WO2021072871A1 - 显示面板及其制作方法、显示装置 - Google Patents

显示面板及其制作方法、显示装置 Download PDF

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Publication number
WO2021072871A1
WO2021072871A1 PCT/CN2019/118125 CN2019118125W WO2021072871A1 WO 2021072871 A1 WO2021072871 A1 WO 2021072871A1 CN 2019118125 W CN2019118125 W CN 2019118125W WO 2021072871 A1 WO2021072871 A1 WO 2021072871A1
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WO
WIPO (PCT)
Prior art keywords
substrate
display panel
short side
frame
pin
Prior art date
Application number
PCT/CN2019/118125
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English (en)
French (fr)
Inventor
朱清永
Original Assignee
Tcl华星光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tcl华星光电技术有限公司 filed Critical Tcl华星光电技术有限公司
Priority to US16/619,077 priority Critical patent/US20210116733A1/en
Publication of WO2021072871A1 publication Critical patent/WO2021072871A1/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G02F1/133317—Intermediate frames, e.g. between backlight housing and front frame

Definitions

  • the present invention relates to the field of display technology, in particular to a display panel, a manufacturing method thereof, and a display device.
  • Thin film transistor liquid crystal display mostly uses Outer Lead Bonding (OLB), the upper and lower glass substrates adopt a non-cutting design and stagger a certain distance, and the exposed TFT pins are connected to the integrated circuit (IC), and the driving signal is input to the panel.
  • the method of connecting the driver IC is to first connect the chip on film (Chip One end of the On Film (COF) is bound to the bonding lead of the TFT glass, and the other end of the COF is crimped with the Printed Circuit Board (PCB).
  • Anisotropic Conductive Film (ACF) is usually used as an adhesive between components to achieve fixation and conduction.
  • the ultra-narrow frame display process has the following problems: high contact resistance, poor appearance, insufficient adhesion, and separation of the panel and frame during the shock test, resulting in abnormal quality.
  • the embodiment of the present invention provides a display panel, a manufacturing method thereof, and a display device.
  • the display panel in this embodiment increases the cross-sectional area of the metal pins and reduces the contact impedance of the side binding by adopting the bevel grinding method;
  • the glue filling space is increased, the amount of glue is increased, and the problem of glue overflow is avoided; at the same time, the adhesion between the frame and the substrate is improved.
  • the present application provides a display panel, the display panel comprising: a first substrate having a first short side; a second substrate disposed opposite to the first substrate, the second substrate The substrate has a second short side that is flush with the first short side; a flip chip film is bound to the first short side and the second short side; wherein the second short side of the second substrate The side surface and the lower surface of the second substrate form a first angle ⁇ , 1° ⁇ 60°.
  • the display panel further includes a metal pin disposed on a surface of the first substrate on a side close to the second substrate, and the metal pin extends to the first substrate of the first substrate.
  • the short sides form the pin cross-section.
  • the display panel further includes a conductive film disposed between the cross section of the pin and the flip chip film.
  • the material of the conductive film is at least one of metal powder nickel, gold, silver, and tin alloy.
  • the display panel further includes a frame disposed on the side surface of the first substrate and perpendicular to the lower surface of the first substrate.
  • the display panel further includes a frame disposed on a side surface of the first substrate, and the frame is arc-shaped.
  • the display panel further includes the PCB board, and the PCB board is crimped with the flip chip film.
  • the display panel further includes a backlight source, and the backlight source and the frame are fixed by screw locking.
  • the present application also provides a manufacturing method of a display panel, the manufacturing method includes:
  • Step 1 Provide a first substrate, and set metal pins on the surface of the first substrate;
  • Step 2 Provide a second substrate, and attach the first substrate to the second substrate;
  • Step 3 Performing a bevel edging process on the same side of the first substrate and the second substrate to form a first short side surface and a second short side surface, and expose the pin section of the metal pin;
  • Step 4 Disposing a conductive film and a flip chip film on the cross section of the pin to form the display panel.
  • the step 3 further includes: cutting the same side of the first substrate and the second substrate, and then using a grinding wheel for beveling.
  • the inclination angle of the grinding wheel relative to the second substrate during bevel edging is a first angle ⁇ , 1° ⁇ 60°.
  • the present application further provides a display device.
  • the display device includes the above-mentioned display panel.
  • the display panel includes: a first substrate having a first short side surface; a second substrate disposed opposite to the first substrate; The second substrate has a second short side that is flush with the first short side; the flip chip film is bound to the first short side and the second short side; wherein, the first short side of the second substrate The two short sides form a first angle ⁇ with the lower surface of the second substrate, 1° ⁇ 60°.
