WO2021012337A1 - 显示装置的绑定方法及显示装置 - Google Patents

显示装置的绑定方法及显示装置 Download PDF

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Publication number
WO2021012337A1
WO2021012337A1 PCT/CN2019/101442 CN2019101442W WO2021012337A1 WO 2021012337 A1 WO2021012337 A1 WO 2021012337A1 CN 2019101442 W CN2019101442 W CN 2019101442W WO 2021012337 A1 WO2021012337 A1 WO 2021012337A1
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WO
WIPO (PCT)
Prior art keywords
display panel
circuit board
flexible circuit
conductive glue
conductive
Prior art date
Application number
PCT/CN2019/101442
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English (en)
French (fr)
Inventor
李春旺
Original Assignee
武汉华星光电半导体显示技术有限公司
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Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Publication of WO2021012337A1 publication Critical patent/WO2021012337A1/zh

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Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays

Definitions

  • the present invention relates to the field of display technology, in particular to a method for binding a display panel and a display device.
  • the current flat display devices on the market include liquid crystal display devices (Liquid Crystal Display, LCD) and active matrix organic light-emitting diodes (Active-matrix Organic light emitting diode, AMOLED) display device.
  • LCD Liquid Crystal Display
  • AMOLED Active matrix organic light-emitting diodes
  • AMOLED has the characteristics of self-luminescence, high brightness, wide viewing angle, high contrast, flexibility, low energy consumption, etc., so it has received widespread attention, and as a new generation of display methods, it has begun to gradually replace traditional liquid crystal display devices and is widely used On mobile phone screens, computer monitors, full-color TVs, etc.
  • Existing flat panel display devices generally include a display panel (Panel) and an external circuit.
  • an external circuit such as a flexible circuit board (Free Pascal Compiler, FPC), driver chip (IC), etc.
  • FPC Flexible Pascal Compiler
  • IC driver chip
  • OLB Lead Bonding
  • ACF anisotropic conductive film
  • ACF products mainly include resin layer (Electrical insulation) and conductive particles (Electrical insulation) distributed in the resin layer. conduction), the binding method of the display device includes a base and a hot plate indenter above the base. In bonding, the alignment is performed first, and then the pressing is performed. Among them, the temperature, time and pressure of the pressing are very strict during the pressing. If the alignment accuracy is not enough or the pressing conditions are not suitable, it will cause the bonding. bad.
  • COP Chip On Panel
  • Attach the ACF to form the first conductive glue 400 and then connect the chip device 300 to the display panel 100 through pre-pressing and self-pressing, and realize the electrical conduction between the two through the first conductive glue 400 in the middle; then perform FPC bonding
  • the flexible circuit board 200 is bound to the display panel 100, specifically, as shown in FIG. 2, an ACF is attached to the FPC binding area of the display panel 100 to form a second conductive glue 500, and then as shown in FIG.
  • the flexible circuit board 200 is connected to the display panel 100 through pre-pressing and local pressing, and electrical conduction between the two is realized through the second conductive gel 500 in the middle.
  • the yield rate of its Panel heavy industry must be extremely low; accordingly, the bonding process of flexible AMOLED devices is involved
  • the main materials are Panel, IC and FPC, among which Panel is the main cost of the entire flexible AMOLED module, so it is necessary to improve the bonding process
  • the yield rate of the Panel is particularly important.
  • the flexible circuit board 200 is pressed against the display panel 100.
  • the display panel 100 and the chip device 300 will be scrapped together.
  • the scrapping of the Panel and IC will cause a significant cost loss and also affect the utilization rate of the equipment.
  • the ACF is first attached to the FPC bonding area of the display panel 100, and then the flexible circuit board 200 is pressed together with the display panel 100 to ensure good bonding.
  • the width of the second conductive adhesive 500 needs to be set to be greater than the width of the flexible circuit board 200, that is, on one side of the flexible circuit board 200, the distance between the edge of the display panel 100 and the edge of the second conductive adhesive 500 is X1.
  • the distance from the edge of the panel 100 to the edge of the flexible circuit board 200 is X2, then X1 ⁇ X2. Since the ACF material is expensive, this increases the material cost of the display device.
  • the purpose of the present invention is to provide a binding method for a display device, which can reduce the influence of the ACF attachment process on the binding process, avoid panel scrapping during heavy work due to poor ACF attachment, reduce the use of ACF materials, and improve product performance Yield rate and equipment utilization rate.
  • the purpose of the present invention is also to provide a display device that can reduce the impact of ACF attachment process on the binding process, avoid panel scrapping during heavy work due to poor ACF attachment, reduce the use of ACF materials, and improve product yield and Equipment utilization rate.
  • the present invention first provides a method for binding a display device, which includes the following steps:
  • Step S1 Provide a display panel and a flexible circuit board.
  • the flexible circuit board is provided with a plurality of conductive terminals arranged horizontally, and an anisotropic conductive glue is attached to the conductive terminals of the flexible circuit board to form a first conductive glue.
