WO2019155505A1 - 熱電クーラー内蔵型ステム - Google Patents
熱電クーラー内蔵型ステム Download PDFInfo
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- WO2019155505A1 WO2019155505A1 PCT/JP2018/003913 JP2018003913W WO2019155505A1 WO 2019155505 A1 WO2019155505 A1 WO 2019155505A1 JP 2018003913 W JP2018003913 W JP 2018003913W WO 2019155505 A1 WO2019155505 A1 WO 2019155505A1
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- stem
- thermoelectric cooler
- stem member
- built
- temperature
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
- H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02218—Material of the housings; Filling of the housings
- H01S5/02234—Resin-filled housings; the housings being made of resin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/0231—Stems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02315—Support members, e.g. bases or carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/0232—Lead-frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02476—Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
Definitions
- thermoelectric cooler built-in stem that realizes a temperature control function of an optical module.
- thermoelectric cooler hereinafter also referred to as TEC: Thermoelectric Cooler
- TEC Thermoelectric Cooler
- the TEC is mounted on the stem upper surface (also referred to as the upper surface of the eyelet), and the TEC Optical components and other components are stacked and mounted on the upper surface to form a coaxial cooling optical module (see, for example, Patent Document 1).
- a configuration of a box-type optical fiber module in which components are mounted on the upper surface of the TEC is disclosed (for example, see Patent Document 2).
- a configuration in which a light emitting element used as a light source for a Peltier element is easily attached is disclosed (for example, see Patent Document 3).
- a configuration of an optical element stem that eliminates interference with the protrusions on the periphery of the lead electrode and reduces high-frequency propagation loss is disclosed (for example, see Patent Document 4).
- a configuration is disclosed in which an existing CAN package is used to dispose the Peltier element below the stem and cool the entire element (see, for example, Patent Document 5).
- thermoelectric cooler In the conventional method, it is necessary to stack optical components on the thermoelectric cooler itself, so the optical axis of the optical component is not stable due to stress due to the mounted component, etc. May have an impact. Further, since the stress on the thermoelectric element of the thermoelectric cooler is large, there is a problem that the thermoelectric cooler may be broken due to a disturbance such as a drop impact or vibration.
- thermoelectric cooler 5 since the weight of the stacked components used for the optical component 7 is applied to the thermoelectric cooler 5, the stress applied to the thermoelectric cooler 5 increases when vibration or impact is applied, and the thermoelectric that becomes the support column of the thermoelectric cooler 5.
- the element 5a is easily broken or peeled off from the joint between the substrate 5b and the stem 20 of the thermoelectric cooler 5.
- the thermoelectric cooler 5 and the stem 20 are bonded with a conductive resin, the possibility of peeling due to impact increases.
- the lead 3 a that supplies an electrical signal to the LD chip and the lead 3 b that supplies an electrical signal to the thermoelectric cooler 5 protrude from the upper surface of the stem 20 and are attached to the stem 20.
- the lead 3 b is connected to the substrate 5 b of the thermoelectric cooler 5 at the connection point portion 4.
- the present invention is a thermoelectric cooler built-in stem that realizes the temperature control function of a CAN-type optical module as one function of the stem, and in particular, an optical axis caused by stress fluctuations on a member or the like.
- the objective is to realize a stem with a built-in thermoelectric cooler that suppresses the occurrence of characteristic fluctuations related to the optical axis, such as position fluctuations.
- the objective is to realize a thermoelectric cooler built-in stem configured such that the extended contour of the component built in one member of the stem surrounds the thermoelectric cooler.
- thermoelectric cooler built-in stem is A first stem member having a temperature controlled object mounted on the surface; A second stem member that is disposed on the back side of the first stem member and sandwiches a thermoelectric cooler that controls the temperature of the temperature control object between the first stem member; An insulating resin filled between the first stem member and the second stem member; It is characterized by comprising.
