WO2019011291A1 - 硅片的承载装置 - Google Patents

硅片的承载装置 Download PDF

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Publication number
WO2019011291A1
WO2019011291A1 PCT/CN2018/095408 CN2018095408W WO2019011291A1 WO 2019011291 A1 WO2019011291 A1 WO 2019011291A1 CN 2018095408 W CN2018095408 W CN 2018095408W WO 2019011291 A1 WO2019011291 A1 WO 2019011291A1
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WO
WIPO (PCT)
Prior art keywords
fixing rod
silicon wafer
upper fixing
limiting
plate
Prior art date
Application number
PCT/CN2018/095408
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English (en)
French (fr)
Inventor
龙永灯
陈贤刚
杨苗
郁操
张津燕
徐希翔
Original Assignee
君泰创新（北京）科技有限公司
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Publication of WO2019011291A1 publication Critical patent/WO2019011291A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1876—Particular processes or apparatus for batch treatment of the devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
    • B65G1/02—Storage devices
    • B65G1/04—Storage devices mechanical
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present disclosure relates to the field of solar cell technology, for example, to a carrier device for a silicon wafer.
  • Solar cells produced on silicon such as conventional batteries, Heterojunction with Intrinsic Thin Layer (HJT) batteries, Interdigitated Back Contact (IBC) batteries, passivation Passively diffused solar cells (PERL) cells, Heterojunction Back Contact (HBC) cells, and Passived Emitter Rear Contact (PERC) Batteries, etc., all of which contain crystalline silicon.
  • HJT Heterojunction with Intrinsic Thin Layer
  • IBC Interdigitated Back Contact
  • PROL Passively diffused solar cells
  • HBC Heterojunction Back Contact
  • PERC Passived Emitter Rear Contact
  • a silicon wafer limiting device for a silicon wafer or a silicon wafer cleaning device for mass production of a crystalline silicon production line is provided with a silicon wafer limiting rod, and the silicon limiting rod is generally toothed.
  • the silicon wafer is used, the surface of the silicon wafer is easily scratched by the tip end of the tooth, thereby affecting the subsequent process, resulting in inefficiency and poor appearance.
  • the device for carrying the silicon wafer is further provided with a support rod. If the support rod is improperly designed, the dead zone of the wafer fluffing, the silicon wafer cleaning or the silicon wafer drying may be caused, such as poor lapping and poor cleaning on the edge portion of the silicon wafer. Or the phenomenon of leaving water marks.
  • the application provides a silicon wafer carrier device to prevent the silicon wafer from being scratched and to improve product yield.
  • the application provides a silicon wafer carrying device, comprising:
  • the pair of fixing plates comprising a first fixing plate and a second fixing plate;
  • An upper fixing rod a first end of the upper fixing rod is fixedly connected to the first fixing plate, a second end of the upper fixing rod is fixedly connected to the second fixing plate; and the upper fixing rod is provided with a plurality of limiting columns; the limiting column comprises a cylindrical body and a hemispherical end;
  • a lower fixing rod a first end of the lower fixing rod is fixedly connected to the first fixing plate, and a second end of the lower fixing rod is fixedly connected to the second fixing plate.
  • the lower fixing rod is provided with a plurality of limiting slots.
  • the lower fixing rod includes: a horizontal plate and a plurality of card plates respectively vertically fixed on the horizontal plate, and one of each two adjacent ones of the plurality of card plates forms a card Limit slot.
  • the lower fixing rod includes: a plate body and a plurality of limiting protrusions, wherein the plurality of limiting protrusions are disposed on the plate body, and each of the plurality of limiting protrusions A limiting slot is formed between adjacent limiting protrusions.
  • each of the limiting projections is semi-cylindrical.
  • an overflow hole is opened in each of the limiting slots of the plate body.
  • the number of the limit posts is in the range of 1-300.
  • the first fixing plate and the second fixing plate are both provided with a convection hole.
  • the first fixing plate and the second fixing plate are provided with a tool card slot to facilitate extraction of the cleaning tool.
  • the application also provides a carrier device for a silicon wafer, comprising:
  • a first upper fixing rod and a second upper fixing rod disposed oppositely; a first end of the first upper fixing rod is fixedly connected to the first fixing plate, and a second end of the first upper fixing rod is opposite to the The second fixing plate is fixedly connected; the first end of the second upper fixing rod is fixedly connected to the first fixing plate, and the second end of the second upper fixing rod is fixedly connected to the second fixing plate; a plurality of limiting posts are disposed on the first upper fixing rod and the second upper fixing rod, and each of the limiting columns comprises a cylindrical main body and a hemispherical end;
  • the lower fixing rod is disposed below the first upper fixing rod and the second upper fixing rod, and the first end of the lower fixing rod is fixedly connected with the first fixing plate, The second end of the lower fixing rod is fixedly connected to the second fixing plate.
  • two sides of the silicon wafer are respectively inserted from each of two adjacent limiting posts of the first upper fixing rod and the second upper fixing rod, and the silicon wafer The bottom edge is received by the lower fixing rod.
  • the lower fixing rod is parallel to the first upper fixing rod and the second upper fixing rod.
