WO2021036160A1 - 覆晶薄膜及显示装置 - Google Patents

覆晶薄膜及显示装置 Download PDF

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Publication number
WO2021036160A1
WO2021036160A1 PCT/CN2020/070733 CN2020070733W WO2021036160A1 WO 2021036160 A1 WO2021036160 A1 WO 2021036160A1 CN 2020070733 W CN2020070733 W CN 2020070733W WO 2021036160 A1 WO2021036160 A1 WO 2021036160A1
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WO
WIPO (PCT)
Prior art keywords
chip
film
connection
mark
alignment mark
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PCT/CN2020/070733
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English (en)
French (fr)
Inventor
袁传贵
Original Assignee
武汉华星光电半导体显示技术有限公司
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Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Priority to US16/638,762 priority Critical patent/US11302614B2/en
Publication of WO2021036160A1 publication Critical patent/WO2021036160A1/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Definitions

  • This application relates to the field of display technology, in particular to a flip chip film and a display device.
  • OLED Organic Light Emitting Diode
  • the main flexible screens need to pass through the bonding between the chip on film (COF) and the OLED panel, and the flexible printed circuit board (Flexible Printed Circuit).
  • the board (referred to as FPC) and the chip-on-chip film are connected to connect the external current to the chip-on-chip film and the flexible printed circuit board, and then conduct the internal circuits of the flexible screen to achieve the display effect.
  • Figure 1 is a schematic diagram of the anisotropic conductive adhesive film in the existing bonding process
  • Figure 2 is a schematic diagram of the bonding between the flip chip film and the OLED panel in the existing bonding process
  • Figure 3 It is a schematic diagram of the bonding between the flexible printed circuit board and the chip on film in the existing bonding process.
  • the existing bonding production process is as follows: first attach the first anisotropic conductive film (Anisotropic Conductive Film, ACF) 12 to the outer lead connection (Outer) of the OLED panel 11.
  • Lead Bonding (OLB for short) area 111 completes the anisotropic conductive adhesive film attaching process, as shown in Figure 1.
  • one end of the chip on film 21 is bonded to the external lead connection area 111 through the anisotropic conductive adhesive film 12 attached to the external lead connection area 111 to complete the bonding process between the flip chip film and the OLED panel, as shown in FIG. 2 Show.
  • the second anisotropic conductive adhesive film 32 is attached to the bonding area 311 of the flexible printed circuit board 31, and then the bonding area 311 of the flexible printed circuit board 31 is bonded to the cover through the second anisotropic conductive adhesive film 32.
  • the other end of the crystal film 21 completes the bonding process between the flexible printed circuit board and the chip on film, and the flexible printed circuit board 31 can be bent to the back of the display panel 11, as shown in FIG. 3.
  • the main composition of the anisotropic conductive adhesive film includes two parts: resin adhesive and conductive particles.
  • the conduction principle is to use conductive particles to connect the electrodes between the two components to make them conductive, while avoiding two adjacent components. There is a short-circuit between the electrodes to achieve the purpose of conducting only in the Z-axis direction and not conducting in the X and Y directions.
  • the bonding process requires the use of tools, after a certain temperature and pressure time and other process conditions, the conductive particles of the anisotropic conductive adhesive film are pressed together, and then the various components are connected to achieve the display function.
  • the current production process is limited by the materials of flip-chip films and flexible printed circuit boards, and is only suitable for hot pressing anisotropic conductive adhesive films to generate conductive particles to conduct circuits. Since the manufacturing process of the conventional flexible printed circuit board is different from that of the chip-on-chip film, the thermal conductivity of the chip-on-chip film is relatively higher than that of the flexible printed circuit board. Therefore, it is necessary to use two anisotropic conductive adhesive films. At the same time, the bonding process between the flip chip film and the flexible printed circuit board is the pressing of two flexible materials, the accuracy is correspondingly poor, and the production process will be more complicated.
  • the purpose of this application is to provide a chip on film and a display device that can optimize the bonding process between the chip on film and the flexible printed circuit board, save material and equipment costs, and improve product accuracy and yield in response to the problems in the prior art.