- the stem with a built-in thermoelectric cooler of the present invention can reduce the height size of the mounted component on the upper surface of the stem, and reduces the variation in stress on the component, thereby affecting the characteristic variation with respect to the optical axis of the optical module. Can be suppressed.
- the built-in thermoelectric cooler can be protected from disturbances such as drop impact and vibration.
- thermoelectric cooler built-in type stem which concerns on Embodiment 1 of this invention. It is the figure which mounted the optical module in the thermoelectric cooler built-in type stem concerning Embodiment 1 of the present invention. It is a figure which shows an example of the thermoelectric cooler built-in type stem which concerns on Embodiment 2 of this invention. It is a figure for demonstrating the influence of the external air with respect to the thermoelectric cooler built-in type stem which concerns on Embodiment 1 of this invention. It is a figure for demonstrating the influence of the external air with respect to the thermoelectric cooler built-in type stem which concerns on Embodiment 2 of this invention.
- thermoelectric cooler built-in type stem It is a top view for demonstrating in detail the structure of the 1st stem member of the thermoelectric cooler built-in type stem of FIG. It is a figure which shows an example of the thermoelectric cooler built-in type stem which concerns on Embodiment 3 of this invention. It is a figure for demonstrating the subject of this invention.
- FIG. 1 is a diagram showing an example of a thermoelectric cooler built-in stem according to Embodiment 1 of the present invention.
- FIG. 2 is a diagram in which an optical module is mounted on the thermoelectric cooler built-in stem according to Embodiment 1 of the present invention.
- a thermoelectric cooler 5 (for cooling the optical module to an appropriate temperature is provided immediately below a disk-shaped first stem member 1 for mounting a temperature control object such as an optical module.
- TEC 5 for cooling the optical module to an appropriate temperature
- TEC 5 for cooling the optical module to an appropriate temperature
- thermoelectric cooler is mounted on the upper surface of the disc-shaped second stem member 2 that is coaxially disposed opposite to the first stem member 1. .
- the thermoelectric cooler 5 is joined to the surfaces of the first stem member 1 and the second stem member 2 with a conductive material such as soldering or conductive resin.
- first stem member 1 and the second stem member 2 are provided with leads 3a for supplying an electric signal to the optical module so as to penetrate in the axial direction of the two stems.
- the lead 3 a is a component of the optical component 7 mounted on the upper surface of the first stem member 1 by protruding from the upper surface of the first stem member 1.
- an LD (abbreviation of laser diode) chip 10 By connecting to an LD (abbreviation of laser diode) chip 10 with an Au wire (not shown), it is possible to control the operation from the outside.
- a lead 3 b for supplying an electrical signal to the thermoelectric cooler 5 is provided through the second stem member 2, and is connected to the substrate 5 b of the thermoelectric cooler 5 at the connection point portion 4.
- thermoelectric cooler 5 Further, the anode and cathode (not shown) of the thermoelectric cooler 5 are joined to the lead 3b by solder or the like at the connection point portion 4 described above. Thereby, the two terminals of the anode and the cathode can be used as control terminals (electrodes) from the outside of the thermoelectric cooler 5.
- an insulating resin 6 having a low thermal conductivity is provided between the first stem member 1 and the second stem member 2. Or is filled so as to surround the thermoelectric cooler 5.
- thermoelectric cooler 5 This serves to divide the influence of heat generated by the thermoelectric cooler 5 between the first stem member 1 and the second stem member 2. In addition to this, it plays a role of protecting the thermoelectric cooler 5 from disturbance caused by a drop impact or vibration.
- the leads 3a penetrating the first stem member 1 and the second stem member 2 are separated at substantially equal intervals on the same appropriate radius of the first stem member 1 and the second stem member 2. Four places are installed, and together with the insulating resin 6, it becomes a reinforcing material for protecting the thermoelectric cooler 5.
- thermoelectric cooler built-in stem when components other than the thermoelectric cooler 5 are configured on the upper surface of the first stem member 1 will be described with reference to FIG.