  • the number of the limiting posts disposed on the first upper fixing rod and the second upper fixing rod is the same and is arranged in a one-to-one correspondence.
  • the first upper fixing rod includes two first upper fixing rods fixed on the same side, and the two first upper fixing rods are arranged in a vertical direction, and are arranged to fix the silicon wafer. a first side fixing;
  • the second upper fixing rod includes two second upper fixing rods fixed on the same side, and the two second upper fixing rods are arranged in a vertical direction, and are arranged to fix the silicon sheet Two sides; and the heights of the two first upper fixing rods are respectively the same as the heights of the two second upper fixing rods.
  • the lower fixing rod is provided with a plurality of limiting slots.
  • the width of each of the limiting slots is greater than the thickness of the silicon wafer.
  • the width of each of the limiting slots is in the range of 3 to 5 times the thickness of the silicon wafer.
  • the lower fixing rod has a cylindrical shape, and each of the limiting grooves is formed by slotting on the lower fixing rod.
  • the length of each of the limiting slots is less than or equal to the diameter of the lower fixing rod, and the depth of each of the limiting slots is less than or equal to the radius of the lower fixing rod.
  • the lower fixing rod includes: a plate body and a plurality of limiting protrusions, wherein the plurality of limiting protrusions are disposed on the plate body, and each of the plurality of limiting protrusions A limiting slot is formed between adjacent limiting protrusions.
  • each of the limiting projections is semi-cylindrical.
  • an overflow hole is defined in each of the limiting slots of the lower fixing rod.
  • the number of the limit posts is in the range of 1-300.
  • the first fixing plate and the second fixing plate are both provided with a convection hole.
  • the first fixing plate and the second fixing plate are respectively provided with a tool card slot to facilitate extraction of the carrying device.
  • the shape of the first upper fixing rod and the shape of the second upper fixing rod are both cylindrical.
  • the carrier device of the silicon wafer provided by the present application has a cylindrical shape by providing a main body of the limiting post, and the end is hemispherical, which can avoid scratching the silicon wafer and improve the product yield.
  • FIG. 1 is a top plan view showing the structure of a silicon wafer carrier device according to an embodiment
  • Figure 2 is an enlarged view of A in Figure 1;
  • FIG. 3 is a top plan view showing a structure of a carrying device for a silicon wafer according to another embodiment
  • FIG. 4 is a perspective view of a carrier device for a silicon wafer according to an embodiment
  • Figure 5 is a front elevational view of the lower fixing rod provided by an embodiment
  • Figure 6 is a plan view of the lower fixing rod shown in Figure 5;
  • Figure 7 is a front elevational view of a lower fixing rod provided by another embodiment
  • Figure 8 is a plan view of the lower fixing rod shown in Figure 7;
  • Figure 9 is a plan view showing the lower fixing rod shown in Figure 5 with an overflow hole
  • Figure 10 is a side view of a first fixing plate provided by an embodiment
  • FIG. 11 is a top plan view showing a structure of a carrier for a silicon wafer according to another embodiment.
  • FIG. 1 is a top plan view showing a structure of a silicon wafer carrier device according to an embodiment
  • FIG. 2 is an enlarged view of a portion A in FIG.
  • the embodiment provides a carrying device for a silicon wafer
  • the carrying device of the silicon wafer includes a pair of fixing plates for use as a supporting structure.
  • the pair of fixing plates include a first fixing plate 1a and a second fixing plate 1b.
  • the carrier of the silicon wafer further includes an upper fixing rod 2 and a lower fixing rod 3. Both the upper fixing rod 2 and the lower fixing rod 3 may be arranged in pairs, and the upper fixing rod 2 and the lower fixing rod 3 may each have a cylindrical shape.
  • each upper fixing rod 2 is fixedly connected with the first fixing plate 1a, and the second end of each upper fixing rod 2 is fixedly connected with the second fixing plate 1b;
  • the upper fixing rod 2 is provided with a plurality of limiting posts 21 for limiting the first end of the silicon wafer; the limiting post 21 comprises a cylindrical body and a hemispherical end.
  • the first end of each lower fixing rod 3 is fixedly connected to the first fixing plate 1a, and the second end of each lower fixing rod 3 is fixedly connected to the second fixing plate 1b.
  • the number of the limiting posts 21 is plural. In the present embodiment, according to the overall size of the carrying device, the number of the limiting posts 21 can be designed to be in the range of 1-300.
  • each of the lower fixing rods 3 is provided with a plurality of limiting slots 31 for limiting the second end of the silicon wafer, so that the second end of the silicon wafer can be placed at the limit.
  • the first end of the silicon wafer is placed between two adjacent limiting posts 21. Since the shape of the main body of the limiting post 21 is cylindrical and the shape of the end is hemispherical, scratching of the silicon wafer is avoided, and the product yield is improved.
  • the lower fixing rod 3 includes a horizontal plate and a plurality of clamping plates vertically fixed on the horizontal plate, and a limiting groove is formed between each two adjacent ones of the plurality of clamping plates.
  • the limiting slot 31 may be formed by providing a plurality of limiting protrusions 32.
  • the limiting groove 31 is grooved on the cylindrical lower fixing rod 3 to form a plurality of limiting protrusions 32 and a plurality of limiting grooves 31.