  • the display panel further includes a metal pin disposed on a surface of the first substrate on a side close to the second substrate, and the metal pin extends to the first substrate of the first substrate.
  • the short sides form the pin cross-section.
  • the display panel further includes a conductive film disposed between the cross section of the pin and the flip chip film.
  • the material of the conductive film is at least one of metal powder nickel, gold, silver, and tin alloy.
  • the display panel further includes a frame disposed on the side surface of the first substrate and perpendicular to the lower surface of the first substrate.
  • the display panel further includes a frame disposed on a side surface of the first substrate, and the frame is arc-shaped.
  • the display panel further includes the PCB board, and the PCB board is crimped with the flip chip film.
  • the display panel further includes a backlight source, and the backlight source and the frame are fixed by screw locking.
  • the embodiment of the present invention increases the cross-sectional area of the metal pin and reduces the contact resistance of the side binding by adopting the oblique edging method; the space for filling and coating is increased, the amount of coating is increased, and the small space is avoided. Glue overflow caused by the problem; the contact area between the filler and the glass substrate is increased, and the adhesion is enhanced; at the same time, the glue is filled to form bumps, which jam the glass substrate. Make the frame and the glass substrate bond more firmly.
  • FIG. 1 is a schematic structural diagram of a display panel provided in the prior art
  • FIG. 2 is a schematic structural diagram of an embodiment of a display panel in an embodiment of the present invention.
  • FIG. 3 is a schematic structural diagram of an embodiment of a display panel in an embodiment of the present invention.
  • FIG. 4 is a schematic structural diagram of an embodiment of a display panel in an embodiment of the present invention.
  • FIG. 5 is a schematic flowchart of an embodiment of the manufacturing method in the embodiment of the present invention.
  • Fig. 6 is a schematic diagram of the bevel edging process of an embodiment of the manufacturing method in the embodiment of the present invention.
  • first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features.
  • the features defined with “first” and “second” may explicitly or implicitly include one or more of the features.
  • “plurality” means two or more than two, unless otherwise specifically defined.
  • FIG. 1 a schematic structural diagram of a display panel provided in the prior art.
  • the display panel includes an upper polarizer 101, a lower polarizer 111, a second substrate 102, a first substrate 112, a second short side 122, a first short side 132, a backlight source 103, a liquid crystal 104, a sealant 114, and a metal lead
  • the display panel has the following problems: high contact impedance, poor appearance, insufficient adhesion, and separation of the panel and the frame during the shock test, resulting in abnormal quality.
  • embodiments of the present invention provide a display panel, a manufacturing method thereof, and a display device. Detailed descriptions are given below.
  • FIG. 2 it is a schematic structural diagram of an embodiment of a display panel in an embodiment of the present invention.
  • the display panel includes: a first substrate 112 having a first short side surface 132; a second substrate 102 and the first The substrate 112 is arranged oppositely, the second substrate 102 has a second short side 122 that is flush with the first short side 132; the flip chip film 207 is bound to the first short side 132 and the second short side On the side surface 122; wherein, the second short side surface 122 of the second substrate 102 and the lower surface of the second substrate 102 form a first angle ⁇ , 1° ⁇ 60°.
  • the first substrate 112 and the second substrate 102 are respectively a rectangular solid board with upper and lower surfaces and four side surfaces.
  • the first short side surface 132 and the second short side surface 122 It is located between two long side surfaces (not labeled), and the first short side surface 132 and the second short side surface 122 are perpendicular to the two long side surfaces.
  • the first short side 132 and the second short side 122 are preferably short sides close to the flip chip film 207, or optionally one of the first substrate 112 and the second substrate 102 One's short side, change as needed.
  • the second short side 122 of the second substrate 102 and the lower surface of the second substrate 102 form a specific angle, thereby increasing the size of the metal pins.
  • the lead 105 has a cross-sectional area, which reduces the side bonding contact impedance. Specifically, the side seal 108 coating space is increased, the amount of glue applied is increased, and the problem of glue overflow caused by small space is avoided. In other words, the contact area between the filler 108 and the glass substrate is increased, and the adhesive force is enhanced; at the same time, the filler 108 forms protrusions, which jam the glass substrate, so that the frame 109 and the glass substrate are more firmly bonded.
  • a display panel in general, it also includes liquid crystal 104, sealant 114, metal pins 105, and conductive film 206.
