WO2020107774A1 - 显示面板及其制备方法 - Google Patents

显示面板及其制备方法 Download PDF

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Publication number
WO2020107774A1
WO2020107774A1 PCT/CN2019/082964 CN2019082964W WO2020107774A1 WO 2020107774 A1 WO2020107774 A1 WO 2020107774A1 CN 2019082964 W CN2019082964 W CN 2019082964W WO 2020107774 A1 WO2020107774 A1 WO 2020107774A1
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WO
WIPO (PCT)
Prior art keywords
substrate
area
substrate layer
display panel
circuit board
Prior art date
Application number
PCT/CN2019/082964
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English (en)
French (fr)
Inventor
卢延涛
Original Assignee
武汉华星光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 武汉华星光电技术有限公司 filed Critical 武汉华星光电技术有限公司
Priority to US16/481,098 priority Critical patent/US20210333604A1/en
Publication of WO2020107774A1 publication Critical patent/WO2020107774A1/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H05K2201/10136—Liquid Crystal display [LCD]

Definitions

  • the invention relates to the field of displays, in particular to a display panel and a preparation method thereof.
  • COF Chip on FPC
  • COG chip on glass
  • glass is commonly used as a substrate in display panels, because glass has good advantages in many aspects such as chemical stability, optical characteristics, and material cost.
  • LCD In terms of cell Gap is more stable with glass as the substrate.
  • the area where the substrate 100 exceeds the display area 200 is a step area.
  • the display area includes an effective display area (AA area), and the integrated circuit 400 and the flexible circuit board 500 are included in the step area
  • the step area is glass, and the bending characteristics are not as good as those of flexible substrate materials, so that the proportion of the display panel screen cannot be further improved.
  • the area where the substrate 100 exceeds the display area 200 is a step area.
  • the display area includes an effective display area (AA area), and COF500, COF (chip) are included in the step area.
  • on FPC is an integrated circuit made on a flexible circuit board.
  • the step area is glass, and the bending characteristics are not as good as those of flexible substrate materials, so that the screen ratio of the display panel cannot be further improved.
  • the purpose of the present invention is to solve the technical problem that the bending performance of the step area is poor in the prior art and the screen ratio cannot be improved.
  • the present invention provides a display panel including: a substrate including a first area and a second area connected to each other; a substrate layer provided on the upper surface of the first area; and a display area provided with On the upper surface of the second area, the display area covers a part of the substrate layer, and a portion of the substrate layer that cannot be covered by the display area forms a step area; and a circuit board is provided on the substrate layer away from the One side surface of the substrate; when the middle portion of the substrate layer is bent, one end is attached to the upper surface of the substrate, and the other end is attached to the lower surface of the substrate.
  • the circuit board includes an integrated circuit and a flexible circuit board.
  • circuit board includes COF.
  • the present invention also provides a method for manufacturing a display panel, including the following steps: S1
  • the substrate setting step provides a substrate, the substrate includes a first region and a second region connected to each other;
  • S2 In the preparation step of the substrate layer, the substrate material is coated on the upper surface of the first region to form a substrate layer;
  • S3 In the preparation step of the display area, a display area is prepared on the upper surface of the second area, the display area covers a part of the substrate layer, and a portion of the substrate layer not covered by the display area forms a step area;
  • S4 Bonding step bonding the circuit board on the surface of the substrate layer of the step area;
  • S5 A stripping step, stripping the substrate layer of the step area from the substrate;
  • S6 Cutting step cutting and removing the substrate under the step area;
  • S7 In the bending step, the substrate layer in the step area is bent, and one end of the substrate layer is attached to the lower surface of the substrate.
  • the circuit board includes an integrated circuit and a flexible circuit board.
  • circuit board includes COF.
  • the display area preparation step includes an array substrate preparation step, a color film substrate preparation step, an alignment step, and a box-forming step.
  • the material of the display area is a color filter.
  • the material of the substrate layer includes one of a flexible LED substrate material, a polymer substrate material, a metal foil substrate material, and an ultra-thin glass substrate material.
  • the material of the substrate is glass.