  • the length of the limiting slot 31 is less than or equal to the diameter of the lower fixing rod 3, the depth of the limiting slot 31 is less than or equal to the radius of the lower fixing rod 3, and the depth of the limiting slot 31 is at least 5 mm.
  • the lower fixing rod 3 includes a plate body and a plurality of limiting protrusions 32.
  • the plurality of limiting protrusions 32 are disposed on the plate body, and each of the plurality of limiting protrusions 32 is adjacent to the limit.
  • a limiting groove 31 is formed between the protrusions 32.
  • the limiting protrusion 32 is semi-cylindrical. It can be understood that the limiting protrusion 32 can also be other shapes as long as the rounding is set thereon. To avoid scratching the silicon wafer.
  • an overflow hole 33 is opened in each of the limiting slots 31 of the plate body.
  • the arrangement of the overflow holes 33 can enhance the flow of the liquid or gas, and reduce the dead zone of the silicon wafer during cleaning, texturing or drying, resulting in poor cleanness of the silicon wafer.
  • the extraction carrying device can avoid the liquid accumulation in the limiting tank 31 and accelerate the elimination of the solution.
  • the solution when the silicon wafer is placed in the cleaning solution along with the carrier device, the solution generates bubbles through the overflow hole 33, so that the air in the solution flows to the limiting slot 31 where the silicon wafer is placed, and the silicon wafer is in the limiting slot 31.
  • the left and right swings avoid the occurrence of traces of the cleaning tool (or the cleaning basket) compared to the related art in which the silicon wafer is in a stationary state.
  • the first fixing plate 1 a and the second fixing plate 1 b are respectively provided with convection holes 4 to enhance the flow of liquid and gas, improve the uniformity of the solution or gas, and improve cleaning. , texturing or drying effect.
  • first fixing plate 1a and the second fixing plate 1b are provided with tool slot 11 respectively, and the tool slot 11 is respectively disposed at an upper end of the first fixing plate 1a and an upper end of the second fixing plate 1b for convenient Extract the cleaning tooling.
  • FIG. 3 is a top plan view of another silicon wafer carrier device according to the embodiment
  • FIG. 4 is a perspective view of the silicon wafer carrier device shown in FIG. 3, and only the first fixing plate 1a and the second portion are shown in FIG.
  • the fixing plate 1b, the first upper fixing rod 2a, the second upper fixing rod 2b, and the lower fixing rod 3 do not have other structures such as the stopper post 21 in Fig. 3. Referring to FIG. 3 and FIG.
  • the carrying device of the silicon wafer includes: a first fixing plate 1a and a second fixing plate 1b disposed opposite to each other; and a first upper fixing rod 2a and a second upper fixing rod disposed opposite to each other 2b, the first end of the first upper fixing rod 2a is fixedly connected with the first fixing plate 1a, the second end of the first upper fixing rod 2a is fixedly connected with the second fixing plate 1b; the first end of the second upper fixing rod 2b Fixedly connected to the first fixing plate 1a, the second end of the second upper fixing rod 2b is fixedly connected with the second fixing plate 1b; the first upper fixing rod 2a and the second upper fixing rod 2b are respectively provided with a plurality of limiting columns 21, and each of the limiting posts 21 comprises a cylindrical main body and a hemispherical end; a lower fixing rod 3 (two lower fixing rods 3 in FIG.
  • a lower fixing rod 3 is fixed on the first upper portion Below the rod 2a and the second upper fixing rod 2b, the first end of the lower fixing rod 3 is fixedly coupled to the first fixing plate 1a, and the second end of the lower fixing rod 3 is fixedly coupled to the second fixing plate 1b.
  • the two sides of the silicon wafer are respectively inserted from each of the two adjacent limiting posts 21 of the first upper fixing rod 2a and the second upper fixing rod 2b, and the bottom edge of the silicon wafer is fixed by the lower portion.
  • the rod 3 is taken over.
  • first upper fixing rod 2a and the second upper fixing rod 2b are arranged in parallel, and the lower fixing rod 3 is disposed in parallel with the first upper fixing rod 2a and the second upper fixing rod 2b and is located at the first upper fixing rod 2a. And below the second upper fixing rod 2b.
  • the shape of the first fixing plate 1a and the second fixing plate 1b may be any shape as long as the first upper fixing rod 2a, the second upper fixing rod 2b, and the lower fixing rod 3 can be supported.
  • the shapes of the first fixing plate 1a and the second fixing plate 1b may each be a shape such as a rectangular parallelepiped or a cylinder.
  • the number of the limiting posts 21 disposed on the first upper fixing rod 2a and the second upper fixing rod 2b is the same and arranged in a one-to-one correspondence.
  • first upper fixing rod 2a and the second upper fixing rod 2b are identical in structure except that the first upper fixing rod 2a has the orientation of the side of the limiting column 21 and the second upper fixing rod.
  • the orientation of the side having the limit post 21 on 2b is different.
  • the number of the first upper fixing rods 2a may be one or more, and the number of the second upper fixing rods 2b may be one or more.
  • the number of the first upper fixing rod 2a and the second upper fixing rod 2b is the same.
