WO2020258459A1 - 显示面板及其制备方法 - Google Patents

显示面板及其制备方法 Download PDF

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Publication number
WO2020258459A1
WO2020258459A1 PCT/CN2019/100627 CN2019100627W WO2020258459A1 WO 2020258459 A1 WO2020258459 A1 WO 2020258459A1 CN 2019100627 W CN2019100627 W CN 2019100627W WO 2020258459 A1 WO2020258459 A1 WO 2020258459A1
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WO
WIPO (PCT)
Prior art keywords
film
array substrate
display panel
color filter
inclined surface
Prior art date
Application number
PCT/CN2019/100627
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English (en)
French (fr)
Inventor
马荣
刘广辉
Original Assignee
武汉华星光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 武汉华星光电技术有限公司 filed Critical 武汉华星光电技术有限公司
Priority to US16/609,211 priority Critical patent/US20200403012A1/en
Publication of WO2020258459A1 publication Critical patent/WO2020258459A1/zh

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements

Definitions

  • the invention relates to the field of displays, in particular to a display panel and a preparation method thereof.
  • LTPS Low Temperature Poly-Silicon
  • COF Chip On Flex /Chip On Film
  • the narrow borders mainly compress the borders on the left and right sides by cutting on seal.
  • Chip on film is integrated on flexible printed circuit board (Flexible Printed Circuit Board, FPC), through anisotropic conductive adhesive (Anisotropic Conductive Film (ACF) bonds COF to TFT glass.
  • FPC Flexible Printed Circuit Board
  • ACF anisotropic Conductive Film
  • the special-shaped display mainly increases the display area by avoiding the camera and other areas by the upper edge of the special-shaped display.
  • the existing display panel includes an array substrate 100, a color filter substrate 200, and a chip on film 300.
  • the color filter substrate 200 is provided on the upper surface of the array substrate 100, and the chip on film 300 is bonded to one end of the array substrate 100.
  • the upper surface of the array substrate 100 is bent to the back surface of the array substrate 100, and the integrated circuit unit is disposed on the upper surface of the flip chip film 300 bent to the back surface of the array substrate 100.
  • IC integrated circuit
  • the chip-on-chip film 300 on the right side of the figure is installed in the frame on one side of the display device.
  • the stress must be a radian, and the chip on film 300 needs to occupy a certain space; therefore, the frame on which the chip on film 300 is installed needs to have a certain width.
  • the frame on which the chip-on-chip 300 is installed is generally set as the lower frame of the display device.
  • the purpose of the present invention is to solve the technical problems in the prior art that the lower frame width of the display device is large and the screen-to-body ratio of the display device is low.
  • the present invention provides a display panel including: an array substrate with a first bevel at the edge of one side; a color filter substrate provided on the surface of one side of the array substrate; the color filter substrate A second inclined surface is provided at the edge of one side, which is in the same plane as the first inclined surface; and the flip chip film is bonded to the first inclined surface and the second inclined surface.
  • the display panel further includes: a silver wire layer attached to the first inclined surface and the second inclined surface; and a conductive adhesive layer attached to the surface of the silver wire layer, the flip chip film Bonding to the conductive adhesive layer.
  • the silver wire layer includes two or more parallel wires, one end of any wire is electrically connected to the array substrate, and the other end is electrically connected to the flip chip film.
  • a side surface of the array substrate opposite to the first inclined surface is a first side surface; a side surface of the color filter substrate opposite to the second inclined surface is a second side surface; the first side surface and the The second side is on the same plane.
  • the chip-on-chip film includes a first film integrally arranged and bonded to the outer surface of the conductive adhesive layer; a second film arranged opposite to the array substrate; and a bending part, one end of which is connected to the The other end of the first film is connected to the second film.
  • the chip-on-chip film further includes a circuit unit attached to the surface of the second film on a side close to the array substrate.
  • the present invention also provides a method for manufacturing a display panel, which includes the following steps: an array substrate is provided, an array substrate is provided; a color filter substrate is provided, a color filter substrate is provided on the upper surface of the array substrate Cutting step, cutting one side of the color filter substrate and the array substrate, forming a first bevel on one side of the array substrate, and forming a second bevel on one side of the color filter substrate, the second The inclined plane and the first inclined plane are in the same plane; and the bonding step, bonding a flip chip film on the first inclined plane and the second inclined plane.
  • the side surface of the color filter substrate and the side surface of the array substrate are on the same plane.
  • the manufacturing method of the display panel further includes: a silver paste coating step, spraying a layer of silver paste on the first inclined surface and the second inclined surface to form a silver paste layer Etching step, laser etching the silver paste layer to etch two or more parallel wires to form a silver wire layer; and a conductive adhesive layer attaching step, attaching a conductive layer on the outer surface of the silver wire layer Glue layer.