- an optical component 7 which is a component other than the thermoelectric cooler 5 is mounted on the upper surface of the first stem member 1. Since the optical component 7 is mounted on the upper surface of the first stem member 1, the height of the component from the stem can be reduced by the height of the thermoelectric cooler 5. Therefore, as compared with the case where the optical component 7 is directly installed on the thermoelectric cooler 5 shown in FIG. 8, the angle deviation due to thermal stress or the like of the optical axis of the LD chip 10 which is one component of the optical component 7 is suppressed. Therefore, the occurrence rate of defects related to the optical axis can be reduced.
- thermoelectric cooler 5 is covered with an insulating resin 6 having a low thermal conductivity, and the lead 3a penetrating both stems of the second stem member 2 and the first stem member 1 is also provided. Therefore, impact resistance and vibration resistance can be further improved.
- thermoelectric cooler built-in type stem As described above, in the thermoelectric cooler built-in type stem according to the first embodiment, the height of the mounted component on the upper surface of the stem can be reduced, and thus the above-described characteristic variation regarding the optical axis can be suppressed. Moreover, resin is filled between the first stem member and the second stem member to directly cover the thermoelectric cooler, or to cover the periphery of the thermoelectric cooler, and to the first stem member or the second stem. By providing the lead 3a that penetrates the member or the lead 3b that penetrates the second stem member, it is possible to protect the thermoelectric cooler from disturbances such as impact and vibration.
- thermoelectric cooler is connected to the first stem member 1 or the second stem member 2 using solder or conductive resin, and supplies current to the thermoelectric cooler to control the operation of the thermoelectric cooler.
- the lead 3b for doing so penetrates the second stem member 2 and protrudes to the upper surface thereof.
- the anode terminal and the cathode terminal, which are electrodes of the thermoelectric cooler, and the lead 3b are connected by welding such as soldering.
- the lead 3 a for supplying current is connected to the first stem member 1 and the first stem member 1.
- the two stem members 2 are provided so as to penetrate both of the two stem members 2, and also serve to suppress disturbance such as vibration with respect to the optical component 7.
- first stem member outer periphery
- second stem member outer periphery
- the space inside the cylindrical body surrounded by the curved surface is reinforced by filling with insulating resin, and this insulating resin is formed around the thermoelectric cooler (in this case insulating)
- the gap can be formed between the resin and the thermoelectric cooler), or the portion of the thermoelectric element 5a serving as the support of the thermoelectric cooler can be filled and filled.
- This insulating resin has a low thermal conductivity and is insulative. Thus, it is possible to form a thermoelectric cooler built-in stem having a function capable of temperature control.
- thermoelectric cooler built-in stem according to the first embodiment is clearly different from the invention according to the above-mentioned literature or the combination thereof particularly in the following points.
- the first is that, unlike the conventional technique in which a thermoelectric cooler is disposed outside the stem, the thermoelectric cooler having a cooling function is provided as a part of a single stem.
- the second is that an insulating resin is formed around the thermoelectric cooler so that it is configured as a thermoelectric cooler built-in stem.
- the lead that penetrates the stem is used to protect the thermoelectric cooler.
- FIG. A thermoelectric cooler built-in stem according to Embodiment 2 of the present invention will be described below with reference to FIG.
- the difference from the thermoelectric cooler built-in type stem described in the first embodiment is that, as shown in FIG. 3, an annular resin mold portion 8 which is a region molded in a ring shape with resin is formed on the first stem member 1a. It is a point that has been.
- the annular resin mold portion 8 is formed on the first stem member 1a in order to improve the function of the thermoelectric cooler.
- the thermoelectric cooler built-in stem according to the second embodiment will be described in detail below.