  • the present application provides a chip on film, the chip on film includes a flexible film, the flexible film includes a first surface, the first surface includes: a chip bonding area, the A chip is arranged in the chip bonding area; a first connecting end, the first connecting end is provided with at least one pin, a first inserting mark and a second inserting mark, wherein the first The plug-in positioning mark and the second plug-in positioning mark are respectively provided at two ends of the area where the plug pins are located, and the plug pins are used to electrically connect a flexible printed circuit board; and a second connecting end, The second connection end is provided with at least one bonding pad, a first connection alignment mark, and a second connection alignment mark, wherein the first connection alignment mark and the second connection alignment mark are respectively provided At both ends of the area where the bonding pads are located, the bonding pads are used to electrically connect a display panel.
  • the present application also provides a chip-on-chip film, the chip-on-chip film includes a flexible film, the flexible film includes a first surface, the first surface includes: a chip bonding area, so A chip is arranged in the chip bonding area; and a first connecting end, the first connecting end is provided with at least one plug pin, and the plug pin is used to electrically connect the flexible printed circuit board.
  • the present application also provides a display device, including: a display panel, the display panel including an external lead connection area; a flip chip film, the first connection end of the flip chip film is provided with at least A plug pin, the second connection end of which is provided with at least one bonding pad; a conductive connection layer electrically connecting the bonding pad to the external lead connection area; and a flexible printed circuit board, the flexible printed circuit
  • the first connection end of the board is provided with at least one insertion interface, and the insertion pin is inserted into the insertion interface, thereby electrically connecting the flexible printed circuit board and the chip on film.
  • the flexible printed circuit board and the chip-on-chip film adopt a plug-in method of mating pins and sockets, and the bonding between the flexible printed circuit board and the chip-on film does not require the use of anisotropic conductive glue Therefore, there is no need to use flexible printed circuit board hot pressing tools. After a certain temperature and pressure time and other process conditions, the conductive particles of the anisotropic conductive adhesive film are pressed together, and the production process will not be affected by the flexible printed circuit board materials. limits.
  • the display device of the present application optimizes the bonding process between the flexible printed circuit board and the chip on film, improves the circuit conduction accuracy and yield between the flexible printed circuit board and the chip on film, and saves anisotropic conductive adhesive film
  • the cost of materials and the cost of equipment required for hot pressing have improved the accuracy and yield of the display device.
  • FIG. 1 is a schematic diagram of anisotropic conductive adhesive film attachment in the existing bonding process
  • FIG. 2 is a schematic diagram of the bonding between the flip chip film and the OLED panel in the existing bonding process
  • 3 is a schematic diagram of the bonding between the flexible printed circuit board and the chip on film in the existing bonding process
  • FIG. 4 is a schematic diagram of the structure of the display device of this application.
  • 5A is a schematic structural diagram of an embodiment of a flip chip film according to the present application.
  • FIG. 5B is an enlarged schematic diagram of the first connecting end in FIG. 5A;
  • 6A is a schematic structural diagram of an embodiment of a flexible printed circuit board of this application.
  • Fig. 6B is an enlarged schematic diagram of the first connecting end in Fig. 6A.
  • the first feature “above” or “below” the second feature may include direct contact between the first and second features, or may include the first and second features.
  • the features are not in direct contact but through other features between them.
  • “above”, “above” and “above” the first feature include the first feature being directly above and obliquely above the second feature, or it simply means that the first feature is higher in level than the second feature.
  • the first feature is "below”, “below” and “below” the second feature, including the first feature directly below and obliquely below the second feature, or it simply means that the level of the first feature is smaller than the second feature.
  • FIG. 4 is a schematic diagram of the structure of the display device of this application.
  • the display device includes: a display panel 41, the display panel 41 includes an external lead connection area 411; a chip on film 42, the first connection end 421 of the chip on film 42 is provided with at least one pin ( pin) 5121 (shown in FIG. 5A), the second connection end 422 of which is provided with at least one bonding pad 5131 (shown in FIG. 5A); a conductive connection layer 43, electrically connecting the bonding pad 5131 to the outside On the lead connection area 411; and a flexible printed circuit board 44, the first connection end 441 of the flexible printed circuit board 44 is provided with at least one plug interface 6111 (shown in FIG. 6A), and the plug pin 5121 is inserted into the The insertion interface 6111 is thereby electrically connected to the flexible printed circuit board 44 and the chip on film 42.