  • the first film is bonded to the surface of the conductive adhesive layer
  • the second film is disposed under the array substrate, and one end of the bending part is connected to the first film , The other end of which is connected to the second film.
  • the technical effect of the present invention is that one end of the array substrate and the color filter substrate is made into an inclined plane, the flip chip film is bonded to the inclined plane, and the flip chip film is integrally arranged on the side of the array substrate away from the display area.
  • the display panel is installed in a display device (such as a smart phone)
  • the flip chip film is installed in the housing of the display device instead of in the frame. Therefore, the frame width of the display device can be designed to be smaller, further improving the display
  • the screen-to-body ratio of the device enhances the market competitiveness of the display device.
  • FIG. 1 is a schematic diagram of the structure of a display panel in the prior art
  • FIG. 2 is a flowchart of a method for manufacturing a display panel according to an embodiment of the invention
  • FIG. 3 is a schematic diagram of the structure after the cutting step according to the embodiment of the present invention.
  • FIG. 4 is a schematic diagram of a silver wire layer according to an embodiment of the present invention.
  • FIG. 5 is a schematic structural diagram of a display panel according to an embodiment of the invention.
  • the component can be directly placed on the other component; there may also be an intermediate component on which the component is placed , And the intermediate component is placed on another component.
  • a component is described as “installed to” or “connected to” another component, both can be understood as directly “installed” or “connected”, or a component is “installed to” or “connected to” through an intermediate component Another component.
  • this embodiment provides a method for manufacturing a display panel, including the following steps S1 to S7.
  • the array substrate providing step is to provide an array substrate, the array substrate is provided with a first side surface, and the thickness of the array substrate ranges from 0.1 mm to 0.2 mm. In this embodiment, it is preferably 0.15 mm. Provide circuit support for the display panel.
  • the color filter substrate setting step is to set a color filter substrate on the upper surface of the array substrate, and set the color filter substrate on the upper surface of the array substrate through a glue layer, so that the side surface of the color filter substrate is
  • the side surfaces of the array substrate are on the same plane, wherein the color filter substrate is provided with a second side surface, and the second side surface is in the same plane as the first side surface.
  • the thickness of the color filter substrate ranges from 0.1 mm to 0.2 mm, and in this embodiment, it is preferably 0.15 mm.
  • the color film substrate is used for filtering light, which can enable the display panel to display color.
  • S3 cutting step using a laser to cut the array substrate and the color filter substrate, the cutting surface generated during the cutting process forms a cutting angle with the upper surface or the lower surface of the array substrate or the color filter substrate, and The range of cutting angle is 30° ⁇ 60°.
  • the cut panel structure is shown in FIG. 3, which is cut from the edge of the color filter substrate to the lower left in the figure. A first slope is formed on one side of the array substrate, and a second slope is formed on one side of the color filter substrate.
  • first inclined plane the first inclined plane and the second inclined plane are in the same plane
  • the included angle between the first inclined plane and the horizontal plane is a first inclined angle
  • the included angle between the second inclined plane and the horizontal plane is a second inclined angle
  • the angle range of the first inclination angle is 30° to 60°
  • the angle range of the second inclination angle is 30° to 60°. Therefore, in different embodiments, the first inclination angle may be 35° , 40°, 45°, 50°, 55°, etc.
  • the second inclination angle may be 35°, 40°, 45°, 50°, 55°, etc., which are not specifically limited in this embodiment.
  • the available area of the first inclined surface and the second inclined surface is larger.
  • the coating range of the subsequent silver paste and conductive adhesive is also larger, which can improve the adhesion of the silver paste and conductive adhesive, and the area of the bonded chip on film is also larger.
  • the available area of the first inclined surface and the second inclined surface is smaller
  • the coating range of the subsequent silver paste and conductive adhesive is also small, and the area of the bonded chip-on-chip film is also small, so the angle of inclination angle can be determined according to the area of the chip-on-chip bonding required. .
  • the total thickness of the array substrate and the color filter substrate ranges from about 0.2 mm to 0.5 mm, which is a relatively small thickness, it is necessary to apply conductive glue or the like on the sides of the array substrate and the color filter substrate. It is more difficult to fabric, so in this embodiment, by cutting, a first inclined plane and a second inclined plane are formed on the side surfaces of the array substrate and the color filter substrate, which increases the usable area of subsequent module processes, that is, increases the subsequent
  • the coating range of silver paste and conductive adhesive can improve the adhesion of silver paste and conductive adhesive.
  • a layer of silver paste is sprayed on the first inclined surface and the second inclined surface to form a silver paste layer.
  • the silver paste itself functions as a conductive member and can be used as a conductive material.
  • the silver paste layer is used to conduct electricity.
  • S5 etching step laser etching the silver paste layer to etch two or more parallel wires to form a silver wire layer (see FIG. 4), one end of any wire is electrically connected to the array substrate, and the other One end is electrically connected to the subsequent chip on film, and the circuit is connected between the chip on film and the array substrate.