  • the liquid crystal 104 and the sealant 114 are both disposed on the first substrate 112 and the first substrate 112. Between the two substrates 102, the liquid crystal 104 is located in the display area of the display panel, and the sealant 114 is located in the non-display area of the display panel for bonding the first substrate 112 and the second substrate 102 to form a liquid crystal panel, seal the internal space of the liquid crystal cell, prevent the liquid crystal 104 from overflowing, and at the same time prevent water vapor and oxygen in the air from entering the inside of the liquid crystal cell.
  • the curing methods include thermal curing, photothermal curing, and photocuring;
  • the metal pin 105 is disposed on the surface of the first substrate 112 on the side close to the second substrate 102, and the metal pin 105 extends to the first short side 132 of the first substrate 112 to form a pin Section, the pin section also corresponds to the non-display area of the display panel;
  • the conductive film 206 is disposed between the pin section and the chip on film 207, because in this embodiment, the first The first short side 132 of a substrate 112 and the second short side 122 of the second substrate 102 are both inclined surfaces.
  • the second short side 122 of the second substrate 102 is The lower surface of the second substrate 102 forms a first angle ⁇ , and the arrangement of the cross-section of the pin and the conductive film 206 also changes accordingly, that is, the cross-sectional area of the cross-section of the pin becomes larger, and it is in contact with the conductive film 206 The area also becomes larger, reducing the contact impedance of the side binding.
  • the second short side 122 of the second substrate 102 and the lower surface of the second substrate 102 form a first angle ⁇ , ⁇ is preferably 1° ⁇ 60°, more preferably 3° ⁇ 50°, most preferably 5° ⁇ 45°; one end of the chip on film 207 is bound to the pin section of the metal pin 105, and the other end of the chip on film 207 is connected to the PCB board 117 crimping, the position of the PCB board 117 is flexible, and it can be arranged on the side of the backlight source 103 away from the first substrate 112, or on the side of the upper polarizer 101 away from the second substrate 102, It is beneficial to further reduce the frame width of the display panel, thereby further realizing the narrow frame design of the display device.
  • the conductive film 206 is used as an adhesive between the chip on film 207 and the pin section, and an anisotropic conductive film is usually used to realize the metal pins 105 and the chip on film 207.
  • the ACF has the characteristics of being able to continuously process extremely low material loss, and mainly includes two parts: resin adhesive and conductive particles.
  • the resin adhesive functions in addition to moisture prevention, heat resistance and insulation functions, mainly to fix the relative position of the electrode between the IC chip and the substrate, and provide a pressing force to maintain the contact area between the electrode and the conductive particles; in terms of conductive particles, the difference is different.
  • the conductive properties of the square mainly depend on the filling rate of the conductive particles, and the particle size distribution and uniformity of the conductive particles will also affect the conductive properties of the different squares.
  • conductive particles must have good particle size uniformity and roundness to ensure that the contact area between the electrode and the conductive particles is the same, maintain the same on-resistance, and at the same time prevent some electrodes from not contacting the conductive particles, resulting in open circuit The situation happened.
  • the common particle size range is between 3 ⁇ 5 ⁇ m.
  • Conductive particles that are too large will reduce the number of particles in contact with each electrode, and at the same time easily cause the conductive particles of adjacent electrodes to contact and short-circuit; conductive particles that are too small are easy to form
  • the problem of particle aggregation causes uneven particle distribution density.
  • metal powder and polymer plastic balls are mainly coated on the surface.
  • the commonly used material of the conductive film 206 is at least one of metal powder nickel, gold, silver, and tin alloy.
  • FIG. 3 it is a schematic structural diagram of an embodiment of the display panel in the embodiment of the present invention.
  • the display panel further includes a frame 109 and a glue 108, the frame 109 is arranged on the side of the liquid crystal panel for fixing the liquid crystal panel, and the liquid crystal panel and the frame 109 are glued and fixed by the glue 108.
  • the frame 109 can be made of a metal material, and the glue 108 is VHB glue.
  • the display panel further includes an upper polarizer 101, a lower polarizer 111, and a backlight source 103.
  • the frame 109 is arranged on the side surface of the first substrate 112 and is perpendicular to the lower surface of the first substrate 112.
  • the side of the frame 109 close to the backlight source 103 is provided with a threaded hole, and the backlight source 103 and the frame 109 are fixed by screwing.
  • the second substrate 102 has a second
  • the short side surface 122 and the lower surface of the second substrate 102 form a first angle ⁇ , which increases the coating space of the glue filling 108, increases the amount of glue applied, and avoids the problem of glue overflow caused by small space.
  • the contact area between the filler 108 and the glass substrate is increased, and the adhesive force is enhanced; at the same time, the filler 108 forms protrusions, which jam the glass substrate.