  • the lateral width of the first conductive glue is smaller than the lateral width of the flexible circuit board;
  • Step S2 Perform attachment detection on the first conductive glue on the flexible circuit board. If the first conductive glue is not qualified, discard the flexible circuit board, if the first conductive glue is qualified, go to step S3;
  • Step S3 the side of the flexible circuit board attached with the first conductive adhesive faces the display panel, and the flexible circuit board and the display panel are aligned and pressed together so that the flexible circuit board and the display panel pass through
  • the first conductive glue realizes electrical conduction, and the first conductive glue is completely sandwiched between the flexible circuit board and the display panel.
  • the step S1 also includes providing a chip device, attaching an anisotropic conductive glue to the display panel to form a second conductive glue, aligning the chip device with the second conductive glue on the display panel, and then aligning The chip device and the display panel are pressed together, so that the chip device and the display panel are electrically connected through the second conductive glue.
  • the display panel includes a display area and a peripheral area located outside the display area, and the peripheral area includes a COP binding area and an FPC binding area arranged at intervals;
  • the second conductive glue is correspondingly attached to the COP binding area of the display panel
  • the first conductive glue is correspondingly attached to the FPC binding area of the display panel.
  • the flexible circuit board is provided with alignment marks on both sides of the plurality of conductive terminals;
  • step S2 it is determined whether the first conductive gel is qualified according to the distance between the edge of the first conductive gel and the alignment mark.
  • the display panel is an AMOLED display panel, and the display panel includes a base substrate, a TFT array layer provided on the base substrate, and an OLED functional layer provided on the TFT display layer;
  • the base substrate is a flexible substrate.
  • an ACF attaching device is used to attach an anisotropic conductive adhesive to the flexible circuit board
  • the ACF attaching device has an automatic detection function. In the step S2, the ACF attaching device automatically detects whether the first conductive glue is attached qualified.
  • the present invention also provides a display device, including a display panel and a flexible circuit board bound to the display panel, a first conductive glue is arranged between the display panel and the flexible circuit board, and the first conductive glue is anisotropic Conductive glue, the display panel and the flexible circuit board are electrically connected through the first conductive glue;
  • the flexible circuit board is provided with a plurality of conductive terminals arranged horizontally, and the first conductive glue is first attached to the conductive terminals of the flexible circuit board, and then is pressed together with the flexible circuit board to the display panel on;
  • the lateral width of the first conductive glue is smaller than the lateral width of the flexible circuit board, and the first conductive glue is completely sandwiched between the flexible circuit board and the display panel.
  • the display device further includes a chip supply device bound to the display panel, a second conductive glue is arranged between the display panel and the chip device, the second conductive glue is an anisotropic conductive glue, and the display panel
  • the chip device is electrically connected to the chip device through the second conductive glue.
  • the display panel includes a display area and a peripheral area located outside the display area, and the peripheral area includes a COP binding area and an FPC binding area arranged at intervals;
  • the first conductive glue is correspondingly attached to the FPC binding area of the display panel
  • the second conductive adhesive is correspondingly attached to the COP binding area of the display panel.
  • the display panel is an AMOLED display panel, and the display panel includes a base substrate, a TFT array layer provided on the base substrate, and an OLED functional layer provided on the TFT display layer;
  • the base substrate is a flexible substrate.
  • the binding method of the display device of the present invention first attaches an anisotropic conductive glue to the flexible circuit board to form a first conductive glue, and then quality the attached state of the first conductive glue After inspection, after confirming that the first conductive adhesive is qualified, the flexible circuit board and the display panel are aligned and pressed together, so as to avoid the expensive display panel being scrapped during heavy work due to poor adhesion of the first conductive adhesive.
  • a conductive glue is attached unqualified, the flexible circuit board can be thrown directly, so that the bonding equipment can continue to operate, and the equipment utilization rate can be effectively improved.
  • the width of the first conductive adhesive can be reduced, thereby reducing the use of anisotropic conductive adhesive and reducing the material cost of the anisotropic conductive adhesive in the bonding process.
  • the display device of the present invention can prevent expensive display panels from being scrapped during heavy work due to poor adhesion of the first conductive glue, reduce the use of anisotropic conductive glue materials, and improve product yield and equipment utilization.
  • FIG. 1 is a schematic diagram of bonding a chip device on a display panel in a bonding process of a conventional display device
  • FIG. 2 is a schematic diagram of attaching an ACF to the FPC binding area of the display panel in the binding process of the existing display device;
  • FIG. 3 is a schematic diagram of binding the flexible circuit board on the display panel in the binding process of the existing display device
  • FIG. 4 is a schematic flowchart of a method for binding a display device of the present invention.
  • step S1 of the binding method of the display device of the present invention is a schematic diagram of step S1 of the binding method of the display device of the present invention.
  • step S2 of the binding method of the display device of the present invention is a schematic diagram of step S2 of the binding method of the display device of the present invention.
  • FIG. 7 is a schematic diagram of step S3 of the binding method of a display device of the present invention and a schematic structural diagram of the display device of the present invention.