  • the conductive adhesive layer attaching step attaching conductive adhesive (Anisotropic Conductive Film, ACF) to the outer surface of the silver wire layer to form a conductive adhesive layer.
  • the conductive adhesive is an anisotropic conductive adhesive and has good conductivity. ability.
  • the conductive principle of the conductive adhesive is to use conductive particles to connect the electrodes between the IC chip and the array substrate to make them conductive, and at the same time, it can avoid the conduction and short circuit between the two adjacent electrodes, and achieve only in the Z-axis direction.
  • the material of the conductive adhesive includes two parts: resin adhesive and conductive particles. In addition to moisture-proof, heat-resistant, and insulating functions, the resin adhesive mainly fixes the relative position of the electrode between the IC chip and the array substrate, and provides a pressing force to maintain the contact area between the electrode and the conductive particles.
  • the chip-on-chip film includes a first film, a bending portion, and a second film that are integrally arranged.
  • the first film is bonded Fixed to the surface of the conductive adhesive layer, the second film is disposed under the array substrate, one end of the bending part is connected to the first film, and the other end is connected to the second film.
  • the included angle between the second film and the first film ranges from 120° to 150°, that is, the bending angle of the bending portion ranges from 120° to 150°, so that the chip on film is in contact with the
  • the bonding of the conductive adhesive layer is more compliant, and the conductive performance between the chip-on-chip film and the conductive adhesive layer is guaranteed to be good.
  • a circuit unit is provided on the upper surface of the second film, and the circuit unit is electrically connected to the array substrate through the flip chip film, the conductive adhesive layer and the silver wire layer to form an electrical signal of the display panel The conduction.
  • the manufacturing method of the display panel described in this embodiment may further include a polarizer preparation step, a backlight module preparation step and other process flows to prepare a qualified display panel.
  • one end of the array substrate and the color filter substrate is made into an inclined plane, the flip chip film is bonded to the inclined plane, and the flip chip film is integrally arranged on the array substrate away from the display area.
  • the display panel is installed in a display device (such as a smart phone)
  • the flip chip film is installed in the housing of the display device instead of in the frame. Therefore, the frame width of the display device can be designed to be smaller, further improving the display
  • the screen-to-body ratio of the device enhances the market competitiveness of the display device.
  • the frame area of the display device does not need to reserve conductive adhesive coating space, which greatly reduces the thickness of the frame of the display device, thereby increasing the screen-to-body ratio of the display device, and ultimately improving the market competition of the display device force.
  • this embodiment also provides a display panel, which is prepared by the above-mentioned manufacturing method of the display panel.
  • the display panel includes an array substrate 1, a color film substrate 2, an adhesive layer 3, a silver wire layer 4, Conductive adhesive layer 5 and flip chip film 6.
  • the array substrate 1 provides circuit support for the display panel.
  • the thickness of the array substrate 1 ranges from 0.1 mm to 0.2 mm, and in this embodiment, it is preferably 0.15 mm.
  • the array substrate 1 includes a first inclined surface 11 and a first side surface 12 (see FIG. 3).
  • the angle between the first inclined surface 11 and the horizontal plane is a first inclined angle 13, and the angle range of the first inclined angle 13 is 30°-60°.
  • the first inclination angle 13 may be 35°, 40°, 45°, 50°, 55°, etc., which are not specifically limited in this embodiment, the first inclined surface 11 and the first inclination angle 13 The existence of this increases the usable area for subsequent module processes.
  • the color filter substrate 2 is arranged on the upper surface of the array substrate 1 for filtering light, so that the display panel can display color.
  • the thickness of the color filter substrate 2 ranges from 0.1 mm to 0.2 mm, and in this embodiment, it is preferably 0.15 mm.
  • the side surface of the color filter substrate 2 and the side surface of the array substrate 1 are in the same plane.
  • the color filter substrate 2 includes a second inclined surface 21 and a second side surface 22.
  • the second inclined surface 21 and the first inclined surface 11 are in the same plane. It is in the same plane as the first side surface 12 (see Figure 3).
  • the angle between the second inclined surface 21 and the horizontal plane is the second inclination angle 23, and the angle range of the second inclination angle 23 is 30° ⁇ 60°.
  • the second inclination angle 23 can be 35°, 40° , 45°, 50°, 55° and other angles, which are not specifically limited in this embodiment.
  • the existence of the second inclined surface 21 and the second inclined angle 23 increase the usable area of the subsequent module process.
  • the adhesive layer 3 is provided between the array substrate 1 and the color filter substrate 2 for bonding the array substrate 1 and the color filter substrate 2.
  • the silver wire layer 4 is attached to the first inclined surface 11 and the second inclined surface 21 for conducting electricity.
  • the silver wire layer 4 includes two or more wires 41 parallel to each other. One end of any wire 41 is electrically connected to the array substrate 1, and the other end is electrically connected to the flip chip film 6.