  • the frame 109 and the glass substrate are combined more firmly.
  • the frame 109 can also be optimized continuously. Therefore, on the basis of the above embodiment, in another embodiment of the present invention, as shown in FIG. 4, it is an embodiment of the present invention.
  • the frame 209 is disposed on the side surface of the first substrate 112, and the frame 209 is arc-shaped, the shape of the glue 208 is also changed accordingly, and the frame 209 can be further combined with the liquid crystal panel. firm.
  • an embodiment of the present invention also provides a manufacturing method of a display panel, as shown in FIG. 5, which is a schematic flowchart of an embodiment of the manufacturing method in the embodiment of the present invention.
  • the manufacturing method of the display panel includes the following steps:
  • Step 1 (S1 in the figure), providing a first substrate 112, and setting metal pins 105 on the surface of the first substrate 112;
  • Step 2 (S2 in the figure), providing a second substrate 102, and bonding the first substrate 112 to the second substrate 102;
  • Step 3 (S3 in the figure), bevel the same side of the first substrate 112 and the second substrate 102 to form a first short side 132 and a second short side 122, and expose the metal Pin section of pin 105;
  • Step 4 (S4 in the figure), a conductive film 206 and a flip chip film 207 are arranged at the pin section to form the display panel.
  • FIG. 6 it is a schematic diagram of the bevel edging process of an embodiment of the manufacturing method in the embodiment of the present invention.
  • the step 3 also includes: cutting the same side of the first substrate 112 and the second substrate 102, and then using a grinding wheel for bevel edging. When beveling, the grinding wheel is opposite to the second substrate 102.
  • the inclination angle of is the first angle ⁇ , ⁇ is preferably 1° ⁇ 60°, more preferably 3° ⁇ 50°, and most preferably 5° ⁇ 45°.
  • the embodiment of the present invention increases the cross-sectional area of the metal pin 105 and reduces the side binding contact impedance by adopting the oblique edging method. Specifically, the coating space of the glue filling 108 is increased, the amount of glue applied is increased, and the problem of glue overflow caused by small space is avoided. In other words, the contact area between the filler 108 and the glass substrate is increased, and the adhesive force is enhanced; at the same time, the filler 108 forms protrusions, which jam the glass substrate. The frame 109 and the glass substrate are combined more firmly.