  • the present invention first provides a method for binding a display device, including the following steps:
  • Step S1 As shown in FIG. 5, a display panel 10, a flexible circuit board 20 and a chip device 30 are provided.
  • the flexible circuit board 20 is provided with a plurality of conductive terminals 21 arranged horizontally.
  • the chip device 30 is bound to the display On the panel 10, an anisotropic conductive adhesive is then attached to the conductive terminals 21 of the flexible circuit board 20 to form a first conductive adhesive 40.
  • the lateral width of the first conductive adhesive 40 is smaller than that of the flexible circuit board. 20 horizontal width.
  • the process of binding the chip device 30 to the display panel 10 specifically includes attaching an anisotropic conductive glue to the display panel 10 to form a second conductive glue 50, and connecting the chip device 30 with The second conductive glue 50 on the display panel 10 is aligned, and then the chip device 30 and the display panel 10 are pressed together, so that the chip device 30 and the display panel 10 are electrically connected through the second conductive glue 50 to complete the The bonding between the chip device 30 and the display panel 10; wherein after the chip device 30 is aligned with the second conductive gel 50 on the display panel 10, the pre-pressing process and the original The pressing process realizes the pressing of the chip device 30 and the display panel 10.
  • the display panel 10 includes a display area 11 and a peripheral area 12 located outside the display area 12.
  • the peripheral area 12 includes a COP binding area 13 and an FPC binding area 14 arranged at intervals; the step S1
  • the second conductive glue 50 is correspondingly attached to the COP binding area 13 of the display panel 10.
  • the display panel 10 is an AMOLED display panel, and the display panel 10 includes a base substrate, a TFT array layer provided on the base substrate, and an OLED functional layer (not shown) provided on the TFT display layer;
  • the base substrate is a flexible substrate.
  • an ACF attaching device is used to attach an anisotropic conductive adhesive to the flexible circuit board 20.
  • Step S2 As shown in FIG. 6, the first conductive adhesive 40 on the flexible circuit board 20 is attached and tested. If the first conductive adhesive 40 fails to be attached, the flexible circuit board 20 is discarded. Step S3 is performed if the glue 40 is qualified.
  • the flexible circuit board 20 is provided with alignment marks 25 on both sides of the plurality of conductive terminals 21; in step S2, the distance between the edge of the first conductive glue 40 and the alignment mark 25 is determined. Determine whether the first conductive adhesive 40 is qualified; further, use the two-end alignment marks 25 as a reference to measure the attachment positions of the two ends of the first conductive adhesive 40 to calculate the attachment tolerance of the first conductive adhesive 40 .
  • the ACF attaching device has an automatic detection function. After attaching the anisotropic conductive adhesive to the flexible circuit board 20, the ACF attaching device automatically detects whether the first conductive adhesive 40 is qualified. In this way, the attachment accuracy of the first conductive adhesive 40 is controlled, and the allowable lateral error X: ⁇ 200um and the allowable longitudinal error Y: ⁇ 100um, so as to ensure that the first conductive adhesive 40 is well attached before being supplied to the binding device and the display panel 10 The pressing can avoid the scrapping of the display panel 10 caused by the poor attachment of the first conductive glue 40, thereby reducing the cost.
  • Step S3 As shown in FIG. 7, the side of the flexible circuit board 20 on which the first conductive glue 40 is attached faces the display panel 10, and the flexible circuit board 20 is aligned with the display panel 10. Pressing and bonding enables the flexible circuit board 20 and the display panel 10 to achieve electrical conduction through the first conductive glue 40, which is completely sandwiched between the flexible circuit board 20 and the display panel 10, completing the flexible circuit board 20 and the display The binding between panels 10.
  • the lateral width of the first conductive glue 40 is smaller than the lateral width of the flexible circuit board 20, and the flexible circuit board 20 and the display are completed.
  • the panels 10 are bound, then on one side of the flexible circuit board 20, the lateral distance from the edge of the display panel 10 to the edge of the first conductive adhesive 40 is X1, and the lateral distance from the edge of the display panel 10 to the edge of the flexible circuit board 20 X2, then X1>X2, compared with the prior art, the use of anisotropic conductive adhesive is reduced, thereby reducing the material cost of the anisotropic conductive adhesive in the bonding process.
  • the flexible circuit board 20 and the display panel 10 are realized through the pre-pressing process and the current pressing process performed on the binding device. ⁇ .
  • the first conductive glue 40 is correspondingly attached to the FPC binding area 14 of the display panel 10.
  • an anisotropic conductive adhesive is first attached to the flexible circuit board 20 to form a first conductive adhesive 40.
  • the flexible circuit The board 20 and the display panel 10 are aligned and pressed together, so as to avoid the expensive display panel 10 being scrapped during rework due to poor adhesion of the first conductive glue 40, and when the first conductive glue 40 is unqualified, the flexible The circuit board 20 is thrown, so that the binding equipment can continue to operate, and the equipment utilization rate can be effectively improved. Since the first conductive gel 40 is directly attached to the flexible circuit board 20, compared with the prior art, the first The width of the conductive adhesive 40 reduces the material cost of the anisotropic conductive adhesive in the bonding process.