  • the technical effect of the present invention is that the flexible substrate material is bent to the back of the substrate, effectively narrowing the frame of the display panel, and improving the screen-to-body ratio.
  • Figure 1 is a top view of the distribution of COG lower borders in the prior art
  • FIG. 3 is a top view of the distribution of the COF lower frame in the prior art
  • FIG. 5 is a top view of the display panel according to Embodiment 1 of the present invention.
  • FIG. 6 is a cross-sectional view of the display panel according to Embodiment 1 of the present invention.
  • FIG. 7 is a flowchart of steps for preparing a display panel according to an embodiment of the invention.
  • FIG. 8 is a cross-sectional view of the display panel after the bonding step according to the embodiment of the present invention.
  • FIG. 9 is a cross-sectional view of a display panel after a cutting step according to an embodiment of the invention.
  • FIG. 10 is a cross-sectional view of the display panel after the bending step according to the embodiment of the present invention.
  • FIG. 11 is a cross-sectional view of a display panel according to Embodiment 2 of the present invention.
  • the component When certain components are described as “on” another component, the component may be directly placed on the other component; there may also be an intermediate component, which is placed on the intermediate component , And the intermediate component is placed on another component.
  • the two When a component is described as “installed to” or “connected to” another component, the two can be understood to be “installed” or “connected” directly, or a component “installed to” or “connected to” through an intermediate component Another component.
  • this embodiment provides a display panel, including: a substrate 1, and the substrate 1 includes a first region and a second region connected to each other.
  • the substrate layer 2 provided on the upper surface of the first area of the substrate 1
  • the display area 3 is provided on the upper surface of the second area of the substrate 1
  • the display area 3 covers part of the substrate layer, and the portion of the substrate layer 2 that cannot be covered by the display area 3 Form a step area.
  • the circuit board is provided on a surface of the substrate layer 2 away from the substrate 1.
  • the circuit board in this embodiment is an integrated circuit 4 (IC) and a flexible circuit board 5 (Flexible Printed Circuit, FPC).
  • IC integrated circuit 4
  • FPC Flexible Printed Circuit
  • the middle of the substrate layer 2 When the middle of the substrate layer 2 is bent, one end is attached to the upper surface of the substrate 1 and the other end is attached to the lower surface of the substrate 2.
  • the circuit board is attached to the substrate layer 3 on the lower surface of the substrate 1 surface.
  • the length of the substrate 1 may be the same as the length of the display area 3, or it may be appropriately lengthened, as long as the substrate layer 3 is bent, the circuit board above it is then bent to the lower surface of the substrate 1 accordingly.
  • the substrate 1 is made of glass.
  • the material of the substrate layer 2 is a flexible material, including: one of flexible LED substrate material, polymer substrate material, metal foil substrate material, and ultra-thin glass substrate material.
  • the display area 3 is the AA area (Ative Area), generally refers to the area where graphics are displayed, the stepped area is the area where the substrate 1 is more than the color filter 2, the border refers to the area from the display area 3 to the edge of the substrate 1, generally speaking, the narrower the border, the more The greater the area ratio, the greater the screen ratio.
  • AA area Absolute Area
  • the material of the display area 3 can be a color filter (Color Filter, CF).
  • the substrate layer bent to the stepped area on the back of the substrate 1 must include the integrated circuit 4 and the flexible circuit board 5 attached to the substrate layer 3, the substrate layer left on the upper surface of the substrate 1 and the substrate 1 and the color filter 2. It is sufficient to connect to ensure that the circuit board on the substrate layer 3 and the circuit on the substrate 1 have good connectivity, which is convenient for the normal use of the display panel.
  • the technical effect of this embodiment is that the substrate layer is directly bent to the back of the substrate, effectively shortening the length of the frame, and greatly increasing the screen-to-body ratio.
  • this embodiment also provides a method for manufacturing a display panel, including steps S1 to S7.
  • a substrate is provided.
  • the substrate is made of glass.
  • the substrate includes a first region and a second region connected to each other.
  • the substrate material is applied to the upper surface of the first area of the substrate by printing or spraying to form a substrate layer.
  • the material of the substrate layer is a flexible material, including: one of flexible LED substrate material, polymer substrate material, metal foil substrate material, and ultra-thin glass substrate material.