  • the conductive adhesive layer 5 is attached to the outer surface of the silver wire layer 4 to play a conductive role.
  • the conductive adhesive layer 5 is made of conductive adhesive (Anisotropic Conductive Film, ACF), the conductive adhesive shown is anisotropic conductive adhesive, which has good conductivity.
  • ACF isotropic Conductive Film
  • the conductive principle of the conductive adhesive is to use conductive particles to connect the electrodes between the IC chip and the array substrate to make them conductive, and at the same time, it can avoid the conduction and short circuit between the two adjacent electrodes, and achieve only in the Z-axis direction.
  • the material of the conductive adhesive includes two parts: resin adhesive and conductive particles. In addition to moisture-proof, heat-resistant, and insulating functions, the resin adhesive mainly fixes the relative position of the electrode between the IC chip and the array substrate, and provides a pressing force to maintain the contact area between the electrode and the conductive particles.
  • the chip on film 6 is bonded to the conductive adhesive layer 5 to provide circuit support for the display panel.
  • the chip on film 6 includes a first film 61, a bending portion 62 and a second film 63 that are integrally arranged.
  • the first film 61 is bonded to the outer surface of the conductive adhesive layer 5, the second film 63 is arranged below the array substrate 1, and is opposite to the array substrate 1.
  • One end of the bending portion 62 is connected to the first film 61, and the other end is connected To the second film 63.
  • the angle between the second film 63 and the first film 61 ranges from 120° to 150°, that is, the angle of the bending portion 62 is from 120° to 150°, so that the chip on film 6 and the conductive adhesive layer 5
  • the bonding is more compliant, ensuring good electrical conductivity between the chip-on-chip film 6 and the conductive adhesive layer 5.
  • a circuit unit 64 is provided on the upper surface of the second film 63, and the circuit unit 64 is electrically connected to the array substrate 1 through the flip chip film 6, the conductive adhesive layer 5 and the silver wire layer 4 to form electrical signal conduction of the display panel.