  • the embodiment of the present invention also provides a display device, and the display device includes the display panel as described in the foregoing embodiment.
  • the performance of the display device is further improved.
  • each of the above units or structures can be implemented as independent entities, or can be combined arbitrarily, and implemented as the same or several entities.
  • specific implementation of each of the above units or structures please refer to the previous method embodiments. No longer.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

一种显示面板及其制作方法、显示装置，包括第一基板（112），具有第一短侧面（132）；第二基板（102），与第一基板（112）相对设置，第二基板（102）具有与第一短侧面（132）齐平的第二短侧面（122）；覆晶薄膜（207），绑定于第一短侧面（132）和第二短侧面（122）上；其中，第二基板（102）的第二短侧面（122）与第二基板（112）的下表面成第一角度a，10 o＜a＜60 o。

Description

显示面板及其制作方法、显示装置 技术领域
本发明涉及显示技术领域，具体涉及一种显示面板及其制作方法、显示装置。
 背景技术
薄膜晶体管液晶显示器（Thin film transistor liquid crystal display，TFT-LCD）多采用外引脚绑定（Outer Lead Bonding，OLB），上下玻璃基板采用非切齐设计错开一段距离，露出TFT引脚连接驱动集成电路(Integrated Circuit，IC），将驱动信号输入面板。连接驱动IC的方法是，先将覆晶薄膜（Chip On Film，COF）的一端绑定TFT 玻璃的金属引脚（bonding lead）上，COF另一端与印制电路板（Printed Circuit Board，PCB）压接。各部件间通常采用异方性导电膜（Anisotropic Conductive Film，ACF）作为接着剂，实现固定和导通。
OLB区外露的引脚，增加了整机的边框宽度，影响美观。为解决此问题，业界出现了一种新型的侧面绑定（Side Bonding）技术。该技术将上下基板切齐，通过侧面研磨露出金属引脚的断面，在断面处印刷导电薄膜，从侧面绑定COF。再通过填胶（Side sealing）与边框粘连，实现超窄边框。
 技术问题
超窄边框显示屏工艺存在以下问题：接触阻抗较高、外观不良、粘附力不足，震荡测试时面板与边框分离，造成品质异常。
 技术解决方案
本发明实施例提供一种显示面板及其制作方法、显示装置，本实施例中的显示面板通过采用斜磨边的方式，增大了金属引脚截面积，减小了侧面绑定接触阻抗；增大了填胶空间，增大了涂胶量，避免了溢胶问题；同时提升了边框与基板的粘附力。
为解决上述问题，第一方面，本申请提供一种显示面板，所述显示面板包括：第一基板，具有第一短侧面；第二基板，与所述第一基板相对设置，所述第二基板具有与所述第一短侧面齐平的第二短侧面；覆晶薄膜，绑定于所述第一短侧面和所述第二短侧面上；其中，所述第二基板的第二短侧面与所述第二基板的下表面成第一角度α，1°＜α＜60°。
根据本发明一些实施例，所述显示面板还包括金属引脚，设置于所述第一基板靠近所述第二基板一侧的表面，所述金属引脚延伸至所述第一基板的第一短侧面形成引脚断面。
根据本发明一些实施例，所述显示面板还包括导电膜，设置于所述引脚断面与所述覆晶薄膜之间。
根据本发明一些实施例，所述导电膜的材料为金属粉镍、金、银以及锡合金中的至少一种。
根据本发明一些实施例，所述显示面板还包括边框，设置于所述第一基板的侧面，且垂直于所述第一基板的下表面。
根据本发明一些实施例，所述显示面板还包括边框，设置于所述第一基板的侧面，且所述边框呈弧形。
根据本发明一些实施例，所述显示面板还包括所述PCB板，所述PCB板与所述覆晶薄膜压接。