  • the first upper fixing rod 2a includes two first upper fixing rods 2a fixed to the same side
  • the two first upper fixing rods 2a are arranged in the vertical direction
  • the second upper fixing rod 2b includes two fixed on the same side.
  • the second upper fixing rod 2b, the two second upper fixing rods 2b are arranged in the vertical direction, thereby fixing the first side of the silicon wafer by the two first upper fixing rods 2a, and fixing the silicon by the two second upper fixing rods 2b
  • the second side of the sheet is used to fix the wafer more stably.
  • the heights of the two first upper fixing rods 2a may be the same as the heights of the two second upper fixing rods 2b, respectively, in one-to-one correspondence.
  • the number of lower fixing bars 3 may be one or more to receive the bottom edge of the silicon wafer through one or more lower fixing bars 3.
  • the first side of the silicon wafer is placed between two adjacent limiting posts 21 on the first upper fixing rod 2a, and the second side of the silicon wafer opposite to the first side edge Positioned between two adjacent limiting posts 21 on the second upper fixing rod 2b, and then the first side and the second side of the silicon wafer are fixed by the first upper fixing rod 2a and the second upper fixing rod 2b, The bottom edge of the silicon wafer adjacent to both the first side and the second side is placed on the lower fixing rod 3, and the bottom side of the silicon wafer is received by the lower fixing rod 3, thereby carrying the wafer.
  • the shape of the main body of the limiting post 21 is cylindrical and the shape of the end is hemispherical, the scratch of the silicon wafer by the carrying device is avoided, and the product yield is improved.
  • the number of the limiting posts 21 can be set according to the overall size of the carrying device, and the number of the limiting posts 21 determines the number of silicon wafers carried. In an embodiment, the number of limit posts 21 is in the range of 1-300.
  • the lower fixing rod 3 is provided with a plurality of limiting slots 31.
  • the bottom edge of the silicon wafer is placed in the limiting slot 31.
  • the depth of each of the limiting slots 31 is greater than or equal to 5 mm to prevent the silicon wafer from falling out of the limiting slot 31.
  • the width of each of the limiting slots 31 is greater than the thickness of the silicon wafer.
  • the width of each of the limiting slots 31 is in the range of 3 to 5 times the thickness of the silicon wafer.
  • FIG. 5 is a front view of a lower fixing rod provided in the embodiment
  • FIG. 6 is a top view of the lower fixing rod shown in FIG. 5.
  • the lower fixing rod 3 has a cylindrical shape, and each of the limiting slots 31 is formed by slotting on the lower fixing rod 31, and a gap is formed between two adjacent limiting slots 31. Limiting projection 32.
  • the length of each of the limiting slots 31 is less than or equal to the diameter of the lower fixing rod 3, and the depth of each of the limiting slots 31 is less than or equal to the radius of the lower fixing rod 3.
  • FIG. 7 is a front view of another lower fixing rod provided in the embodiment
  • FIG. 8 is a top view of the lower fixing rod shown in FIG. 7.
  • the lower fixing rod 3 includes a plate body 34 and a plurality of limiting protrusions 32.
  • the plurality of limiting protrusions 32 are disposed on the plate body 34, and each of the plurality of limiting protrusions 32 is adjacent to each other.
  • a limiting slot 31 is formed between the limiting protrusions 32.
  • the shape of the limiting protrusion 32 is semi-cylindrical.
  • an overflow hole 33 is defined in each of the limiting slots 31 of the lower fixing rod 3, and an overflow hole 33 is opened in each of the limiting slots 31 of the lower fixing 3 shown in FIG.
  • the top view is shown in Figure 9.
  • the arrangement of the overflow holes 33 can enhance the flow of liquid or gas, and reduce the dead zone of the silicon wafer during cleaning, texturing or drying, resulting in poor cleanness of the silicon wafer.
  • the extraction carrying device can avoid the liquid accumulation in the limiting tank 31 and accelerate the elimination of the solution.
  • the solution when the silicon wafer is placed in the cleaning solution along with the carrier device, the solution generates bubbles through the overflow hole 33, so that the air in the solution flows to the limiting slot 31 where the silicon wafer is placed, and the silicon wafer is in the limiting slot 31.
  • the left and right swings avoid the occurrence of cleaning marks as compared with the related art in which the silicon wafer is in a stationary state.
  • FIG. 10 is a side view of a first fixing plate according to an embodiment of the present invention.
  • the side view of the second fixing plate is the same as the side view of the first fixing plate.
  • the first fixed plate 1a and the second fixed plate 1b are each provided with a convection hole 4.
  • first fixing plate 1a and the second fixing plate 1b are each provided with a plurality of convection holes 4.
  • the shape and position of the convection hole 4 can be arbitrarily set.
  • the cross section of the convection hole 4 may be a circular shape, a square shape or a triangular shape.
  • first fixing plate 1a and the second fixing plate 1b are each provided with a tool card slot to facilitate the extraction of the carrying device.
  • the tool slots may be respectively disposed on the top of the first fixing plate 1a and the top of the second fixing plate 2a, or respectively disposed in the first fixing plate 1a and the first upper fixing rod 2a.
  • the side opposite side faces of the end are joined to the side opposite to the side of the second fixing plate 1b which is connected to the second end of the first upper fixing rod 2a.