- thermoelectric cooler 5 The region where each component of the optical module (not shown) is mounted is inside the annular resin mold portion 8 shown in FIG. Then, the entire thermoelectric cooler 5 is arranged at a position directly below this inner side, so that the thermoelectric cooler 5 applies heat to the optical module via the first stem member 1a or conversely reduces the heat. It is possible.
- the said cyclic resin mold part 8 provided in said 1st stem member 1a has the said extending
- thermoelectric cooler 5 since the outer portion of the ring formed by the annular resin mold portion 8 is directly affected by the temperature of the outside air, the thermoelectric cooler 5 is affected by the outside air when there is no annular resin mold portion 8. It is easy and the case where the thermoelectric cooler 5 cannot fully perform the function can be considered. For this reason, by providing the annular resin mold portion 8, the influence of the outside air temperature on the thermoelectric cooler 5 is reduced.
- thermoelectric cooler built-in stem described in the first embodiment of FIG. 4
- the first surface is cooled by cooling the upper surface of the thermoelectric cooler 5.
- the temperature of the lower surface of the stem member 1 is lowered, and the overall temperature of the first stem member 1 is lowered by heat conduction due to a temperature difference from the upper surface of the first stem member 1 (see the arrow in the figure).
- the difference between the temperature and the outside air 30 is large, it is assumed that the function of the thermoelectric cooler 5 is insufficient and the temperature does not decrease.
- a ring-shaped annular resin mold portion 8 is provided on the first stem member 1a.
- the annular resin mold portion 8 allows the first stem member 1a that is easily affected by the outside air 30 to be connected to the outside portion of the ring of the annular resin mold portion 8 and the inside of the ring of the annular resin mold portion 8 that is not easily affected.
- the thermoelectric cooler 5 is not easily affected by the temperature of the outside air 30, and the ability of the thermoelectric cooler 5 can be fully exhibited.
- FIG. 6 is a top view of the first stem member 1a as viewed from above, in order to explain the structure of the first stem member 1a in more detail.
- four leads 3a penetrating the first stem member 1a and the second stem member 2 are arranged at substantially the same radial position outside the ring-shaped annular resin mold portion 8 and spaced apart from each other at equal intervals.
- the annular resin mold portion 8 is provided in a form penetrating in the thickness direction of the first stem member 1a.
- the first stem member 1 a is thermally separated into the first stem member outer side 12 and the first stem member inner side 11 by the annular resin mold portion 8.
- the portion of the first stem member inner side 11 is changed to the first side by the thermoelectric cooler 5 whose upper surface is bonded to the rear surface of the first stem member inner side 11 (the contour position is indicated by a dotted line in the drawing). It is possible to control the temperature separately from the stem member outer side 12.
- thermoelectric cooler can be expanded by providing the annular resin mold portion 8 on the first stem member 1a and making the structure less susceptible to the influence of the ambient temperature.
- FIG. 7 An example of a thermoelectric cooler built-in stem according to Embodiment 3 of the present invention will be described below with reference to FIG.
- the stem with built-in thermoelectric cooler of the present embodiment has a configuration in which a reinforcing bar 9 is additionally provided between the first stem member 1a and the second stem member 2.
- the other configurations are the same.
- the reinforcing bar 9 is connected to the outer peripheral side of each lead at the radial position of these stems so as to connect the first stem member 1a and the second stem member 2 to each other.
- a plurality of cables are fixed by welding.
- the reinforcing bar 9 further strengthens the protection from disturbance caused by the lead and the insulating resin through the first stem member 1 and the second stem member 2 with respect to the thermoelectric cooler. It plays the role of a reinforcing material to protect against external disturbances such as impact and vibration.
- the present invention is not limited to this example, and as described in the first embodiment, the first stem member has an annular resin mold. Even in the case where the mold part 8 is not formed, the same effect can be obtained when the influence of outside air is small.