根据本发明一些实施例，所述显示面板还包括背光源，所述背光源与所述边框通过螺钉锁附固定。
本申请还提供一种显示面板的制作方法，所述制作方法包括：
步骤1、提供第一基板，在所述第一基板表面设置金属引脚；
步骤2、提供第二基板，将所述第一基板与所述第二基板相贴合；
步骤3、对所述第一基板和所述第二基板的同一侧进行斜磨边处理以形成第一短侧面和第二短侧面，且露出所述金属引脚的引脚断面；
步骤4、在所述引脚断面处设置导电膜以及覆晶薄膜形成所述显示面板。
根据本发明一些实施例，所述步骤3中还包括：对所述第一基板和所述第二基板的同一侧进行切割，然后使用磨轮进行斜磨边。
根据本发明一些实施例，斜磨边时所述磨轮相对所述第二基板的倾斜角为第一角度α，1°＜α＜60°。
本申请又提供一种显示装置，所述显示装置包括上述的显示面板，所述显示面板包括：第一基板，具有第一短侧面；第二基板，与所述第一基板相对设置，所述第二基板具有与所述第一短侧面齐平的第二短侧面；覆晶薄膜，绑定于所述第一短侧面和所述第二短侧面上；其中，所述第二基板的第二短侧面与所述第二基板的下表面成第一角度α，1°＜α＜60°。
根据本发明一些实施例，所述显示面板还包括金属引脚，设置于所述第一基板靠近所述第二基板一侧的表面，所述金属引脚延伸至所述第一基板的第一短侧面形成引脚断面。
根据本发明一些实施例，所述显示面板还包括导电膜，设置于所述引脚断面与所述覆晶薄膜之间。
根据本发明一些实施例，所述导电膜的材料为金属粉镍、金、银以及锡合金中的至少一种。
根据本发明一些实施例，所述显示面板还包括边框，设置于所述第一基板的侧面，且垂直于所述第一基板的下表面。
根据本发明一些实施例，所述显示面板还包括边框，设置于所述第一基板的侧面，且所述边框呈弧形。
根据本发明一些实施例，所述显示面板还包括所述PCB板，所述PCB板与所述覆晶薄膜压接。
根据本发明一些实施例，所述显示面板还包括背光源，所述背光源与所述边框通过螺钉锁附固定。
 有益效果
本发明实施例通过采用斜磨边的方式，增大了金属引脚截面积，减小了侧面绑定接触阻抗；增大了填胶涂布空间，增大了涂胶量，避免了空间小造成的溢胶问题；增大了填胶与玻璃基板的接触面积，增强了粘力；同时填胶形成凸起，卡住了玻璃基板。使边框与玻璃基板结合更牢固。
 附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是现有技术中提供的一种显示面板的结构示意图；
图2是本发明实施例中显示面板的一个实施例的结构示意图；
图3是本发明实施例中显示面板的一个实施例的结构示意图；
图4是本发明实施例中显示面板的一个实施例的结构示意图；
图5是本发明实施例中制作方法的一个实施例的流程示意图；及
图6是本发明实施例中制作方法的一个实施例的斜磨边制程示意图。
图中101-上偏光片；111-下偏光片；102-第二基板；112-第一基板；122-第二短侧面；132-第一短侧面；103-背光源；104-液晶；114-框胶；105-金属引脚；106/206-导电膜；107/207覆晶薄膜；117-PCB板；108/208-填胶；109/209-边框。
 本发明的实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
在本发明的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本发明的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
如图1所示，现有技术中提供的一种显示面板的结构示意图。所述显示面板包括上偏光片101、下偏光片111、第二基板102、第一基板112、第二短侧面122、第一短侧面132、背光源103、液晶104、框胶114、金属引脚105、导电膜106、覆晶薄膜107、PCB板117、填胶108以及边框109。所述显示面板存在以下问题：接触阻抗较高、外观不良、粘附力不足，震荡测试时面板与边框分离，造成品质异常。
基于此，本发明实施例提供一种显示面板及其制作方法、显示装置。以下分别进行详细说明。
首先，如图2所示，为本发明实施例中显示面板的一个实施例结构示意图，该显示面板包括：第一基板112，具有第一短侧面132；第二基板102，与所述第一基板112相对设置，所述第二基板102具有与所述第一短侧面132齐平的第二短侧面122；覆晶薄膜207，绑定于所述第一短侧面132和所述第二短侧面122上；其中，所述第二基板102的第二短侧面122与所述第二基板102的下表面成第一角度α，1°＜α＜60°。
在一实施例中，所述第一基板112与所述第二基板102分别为一矩形实体板体且具有上下表面以及四个侧面，所述第一短侧面132与所述第二短侧面122为位于二长侧面(未标示)之间，且所述第一短侧面132与所述第二短侧面122与所述两长侧面相互垂直。在本实施例中，所述第一短侧面132与所述第二短侧面122优选为靠近覆晶薄膜207的短侧面，或任选所述第一基板112与所述第二基板102其中之一的短侧面，视需要而改变。
本发明实施例通过使得所述第二基板102的第二短侧面122与所述第二基板102的下表面成特定角度的方式，增大了金属引脚(bonding lead)105截面积，减小了侧面绑定(side bonding)接触阻抗。具体的，增大了填胶(side seal)108涂布空间，增大了涂胶量，避免了空间小造成的溢胶问题。换言之，增大了填胶108与玻璃基板的接触面积，增强了粘力；同时填胶108形成凸起，卡住了玻璃基板，使边框109与玻璃基板结合更牢固。