  • the height of the tool slot on the first fixing plate 1a coincides with the height of the tool slot on the second fixing plate 1b.
  • the shape of the first upper fixing rod 2a and the shape of the second upper fixing rod 2b are both cylindrical.
  • FIG. 11 is a top plan view showing another structure of a silicon wafer carrying device according to an embodiment of the present invention.
  • the carrying device may further comprise a pressing rod 5, the first end of the pressing rod 5 is fixedly connected with the first fixing plate 1a, and the second end and the second end of the pressing rod 5
  • the fixing plate 1b is fixedly connected, and the pressing plate 5 is disposed to fix the top edge of the silicon wafer opposite to the bottom edge of the silicon wafer.
  • the pressure bar 5 is provided with a plurality of limiting slots 31, and the fourth side of the silicon wafer is placed in the limiting slot 31 of the pressing bar 5.

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  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Packaging Frangible Articles (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

一种硅片的清洗工装。该承载装置包括：相对设置的第一固定板和第二固定板；相对设置的第一上部固定杆和第二上部固定杆，第一上部固定杆的第一端与第一固定板固定连接，第一上部固定杆的第二端与第二固定板固定连接；第二上部固定杆的第一端与第一固定板固定连接，第二上部固定杆的第二端与第二固定板固定连接；第一上部固定杆和第二上部固定杆上均设置有多个限位柱，且每个限位柱包括圆柱状的主体和半球状的端头；下部固定杆，下部固定杆设置于第一上部固定杆和第二上部固定杆的下方，下部固定杆的第一端与第一固定板固定连接，下部固定杆的第二端与第二固定板固定连接。

Description

硅片的承载装置
本公开要求申请日为2017年07月14日、申请号为201720856685.9、名称为“硅片清洗工装”的中国专利申请的优先权，该申请的全部内容通过引用结合在本公开中。
技术领域
本公开涉及太阳能电池技术领域，例如涉及一种硅片的承载装置。
背景技术
以硅为基底所生产的太阳能电池，如常规电池、具有本征薄层的异质结(Heterojunction with Intrinsic Thin layer，HJT)电池、叉指型背接触(Interdigitated Back Contact，IBC)电池、钝化发射极背部局域扩散(Passivated emitter，rear locally diffused solar cells，PERL)电池、异质结背接触(Heterojunction Back Contact，HBC)电池和钝化发射极背部局域接触(Passivated Emitter Rear Contact，PERC)电池等，这些电池的结构都含有晶体硅。硅片钝化前，硅片清洗、制绒以及干燥制程中的硅片产品良率是保障电池的整个生产线成本降低以及成品良率的基础，且硅片表面的清洁度的提高，也是保障电池效率提高的必备前提。因此生产电池的过程中，承载硅片的工具的设计和选用尤为重要。
相关技术中，量产晶体硅生产线上的用于硅片制绒或硅片清洗的承载硅片的装置上设置有硅片限位杆，该硅片限位杆一般为齿状，在取放硅片时，硅片表面易被齿状的尖端划伤，从而影响后续制程，造成低效和外观不良。
另外，承载硅片的装置上还设置有支撑杆，若支撑杆设计不当，易造成硅片制绒、硅片清洗或硅片干燥的死区，如硅片边缘部分出现制绒不良、清洗不良或留下水迹的现象。
发明内容
本申请提供一种硅片的承载装置，以避免硅片被划伤，提高产品良率。