  • the present invention also provides a display device, which is manufactured by using the above-mentioned display device binding method, and specifically includes a display panel 10 and a flexible circuit bound to the display panel 10
  • the board 20 and the chip supply device 30 bound to the display panel 10 a first conductive glue 40 is provided between the display panel 10 and the flexible circuit board 20, and the first conductive glue 40 is an anisotropic conductive glue, so The display panel 10 and the flexible circuit board 20 are electrically connected through a first conductive glue 40; a second conductive glue 50 is provided between the display panel 10 and the chip device 30, and the second conductive glue 50 is an anisotropic conductive glue ,
  • the display panel 10 and the chip device 30 are electrically connected through the second conductive glue 50.
  • the flexible circuit board 20 is provided with a plurality of conductive terminals 21 arranged horizontally, and the first conductive glue 40 is first attached to the conductive terminals 21 of the flexible circuit board 20, and then follows the flexible circuit board 20 is pressed together on the display panel 10.
  • the lateral width of the first conductive glue 40 is smaller than the lateral width of the flexible circuit board 20, and the first conductive glue 40 is completely sandwiched between the flexible circuit board 20 and the display panel 10.
  • the display panel 10 includes a display area 11 and a peripheral area 12 located outside the display area 12, and the peripheral area 12 includes a COP binding area 13 and an FPC binding area 14 arranged at intervals.
  • the first conductive glue 40 is correspondingly attached to the FPC binding area 14 of the display panel 10; the second conductive glue 50 is correspondingly attached to the COP binding area 13 of the display panel 10.
  • the display panel 10 is an AMOLED display panel, and the display panel 10 includes a base substrate, a TFT array layer provided on the base substrate, and an OLED functional layer provided on the TFT display layer; the base substrate It is a flexible substrate.
  • the display device of the present invention is manufactured by using the above-mentioned binding method of the display device, which can avoid the expensive display panel 10 being scrapped during heavy work due to poor attachment of the first conductive glue 40, reduce the use of anisotropic conductive glue materials, and improve the product The yield rate and equipment utilization rate.