  • pin pin
  • the display panel 41 may be an OLED panel, an LCD panel, etc., and a metal bonding pad is exposed above the outer lead connection area 411.
  • the conductive connection layer 43 is an anisotropic conductive adhesive film.
  • the main composition of the anisotropic conductive adhesive film includes two parts: resin adhesive and conductive particles.
  • the conduction principle is to use conductive particles to connect the electrodes between the two components to make them conductive, while avoiding two adjacent components. There is a short-circuit between the electrodes to achieve the purpose of conducting only in the Z-axis direction and not conducting in the X and Y directions.
  • a hot pressing tool after a certain temperature and pressure time and other process conditions, the conductive particles of the anisotropic conductive adhesive film are pressed together to conduct each component.
  • the production process of the bonding of the present application is: first attach the anisotropic conductive adhesive film to the external lead connection area 411 of the display panel 41 to complete the anisotropic conductive adhesive film attaching process (refer to FIG. 1 Show). Then, the end of the chip on film 42 provided with the bonding pad 5131 is bonded to the external lead connection area 411 through the anisotropic conductive adhesive film to complete the bonding process between the chip on film 42 and the display panel ( Refer to Figure 2).
  • the bonding between the flexible printed circuit board and the chip on film adopts a pin connect method in which a pin and a socket are matched, and the bonding between the flexible printed circuit board and the chip on film does not need to use different Square conductive adhesive film, so there is no need to use flexible printed circuit board hot pressing tools.
  • the conductive particles of the anisotropic conductive adhesive film are pressed together, and the production process will not be subject to flexibility. Limitations of printed circuit board materials.
  • the display device of the present application optimizes the bonding process between the flexible printed circuit board and the chip on film, improves the circuit conduction accuracy and yield between the flexible printed circuit board and the chip on film, and saves anisotropic conductive adhesive film
  • the cost of materials and the cost of equipment required for hot pressing have improved the accuracy and yield of the display device.
  • FIG. 5A is a schematic structural diagram of an embodiment of a flip chip film according to the present application
  • FIG. 5B is an enlarged schematic diagram of the first connection terminal in FIG. 5A
  • the chip on film 42 includes: a flexible film 51; the flexible film 51 includes a first surface 510; the first surface 510 includes a chip bonding area 511 and a first connecting terminal 512.
  • a chip 52 is arranged in the chip bonding area 511; the first connecting end 512 is provided with at least one pin 5121, and the pin 5121 is used to electrically connect to the flexible printed circuit board 44 (shown in Figure 4).
  • the first connection terminal 512 is further provided with a first insertion point mark 5122 and a second insertion point mark 5123, wherein the first insertion point mark 5122 and the second insertion point mark 5123
  • the 5123 are respectively arranged at both ends of the area where the plug pins 5121 are located, so that the alignment can be performed by manual plugging or by using plugging jigs to grab the alignment mark (Mark).
  • a first distance L1 is included between the first insertion point mark 5122 and the second insertion point mark 5123.
  • the shape of the first insertion point mark 5122 and the second insertion point mark 5123 are different, so that misrecognition and misoperation can be prevented.
  • the shapes of the registration marks at both ends are inconsistent, and the main function is to prevent fools. When manually pressing, it can avoid misoperation (rotation 180°) causing damage to the plug pins, or when using a plug jig to automatically press the plug, it can avoid damage to the plug pins caused by misrecognition.
  • the first surface 510 further includes a second connecting end 513, the second connecting end 513 includes a bonding pad 5131, and the bonding pad 5131 is used to electrically connect to the display panel.
  • the bonding pad 5131 may be bonded to the external lead connection area of the display panel through an anisotropic conductive adhesive film, so that the flip chip film is electrically connected to the display panel.
  • the second connection end 513 is further provided with a first connection alignment mark 5132 and a second connection alignment mark 5133, wherein the first connection alignment mark 5132 and the second connection alignment mark 5132
  • the 5133 are respectively arranged at both ends of the area where the bonding pad 5131 is located, so that the alignment mark can be grasped by a pressing tool for alignment and crimping.
  • the first connection alignment mark 5132 and the second connection alignment mark 5133 have different shapes, so as to prevent misrecognition and misoperation when the pressing tool grabs the alignment mark.