- thermoelectric cooler built-in stem As shown in FIG. 7, by providing a reinforcing rod 9 between the first stem member 1a and the second stem member 2, in addition to protecting the thermoelectric cooler 5 from the surface of the structural strength by the insulating resin, Protection from the aspect of strength becomes possible. Thereby, the thermoelectric cooler 5 and the connection point part 4 mounted in the inside of the 1st stem member 1a and the 2nd stem member 2 can be protected.
- thermoelectric cooler built-in stem As described above, in the thermoelectric cooler built-in stem according to the present embodiment, the components mounted between the first stem member 1a and the second stem member 2 are separated from disturbances such as impact and vibration. It can be further strengthened and protected.
- the present invention can be freely combined with each other within the scope of the invention, and each embodiment can be appropriately modified or omitted.
- the first stem member and the second stem member have been described as being installed in the vertical direction (gravity direction). (Vertical direction).
- the plurality of leads for supplying an electrical signal to the optical module has been described in the example of penetrating the second stem member.
- the present invention is not limited thereto, and the form does not penetrate the first stem member.
- the upper end of the lead may be the same surface as the upper surface of the first stem member or may be substantially the same surface.
- the number of leads is 4 as an example in the figure, but the present invention is not limited to this.
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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- Semiconductor Lasers (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
特に、熱電クーラー5とステム20を導電性樹脂でボンディングしている場合は、衝撃による剥離の可能性が高くなる。
表面に温度制御対象体が搭載された第1のステム部材と、
前記第1のステム部材の裏面側に配置され、前記第1のステム部材との間に前記温度制御対象体の温度制御を行う熱電クーラーを挟み込む第2のステム部材と、
前記第1のステム部材および前記第2のステム部材間に充填された絶縁性樹脂と、
を備えたことを特徴とするものである。
この発明の実施の形態1に係る熱電クーラー内蔵型ステムについて、図を基にして以下説明する。図1は、本発明の実施の形態1に係る熱電クーラー内蔵型ステムの一例を示す図である。また図2は本発明の実施の形態1に係る熱電クーラー内蔵型ステムに光学モジュールを搭載した図である。
図1において、光学モジュールなどの温度制御対象体を搭載するための円板状の第1のステム部材1のすぐ下側には、この光学モジュールを適切な温度に冷却するための熱電クーラー5(以下、TEC5と呼ぶこともある。TEC:Thermoelectric Cooler)が、第1のステム部材1と対向して同軸上に配置された円板状の第2のステム部材2の、上面に搭載されている。ここで、熱電クーラー5は、第1のステム部材1および第2のステム部材2の表面に、半田付けや導電性樹脂などの導電性材料で接合されている。