  • the bonding method of the display device of the present invention first attaches an anisotropic conductive adhesive to the flexible circuit board to form a first conductive adhesive, and then performs quality inspection on the attachment state of the first conductive adhesive After confirming that the first conductive adhesive is qualified, the flexible circuit board and the display panel are aligned and pressed together, so as to avoid the expensive display panel being scrapped during heavy work due to the poor attachment of the first conductive adhesive.
  • the conductive adhesive is unqualified, the flexible circuit board can be directly thrown, so that the bonding equipment can continue to operate, and the equipment utilization rate can be effectively improved.
  • the width of the first conductive glue can be reduced, thereby reducing the use of anisotropic conductive glue, and reducing the material cost of the anisotropic conductive glue in the binding process.
  • the display device of the present invention can prevent expensive display panels from being scrapped during heavy work due to poor adhesion of the first conductive glue, reduce the use of anisotropic conductive glue materials, and improve product yield and equipment utilization.

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Abstract

本发明提供一种显示装置的绑定方法及显示装置。本发明的显示装置的绑定方法，先在所述柔性线路板上贴附各向异性导电胶，形成第一导电胶体，然后对第一导电胶体的贴附状态进行品质检查，待确认第一导电胶体贴附合格后，再将柔性线路板与显示面板对位、压合，从而可避免因第一导电胶体贴附不良导致昂贵的显示面板重工时报废，而当第一导电胶体贴附不合格时可直接对柔性线路板进行抛料，使绑定设备可持续运行，设备稼动率得以有效提升，并由于第一导电胶体直接贴附于柔性线路板上，相对于现有技术，可缩减第一导电胶体的宽度，从而减少各向异性导电胶的使用，降低绑定制程在各向异性导电胶上的材料成本。

Description

显示装置的绑定方法及显示装置 技术领域
本发明涉及显示技术领域，尤其涉及一种显示面板的绑定方法及显示装置。
 背景技术
现有市场上的平面显示装置包括液晶显示装置（Liquid Crystal Display，LCD）和有源矩阵有机发光二极体（Active-matrix organic light emitting diode，AMOLED）显示装置。其中AMOLED具备自发光、高亮度、宽视角、高对比度、可挠曲、低能耗等特性，因此受到广泛的关注，并作为新一代的显示方式，已开始逐渐取代传统液晶显示装置，被广泛应用在手机屏幕、电脑显示器、全彩电视等。
现有的平板显示装置一般包括显示面板（Panel）和外接电路，显示面板在正常显示时，需要使用外接电路，如柔性电路板（Free Pascal Compiler，FPC）、驱动芯片（IC）等，通过引线连接到面板的外引脚贴合（Outer Lead Bonding，OLB）区域，实现对显示面板中的各信号线传递驱动信号。而外接电路与显示面板的OLB区域的电连接是通过绑定（Bonding）工艺完成的，Bonding工艺主要是在显示装置的绑定方法上将外接电路经过预压、本压连接到显示面板上，将外接电路上的外接电极和显示面板上的电极线压合到一起，中间通过各项异性导电胶（Anisotropic Conductive Film， ACF）实现电导通。通常ACF产品主要包括树脂层（Electrical insulation）、及分布于树脂层中的导电粒子（Electrical conduction），显示装置的绑定方法包括底座、和底座上方的热板（Hot plate）压头。在Bonding时，先进行对位，再进行压合，其中，在压合时对压合的温度、时间和压力都有很严格的要求，如果对位精度不够或压合条件不合适都会造成Bonding不良。