  • FIGS. 6A-6B where FIG. 6A is a schematic structural diagram of an embodiment of a flexible printed circuit board according to the present application, and FIG. 6B is an enlarged schematic diagram of the first connection terminal in FIG. 6A.
  • the flexible printed circuit board 44 includes: a substrate 61; the substrate 61 includes a first surface 610; the first surface 610 includes a first connecting end 611; the first connecting end 611 is provided with at least one
  • the plug-in interface 6111 is adapted to the plug pins 5121 of the chip on film 42 shown in FIGS. 5A-5B, and is used to accommodate the plug pins 5121. In the process of joining the flexible printed circuit board and the chip on film, the pin 5121 is inserted into the socket 6111 to electrically connect the flexible printed circuit board 44 and the chip on film 42.
  • the first connection end 611 is further provided with a first interface alignment mark 6112 and a second interface alignment mark 6113, wherein the first interface alignment mark 6112 and the second interface alignment mark 6113
  • the 6113 are respectively arranged at both ends of the area where the insertion interface 6111 is located, so that the alignment can be performed by manual insertion or by using an insertion jig to grab the alignment mark (Mark).
  • the first interface alignment mark 6112 and the second interface alignment mark 6113 have different shapes, so that misidentification and misoperation can be prevented.
  • the shapes of the registration marks at both ends are inconsistent, and the main function is to prevent fools. When manually pressing, it can avoid misoperation (rotation 180°) causing damage to the plug pins, or when using a plug jig to automatically press the plug, it can avoid damage to the plug pins caused by misrecognition.
  • the first interface alignment mark 6112 and the second interface alignment mark 6113 include a second spacing L2, and the second spacing L2 is the same as the first spacing L1 shown in FIG. 5B. Therefore, it is ensured that the socket 6111 of the flexible printed circuit board 44 matches the socket pin 5121 of the chip on film 42.