  • S3 preparing a display area, preparing a display area on the upper surface of the second area, the display area covering part of the substrate layer, the material of the display area is a color filter, and the substrate layer is not displayed
  • the area covered by the area is formed with a step area.
  • the display panel circuit is simultaneously arranged on the substrate and the substrate layer of the step area through the Array, CF and other processes.
  • the circuit board (in this In the embodiment, the integrated circuit and the flexible circuit board are bonded on the substrate layer of the step area (see FIG. 8).
  • the substrate layer on which the circuit board is bonded is completely or partially peeled from the substrate, but it is necessary to ensure that the substrate layer still has some parts connected to the upper surface of the substrate to ensure that the circuit board on the substrate layer and the substrate
  • the display panel circuit on the substrate keeps the electrical connection intact, which is convenient for the normal use of the display panel.
  • the substrate layer in the stepped region is bent, and one end of the substrate layer is attached to the lower surface of the substrate. It is necessary to ensure that the circuit board above the substrate layer is bent to the back of the substrate together (see FIG. 10) .
  • the technical effect of this embodiment is that the substrate layer is connected to the substrate, the substrate in the step area is cut off, and the substrate layer is directly bent, effectively shortening the length of the step area, increasing the proportion of the display area, and further improving the display The performance of the panel.
  • the technical solutions of this embodiment and Embodiment 1 are mostly the same, the difference is that the circuit board is COF6, and COF6 is attached to the substrate layer, and then bent to the lower surface of the substrate, COF (Chip on FPC) is an integrated circuit made on a flexible circuit board.
  • COF Chip on FPC
  • the display panel includes: a substrate 1 including a first area and a second area connected to each other.