また、上記の熱電クーラー5に電気信号を供給するリード3bが、第2のステム部材2を貫通して設けられ、接続ポイント部4で、熱電クーラー5の基板5bと接続されている。
この図に示すように、第1のステム部材1の上面に熱電クーラー5以外の部品である光学部品7を搭載した例である。第1のステム部材1の上面に光学部品7を搭載しているため、ステムからの部品の高さを、熱電クーラー5の高さ分だけ減らすことが可能となる。
従って、図8に示した、熱電クーラー5に直接、光学部品7を設置する場合に比較して、光学部品7の一部品であるLDチップ10の光軸の、熱ストレスなどによる角度ずれが抑制されるため、この光軸に関する不具合の発生率を減らすことができる。
1つ目は、ステムの外部に熱電クーラーを配置する従来の技術とは異なり、単体のステムの一部として冷却機能を有する熱電クーラーを持つ形態としたものであることである。2つ目は、熱電クーラーの周囲に絶縁性樹脂を形成したことにより、熱電クーラー内蔵型ステムとして構成していることである。3つ目は、熱電クーラーの保護のために、ステムを貫通するリードを利用していることである。
この発明の実施の形態2に係る熱電クーラー内蔵型ステムについて、図3を基にして以下説明する。
実施の形態1で説明した熱電クーラー内蔵型ステムとの違いは、図3に示すように、第1のステム部材1aに、樹脂によりリング状にモールドされた領域である環状樹脂モールド部8が形成されている点である。この環状樹脂モールド部8は、熱電クーラーの機能を向上させるためにこの第1のステム部材1aに形成されたものである。この実施の形態2に係る熱電クーラー内蔵型ステムについて、以下詳しく説明する。
図4の実施の形態1で説明した熱電クーラー内蔵型ステムを使用した場合においては、外気30が、光学モジュールに搭載したデバイスの温度より高温の場合、熱電クーラー5の上面を冷やすことで第1のステム部材1下面の温度が下がり、第1のステム部材1上面との温度差による熱伝導によって(図中の矢印参照)、第1のステム部材1の全体温度を下げるが、駆動したいデバイスの温度と外気30の差が大きい場合、熱電クーラー5の機能が不足して温度が下がらないケースが想定される。
この図において、第1のステム部材1aと第2のステム部材2を貫通するリード3aは、リング状の環状樹脂モールド部8の外側のほぼ同じ半径位置に、互いに等間隔に離れて4個配置されている。また、この環状樹脂モールド部8は、第1のステム部材1aの厚さ方向に貫通する形態で設けられている
この発明の実施の形態3に係る熱電クーラー内蔵型ステムの一例について、図7を基にして以下説明する。
図7に示すように、本実施の形態の熱電クーラー内蔵型ステムは、第1のステム部材1aと第2のステム部材2間に、補強棒9を、さらに追加して設けた構成とした点が、実施の形態2で説明した熱電クーラー内蔵型ステムと異なり、その他の構成は同じである。この補強棒9は、図に示すように、第1のステム部材1aと第2のステム部材2を繋ぐように、これらのステムの半径位置において、各リードの配置位置よりもさらに外周側に、溶接により固定されて複数本設置されている。
図7に示すように、第1のステム部材1aと第2のステム部材2の間に補強棒9を設けることで、絶縁性樹脂による構造強度の面からの熱電クーラー5の保護に加え、構造強度の面からの保護が可能となる。これにより、第1のステム部材1aと第2のステム部材2の内部に搭載される熱電クーラー5や接続ポイント部4を保護できる。
Claims (6)
- 表面に温度制御対象体が搭載された第1のステム部材と、
前記第1のステム部材の裏面側に配置され、前記第1のステム部材との間に前記温度制御対象体の温度制御を行う熱電クーラーを挟み込む第2のステム部材と、
前記第1のステム部材および前記第2のステム部材間に充填された絶縁性樹脂と、
を備えたことを特徴とする熱電クーラー内蔵型ステム。 - 前記第1のステム部材および前記第2のステム部材を貫通し、前記温度制御対象体に電気信号を供給するリードを複数備えたことを特徴とする請求項1に記載の熱電クーラー内蔵型ステム。
- 前記熱電クーラーは、支柱となる熱電素子と、前記第1のステム部材および前記第2のステム部材にそれぞれ接合する基板とを備え、前記熱電クーラーに電気信号を供給する別のリードに接続ポイント部を介して接続されていることを特徴とする請求項1または請求項2に記載の熱電クーラー内蔵型ステム。
- 前記第1のステム部材は、内部に樹脂により環状にモールドされた環状樹脂モールド部を有し、当該環状樹脂モールド部は、その環状の輪郭部分の前記絶縁性樹脂への延伸輪郭線が、前記熱電クーラーを取り囲むように構成されていることを特徴とする請求項1から3のいずれか1項に記載の熱電クーラー内蔵型ステム。
- 前記第1のステム部材と前記第2のステム部材とに繋がる補強棒を設けたことを特徴とする請求項1から4のいずれか1項に記載の熱電クーラー内蔵型ステム。
- 前記第1のステム部材は、温度を変更するデバイスを搭載する部分と、温度を変更するデバイスを搭載しない部分とに分離された構造を有していることを特徴とする請求項1に記載の熱電クーラー内蔵型ステム。
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