在显示面板中，一般情况下，还包括液晶104、框胶114、金属引脚105以及导电膜206，所述液晶104和所述框胶114均设置于所述第一基板112与所述第二基板102之间，所述液晶104位于所述显示面板的显示区，所述框胶114位于所述显示面板的非显示区，用于粘合所述第一基板112与所述第二基板102以形成液晶面板，密封液晶盒内部空间，阻止所述液晶104外溢，同时阻止空气中的水汽和氧气进入液晶盒内部，其固化方法有热固化法、光热固化并用法、光固化法；所述金属引脚105，设置于所述第一基板112靠近所述第二基板102一侧的表面，所述金属引脚105延伸至所述第一基板112的第一短侧面132形成引脚断面，所述引脚断面也对应所述显示面板的非显示区；所述导电膜206，设置于所述引脚断面与所述覆晶薄膜207之间，由于本实施例中，所述第一基板112的第一短侧面132和所述第二基板102的第二短侧面122均为倾斜的面，相比于现有技术，所述第二基板102的第二短侧面122与所述第二基板102的下表面成第一角度α，所述引脚断面和所述导电膜206的设置方式也随之发生改变，即引脚断面的截面积变大，与所述导电膜206接触的面积也变大，减小了侧面绑定接触阻抗。
进一步的，所述第二基板102的第二短侧面122与所述第二基板102的下表面成第一角度α，α优选为1°＜α＜60°，更优选为3°＜α＜50°，最优选为5°＜α＜45°；所述覆晶薄膜207的一端绑定所述金属引脚105的引脚断面上，所述覆晶薄膜207的另一端与所述PCB板117压接，所述PCB板117位置灵活，可以设置在所述背光源103远离所述第一基板112一侧，也可设置在所述上偏光片101远离所述第二基板102一侧，有利于进一步减小显示面板的边框宽度，从而进一步实现显示装置的窄边框设计。
所述导电膜206作为所述覆晶薄膜207与所述引脚断面之间的接着剂，通常采用异方性导电膜，用于实现所述金属引脚105和所述覆晶薄膜207、所述覆晶薄膜207和所述PCB板117的固定和导通，ACF具有可以连续加工极低材料损失的特性，主要包括树脂黏着剂、导电粒子两大部分。树脂黏着剂功能除了防湿气，接着，耐热及绝缘功能外主要为固定IC芯片与基板间电极相对位置，并提供一压迫力量已维持电极与导电粒子间的接触面积；在导电粒子方面，异方导电特性主要取决于导电粒子的充填率，导电粒子的粒径分布和分布均匀性亦会对异方导电特性有所影响。通常，导电粒子必须具有良好的粒径均一性和真圆度，以确保电极与导电粒子间的接触面积一致，维持相同的导通电阻，并同时避免部分电极未接触到导电粒子，导致开路的情形发生。常见的粒径范围在3~5μm之间，太大的导电粒子会降低每个电极接触的粒子数，同时也容易造成相邻电极导电粒子接触而短路的情形；太小的导电粒子容易行成粒子聚集的问题，造成粒子分布密度不平均。在导电粒子的种类方面目前已金属粉末和高分子塑料球表面涂布金属为主，常见使用的所述导电膜206的材料为金属粉镍、金、银以及锡合金中的至少一种。
在上述实施例的基础上，在本发明的另一个实施例中，如图3所示，是本发明实施例中显示面板的一个实施例的结构示意图。所述显示面板还包括边框109和填胶108，所述边框109设置在液晶面板侧面用于固定所述液晶面板，所述液晶面板与所述边框109通过填胶108粘合固定。优选的，所述边框109可以采用金属材质制作，所述填胶108为VHB胶。具体地，所述显示面板还包括上偏光片101、下偏光111、背光源103，所述边框109设置于所述第一基板112的侧面，且垂直于所述第一基板112的下表面，所述边框109靠近所述背光源103的一侧设有螺纹孔，所述背光源103与所述边框109通过螺钉锁附固定，相比于现有技术，所述第二基板102的第二短侧面122与所述第二基板102的下表面成第一角度α，增大了填胶108涂布空间，增大了涂胶量，避免了空间小造成的溢胶问题。换言之，增大了填胶108与玻璃基板的接触面积，增强了粘力；同时填胶108形成凸起，卡住了玻璃基板。使边框109与玻璃基板结合更牢固。
当然，本发明实施例中，也可以对所述边框109继续进行优化，因此，在上述实施例的基础上，在本发明的另一个实施例中，如图4所示，是本发明实施例中显示面板的一个实施例的结构示意图。所述边框209设置于所述第一基板112的侧面，且所述边框209呈弧形，所述填胶208的形状也随之改变，可进一步使所述边框209与所述液晶面板组合更牢固。
为了实现上述显示面板的结构，本发明实施例还提供了一种显示面板的制备方法，如图5所示，是本发明实施例中制作方法的一个实施例的流程示意图。
所述显示面板的制作方法，包括以下步骤：
步骤1（如图中S1）、提供第一基板112，在所述第一基板112表面设置金属引脚105；
步骤2（如图中S2）、提供第二基板102，将所述第一基板112与所述第二基板102相贴合；
步骤3（如图中S3）、对所述第一基板112和所述第二基板102的同一侧进行斜磨边处理以形成第一短侧面132和第二短侧面122，且露出所述金属引脚105的引脚断面；
步骤4（如图中S4）、在所述引脚断面处设置导电膜206以及覆晶薄膜207形成所述显示面板。