  • the display in this embodiment cuts a first bevel on the side of the array substrate, and a second bevel on the side of the color filter substrate, directly bonding the flip chip film to the first and second bevels, because the cutting direction is the edge When cutting inward, the bonding of the chip-on-chip film is also bent inward, greatly reducing the thickness of the lower frame of the display panel, increasing the utilization rate of the display panel, and increasing the screen-to-body ratio of the display panel.
  • one end of the array substrate and the color filter substrate is made into an inclined plane, the flip chip film is bonded to the inclined plane, and the flip chip film is integrally disposed on the side of the array substrate away from the display area.
  • the flip chip film is installed in the housing of the display device instead of in the frame. Therefore, the frame width of the display device can be designed to be smaller, further improving the display The screen-to-body ratio of the device enhances the market competitiveness of the display device.

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Abstract

本发明提供一种显示面板及其制备方法，所述显示面板包括：阵列基板，其一侧的边缘处设有第一斜面；彩膜基板，设于所述阵列基板一侧的表面；所述彩膜基板一侧的边缘处设有第二斜面，与所述第一斜面在同一平面内；以及覆晶薄膜，邦定至所述第一斜面及所述第二斜面。所述显示面板的制备方法包括以下步骤阵列基板提供步骤、彩膜基板设置步骤、切割步骤以及邦定步骤。本发明的技术效果在于，减小显示面板下边框的厚度，提高屏占比。

Description

显示面板及其制备方法 技术领域
本发明涉及显示器领域，特别涉及一种显示面板及其制备方法。
 背景技术
近年来低温多晶硅 (Low Temperature Poly-Silicon，LTPS)显示屏在中高端小尺寸产品已获得越来越多的应用，LTPS显示屏具有高分辨率、高开口率、高反应速度、低功耗等优点，现阶段为了提高面板的屏占比，衍生了很多新技术，比如窄边框、覆晶薄膜（Chip On Flex /Chip On Film，COF）、异形显示等。
目前这些已知的技术均有自己的局限：
窄边框主要通过切封（Cut on seal）压缩左右上的边框。
覆晶薄膜（COF）为集成在柔性电路板（Flexible Printed Circuit Board，FPC）上，通过各向异性导电胶（Anisotropic Conductive Film，ACF）将COF 邦定（bonding）在TFT 玻璃上。
异形显示主要通过上边缘异形仅避开摄像头等区域增加显示区域。
如图1所示，现有的显示面板包括阵列基板100、彩膜基板200以及覆晶薄膜300，彩膜基板200设于阵列基板100的上表面，覆晶薄膜300邦定至阵列基板100一端的上表面，且弯折至阵列基板100的背面，集成电路单元设于弯折至阵列基板100背面的覆晶薄膜300的上表面。虽节省了集成电路（IC）邦定的区域，但是需要预留空间给各向异性导电胶贴附，很大程度上降低了显示面板的屏占比。
当图1所示的显示面板被安装至一显示装置（如智能手机）时，图中右侧的覆晶薄膜300被安装至所述显示装置一侧的边框内，由于覆晶薄膜300为了释放应力，要保证一定是弧度，覆晶薄膜300需要占据一定的空间；因此，安装有覆晶薄膜300的边框需要保证一定的宽度。在现有技术中，安装有覆晶薄膜300的边框一般被设置为显示装置的下边框。
 技术问题
本发明的目的在于，解决现有技术中显示装置的下边框宽度大，显示装置的屏占比低的技术问题。
 技术解决方案
为实现上述目的，本发明提供一种显示面板，包括：阵列基板，其一侧的边缘处设有第一斜面；彩膜基板，设于所述阵列基板一侧的表面；所述彩膜基板一侧的边缘处设有第二斜面，与所述第一斜面在同一平面内；以及覆晶薄膜，邦定至所述第一斜面及所述第二斜面。