  • the substrate layer 2 provided on the upper surface of the first area of the substrate 1
  • the display area 3 is provided on the upper surface of the second area of the substrate 1
  • the display area 3 covers part of the substrate layer, and the portion of the substrate layer 2 that cannot be covered by the display area 3 Form a step area.
  • the circuit board is provided on a surface of the substrate layer 2 away from the substrate 1.
  • the middle of the substrate layer 2 When the middle of the substrate layer 2 is bent, one end is attached to the upper surface of the substrate 1 and the other end is attached to the lower surface of the substrate 2.
  • the circuit board is attached to the substrate layer 3 on the lower surface of the substrate 1 surface.
  • the technical effect of this embodiment is that the length of the step area is effectively reduced, the screen ratio is increased, and the performance of the display panel is further improved.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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Abstract

一种显示面板及其制备方法，包括：一基板（1），包括彼此连接的第一区和第二区；一衬底层（2）；一显示区（3），设于第二区的上表面，显示区（3）覆盖部分衬底层（2），衬底层（2）不能被显示区（3）覆盖的部分形成一台阶区以及电路板；当衬底层（2）中部被弯折时，其一端贴合于基板（1）的上表面，另一端贴合于基板（1）的下表面。显示面板的制备方法包括：基板（1）设置步骤、衬底层（2）制备步骤、显示区（3）制备步骤、邦定步骤、剥离步骤、切割步骤以及弯折步骤。将柔性衬底材料弯折到基板（1）背面，有效地缩窄了显示面板的边框，提高屏占比。

Description

显示面板及其制备方法 技术领域
本发明涉及显示器领域，特别涉及一种显示面板及其制备方法。
 背景技术
由于目前显示屏屏占比的不断提高，显示面板下边框需求也是越小越好，目前下边框Bonding 方案分别有COF （chip on FPC）和COG（chip on glass）两种方案，COG是利用各向异性导电胶ACF将驱动IC直接封装在LCD上的一种制作工艺。
由于目前显示面板常见采用玻璃作为基板，因为玻璃在化学稳定性，光学特性，材料成本等很多方面有较好的优势,对于LCD 来说，cell gap 用玻璃做基板较为稳定。
如图1、2所示，基板100比显示区200超出的区域即为台阶区，所述显示区包括有效显示区（AA区），在所述台阶区内包括集成电路400以及柔性电路板500，而台阶区是玻璃，弯折的特性不如柔性衬底材料好，导致显示面板屏占比无法进一步提升。
如图3、4所示，基板100比显示区200超出的区域即为台阶区，所述显示区包括有效显示区（AA区），在所述台阶区内包括COF500，COF（chip on FPC）为制作在柔性电路板上的集成电路。而台阶区是玻璃，弯折的特性不如柔性衬底材料好，导致显示面板屏占比无法进一步提升。
 技术问题
本发明的目的在于，解决现有技术中台阶区弯折性能差，屏占比无法提升的技术问题。
 技术解决方案
为了实现上述目的，本发明提供一种显示面板，包括：一基板，包括彼此连接的第一区和第二区；一衬底层，设于所述第一区的上表面；一显示区，设于所述第二区的上表面，所述显示区覆盖部分衬底层，所述衬底层不能被所述显示区覆盖的部分形成一台阶区；以及电路板，设于所述衬底层远离所述基板的一侧表面；当所述衬底层中部被弯折时，其一端贴合于所述基板的上表面，另一端贴合于所述基板的下表面。
进一步地，所述电路板包括集成电路及柔性电路板。
进一步地，所述电路板包括COF。