具体地，如图6所示，是本发明实施例中制作方法的一个实施例的斜磨边制程示意图。所述步骤3中还包括：对所述第一基板112和所述第二基板102的同一侧进行切割，然后使用磨轮进行斜磨边，斜磨边时所述磨轮相对所述第二基板102的倾斜角为第一角度α，α优选为1°＜α＜60°，更优选为3°＜α＜50°，最优选为5°＜α＜45°。
本发明实施例通过采用斜磨边的方式，增大了金属引脚105截面积，减小了侧面绑定接触阻抗。具体的，增大了填胶108涂布空间，增大了涂胶量，避免了空间小造成的溢胶问题。换言之，增大了填胶108与玻璃基板的接触面积，增强了粘力；同时填胶108形成凸起，卡住了玻璃基板。使边框109与玻璃基板结合更牢固。
为了更好实施本发明实施例中显示面板，在显示面板的基础之上，本发明实施例中还提供一种显示装置，所述显示装置包括如上述实施例中所述的显示面板。
通过采用如上实施例中描述的显示面板，进一步提升了显示装置的性能。
在上述实施例中，对各个实施例的描述都各有侧重，某个实施例中没有详述的部分，可以参见上文针对其他实施例的详细描述，此处不再赘述。
具体实施时，以上各个单元或结构可以作为独立的实体来实现，也可以进行任意组合，作为同一或若干个实体来实现，以上各个单元或结构的具体实施可参见前面的方法实施例，在此不再赘述。
以上各个操作的具体实施可参见前面的实施例，在此不再赘述。
以上对本发明实施例所提供的一种显示面板及其制作方法、显示装置进行了详细介绍，本文中应用了具体个例对本发明的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本发明的方法及其核心思想；同时，对于本领域的技术人员，依据本发明的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本发明的限制。

Claims (19)

  1. 一种显示面板，包括：
    第一基板，具有第一短侧面；
    第二基板，与所述第一基板相对设置，所述第二基板具有与所述第一短侧面齐平的第二短侧面；
    覆晶薄膜，绑定于所述第一短侧面和所述第二短侧面上；
    其中，所述第二基板的第二短侧面与所述第二基板的下表面成第一角度α，1°＜α＜60°。
  2. 根据权利要求1所述的显示面板，其中，所述显示面板还包括金属引脚，设置于所述第一基板靠近所述第二基板一侧的表面，所述金属引脚延伸至所述第一基板的第一短侧面形成引脚断面。
  3. 根据权利要求2所述的显示面板，其中，所述显示面板还包括导电膜，设置于所述引脚断面与所述覆晶薄膜之间。
  4. 根据权利要求3所述的显示面板，其中，所述导电膜的材料为金属粉镍、金、银以及锡合金中的至少一种。
  5. 根据权利要求1所述的显示面板，其中，所述显示面板还包括边框，设置于所述第一基板的侧面，且垂直于所述第一基板的下表面。
  6. 根据权利要求1所述的显示面板，其中，所述显示面板还包括边框，设置于所述第一基板的侧面，且所述边框呈弧形。
  7. 根据权利要求1所述的显示面板，其中，所述显示面板还包括所述PCB板，所述PCB板与所述覆晶薄膜压接。
  8. 根据权利要求5所述的显示面板，其中，所述显示面板还包括背光源，所述背光源与所述边框通过螺钉锁附固定。
  9. 一种显示面板的制作方法，包括以下步骤：
    步骤1、提供第一基板，在所述第一基板表面设置金属引脚；
    步骤2、提供第二基板，将所述第一基板与所述第二基板相贴合；
    步骤3、对所述第一基板和所述第二基板的同一侧进行斜磨边处理以形成第一短侧面和第二短侧面，且露出所述金属引脚的引脚断面；
    步骤4、在所述引脚断面处设置导电膜以及覆晶薄膜形成所述显示面板。
  10. 根据权利要求7所述的制作方法，其中，所述步骤3中还包括：对所述第一基板和所述第二基板的同一侧进行切割，然后使用磨轮进行斜磨边。
  11. 根据权利要求8所述的制作方法，其中，斜磨边时所述磨轮相对所述第二基板的倾斜角为第一角度α，1°＜α＜60°。
  12. 一种显示装置，包括显示面板，所述显示面板包括：
    第一基板，具有第一短侧面；
    第二基板，与所述第一基板相对设置，所述第二基板具有与所述第一短侧面齐平的第二短侧面；
    覆晶薄膜，绑定于所述第一短侧面和所述第二短侧面上；
    其中，所述第二基板的第二短侧面与所述第二基板的下表面成第一角度α，1°＜α＜60°。
  13. 根据权利要求12所述的显示装置，其中，所述显示面板还包括金属引脚，设置于所述第一基板靠近所述第二基板一侧的表面，所述金属引脚延伸至所述第一基板的第一短侧面形成引脚断面。
  14. 根据权利要求13所述的显示装置，其中，所述显示面板还包括导电膜，设置于所述引脚断面与所述覆晶薄膜之间。
  15. 根据权利要求14所述的显示装置，其中，所述导电膜的材料为金属粉镍、金、银以及锡合金中的至少一种。
  16. 根据权利要求12所述的显示装置，其中，所述显示面板还包括边框，设置于所述第一基板的侧面，且垂直于所述第一基板的下表面。
  17. 根据权利要求12所述的显示装置，其中，所述显示面板还包括边框，设置于所述第一基板的侧面，且所述边框呈弧形。
  18. 根据权利要求12所述的显示装置，其中，所述显示面板还包括所述PCB板，所述PCB板与所述覆晶薄膜压接。
  19. 根据权利要求16所述的显示装置，其中，所述显示面板还包括背光源，所述背光源与所述边框通过螺钉锁附固定。
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