如图1所示，传统显示装置的绑定工艺中需要首先进行COP（Chip On Panel）绑定，将芯片装置300绑定在显示面板100上，具体为，在显示面板100的COP绑定区域贴附ACF，形成第一导电胶体400，然后将芯片装置300经过预压、本压连接到显示面板100，并通过中间的第一导电胶体400实现两者的电导通；然后再进行FPC绑定工序，将柔性线路板200绑定在显示面板100上，具体为，如图2所示，在显示面板100的FPC绑定区域上贴附ACF，形成第二导电胶体500，然后如图3所示，将柔性线路板200经过预压、本压连接到显示面板100，并通过中间的第二导电胶体500实现两者的电导通。
由于AMOLED产品的结构趋势为全柔产品，对应于全柔产品厚度越来越薄的趋势（10um），其Panel重工的良率必然极低；相应地，柔性AMOLED装置的绑定制程中所涉及的主要材料为Panel、IC和FPC，其中Panel为整个柔性AMOLED模组中的主要成本，故提升绑定制程中 Panel的良率尤为重要。
而在传统的绑定工艺流程中，当ACF在FPC绑定区域上贴附不良时即第二导电胶体500贴附不良时，或者当FPC绑定不良时即柔性线路板200与显示面板100压合不良时，便会造成显示面板100加芯片装置300一同报废，对于AMOLED产品，Panel加IC报废会造成成本大幅损失，同时也会影响设备的稼动率。且如图3所示，由于在传统的绑定工艺流程中，先在显示面板100的FPC绑定区域上贴附ACF，再将柔性线路板200与显示面板100压合，为保证绑定良率，需将第二导电胶体500的宽度设定为大于柔性线路板200的宽度，即在柔性线路板200的一侧，设显示面板100边缘到第二导电胶体500边缘的距离为X1，显示面板100边缘到柔性线路板200边缘的距离为X2，则X1<X2，由于ACF材料昂贵，这就增加了显示装置的材料成本。
 技术问题
本发明的目的在于提供一种显示装置的绑定方法，能够降低ACF贴附工艺对绑定制程的影响，规避因ACF贴附不良而导致Panel重工时报废，减少ACF材料的使用，提升产品的良率及设备的稼动率。
本发明的目的还在于提供一种显示装置，能够降低ACF贴附工艺对绑定制程的影响，规避因ACF贴附不良而导致Panel重工时报废，减少ACF材料的使用，提升产品的良率及设备的稼动率。
 技术解决方案
为实现上述目的，本发明首先提供一种显示装置的绑定方法，包括如下步骤：
步骤S1、提供显示面板及柔性线路板，所述柔性线路板设有数个横向排列的导电端子，在所述柔性线路板的数个导电端子上贴附各向异性导电胶，形成第一导电胶体，所述第一导电胶体的横向宽度小于所述柔性线路板的横向宽度；
步骤S2、对所述柔性线路板上的第一导电胶体进行贴附检测，若第一导电胶体贴附不合格则抛弃该柔性线路板，若第一导电胶体贴附合格则进行步骤S3；
步骤S3、将所述柔性线路板贴附有所述第一导电胶体的一面朝向所述显示面板，对所述柔性线路板与显示面板进行对位、压合，使柔性线路板与显示面板通过第一导电胶体实现电导通，所述第一导电胶体完全夹于柔性线路板和显示面板之间。
所述步骤S1还包括提供芯片装置，在所述显示面板上贴附各向异性导电胶，形成第二导电胶体，将所述芯片装置与显示面板上的第二导电胶体对位，然后对所述芯片装置与显示面板进行压合，使所述芯片装置与显示面板通过第二导电胶体实现电导通。
所述显示面板包括显示区及位于所述显示区外侧的外围区，所述外围区包括间隔设置的COP绑定区及FPC绑定区；
所述步骤S1中，所述第二导电胶体对应贴附于所述显示面板的COP绑定区上；
所述步骤S3中，对所述柔性线路板与显示面板进行压合后，所述第一导电胶体对应贴附于所述显示面板的FPC绑定区上。
所述柔性线路板在所述数个导电端子两侧设有对位标记；
所述步骤S2中根据所述第一导电胶体边缘与对位标记之间的距离来判定所述第一导电胶体是否贴附合格。
所述显示面板为AMOLED显示面板，所述显示面板包括衬底基板、设于衬底基板上的TFT阵列层及设于TFT陈列层上的OLED功能层；
所述衬底基板为柔性基板。
所述步骤S1中利用ACF贴附装置在所述柔性线路板上贴附各向异性导电胶；
所述ACF贴附装置具有自动检测功能，所述步骤S2中，通过所述ACF贴附装置自动检测第一导电胶体是否贴附合格。
本发明还提供一种显示装置，包括显示面板及与显示面板绑定的柔性线路板，所述显示面板与柔性线路板之间设有第一导电胶体，所述第一导电胶体为各向异性导电胶，所述显示面板与柔性线路板通过第一导电胶体电导通；
所述柔性线路板设有数个横向排列的导电端子，所述第一导电胶体先贴附于柔性线路板的数个导电端子上，再随着所述柔性线路板一同压合于所述显示面板上；
所述第一导电胶体的横向宽度小于所述柔性线路板的横向宽度，所述第一导电胶体完全夹于柔性线路板和显示面板之间。
所述的显示装置还包括与显示面板绑定的供芯片装置，所述显示面板与芯片装置之间设有第二导电胶体，所述第二导电胶体为各向异性导电胶，所述显示面板与芯片装置通过第二导电胶体电导通。
所述显示面板包括显示区及位于所述显示区外侧的外围区，所述外围区包括间隔设置的COP绑定区及FPC绑定区；
所述第一导电胶体对应贴附于所述显示面板的FPC绑定区上；
所述第二导电胶体对应贴附于所述显示面板的COP绑定区上。
所述显示面板为AMOLED显示面板，所述显示面板包括衬底基板、设于衬底基板上的TFT阵列层及设于TFT陈列层上的OLED功能层；
所述衬底基板为柔性基板。
 有益效果
本发明的有益效果：本发明的显示装置的绑定方法，先在所述柔性线路板上贴附各向异性导电胶，形成第一导电胶体，然后对第一导电胶体的贴附状态进行品质检查，待确认第一导电胶体贴附合格后，再将柔性线路板与显示面板对位、压合，从而可避免因第一导电胶体贴附不良导致昂贵的显示面板重工时报废，而当第一导电胶体贴附不合格时可直接对柔性线路板进行抛料，使绑定设备可持续运行，设备稼动率得以有效提升，并由于第一导电胶体直接贴附于柔性线路板上，相对于现有技术，可缩减第一导电胶体的宽度，从而减少各向异性导电胶的使用，降低绑定制程在各向异性导电胶上的材料成本。本发明的显示装置，可避免因第一导电胶体贴附不良导致昂贵的显示面板重工时报废，减少各向异性导电胶材料的使用，提升产品的良率及设备的稼动率。