为实现上述目的，本发明还提供一种显示面板的制备方法，包括如下步骤：S1 基板设置步骤，提供一基板，所述基板包括彼此连接的第一区和第二区；S2 衬底层制备步骤，涂布衬底材料至所述第一区的上表面，形成一衬底层；S3 显示区制备步骤，在所述第二区的上表面制备一显示区，所述显示区覆盖部分衬底层，所述衬底层未被所述显示区覆盖的部分形成一台阶区；S4 邦定步骤，在所述台阶区的衬底层上表面邦定电路板；S5 剥离步骤，将所述台阶区的衬底层从所述基板上剥离；S6 切割步骤，切割并去除所述台阶区下方的基板；以及S7 弯折步骤，弯折所述台阶区的衬底层，将所述衬底层的一端贴合至所述基板的下表面。
进一步地，所述电路板包括集成电路及柔性电路板。
进一步地，所述电路板包括COF。
进一步地，所述显示区制备步骤包括阵列基板制备步骤、彩膜基板制备步骤、配向步骤及成盒步骤。
进一步地，所述显示区的材质为彩色滤光片。
进一步地，所述衬底层的材质包括柔性LED衬底材料、聚合物衬底材料、金属薄片衬底材料、超薄玻璃衬底材料中的一种。
进一步地，所述基板的材质为玻璃。
 有益效果
本发明的技术效果在于，将柔性衬底材料弯折到基板背面，有效地缩窄了显示面板的边框，提高屏占比。
 附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为现有技术中COG下边框的分布俯视图；
图2为现有技术中COG下边框的剖面图；
图3为现有技术中COF下边框的分布俯视图；
图4为现有技术中COF下边框的剖面图；
图5为本发明实施例1所述显示面板的俯视图；
图6为本发明实施例1所述显示面板的剖面图；
图7为本发明实施例所述显示面板的制备步骤的流程图；
图8为本发明实施例所述邦定步骤后的显示面板剖面图；
图9为本发明实施例所述切割步骤后的显示面板剖面图；
图10为本发明实施例所述弯折步骤后的显示面板剖面图；
图11为本发明实施例2所述显示面板的剖面图。
部分组件标识如下：
100、基板；200、显示区；300、集成电路；400、柔性电路板；500、COF；
1、基板；
2、衬底层；
3、显示区；
4、集成电路；
5、柔性电路板；
6、COF。
 本发明的最佳实施方式
以下结合说明书附图详细说明本发明的优选实施例，以向本领域中的技术人员完整介绍本发明的技术内容，以举例证明本发明可以实施，使得本发明公开的技术内容更加清楚，使得本领域的技术人员更容易理解如何实施本发明。然而本发明可以通过许多不同形式的实施例来得以体现，本发明的保护范围并非仅限于文中提到的实施例，下文实施例的说明并非用来限制本发明的范围。
本发明所提到的方向用语，例如「上」、「下」、「前」、「后」、「左」、「右」、「内」、「外」、「侧面」等，仅是附图中的方向，本文所使用的方向用语是用来解释和说明本发明，而不是用来限定本发明的保护范围。
在附图中，结构相同的部件以相同数字标号表示，各处结构或功能相似的组件以相似数字标号表示。此外，为了便于理解和描述，附图所示的每一组件的尺寸和厚度是任意示出的，本发明并没有限定每个组件的尺寸和厚度。
当某些组件，被描述为“在”另一组件“上”时，所述组件可以直接置于所述另一组件上；也可以存在一中间组件，所述组件置于所述中间组件上，且所述中间组件置于另一组件上。当一个组件被描述为“安装至”或“连接至”另一组件时，二者可以理解为直接“安装”或“连接”，或者一个组件通过一中间组件“安装至”或“连接至”另一个组件。
实施例1
如图5、6所示，本实施例提供一种显示面板，包括：基板1，基板1包括相互连接的第一区和第二区。设于基板1的第一区的上表面的衬底层2，显示区3设于基板1的第二区的上表面，显示区3覆盖部分衬底层，衬底层2不能被显示区3覆盖的部分形成以台阶区。电路板设于衬底层2远离基板1的一侧表面。
本实施例中，所述电路板在本实施例中为集成电路4（IC）以及柔性电路板5（Flexible Printed Circuit，FPC）。
当衬底层2的中部被弯折时，其一端贴合于基板1的上表面，另一端贴合于基板2的下表面，所述电路板贴附于位于基板1下表面的衬底层3的表面。
基板1的长度可与显示区3的长度相同，也可以适当加长，只要保证衬底层3弯折后，其上方的所述电路板随之弯折到基板1的下表面即可。基板1的材质为玻璃材质。
衬底层2的材质为柔性材料，包括：柔性LED衬底材料、聚合物衬底材料、金属薄片衬底材料、超薄玻璃衬底材料中的一种。
显示区3即为AA区（Ative Area），一般指显示图形的区域，所述台阶区为基板1比彩色滤光片2多出来的区域，边框是指显示区3到基板1边缘的区域，一般而言，边框越窄，显示区占比越大，即屏占比越大。
显示区3的材质可为彩色滤光片（Color Filter，CF）。
弯折到基板1背面的所述台阶区的衬底层必须包括贴附于衬底层3上的集成电路4以及柔性电路板5，留在基板1上表面的衬底层与基板1以及彩色滤光片2连接即可，可保证衬底层3上的电路板与基板1上的电路连接性完好，便于显示面板的正常使用。
本实施例的技术效果在于，将衬底层直接弯折到基板的背面，有效地缩窄了边框的长度，大大地提高了屏占比。
如图7所示，本实施例还提供一种显示面板的制备方法，包括步骤S1~S7。
S1基板设置步骤，提供一基板，所述基板的材质为玻璃，所述基板包括相互连接的第一区和第二区。