  • the substrate 61 of the flexible printed circuit board 44 also includes other components required for the operation of the circuit board, such as components, circuit wiring, stiffener, protective film, etc.
  • the setting method can refer to the existing process, which will not be repeated here.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Wire Bonding (AREA)

Abstract

一种覆晶薄膜（42）及显示装置，覆晶薄膜（42）的连接端（512）设置有至少一插接针（5121），与柔性印刷电路板（44）的连接端（513）设置的至少一插接口（6111）适配，柔性印刷电路板（44）与覆晶薄膜（42）间接合采用插接针（5121）与插接口（6111）配合的插接方式，优化了柔性印刷电路板（44）与覆晶薄膜（42）之间的接合制程，且节省了异方性导电胶膜的材料成本、以及热压合所需设备成本。

Description

覆晶薄膜及显示装置
本申请要求于2019年08月23日提交中国专利局、申请号为201910781225.8 、发明名称为“覆晶薄膜及显示装置”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及显示技术领域，尤其是涉及一种覆晶薄膜及显示装置。
 背景技术
随着显示技术的发展，显示技术进入柔性时代，有机发光二极管(Organic Light Emitting Diode，简称OLED)显示技术为目前主流柔性技术。目前主要的柔性屏都是需要经过覆晶薄膜 (Chip On Film，简称COF)与OLED面板间接合(Bonding)、柔性印刷电路板(Flexible Printed Circuit board，简称FPC)与覆晶薄膜间接合，才能将外部电流接入到覆晶薄膜和柔性印刷电路板内，进而导通柔性屏内部线路，达到显示效果。
 技术问题
请参考图1-图3，其中，图1为现有接合制程中的异方性导电胶膜贴程示意图，图2为现有接合制程中的覆晶薄膜与OLED面板间接合示意图，图3为现有接合制程中的柔性印刷电路板与覆晶薄膜间接合示意图。
具体的，现有的接合(Bonding)的生产流程(Process Flow)为：先将第一异方性导电胶膜(Anisotropic Conductive Film，简称ACF)12贴附在OLED面板11的外部引线连接(Outer Lead Bonding，简称OLB)区111，完成异方性导电胶膜贴附制程，如图1所示。接着，将覆晶薄膜21的一端通过贴附在外部引线连接区111的异方性导电胶膜12接合在外部引线连接区111上，完成覆晶薄膜与OLED面板间接合制程，如图2所示。然后，将第二异方性导电胶膜32贴附在柔性印刷电路板31的接合区311上，之后将柔性印刷电路板31的接合区311通过第二异方性导电胶膜32接合在覆晶薄膜21的另一端，完成柔性印刷电路板与覆晶薄膜间接合制程，柔性印刷电路板31可以弯折到显示面板11的背面，如图3所示。
异方性导电胶膜主要组成包括树脂黏着剂、导电粒子两大部分，其导通原理是利用导电粒子连接相接合的两组件之间的电极使之成为导通，同时又能避免相邻两电极间导通短路，达成只在Z轴方向导通，而在X和Y方向则不导电的目的。
由于接合过程中都需要使用工具(Tool)，经过一定温度和压力时间等制程条件，压合出异方性导电胶膜的导电粒子，进而导通各元器件，达到显示功能。而目前的生产流程受到覆晶薄膜和柔性印刷电路板材料的限制，只适用于热压异方性导电胶膜产生导电粒子来导通线路。由于常规的柔性印刷电路板的制作工艺与覆晶薄膜的制作工艺不相同，覆晶薄膜的导热性相对高于柔性印刷电路板的导热性，因此，需要使用两种异方性导电胶膜。同时，覆晶薄膜和柔性印刷电路板间接合过程是两个柔性材料的压合，精度相应较差，生产流程会比较复杂。
因此，如何优化覆晶薄膜和柔性印刷电路板的接合制程，节约材料和设备成本，提高产品精度和良率，成为亟待解决的问题。
 技术解决方案
本申请的目的在于，针对现有技术存在的问题，提供一种覆晶薄膜及显示装置，可以优化覆晶薄膜和柔性印刷电路板的接合制程，节约材料和设备成本，提高产品精度和良率。