本申请提供了一种硅片的承载装置，包括：
一对固定板，所述一对固定板包括第一固定板和第二固定板；
上部固定杆，所述上部固定杆的第一端与所述第一固定板固定连接，所述 上部固定杆的第二端与所述第二固定板固定连接；所述上部固定杆上设置有多个限位柱；所述限位柱包括圆柱状的主体和半球状的端头；
下部固定杆，所述下部固定杆的第一端与所述第一固定板固定连接，所述下部固定杆的第二端与所述第二固定板固定连接。
在一实施例中，所述下部固定杆上设置有多个限位槽。
在一实施例中，所述下部固定杆包括：横板和分别竖直固定在所述横板上的多个卡板，所述多个卡板中每两个相邻卡板之间形成一个限位槽。
在一实施例中，所述下部固定杆包括：板体和多个限位凸起，所述多个限位凸起设置在所述板体上，所述多个限位凸起中每两个相邻限位凸起之间形成一个限位槽。
在一实施例中，每个所述限位凸起为半圆柱体状。
在一实施例中，所述板体的每个所述限位槽中开设有溢流孔。
在一实施例中，所述限位柱的数量在1-300数值范围内。
在一实施例中，所述第一固定板和所述第二固定板上均设置有对流孔。
在一实施例中，所述第一固定板和所述第二固定板上设置有工具卡槽，以方便提取所述清洗工装。
本申请还提供了一种硅片的承载装置，包括：
相对设置的第一固定板和第二固定板；
相对设置的第一上部固定杆和第二上部固定杆；所述第一上部固定杆的第一端与所述第一固定板固定连接，所述第一上部固定杆的第二端与所述第二固定板固定连接；所述第二上部固定杆的第一端与所述第一固定板固定连接，所述第二上部固定杆的第二端与所述第二固定板固定连接；所述第一上部固定杆和所述第二上部固定杆上均设置有多个限位柱，且每个所述限位柱包括圆柱状的主体和半球状的端头；
下部固定杆，所述下部固定杆设置于所述第一上部固定杆和所述第二上部固定杆的下方，所述下部固定杆的第一端与所述第一固定板固定连接，所述下部固定杆的第二端与所述第二固定板固定连接。
在一实施例中，所述硅片的两个侧边分别从所述第一上部固定杆和所述第二上部固定杆的每两个相邻的限位柱插入，且所述硅片的底边由所述下部固定杆承接。
在一实施例中，所述下部固定杆与所述第一上部固定杆和所述第二上部固 定杆平行。
在一实施例中，所述第一上部固定杆和所述第二上部固定杆上设置的限位柱的个数相同且是一一对应排列的。
在一实施例中，所述第一上部固定杆包括固定于同一侧的两个第一上部固定杆，两个所述第一上部固定杆沿竖直方向排列，设置为固定所述硅片的第一侧边；所述第二上部固定杆包括固定于同一侧的两个第二上部固定杆，两个所述第二上部固定杆沿竖直方向排列，设置为固定所述硅片的第二侧边；且所述两个第一上部固定杆的高度分别一一对应地与所述两个第二上部固定杆的高度相同。
在一实施例中，所述下部固定杆上设置有多个限位槽。
在一实施例中，每个所述限位槽的宽度大于所述硅片的厚度。
在一实施例中，每个所述限位槽的宽度在所述硅片的厚度的3倍-5倍范围内。
在一实施例中，所述下部固定杆的形状为圆柱体状，每个所述限位槽是通过在所述下部固定杆上进行开槽形成的。
在一实施例中，每个所述限位槽的长度小于或等于所述下部固定杆的直径，每个所述限位槽的深度小于或等于所述下部固定杆的半径。
在一实施例中，所述下部固定杆包括：板体和多个限位凸起，所述多个限位凸起设置在所述板体上，所述多个限位凸起中每两个相邻的限位凸起之间形成一个限位槽。
在一实施例中，每个所述限位凸起为半圆柱体状。
在一实施例中，所述下部固定杆的每个所述限位槽中均开设有溢流孔。
在一实施例中，所述限位柱的数量在1-300的数值范围内。
在一实施例中，所述第一固定板和所述第二固定板上均设置有对流孔。
在一实施例中，所述第一固定板和所述第二固定板上均设置有工具卡槽，以方便提取所述承载装置。
在一实施例中，所述第一上部固定杆的形状和所述第二上部固定杆的形状均为圆柱体状。
本申请提供的硅片的承载装置通过设置限位柱的主体是圆柱状，且端头是半球状，可以避免划伤硅片，提高了产品良率。
附图说明
图1为一实施例提供的硅片的承载装置的结构俯视图；
图2为图1中的A处放大图；
图3为另一实施例提供的硅片的承载装置的结构俯视图；
图4为一实施例提供的硅片的承载装置的立体图；
图5为一实施例提供的下部固定杆的正视图；
图6为图5所示的下部固定杆的俯视图；
图7为另一实施例提供的下部固定杆的正视图；
图8为图7所示的下部固定杆的俯视图；
图9为图5所示的下部固定杆设置有溢流孔的俯视图；
图10为一实施例提供的第一固定板的侧视图；
图11为另一实施例提供的硅片的承载装置的结构俯视图。
附图标记说明：
1a-第一固定板；1b-第二固定板；11-工具卡槽；2-上部固定杆；2a-第一上部固定杆；2b-第二上部固定杆；21-限位柱；3-下部固定杆；31-限位槽；32-限位凸起；33-溢流孔；34-板体；4-对流孔；5-压杆。
具体实施方式
下面描述本申请的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，仅用于解释本申请，而不能解释为对申请的限制。
图1为一实施例提供的硅片的承载装置的结构俯视图，图2为图1中的A处放大图。