进一步地，所述显示面板还包括：银导线层，贴附至所述第一斜面及所述第二斜面；以及导电胶层，贴附于所述银导线层的表面，所述覆晶薄膜邦定至所述导电胶层。
进一步地，所述银导线层包括两根以上相互平行的导线，任一导线的一端电连接至所述阵列基板，另一端电连接至所述覆晶薄膜。
进一步地，所述阵列基板与所述第一斜面相对的一侧面为第一侧面；所述彩膜基板与所述第二斜面相对的一侧面为第二侧面；所述第一侧面与所述第二侧面在同一平面上。
进一步地，所述覆晶薄膜包括一体化设置的第一薄膜，邦定至导电胶层的外表面；第二薄膜，与所述阵列基板相对设置；以及弯折部，其一端连接至所述第一薄膜，另一端连接至所述第二薄膜。
进一步地，所述覆晶薄膜还包括电路单元，贴附于所述第二薄膜靠近所述阵列基板一侧的表面。
为实现上述目的，本发明还提供一种显示面板的制备方法，包括以下步骤：阵列基板提供步骤，提供一阵列基板；彩膜基板设置步骤，在所述阵列基板的上表面设置一彩膜基板；切割步骤，切割所述彩膜基板与所述阵列基板的一侧面，在所述阵列基板的一侧面形成第一斜面，在所述彩膜基板的一侧面形成第二斜面，所述第二斜面与所述第一斜面在同一平面内；以及邦定步骤，在所述第一斜面及所述第二斜面上邦定一覆晶薄膜。
进一步地，在所述彩膜基板设置步骤中，所述彩膜基板侧面与所述阵列基板的侧面在同一平面上。
进一步地，在所述切割步骤之后，所述显示面板的制备方法还包括：银浆涂布步骤，在所述第一斜面及所述第二斜面上喷涂一层银浆，形成一银浆层；刻蚀步骤，激光刻蚀所述银浆层，刻蚀出两根以上相互平行的导线，形成银导线层；以及导电胶层贴附步骤，在所述银导线层的外表面贴附导电胶层。
进一步地，在所述邦定步骤中，第一薄膜被邦定至所述导电胶层的表面，第二薄膜设于所述阵列基板的下方，弯折部的一端连接至所述第一薄膜，其另一端连接至所述第二薄膜。
 有益效果
本发明的技术效果在于，将阵列基板和彩膜基板的一端制成斜面，将覆晶薄膜邦定至所述斜面，同时将覆晶薄膜整体设于阵列基板与显示区相背离的一侧面。当显示面板被安装至一显示装置（如智能手机）时，覆晶薄膜被安装至显示装置的壳体内，而不是边框内，因此，显示装置的边框宽度可以被设计得更小，进一步提高显示装置的屏占比，提升显示装置的市场竞争力。
 附图说明
图1为现有技术中显示面板的结构示意图；
图2为本发明实施例所述显示面板的制备方法的流程图；
图3为本发明实施例所述切割步骤之后的结构示意图；
图4为本发明实施例所述银导线层的示意图；
图5为本发明实施例所述显示面板的结构示意图。
部分组件标识如下：
100、阵列基板；200、彩膜基板；300覆晶薄膜；
1、阵列基板；2、彩膜基板；3、胶层；4、银导线层；5、导电胶层；6、覆晶薄膜；
11、第一斜面；12、第一侧面；13、第一倾斜角；
21、第二斜面；22、第二侧面；23、第二倾斜角；
41、导线；
61、第一薄膜；62、弯折部；63、第二薄膜；64、电路单元。
 本发明的最佳实施方式
以下结合说明书附图详细说明本发明的优选实施例，以向本领域中的技术人员完整介绍本发明的技术内容，以举例证明本发明可以实施，使得本发明公开的技术内容更加清楚，使得本领域的技术人员更容易理解如何实施本发明。然而本发明可以通过许多不同形式的实施例来得以体现，本发明的保护范围并非仅限于文中提到的实施例，下文实施例的说明并非用来限制本发明的范围。
本发明所提到的方向用语，例如「上」、「下」、「前」、「后」、「左」、「右」、「内」、「外」、「侧面」等，仅是附图中的方向，本文所使用的方向用语是用来解释和说明本发明，而不是用来限定本发明的保护范围。
在附图中，结构相同的部件以相同数字标号表示，各处结构或功能相似的组件以相似数字标号表示。此外，为了便于理解和描述，附图所示的每一组件的尺寸和厚度是任意示出的，本发明并没有限定每个组件的尺寸和厚度。
当某些组件，被描述为“在”另一组件“上”时，所述组件可以直接置于所述另一组件上；也可以存在一中间组件，所述组件置于所述中间组件上，且所述中间组件置于另一组件上。当一个组件被描述为“安装至”或“连接至”另一组件时，二者可以理解为直接“安装”或“连接”，或者一个组件通过一中间组件“安装至”或“连接至”另一个组件。
如图2所示，本实施例提供一种显示面板的制备方法，包括以下步骤S1~S7。
S1 阵列基板提供步骤，提供一阵列基板，所述阵列基板设有第一侧面，所述阵列基板的厚度范围为0.1mm~0.2mm，在本实施例中，优选为0.15mm，所述阵列基板为显示面板提供电路支持。
S2 彩膜基板设置步骤，在所述阵列基板的上表面设置一彩膜基板，通过一胶层将彩膜基板设于所述阵列基板的上表面，使得所述彩膜基板的侧面与所述阵列基板的侧面在同一平面上，其中，所述彩膜基板设有第二侧面，所述第二侧面与所述第一侧面在同一平面内。所述彩膜基板的厚度范围为0.1mm~0.2mm，在本实施例中，优选为0.15mm。所述彩膜基板用以滤光，可使得显示面板能彩色显示。