为实现上述目的，本申请提供了一种覆晶薄膜，所述覆晶薄膜包括一柔性薄膜，所述柔性薄膜包括一第一表面，所述第一表面上包括：一芯片接合区，所述芯片接合区内设置有一芯片；一第一连接端，所述第一连接端设置有至少一插接针、一第一插针对位标记及一第二插针对位标记，其中，所述第一插针对位标记及所述第二插针对位标记分别设置于所述插接针所在区域的两端，所述插接针用于电性连接一柔性印刷电路板；以及一第二连接端，所述第二连接端设置有至少一接合垫、一第一连接对位标记及一第二连接对位标记，其中，所述第一连接对位标记及所述第二连接对位标记分别设置于所述接合垫所在区域的两端，所述接合垫用于电性连接一显示面板。
为实现上述目的，本申请还提供了一种覆晶薄膜，所述覆晶薄膜包括一柔性薄膜，所述柔性薄膜包括一第一表面，所述第一表面上包括：一芯片接合区，所述芯片接合区内设置有一芯片；以及一第一连接端，所述第一连接端设置有至少一插接针，所述插接针用于电性连接柔性印刷电路板。
为实现上述目的，本申请还提供了一种显示装置，包括：一显示面板，所述显示面板包括一外部引线连接区；一覆晶薄膜，所述覆晶薄膜的第一连接端设置有至少一插接针，其第二连接端设置有至少一接合垫；一导电连接层，电性连接所述接合垫于所述外部引线连接区上；以及一柔性印刷电路板，所述柔性印刷电路板的第一连接端设置有至少一插接口，所述插接针插入所述插接口，从而将所述柔性印刷电路板与所述覆晶薄膜电性连接。
 有益效果
本申请显示装置接合制程中，柔性印刷电路板与覆晶薄膜间接合采用插接针与插接口配合的插接方式，柔性印刷电路板与覆晶薄膜之间的接合无需使用异方性导电胶膜，因此也无需使用柔性印刷电路板热压合工具，经过一定温度和压力时间等制程条件，压合出异方性导电胶膜的导电粒子，同时生产流程也不会受到柔性印刷电路板材料的限制。本申请显示装置，优化了柔性印刷电路板与覆晶薄膜之间的接合制程，提高了柔性印刷电路板与覆晶薄膜之间的线路导通精度和良率，且节省了异方性导电胶膜的材料成本、以及热压合所需设备成本，提高了显示装置产品精度和良率。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图。
图1为现有接合制程中的异方性导电胶膜贴附示意图；
图2为现有接合制程中的覆晶薄膜与OLED面板间接合示意图；
图3为现有接合制程中的柔性印刷电路板与覆晶薄膜间接合示意图；
图4为本申请显示装置架构示意图；
图5A为本申请覆晶薄膜一实施例的结构示意图；
图5B为图5A中第一连接端的放大示意图；
图6A为本申请柔性印刷电路板一实施例的结构示意图；
图6B为图6A中第一连接端的放大示意图。
 本发明的实施方式
下面详细描述本申请的实施方式，所述实施方式的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施方式是示例性的，仅用于解释本申请，而不能理解为对本申请的限制。
本申请的说明书和权利要求书以及附图中的术语“第一”“第二”“第三”等(如果存在)是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。应当理解，这样描述的对象在适当情况下可以互换。此外，术语“包括”和“具有”以及它们的任何变形，意图在于覆盖不排它的包含。
在本申请中，除非另有明确的规定和限定，第一特征在第二特征之“之上”或“之下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”“上方”“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”“下方”“下面”包括第一特征在第二特征正下方和斜下方，或仅仅表示第一特征水平高度小于第二特征。
下文的公开提供了许多不同的实施方式或例子用来实现本申请的不同结构。为了简化本申请的公开，下文中对特定例子的部件和设置进行描述。当然，它们仅仅为示例，并且目的不在于限制本申请。本申请可以在不同例子中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设置之间的关系。此外，本申请提供了的各种特定的工艺和材料的例子，但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。
请参考图4，本申请显示装置架构示意图。所述显示装置包括：一显示面板41，所述显示面板41包括一外部引线连接区411；一覆晶薄膜42，所述覆晶薄膜42的第一连接端421设置有至少一插接针(pin)5121(示于图5A中)，其第二连接端422设置有至少一接合垫5131(示于图5A中)；一导电连接层43，电性连接所述接合垫5131于所述外部引线连接区411上；以及一柔性印刷电路板44，所述柔性印刷电路板44的第一连接端441设置有至少一插接口6111(示于图6A中)，所述插接针5121插入所述插接口6111，从而将所述柔性印刷电路板44与所述覆晶薄膜42电性连接。
所述显示面板41可以为OLED面板或LCD面板等，其外部引线连接区411上方裸露出金属接合垫(Bonding Pad)。