如图1所示，本实施例提供了一种硅片的承载装置，该硅片的承载装置包括一对固定板，用作支撑结构。一对固定板包括第一固定板1a和第二固定板1b。该硅片的承载装置还包括上部固定杆2和下部固定杆3。上部固定杆2和下部固定杆3均可以是成对的设置，上部固定杆2和下部固定杆3的形状均可以是圆柱体状。
同时参照图1和图2，其中，每个上部固定杆2的第一端与第一固定板1a固定连接，每个上部固定杆2的第二端与第二固定板1b固定连接；每个上部固定杆2上设置有多个用于对硅片的第一端进行限位的限位柱21；限位柱21包括圆柱状的主体和半球状的端头。每个下部固定杆3的第一端与第一固定板1a固定连接，每个下部固定杆3的第二端与第二固定板1b固定连接。限位柱21的数量是多个，本实施例中，根据承载装置的整体尺寸，可以设计限位柱21的数量是1-300数值范围内的数量。
在对硅片进行清洗时，硅片的第二端放置在下部固定杆3上。在一实施例中，每个下部固定杆3上均设置有多个用于对硅片的第二端进行限位的限位槽31，如此，可将硅片的第二端放置在限位槽31中，再将硅片的第一端放置在两个相邻的限位柱21之间。由于限位柱21的主体的形状是圆柱状，且端头的形状是半球状，避免了对硅片的划伤，提高了产品良率。
限位槽31的结构有多种形式。一种实现方式是，下部固定杆3包括横板和竖直固定在横板上的多个卡板，多个卡板中每两个相邻卡板之间形成一个限位槽。
参照图2，作为一种实现方式，可以通过设置多个限位凸起32来形成上述限位槽31。在一实施例中，限位槽31是在圆柱体状的下部固定杆3上进行开槽，形成多个限位凸起32和多个限位槽31。限位槽31的长度小于或等于下部固定杆3的直径，限位槽31的深度小于或等于下部固定杆3的半径，限位槽31的深度最低为5mm。
在一实施例中，下部固定杆3包括板体和多个限位凸起32，多个限位凸起32设置在板体上，多个限位凸起32中每两个相邻限位凸起32之间形成一个限位槽31。
为了进一步避免硅片被划伤，在一实施例中，设置上述限位凸起32为半圆柱状，可以理解的是，限位凸起32也可以是其他形状，只要在其上设置倒圆角，即可以避免硅片的划伤。
在上述实施例的基础上，本实施例提供的硅片的承载装置中，板体的每个限位槽31中开设有溢流孔33。溢流孔33的设置能够增强液体或气体的流动， 减少硅片在清洗、制绒或干燥出现死区，而导致硅片洁净度不良的现象。同时工艺步骤完成后，提取承载装置可以避免限位槽31积液，加速溶液的排除。而且，当硅片随着该承载装置放入清洗溶液中时，溶液通过溢流孔33产生气泡，使得溶液中空气流通到放置硅片的限位槽31处，硅片在限位槽31中左右摆动，与相关技术中硅片为静止状态相比，避免了产生清洗工装(或清洗花篮)痕迹的现象。
继续参照图1，在一实施例中，第一固定板1a和第二固定板1b上均设置有对流孔4，以加强液体、气体的流动，提高溶液或气体的均匀性，有利于提高清洗、制绒或干燥效果。
在一实施例中，第一固定板1a和第二固定板1b上设置有工具卡槽11，工具卡槽11分别设置在第一固定板1a的上端和第二固定板1b的上端，以方便提取该清洗工装。
图3为本实施例提供的另一种硅片的承载装置的结构俯视图，图4为图3所示的硅片的承载装置的立体图，图4中仅示出第一固定板1a、第二固定板1b、第一上部固定杆2a、第二上部固定杆2b以及下部固定杆3，未示出图3中限位柱21等其他结构。请参见图3和图4，本实施例提供的硅片的承载装置包括：相对设置的第一固定板1a和第二固定板1b；相对设置的第一上部固定杆2a和第二上部固定杆2b，第一上部固定杆2a的第一端与第一固定板1a固定连接，第一上部固定杆2a的第二端与第二固定板1b固定连接；第二上部固定杆2b的第一端与第一固定板1a固定连接，第二上部固定杆2b的第二端与第二固定板1b固定连接；第一上部固定杆2a和第二上部固定杆2b上均设置有多个限位柱21，且每个限位柱21包括圆柱状的主体和半球状的端头；下部固定杆3(图1中以2个下部固定杆3为例)，下部固定杆3设置于第一上部固定杆2a和第二上部固定杆2b的下方，下部固定杆3的第一端与第一固定板1a固定连接，下部固定杆3的第二端与第二固定板1b固定连接。
在一实施例中，硅片的两个侧边分别从第一上部固定杆2a和第二上部固定杆2b的每两个相邻的限位柱21插入，且硅片的底边由下部固定杆3承接。
在一实施例中，第一上部固定杆2a和第二上部固定杆2b平行设置，下部 固定杆3与第一上部固定杆2a和第二上部固定杆2b平行设置且位于第一上部固定杆2a和第二上部固定杆2b的下方。
在一实施例中，第一固定板1a和第二固定板1b的形状可为任意形状，只要可支撑第一上部固定杆2a、第二上部固定杆2b以及下部固定杆3即可。如第一固定板1a和第二固定板1b的形状可均为长方体或圆柱体等形状。
在一实施例中，第一上部固定杆2a和第二上部固定杆2b上设置的限位柱21的个数相同且是一一对应排列的。
在一实施例中，第一上部固定杆2a和第二上部固定杆2b的结构完全相同，区别仅在于第一上部固定杆2a上具有限位柱21的一侧的朝向与第二上部固定杆2b上具有限位柱21的一侧的朝向不同。
在一实施例中，第一上部固定杆2a的个数可为一个或多个，第二上部固定杆2b的个数可为一个或多个。