 附图说明
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图中，
图1为现有显示装置的绑定工艺中将芯片装置绑定在显示面板上的示意图；
图2为现有显示装置的绑定工艺中在显示面板的FPC绑定区贴附ACF的示意图；
图3为现有显示装置的绑定工艺中将柔性线路板绑定在显示面板上的示意图；
图4为本发明显示装置的绑定方法的流程示意图；
图5为本发明显示装置的绑定方法的步骤S1的示意图；
图6为本发明显示装置的绑定方法的步骤S2的示意图；
图7为本发明显示装置的绑定方法的步骤S3的示意图暨本发明显示装置的结构示意图。
 本发明的实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图4，本发明首先提供一种显示装置的绑定方法，包括如下步骤：
步骤S1、如图5所示，提供显示面板10、柔性线路板20及芯片装置30，所述柔性线路板20设有数个横向排列的导电端子21，首先将芯片装置30绑定在所述显示面板10上，然后在所述柔性线路板20的数个导电端子21上贴附各向异性导电胶，形成第一导电胶体40，所述第一导电胶体40的横向宽度小于所述柔性线路板20的横向宽度。
具体地，将芯片装置30绑定在所述显示面板10上的过程具体包括，在所述显示面板10上贴附各向异性导电胶，形成第二导电胶体50，将所述芯片装置30与显示面板10上的第二导电胶体50对位，然后对所述芯片装置30与显示面板10进行压合，使所述芯片装置30与显示面板10通过第二导电胶体50实现电导通，完成所述芯片装置30与显示面板10之间的绑定；其中在将所述芯片装置30与显示面板10上的第二导电胶体50对位后，通过在绑定设备上进行的预压工序和本压工序来实现芯片装置30与显示面板10的压合。
具体地，所述显示面板10包括显示区11及位于所述显示区12外侧的外围区12，所述外围区12包括间隔设置的COP绑定区13及FPC绑定区14；所述步骤S1中，所述第二导电胶体50对应贴附于所述显示面板10的COP绑定区13上。
具体地，所述显示面板10为AMOLED显示面板，所述显示面板10包括衬底基板、设于衬底基板上的TFT阵列层及设于TFT陈列层上的OLED功能层（未图示）；所述衬底基板为柔性基板。
具体地，所述步骤S1中利用ACF贴附装置在所述柔性线路板20上贴附各向异性导电胶。
步骤S2、如图6所示，对所述柔性线路板20上的第一导电胶体40进行贴附检测，若第一导电胶体40贴附不合格则抛弃该柔性线路板20，若第一导电胶体40贴附合格则进行步骤S3。
具体地，所述柔性线路板20在所述数个导电端子21两侧设有对位标记25；所述步骤S2中根据所述第一导电胶体40边缘与对位标记25之间的距离来判定所述第一导电胶体40是否贴附合格；进一步地，以两端对位标记25作为基准，测量第一导电胶体40两端的贴附位置，从而计算出第一导电胶体40的贴附公差。
具体地，所述ACF贴附装置具有自动检测功能，在所述柔性线路板20上贴附各向异性导电胶完成之后，所述ACF贴附装置自动检测第一导电胶体40是否贴附合格，从而对第一导电胶体40的贴附精度进行管控，允许横向误差X:±200um，允许纵向误差Y:±100um，从而保证第一导电胶体40贴附完好再供给绑定设备与显示面板10进行压合，规避因第一导电胶体40贴附不良而导致的显示面板10报废，从而降低成本。
步骤S3、如图7所示，将所述柔性线路板20贴附有所述第一导电胶体40的一面朝向所述显示面板10，对所述柔性线路板20与显示面板10进行对位、压合，使柔性线路板20与显示面板10通过第一导电胶体40实现电导通，所述第一导电胶体40完全夹于柔性线路板20和显示面板10之间，完成柔性线路板20与显示面板10之间的绑定。
具体地，由于所述第一导电胶体40直接贴附于柔性线路板20上，所述第一导电胶体40的横向宽度小于所述柔性线路板20的横向宽度，在完成柔性线路板20与显示面板10之间的绑定后，那么在柔性线路板20的一侧，设显示面板10边缘到第一导电胶体40边缘的横向距离为X1，显示面板10边缘到柔性线路板20边缘的横向距离为X2，则X1＞X2，相对于现有技术，减少了各向异性导电胶的使用，从而降低了绑定制程在在各向异性导电胶上的材料成本。
具体地，所述步骤S3中，在将所述柔性线路板20与显示面板10对位后，通过在绑定设备上进行的预压工序和本压工序来实现柔性线路板20与显示面板10的压合。
具体地，所述步骤S3中，对所述柔性线路板20与显示面板10进行压合后，所述第一导电胶体40对应贴附于所述显示面板10的FPC绑定区14上。
本发明的显示装置的绑定方法，先在所述柔性线路板20上贴附各向异性导电胶，形成第一导电胶体40，待确认第一导电胶体40贴附合格后，再将柔性线路板20与显示面板10对位、压合，从而可避免因第一导电胶体40贴附不良导致昂贵的显示面板10重工时报废，而当第一导电胶体40贴附不合格时可直接对柔性线路板20进行抛料，使绑定设备可持续运行，设备稼动率得以有效提升，并由于第一导电胶体40直接贴附于柔性线路板20上，相对于现有技术，可缩减第一导电胶体40的宽度，从而降低了绑定制程在各向异性导电胶上的材料成本。
请参阅图7，基于上述的显示装置的绑定方法，本发明还提供一种显示装置，采用上述显示装置的绑定方法制作形成，具体包括显示面板10、与显示面板10绑定的柔性线路板20及与显示面板10绑定的供芯片装置30；所述显示面板10与柔性线路板20之间设有第一导电胶体40，所述第一导电胶体40为各向异性导电胶，所述显示面板10与柔性线路板20通过第一导电胶体40电导通；所述显示面板10与芯片装置30之间设有第二导电胶体50，所述第二导电胶体50为各向异性导电胶，所述显示面板10与芯片装置30通过第二导电胶体50电导通。