优选地，所述导电连接层43为异方性导电胶膜。异方性导电胶膜主要组成包括树脂黏着剂、导电粒子两大部分，其导通原理是利用导电粒子连接相接合的两组件之间的电极使之成为导通，同时又能避免相邻两电极间导通短路，达成只在Z轴方向导通，而在X和Y方向则不导电的目的。通过使用热压合工具，经过一定温度和压力时间等制程条件，压合出异方性导电胶膜的导电粒子，进而导通各元器件。
具体的，本申请接合的生产流程为：先将异方性导电胶膜贴附在所述显示面板41的外部引线连接区411，完成异方性导电胶膜贴附制程(可参考图1所示)。接着，将所述覆晶薄膜42的设置有所述接合垫5131的一端通过所述异方性导电胶膜接合在所述外部引线连接区411上，完成覆晶薄膜与显示面板间接合制程(可参考图2所示)。然后，通过手动插接或者采用插接治具抓取对位标记(Mark)将所述覆晶薄膜42的插接针5121插入所述柔性印刷电路板44的插接口6111，从而将所述柔性印刷电路板44与所述覆晶薄膜42电性连接，完成柔性印刷电路板与覆晶薄膜间接合制程，获取如图4所示结构。
本申请显示装置接合制程中，柔性印刷电路板与覆晶薄膜间接合采用插接针与插接口配合的插接(pin connect)方式，柔性印刷电路板与覆晶薄膜之间的接合无需使用异方性导电胶膜，因此也无需使用柔性印刷电路板热压合工具，经过一定温度和压力时间等制程条件，压合出异方性导电胶膜的导电粒子，同时生产流程也不会受到柔性印刷电路板材料的限制。本申请显示装置，优化了柔性印刷电路板与覆晶薄膜之间的接合制程，提高了柔性印刷电路板与覆晶薄膜之间的线路导通精度和良率，且节省了异方性导电胶膜的材料成本、以及热压合所需设备成本，提高了显示装置产品精度和良率。
请参考图5A-图5B，其中，图5A为本申请覆晶薄膜一实施例的结构示意图，图5B为图5A中第一连接端的放大示意图。所述覆晶薄膜42包括：一柔性薄膜51；所述柔性薄膜51包括一第一表面510；所述第一表面510上包括一芯片接合区511及一第一连接端512。所述芯片接合区511内设置有一芯片52；所述第一连接端512设置有至少一插接针(pin)5121，所述插接针5121用于电性连接柔性印刷电路板44(示于图4中)。
具体的，所述第一连接端512还设置有一第一插针对位标记5122及一第二插针对位标记5123，其中，所述第一插针对位标记5122及所述第二插针对位标记5123分别设置于所述插接针5121所在区域的两端，从而可以通过手动插接或者采用插接治具抓取对位标记(Mark)进行对位插接。所述第一插针对位标记5122与所述第二插针对位标记5123之间包括一第一间距L1。
优选地，所述第一插针对位标记5122与所述第二插针对位标记5123形状不同，从而可以防止误识别和误操作。两端对位标记的形状不一致，主要作用为防呆功能。手动压合时，可以避免误操作(旋转180°)导致插接针损坏，或采用插接治具自动压合时，可以避免误识别造成的插接针损坏。
具体的，所述第一表面510上还包括一第二连接端513，所述第二连接端513包括接合垫5131，所述接合垫5131用于电性连接显示面板。可以通过异方性导电胶膜将所述接合垫5131接合在所述显示面板的外部引线连接区上，从而使所述覆晶薄膜与所述显示面板电性连接。
具体的，所述第二连接端513还设置有一第一连接对位标记5132及一第二连接对位标记5133，其中，所述第一连接对位标记5132及所述第二连接对位标记5133分别设置于所述接合垫5131所在区域的两端，从而可以通过压合工具抓取对位标记进行对位压接。优选地，所述第一连接对位标记5132与所述第二连接对位标记5133形状不同，从而可以防止压合工具抓取对位标记时的误识别和误操作。
请参考图6A-图6B，其中，图6A为本申请柔性印刷电路板一实施例的结构示意图，图6B为图6A中第一连接端的放大示意图。所述柔性印刷电路板44包括：一基板61；所述基板61包括一第一表面610；所述第一表面610上包括一第一连接端611；所述第一连接端611设置有至少一插接口6111，所述插接口6111与图5A-5B所示覆晶薄膜42的插接针5121相适配，用于容置所述插接针5121。在柔性印刷电路板与覆晶薄膜接合制程中，通过将所述插接针5121插入所述插接口6111，从而将所述柔性印刷电路板44与所述覆晶薄膜42电性连接。
具体的，所述第一连接端611还设置有一第一接口对位标记6112及一第二接口对位标记6113，其中，所述第一接口对位标记6112及所述第二接口对位标记6113分别设置于所述插接口6111所在区域的两端，从而可以通过手动插接或者采用插接治具抓取对位标记(Mark)进行对位插接。
优选地，所述第一接口对位标记6112与所述第二接口对位标记6113形状不同，从而可以防止误识别和误操作。两端对位标记的形状不一致，主要作用为防呆功能。手动压合时，可以避免误操作(旋转180°)导致插接针损坏，或采用插接治具自动压合时，可以避免误识别造成的插接针损坏。