S3 切割步骤，利用激光切割所述阵列基板及所述彩膜基板，在切割过程中产生的切割面与所述阵列基板或所述彩膜基板的上表面或下表面形成一切割夹角，该切割夹角的范围为30°~60°。切割后的面板结构参见图3，从图中所述彩膜基板的边缘处往左下方切割，在所述阵列基板的一侧面形成第一斜面，在所述彩膜基板的一侧面形成第二斜面，所述第一斜面与所述第二斜面在同一平面内，所述第一斜面与水平面的夹角为第一倾斜角，所述第二斜面与水平面的夹角为第二倾斜角，所述第一倾斜角的角度范围为30°~60°，所述第二倾斜角的角度范围为30°~60°，故在不同的实施例中，所述第一倾斜角可为35°、40°、45°、50°、55°等角度，所述第二倾斜角可为35°、40°、45°、50°、55°等角度，在本实施例中不作具体限定。
当所述第一倾斜角或所述第二倾斜角为较小角（如30°、35°、40°等）时，所述第一斜面及所述第二斜面的可用面积较大，此时，后续的银浆及导电胶的涂布范围也较大，可提高银浆及导电胶的附着力，邦定的覆晶薄膜的面积也较大。当所述第一倾斜角或所述第二倾斜角为较大角（如45°、50°、55°、60°等）时，所述第一斜面及所述第二斜面的可用面积较小，此时，后续的银浆及导电胶的涂布范围也较小，邦定的覆晶薄膜的面积也较小，故可根据覆晶薄膜所需邦定的面积来决定倾斜角的角度大小。
由于所述阵列基板及所述彩膜基板的总厚度范围约为0.2mm~0.5mm，属于较小的厚度，在所述阵列基板及所述彩膜基板的侧面涂布导电胶等时的涂布较为困难，所以在本实施例中通过切割，在所述阵列基板及所述彩膜基板的侧面形成第一斜面及第二斜面，增加后续模组工艺的可用面积，即加大了后续的银浆及导电胶的涂布范围，可提高银浆及导电胶的附着力。
S4银浆涂布步骤，在所述第一斜面及所述第二斜面上喷涂一层银浆，形成一银浆层。银浆本身具有导电件作用，可很好地用作导电材料，在本实施例中，所述银浆层用以导电。
S5 刻蚀步骤，激光刻蚀所述银浆层，刻蚀出两根以上相互平行的导线，形成银导线层（参见图4），任一导线的一端电连接至所述阵列基板，其另一端与后续的覆晶薄膜形成电连接，在所述覆晶薄膜与所述阵列基板之间实现电路的导通。
S6导电胶层贴附步骤，在所述银导线层的外表面贴附导电胶（Anisotropic Conductive Film，ACF），形成一导电胶层，所述导电胶为各向异性导电胶，具有良好的导电能力。所述导电胶的导通原理为利用导电粒子连接IC芯片与阵列基板两者之间的电极使之成为导通，同时又能避免相邻两电极间导通短路，而达成只在Z轴方向导通之目的。所述导电胶的材质包括树脂黏着剂及导电粒子两大部分。树脂黏着剂功能除了防湿气，耐热及绝缘功能外，主要为固定IC芯片与阵列基板间电极的相对位置，并提供一压迫力量以维持电极与导电粒子间的接触面积。
S7 邦定步骤，在所述导电胶层的外表面邦定一覆晶薄膜，所述覆晶薄膜包括一体化设置的第一薄膜、弯折部及第二薄膜，所述第一薄膜被邦定至所述导电胶层的表面，所述第二薄膜设于所述阵列基板的下方，所述弯折部的一端连接至所述第一薄膜，其另一端连接至所述第二薄膜。所述第二薄膜与所述第一薄膜之间的夹角范围为120°~150°，即所述弯折部的弯折角度范围为120°~150°，使得所述覆晶薄膜与所述导电胶层的贴合更服帖，保证所述覆晶薄膜与所述导电胶层之间的导电性能良好。在所述第二薄膜的上表面设有一电路单元，所述电路单元通过所述覆晶薄膜、所述导电胶层及所述银导线层电连接至所述阵列基板，形成显示面板的电信号的导通。
在所述邦定步骤之后，本实施例所述显示面板的制备方法，还可以包括偏光片制备步骤、背光模组制备步骤等工艺流程，制备出合格的显示面板。
本实施例所述显示面板的制备方法，将阵列基板和彩膜基板的一端制成斜面，将覆晶薄膜邦定至所述斜面，同时将覆晶薄膜整体设于阵列基板与显示区相背离的一侧面。当显示面板被安装至一显示装置（如智能手机）时，覆晶薄膜被安装至显示装置的壳体内，而不是边框内，因此，显示装置的边框宽度可以被设计得更小，进一步提高显示装置的屏占比，提升显示装置的市场竞争力。
相对于图1所示的显示面板，显示装置的边框区域无需预留导电胶的涂布空间，大大减小显示装置的边框厚度，进而提高显示装置的屏占比，最终提高显示装置的市场竞争力。
如图5所示，本实施例还提供一种显示面板，利用上述显示面板的制备方法制备而成，所述显示面板包括阵列基板1、彩膜基板2、胶层3、银导线层4、导电胶层5及覆晶薄膜6。
阵列基板1为显示面板提供电路支持，阵列基板1的厚度范围为0.1mm~0.2mm，在本实施例中，优选为0.15mm。阵列基板1包括第一斜面11及第一侧面12（参见图3），第一斜面11与水平面的夹角为第一倾斜角13，第一倾斜角13的角度范围为30°~60°，在不同的实施例中，第一倾斜角13可为35°、40°、45°、50°、55°等角度，在本实施例中不作具体限定，第一斜面11及第一倾斜角13的存在，增加了后续模组工艺的可用面积。
彩膜基板2设于阵列基板1的上表面，用以滤光，可使得显示面板能彩色显示。彩膜基板2的厚度范围为0.1mm~0.2mm，在本实施例中，优选为0.15mm。彩膜基板2的侧面与阵列基板1的侧面处于同一平面内，彩膜基板2包括第二斜面21及第二侧面22，第二斜面21与第一斜面11处于同一平面内，第二侧面22与第一侧面12处于同一平面内（参见图3）。第二斜面21与水平面的夹角为第二倾斜角23，第二倾斜角23的角度范围为30°~60°，在不同的实施例中，第二倾斜角23可为35°、40°、45°、50°、55°等角度，在本实施例中不作具体限定，第二斜面21及第二倾斜角23的存在，增加了后续模组工艺的可用面积。
胶层3设于阵列基板1及彩膜基板2之间，用以粘合阵列基板1及彩膜基板2。