S2 衬底层制备步骤，通过印刷或喷涂的方式，将衬底材料涂布至所述基板的第一区的上表面，形成一衬底层。所述衬底层的材质为柔性材料，包括：柔性LED衬底材料、聚合物衬底材料、金属薄片衬底材料、超薄玻璃衬底材料中的一种。
S3 显示区制备步骤，在所述第二区的上表面制备一显示区，所述显示区覆盖部分衬底层，所述显示区的材质为彩色滤光片，所述衬底层未被所述显示区覆盖的部分形成以台阶区。
S4 邦定步骤，通过Array、CF等制程，将显示面板电路同时设置在所述基板以及所述台阶区的衬底层上，在经过配向制程、成盒制程、切割制程等，将电路板（在本实施例中为集成电路和柔性电路板）邦定在所述台阶区的衬底层上（参见图8）。
S5 剥离步骤，将邦定有所述电路板的衬底层全部或者部分从所述基板上剥离，但需保证衬底层仍留有部分连接至基板的上表面，确保衬底层上的电路板与所述基板上的显示面板电路保持电性连接完好，便于显示面板正常使用。
S6 切割步骤，切割并去除剥离衬底层的所述台阶区的全部或部分基板（参见图9）。
S7 弯折步骤，弯折所述台阶区的衬底层，将所述衬底层的一端贴合至所述基板的下表面，需保证衬底层上方的电路板一起弯折到基板背面（参见图10）。
本实施例的技术效果在于，将衬底层与基板相连，将台阶区的基板切掉，直接弯折衬底层，有效地缩窄了台阶区的长度，提高了显示区的占比，进一步提高显示面板的性能。
实施例2
如图11所示，本实施例与实施例1的技术方案大部分相同，区别在于，所述电路板为COF6，COF6贴附于衬底层上，并随之弯折到基板的下表面，COF（chip on FPC）为制作在柔性电路板上的集成电路。
显示面板包括：包括：基板1，基板1包括相互连接的第一区和第二区。设于基板1的第一区的上表面的衬底层2，显示区3设于基板1的第二区的上表面，显示区3覆盖部分衬底层，衬底层2不能被显示区3覆盖的部分形成以台阶区。电路板设于衬底层2远离基板1的一侧表面。
当衬底层2的中部被弯折时，其一端贴合于基板1的上表面，另一端贴合于基板2的下表面，所述电路板贴附于位于基板1下表面的衬底层3的表面。
本实施例的技术效果在于，有效缩减了台阶区的长度，提高屏占比，进一步提高显示面板的性能。
以上对本发明实施例所提供的显示面板及其制备方法进行了详细介绍。应理解，本文所述的示例性实施方式应仅被认为是描述性的，用于帮助理解本发明的方法及其核心思想，而并不用于限制本发明。在每个示例性实施方式中对特征或方面的描述通常应被视作适用于其他示例性实施例中的类似特征或方面。尽管参考示例性实施例描述了本发明，但可建议所属领域的技术人员进行各种变化和更改。本发明意图涵盖所附权利要求书的范围内的这些变化和更改，这些变化盒更改也应视为本发明的保护范围。

Claims (10)

  1. 一种显示面板，其包括：
    一基板，包括彼此连接的第一区和第二区；
    一衬底层，设于所述第一区的上表面；
    一显示区，设于所述第二区的上表面，所述显示区覆盖部分衬底层，所述衬底层不能被所述显示区覆盖的部分形成一台阶区；以及
    电路板，设于所述衬底层远离所述基板的一侧表面；
    当所述衬底层中部被弯折时，其一端贴合于所述基板的上表面，另一端贴合于所述基板的下表面。
  2. 如权利要求1所述的显示面板，其中，
    所述电路板包括集成电路及柔性电路板。
  3. 如权利要求1所述的显示面板，其中，
    所述电路板包括COF。
  4. 一种显示面板的制备方法，其包括如下步骤：
    S1 基板设置步骤，提供一基板，所述基板包括彼此连接的第一区和第二区；
    S2 衬底层制备步骤，涂布衬底材料至所述第一区的上表面，形成一衬底层；
    S3 显示区制备步骤，在所述第二区的上表面制备一显示区，所述显示区覆盖部分衬底层，所述衬底层未被所述显示区覆盖的部分形成一台阶区；
    S4 邦定步骤，在所述台阶区的衬底层上表面邦定电路板；
    S5 剥离步骤，将所述台阶区的衬底层从所述基板上剥离；
    S6 切割步骤，切割并去除所述台阶区下方的基板；以及
    S7 弯折步骤，弯折所述台阶区的衬底层，将所述衬底层的一端贴合至所述基板的下表面。
  5. 如权利要求4所述的显示面板的制备方法，其中，
    所述电路板包括集成电路及柔性电路板。
  6. 如权利要求4所述的显示面板的制备方法，其中，
    所述电路板包括COF。
  7. 如权利要求4所述的显示面板的制备方法，其中，
    所述显示区制备步骤包括
    阵列基板制备步骤、彩膜基板制备步骤、配向步骤及成盒步骤。
  8. 如权利要求4所述的显示面板的制备方法，其中，
    所述显示区的材质为彩色滤光片。
  9. 如权利要求4所述的显示面板的制备方法，其特征在于，
    所述衬底层的材质包括柔性LED衬底材料、聚合物衬底材料、金属薄片衬底材料、超薄玻璃衬底材料中的一种。
  10. 如权利要求4所述的显示面板的制备方法，其中，
    所述基板的材质为玻璃。
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