具体的，所述第一接口对位标记6112与所述第二接口对位标记6113之间包括一第二间距L2，所述第二间距L2与图5B中所示的第一间距L1相同，从而保证所述柔性印刷电路板44的所述插接口6111与所述覆晶薄膜42的所述插接针5121相适配。
需要说明的是，所述柔性印刷电路板44的基板61上还包括电路板工作所需其它组件，例如元器件、电路走线、补强板(Stiffener)、保护膜(protective film)等，其设置方式可参考现有工艺，此处不再赘述。
可以理解的是，对本领域普通技术人员来说，可以根据本申请的技术方案及其发明构思加以等同替换或改变，而所有这些改变或替换都应属于本申请所附的权利要求的保护范围。

Claims (17)

  1. 一种覆晶薄膜，其中，所述覆晶薄膜包括一柔性薄膜，所述柔性薄膜包括一第一表面，所述第一表面上包括：
    一芯片接合区，所述芯片接合区内设置有一芯片；
    一第一连接端，所述第一连接端设置有至少一插接针、一第一插针对位标记及一第二插针对位标记，并且其中，所述第一插针对位标记及所述第二插针对位标记分别设置于所述插接针所在区域的两端，所述插接针用于电性连接一柔性印刷电路板；以及
    一第二连接端，所述第二连接端设置有至少一接合垫、一第一连接对位标记及一第二连接对位标记，并且其中，所述第一连接对位标记及所述第二连接对位标记分别设置于所述接合垫所在区域的两端，所述接合垫用于电性连接一显示面板。
  2. 如权利要求1所述的覆晶薄膜，其中，所述第一插针对位标记与所述第二插针对位标记形状不同。
  3. 如权利要求1所述的覆晶薄膜，其中，所述第一连接对位标记与所述第二连接对位标记形状不同。
  4. 一种覆晶薄膜，其中，所述覆晶薄膜包括一柔性薄膜，所述柔性薄膜包括一第一表面，所述第一表面上包括：
    一芯片接合区，所述芯片接合区内设置有一芯片；以及
    一第一连接端，所述第一连接端设置有至少一插接针，所述插接针用于电性连接柔性印刷电路板。
  5. 如权利要求4所述的覆晶薄膜，其中，所述第一连接端还设置有一第一插针对位标记及一第二插针对位标记，并且其中，所述第一插针对位标记及所述第二插针对位标记分别设置于所述插接针所在区域的两端。
  6. 如权利要求5所述的覆晶薄膜，其中，所述第一插针对位标记与所述第二插针对位标记形状不同。
  7. 如权利要求4所述的覆晶薄膜，其中，所述第一表面上还包括一第二连接端，所述第二连接端设置有至少一接合垫，所述接合垫用于电性连接显示面板。
  8. 如权利要求7所述的覆晶薄膜，其中，所述第二连接端还设置有一第一连接对位标记及一第二连接对位标记，并且其中，所述第一连接对位标记及所述第二连接对位标记分别设置于所述接合垫所在区域的两端。
  9. 如权利要求8所述的覆晶薄膜，其中，所述第一连接对位标记与所述第二连接对位标记形状不同。
  10. 一种显示装置，其中，包括：
    一显示面板，所述显示面板包括一外部引线连接区；
    一覆晶薄膜，所述覆晶薄膜的第一连接端设置有至少一插接针，其第二连接端设置有至少一接合垫；
    一导电连接层，电性连接所述接合垫于所述外部引线连接区上；以及
    一柔性印刷电路板，所述柔性印刷电路板的第一连接端设置有至少一插接口，所述插接针插入所述插接口，从而将所述柔性印刷电路板与所述覆晶薄膜电性连接。
  11. 如权利要求10所述的显示装置，其中，
    所述覆晶薄膜的第一连接端还设置有一第一插针对位标记及一第二插针对位标记，并且其中，所述第一插针对位标记及所述第二插针对位标记分别设置于所述插接针所在区域的两端；
    所述柔性印刷电路板的第一连接端还设置有一第一接口对位标记及一第二接口对位标记，并且其中，所述第一接口对位标记及所述第二接口对位标记分别设置于所述插接口所在区域的两端。
  12. 如权利要求11所述的显示装置，其中，所述第一插针对位标记与所述第二插针对位标记之间包括一第一间距；所述第一接口对位标记与所述第二接口对位标记之间包括一第二间距；所述第一间距与所述第二间距相同。
  13. 如权利要求11所述的显示装置，其中，所述第一插针对位标记与所述第二插针对位标记形状不同。
  14. 如权利要求11所述的显示装置，其中，所述第一接口对位标记与所述第二接口对位标记形状不同。
  15. 如权利要求10所述的显示装置，其中，所述覆晶薄膜的第二连接端还设置有一第一连接对位标记及一第二连接对位标记，并且其中，所述第一连接对位标记及所述第二连接对位标记分别设置于所述接合垫所在区域的两端。
  16. 如权利要求15所述的显示装置，其中，所述第一连接对位标记与所述第二连接对位标记形状不同。
  17. 如权利要求10所述的显示装置，其中，所述导电连接层为异方性导电胶膜。
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