银导线层4贴附至第一斜面11及第二斜面21，用以导电。银导线层4包括两根以上相互平行的导线41，任一导线41的一端电连接至阵列基板1，另一端电连接至覆晶薄膜6。
导电胶层5贴附于银导线层4的外表面，起到导电作用。导电胶层5的材质为导电胶（Anisotropic Conductive Film，ACF），所示导电胶为各向异性导电胶，具有良好的导电能力。所述导电胶的导通原理为利用导电粒子连接IC芯片与阵列基板两者之间的电极使之成为导通，同时又能避免相邻两电极间导通短路，而达成只在Z轴方向导通之目的。所述导电胶的材质包括树脂黏着剂及导电粒子两大部分。树脂黏着剂功能除了防湿气，耐热及绝缘功能外，主要为固定IC芯片与阵列基板间电极的相对位置，并提供一压迫力量以维持电极与导电粒子间的接触面积。
覆晶薄膜6邦定至导电胶层5，为显示面板提供电路支持。覆晶薄膜6包括一体化设置的第一薄膜61、弯折部62及第二薄膜63。第一薄膜61邦定至导电胶层5的外表面，第二薄膜63设与阵列基板1的下方，与阵列基板1相对设置，弯折部62的一端连接至第一薄膜61，另一端连接至第二薄膜63。第二薄膜63与第一薄膜61之间的夹角范围为120°~150°，即弯折部62的弯折的角度范围为120°~150°，使得覆晶薄膜6与导电胶层5的贴合更服帖，保证覆晶薄膜6与导电胶层5之间的导电性能良好。在第二薄膜63的上表面设有一电路单元64，电路单元64通过覆晶薄膜6、导电胶层5及银导线层4电连接至阵列基板1，形成显示面板的电信号的导通。
相比于图1中的显示面板采用弯折实现覆晶薄膜的邦定，虽然一定程度上减小了下边框的厚度，但仍需要预留导电胶的涂布空间，本实施例所述显示面板在阵列基板的侧面切割出第一斜面，在彩膜基板的侧面切割出第二斜面，直接将覆晶薄膜邦定至所述第一斜面及所述第二斜面，由于切割方向为由边缘处向内切割，覆晶薄膜的邦定也向内弯折，大大减小显示面板下边框的厚度，提高显示面板的利用率，提高显示面板的屏占比。
本实施例所述显示面板，将阵列基板和彩膜基板的一端制成斜面，将覆晶薄膜邦定至所述斜面，同时将覆晶薄膜整体设于阵列基板与显示区相背离的一侧面。当显示面板被安装至一显示装置（如智能手机）时，覆晶薄膜被安装至显示装置的壳体内，而不是边框内，因此，显示装置的边框宽度可以被设计得更小，进一步提高显示装置的屏占比，提升显示装置的市场竞争力。
以上所述仅是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本发明的保护范围。

Claims (10)

  1. 一种显示面板，其包括：
    阵列基板，其一侧的边缘处设有第一斜面；
    彩膜基板，设于所述阵列基板一侧的表面；所述彩膜基板一侧的边缘处设有第二斜面，与所述第一斜面在同一平面内；以及
    覆晶薄膜，邦定至所述第一斜面及所述第二斜面。
  2. 如权利要求1所述的显示面板，其包括：
    银导线层，贴附至所述第一斜面及所述第二斜面；以及
    导电胶层，贴附于所述银导线层的表面，所述覆晶薄膜邦定至所述导电胶层。
  3. 如权利要求2所述的显示面板，其中，
    所述银导线层包括两根以上相互平行的导线，
    任一导线的一端电连接至所述阵列基板，另一端电连接至所述覆晶薄膜。
  4. 如权利要求1所述的显示面板，其中，
    所述阵列基板与所述第一斜面相对的一侧面为第一侧面；
    所述彩膜基板与所述第二斜面相对的一侧面为第二侧面；
    所述第一侧面与所述第二侧面在同一平面上。
  5. 如权利要求1所述的显示面板，其中，
    所述覆晶薄膜包括一体化设置的
    第一薄膜，邦定至导电胶层的外表面；
    第二薄膜，与所述阵列基板相对设置；以及
    弯折部，其一端连接至所述第一薄膜，另一端连接至所述第二薄膜。
  6. 如权利要求5所述的显示面板，其中，
    所述覆晶薄膜还包括
    电路单元，贴附于所述第二薄膜靠近所述阵列基板一侧的表面。
  7. 一种显示面板的制备方法，其包括以下步骤：
    阵列基板提供步骤，提供一阵列基板；
    彩膜基板设置步骤，在所述阵列基板的上表面设置一彩膜基板；
    切割步骤，切割所述彩膜基板与所述阵列基板的一侧面，在所述阵列基板的一侧面形成第一斜面，在所述彩膜基板的一侧面形成第二斜面，所述第二斜面与所述第一斜面在同一平面内；以及
    邦定步骤，在所述第一斜面及所述第二斜面上邦定一覆晶薄膜。
  8. 如权利要求7所述的显示面板的制备方法，其中，
    在所述彩膜基板设置步骤中，
    所述彩膜基板侧面与所述阵列基板的侧面在同一平面上。
  9. 如权利要求7所述的显示面板的制备方法，其中，
    在所述切割步骤之后，还包括：
    银浆涂布步骤，在所述第一斜面及所述第二斜面上喷涂一层银浆，形成一银浆层；
    刻蚀步骤，激光刻蚀所述银浆层，刻蚀出两根以上相互平行的导线，形成银导线层；以及
    导电胶层贴附步骤，在所述银导线层的外表面贴附导电胶层。
  10. 如权利要求9所述的显示面板的制备方法，其中，
    在所述邦定步骤中，
    第一薄膜被邦定至所述导电胶层的表面，第二薄膜设于所述阵列基板的下方，弯折部的一端连接至所述第一薄膜，其另一端连接至所述第二薄膜。
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