵列基板22，以分别连接所述第一阵列基板焊盘22a及所述第二阵列基板焊盘22b。
再者，所述柔性电路板23的一端设置有一柔性电路板焊盘23a，所述柔性电路板焊盘23a与所述第二阵列基板焊盘22b电性连接。
在本实施例中，所述柔性电路板23的一端与所述阵列基板22贴合。
在本实施例中，所述柔性电路板焊盘23a与所述第二阵列基板焊盘22b通过贴合方式实现电性连接。优选地，所述柔性电路板焊盘23a与所述第二阵列基板焊盘22b通过一异方性导电膜( Anisotropic Conductive Film, ACF)贴合。然而，在本发明的另一可能的实施例中，所述柔性电路板焊盘23a与所述第二阵列基板焊盘22b也可通过导线方式实现电性连接。
此外，在本实施例中，相对于所述过孔22c的位置，所述第一阵列基板焊盘22a的延伸方向与所述第二阵列基板焊盘22b的延伸方向为反方向。然而，在本发明的另一可能的实施例中，相对于所述过孔22c的位置，所述第一阵列基板焊盘22a的延伸方向与所述第二阵列基板焊盘22b的延伸方向为同方向。
综上所述，在本发明的一实施例中，所述阵列基板22的一端设置有一第一阵列基板焊盘22a、一第二阵列基板焊盘22b及一过孔22c，其中由于所述过孔22c贯穿所述阵列基板22，并分别连接所述第一阵列基板焊盘22a及所述第二阵列基板焊盘22b，并且所述柔性电路板23的一端设置有一柔性电路板焊盘23a，所述柔性电路板焊盘23a与所述第二阵列基板焊盘22b电性连接，因此所述第一阵列基板焊盘22a依序与所述过孔22c、所述第二阵列基板焊盘22b及所述柔性电路板焊盘23a电性连接。
相较于现有的柔性显示装置，本发明的所述阵列基板22的长度不需要设置大于所述彩色滤光片基板21的长度，也就是在本发明中，所述阵列基板22的长度与所述彩色滤光片基板21的长度相等，因此可进一步缩短所述柔性显示装置20的边缘长度，以有利于所述柔性显示装置20朝向窄边框化的发展方向。
本发明已由上述相关实施例加以描述，然而上述实施例仅为实施本发明的范例。必需指出的是，已公开的实施例并未限制本发明的范围。相反地，包含于权利要求书的精神及范围的修改及均等设置均包括于本发明的范围内。

Claims (18)

  1. 一种柔性显示装置，其包含：
    一彩色滤光片基板；
    一阵列基板，其与所述彩色滤光片基板贴合设置，所述阵列基板的一端设置有一第一阵列基板焊盘、一第二阵列基板焊盘及一过孔，其中所述第一阵列基板焊盘位于面向所述彩色滤光片基板的一表面上，所述第一阵列基板焊盘与所述彩色滤光片基板贴合，所述第二阵列基板焊盘位于相对于所述阵列基板的另一表面上，所述过孔位于所述阵列基板内部，并且贯穿所述阵列基板，以分别连接所述第一阵列基板焊盘及所述第二阵列基板焊盘；及
    一柔性电路板，其一端设置有一柔性电路板焊盘，所述柔性电路板焊盘与所述第二阵列基板焊盘电性连接，所述柔性电路板的一端与所述阵列基板贴合，因此所述第一阵列基板焊盘依序与所述过孔、所述第二阵列基板焊盘及所述柔性电路板焊盘电性连接。
  2. 如权利要求1所述的柔性显示装置，其中所述柔性电路板焊盘与所述第二阵列基板焊盘通过贴合方式实现电性连接。
  3. 如权利要求2所述的柔性显示装置，其中所述柔性电路板焊盘与所述第二阵列基板焊盘通过异方性导电膜贴合。
  4. 如权利要求1所述的柔性显示装置，其中所述柔性电路板焊盘与所述第二阵列基板焊盘通过导线方式实现电性连接。
  5. 如权利要求1所述的柔性显示装置，其中相对于所述过孔的位置，所述第一阵列基板焊盘的延伸方向与所述第二阵列基板焊盘的延伸方向为同方向。
  6. 如权利要求1所述的柔性显示装置，其中相对于所述过孔的位置，所述第一阵列基板焊盘的延伸方向与所述第二阵列基板焊盘的延伸方向为反方向。
  7. 如权利要求1所述的柔性显示装置，其中所述彩色滤光片基板与所述阵列基板由柔性有机材料制成。
  8. 如权利要求7所述的柔性显示装置，其中所述彩色滤光片基板与所述阵列基板由聚酰亚胺材料制成。
  9. 一种柔性显示装置，其包含：
    一彩色滤光片基板；
    一阵列基板，其与所述彩色滤光片基板贴合设置，所述阵列基板的一端设置有一第一阵列基板焊盘、一第二阵列基板焊盘及一过孔，其中所述第一阵列基板焊盘位于面向所述彩色滤光片基板的一表面上，所述第二阵列基板焊盘位于相对于所述阵列基板的另一表面上，所述过孔位于所述阵列基板内部，并且贯穿所述阵列基板，以分别连接所述第一阵列基板焊盘及所述第二阵列基板焊盘；及
    一柔性电路板，其一端设置有一柔性电路板焊盘，所述柔性电路板焊盘与所述第二阵列基板焊盘电性连接，因此所述第一阵列基板焊盘依序与所述过孔、所述第二阵列基板焊盘及所述柔性电路板焊盘电性连接。
  10. 如权利要求9所述的柔性显示装置，其中所述第一阵列基板焊盘与所述彩色滤光片基板贴合。
  11. 如权利要求9所述的柔性显示装置，其中所述柔性电路板的一端与所述阵列基板贴合。
  12. 如权利要求11所述的柔性显示装置，其中所述柔性电路板焊盘与所述第二阵列基板焊盘通过贴合方式实现电性连接。
  13. 如权利要求12所述的柔性显示装置，其中所述柔性电路板焊盘与所述第二阵列基板焊盘通过异方性导电膜贴合。
  14. 如权利要求11所述的柔性显示装置，其中所述柔性电路板焊盘与所述第二阵列基板焊盘通过导线方式实现电性连接。
  15. 如权利要求9所述的柔性显示装置，其中相对于所述过孔的位置，所述第一阵列基板焊盘的延伸方向与所述第二阵列基板焊盘的延伸方向为同方向。
  16. 如权利要求9所述的柔性显示装置，其中相对于所述过孔的位置，所述第一阵列基板焊盘的延伸方向与所述第二阵列基板焊盘的延伸方向为反方向。
  17. 如权利要求9所述的柔性显示装置，其中所述彩色滤光片基板与所述阵列基板由柔性有机材料制成。
  18. 如权利要求17所述的柔性显示装置，其中所述彩色滤光片基板与所述阵列基板由聚酰亚胺材料制成。
PCT/CN2018/105483 2018-07-24 2018-09-13 柔性显示装置 WO2020019434A1 (zh)

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