具体地，所述柔性线路板20设有数个横向排列的导电端子21，所述第一导电胶体40先贴附于柔性线路板20的数个导电端子21上，再随着所述柔性线路板20一同压合于所述显示面板10上。
具体地，所述第一导电胶体40的横向宽度小于所述柔性线路板20的横向宽度，所述第一导电胶体40完全夹于柔性线路板20和显示面板10之间。
具体地，所述显示面板10包括显示区11及位于所述显示区12外侧的外围区12，所述外围区12包括间隔设置的COP绑定区13及FPC绑定区14。
所述第一导电胶体40对应贴附于所述显示面板10的FPC绑定区14上；所述第二导电胶体50对应贴附于所述显示面板10的COP绑定区13上。
具体地，所述显示面板10为AMOLED显示面板，所述显示面板10包括衬底基板、设于衬底基板上的TFT阵列层及设于TFT陈列层上的OLED功能层；所述衬底基板为柔性基板。
本发明的显示装置，采用上述显示装置的绑定方法制作形成，可避免因第一导电胶体40贴附不良导致昂贵的显示面板10重工时报废，减少各向异性导电胶材料的使用，提升产品的良率及设备的稼动率。
综上所述，本发明的显示装置的绑定方法，先在所述柔性线路板上贴附各向异性导电胶，形成第一导电胶体，然后对第一导电胶体的贴附状态进行品质检查，待确认第一导电胶体贴附合格后，再将柔性线路板与显示面板对位、压合，从而可避免因第一导电胶体贴附不良导致昂贵的显示面板重工时报废，而当第一导电胶体贴附不合格时可直接对柔性线路板进行抛料，使绑定设备可持续运行，设备稼动率得以有效提升，并由于第一导电胶体直接贴附于柔性线路板上，相对于现有技术，可缩减第一导电胶体的宽度，从而减少各向异性导电胶的使用，降低绑定制程在各向异性导电胶上的材料成本。本发明的显示装置，可避免因第一导电胶体贴附不良导致昂贵的显示面板重工时报废，减少各向异性导电胶材料的使用，提升产品的良率及设备的稼动率。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明后附的权利要求的保护范围。

Claims (10)

  1. 一种显示装置的绑定方法，包括如下步骤：
    步骤S1、提供显示面板及柔性线路板，所述柔性线路板设有数个横向排列的导电端子，在所述柔性线路板的数个导电端子上贴附各向异性导电胶，形成第一导电胶体，所述第一导电胶体的横向宽度小于所述柔性线路板的横向宽度；
    步骤S2、对所述柔性线路板上的第一导电胶体进行贴附检测，若第一导电胶体贴附不合格则抛弃该柔性线路板，若第一导电胶体贴附合格则进行步骤S3；
    步骤S3、将所述柔性线路板贴附有所述第一导电胶体的一面朝向所述显示面板，对所述柔性线路板与显示面板进行对位、压合，使柔性线路板与显示面板通过第一导电胶体实现电导通，所述第一导电胶体完全夹于柔性线路板和显示面板之间。
  2. 如权利要求1所述的显示装置的绑定方法，其中，所述步骤S1还包括提供芯片装置，在所述显示面板上贴附各向异性导电胶，形成第二导电胶体，将所述芯片装置与显示面板上的第二导电胶体对位，然后对所述芯片装置与显示面板进行压合，使所述芯片装置与显示面板通过第二导电胶体实现电导通。
  3. 如权利要求2所述的显示装置的绑定方法，其中，所述显示面板包括显示区及位于所述显示区外侧的外围区，所述外围区包括间隔设置的COP绑定区及FPC绑定区；
    所述步骤S1中，所述第二导电胶体对应贴附于所述显示面板的COP绑定区上；
    所述步骤S3中，对所述柔性线路板与显示面板进行压合后，所述第一导电胶体对应贴附于所述显示面板的FPC绑定区上。
  4. 如权利要求1所述的显示装置的绑定方法，其中，所述柔性线路板在所述数个导电端子两侧设有对位标记；
    所述步骤S2中根据所述第一导电胶体边缘与对位标记之间的距离来判定所述第一导电胶体是否贴附合格。
  5. 如权利要求1所述的显示装置的绑定方法，其中，所述显示面板为AMOLED显示面板，所述显示面板包括衬底基板、设于衬底基板上的TFT阵列层及设于TFT陈列层上的OLED功能层；
    所述衬底基板为柔性基板。
  6. 如权利要求1所述的显示装置的绑定方法，其中，所述步骤S1中利用ACF贴附装置在所述柔性线路板上贴附各向异性导电胶；
    所述ACF贴附装置具有自动检测功能，所述步骤S2中，通过所述ACF贴附装置自动检测第一导电胶体是否贴附合格。
  7. 一种显示装置，包括显示面板及与显示面板绑定的柔性线路板，所述显示面板与柔性线路板之间设有第一导电胶体，所述第一导电胶体为各向异性导电胶，所述显示面板与柔性线路板通过第一导电胶体电导通；
    所述柔性线路板设有数个横向排列的导电端子，所述第一导电胶体先贴附于柔性线路板的数个导电端子上，再随着所述柔性线路板一同压合于所述显示面板上；
    所述第一导电胶体的横向宽度小于所述柔性线路板的横向宽度，所述第一导电胶体完全夹于柔性线路板和显示面板之间。
  8. 如权利要求7所述的显示装置，还包括与显示面板绑定的供芯片装置，所述显示面板与芯片装置之间设有第二导电胶体，所述第二导电胶体为各向异性导电胶，所述显示面板与芯片装置通过第二导电胶体电导通。
  9. 如权利要求8所述的显示装置，其中，所述显示面板包括显示区及位于所述显示区外侧的外围区，所述外围区包括间隔设置的COP绑定区及FPC绑定区；
    所述第一导电胶体对应贴附于所述显示面板的FPC绑定区上；
    所述第二导电胶体对应贴附于所述显示面板的COP绑定区上。
  10. 如权利要求7所述的显示装置，其中，所述显示面板为AMOLED显示面板，所述显示面板包括衬底基板、设于衬底基板上的TFT阵列层及设于TFT陈列层上的OLED功能层；
    所述衬底基板为柔性基板。
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