在一实施例中，第一上部固定杆2a和第二上部固定杆2b的个数相同。如第一上部固定杆2a包括固定于同一侧的两个第一上部固定杆2a，两个第一上部固定杆2a沿竖直方向排列，第二上部固定杆2b包括固定于同一侧的两个第二上部固定杆2b，两个第二上部固定杆2b沿竖直方向排列，进而通过两个第一上部固定杆2a固定硅片的第一侧，通过两个第二上部固定杆2b固定硅片的第二侧，以更加稳定地固定硅片。
在一实施例中，两个第一上部固定杆2a的高度可分别一一对应地与两个第二上部固定杆2b的高度相同。
在一实施例中，下部固定杆3的个数可为一个或多个，以通过一个或多个下部固定杆3承接硅片的底边。
在对硅片进行承载时，硅片的第一侧边放置在第一上部固定杆2a上的两个相邻限位柱21之间，与第一侧边相对的硅片的第二侧边放置在第二上部固定杆2b上的两个相邻限位柱21之间，进而通过第一上部固定杆2a和第二上部固定杆2b固定硅片的第一侧边和第二侧边，与第一侧边和第二侧边均相邻的硅片的底边放置在下部固定杆3上，进而通过下部固定杆3承接硅片的底边，由此，实现对硅片的承载。
由于限位柱21的主体的形状是圆柱状，且端头的形状是半球状，因此避免了承载装置对硅片的划伤，提高了产品良率。
在一实施例中，限位柱21的数量可根据承载装置的整体尺寸进行设置，限位柱21的数量决定所承载的硅片的数量。在一实施例中，限位柱21的数量在1-300的数值范围内。
在一实施例中，下部固定杆3上设置有多个限位槽31。硅片的底边放置于限位槽31内。
在一实施例中，每个限位槽31的深度大于或等于5mm，以避免硅片从限位槽31中脱落。
在一实施例中，每个限位槽31的宽度大于硅片的厚度。
在一实施例中，每个限位槽31的宽度在硅片的厚度的3倍-5倍范围内。
限位槽31的实现方式有很多，下面仅举例说明。
请参见图5和图6，图5为本实施例提供的一种下部固定杆的正视图，图6为图5所示的下部固定杆的俯视图。在一实施例中，下部固定杆3的形状为圆柱体状，每个限位槽31是通过在下部固定杆31上进行开槽形成的，两个相邻的限位槽31之间形成一个限位凸起32。
在一实施例中，每个限位槽31的长度小于或等于下部固定杆3的直径，每个限位槽31的深度小于或等于下部固定杆3的半径。
请参见图7和图8，图7为本实施例提供的另一种下部固定杆的正视图，图8为图7所示的下部固定杆的俯视图。在一实施例中，下部固定杆3包括板体34和多个限位凸起32，多个限位凸起32设置在板体34上，多个限位凸起32中每两个相邻的限位凸起32之间形成一个限位槽31。
在一实施例中，限位凸起32的形状为半圆柱体状。
在一实施例中，下部固定杆3的每个限位槽31中开设有溢流孔33，如在图5所示的下部固定3的每个限位槽31中开设有溢流孔33，俯视图如图9所示。溢流孔33的设置能够增强液体或气体的流动，减少硅片在清洗、制绒或干燥出现死区，而导致硅片洁净度不良的现象。同时工艺步骤完成后，提取承载装置可以避免限位槽31积液，加速溶液的排除。而且，当硅片随着该承载装置放入 清洗溶液中时，溶液通过溢流孔33产生气泡，使得溶液中空气流通到放置硅片的限位槽31处，硅片在限位槽31中左右摆动，与相关技术中硅片为静止状态相比，避免了产生清洗痕迹的现象。
请参见图10，图10为本实施例提供的一种第一固定板的侧视图。第二固定板的侧视图与第一固定板的侧视图相同。在一实施例中，第一固定板1a和第二固定板1b上均设置有对流孔4。
在一实施例中，第一固定板1a和第二固定板1b上均设置有多个对流孔4。
在一实施例中，对流孔4的形状和位置可任意设置。如对流孔4的横截面可为圆形，正方形或三角形等形状。
在一实施例中，第一固定板1a和第二固定板上1b均设置有工具卡槽，以便于提取承载装置。
在一实施例中，工具卡槽可分别设置于第一固定板1a的顶部和第二固定板2a的顶部，或者，分别设置于第一固定板1a中与第一上部固定杆2a的第一端相连的侧面相对的侧面和第二固定板1b中与第一上部固定杆2a的第二端相连的侧面相对的侧面上。
在一实施例中，第一固定板1a上的工具卡槽的高度与第二固定板1b上的工具卡槽的高度一致。
在一实施例中，第一上部固定杆2a的形状和第二上部固定杆2b的形状均为圆柱体状。
请参见图11，图11为本实施例提供的另一种硅片的承载装置的结构俯视图。在一实施例中，为了更好的地固定硅片，承载装置还可包括压杆5，压杆5的第一端与第一固定板1a固定连接，压杆5的第二端与第二固定板1b固定连接，压板5设置为固定与硅片的底边相对的硅片的顶边。
在一实施例中，压杆5上设置有多个限位槽31，硅片的第四侧放置于压杆5的限位槽31内。
以上依据图式所示的实施例说明了本申请的构造、特征及作用效果，以上所述仅为本申请的实施例。

Claims (15)

  1. 一种硅片的承载装置，包括：
    相对设置的第一固定板和第二固定板；
    相对设置的第一上部固定杆和第二上部固定杆；所述第一上部固定杆的第一端与所述第一固定板固定连接，所述第一上部固定杆的第二端与所述第二固定板固定连接；所述第二上部固定杆的第一端与所述第一固定板固定连接，所述第二上部固定杆的第二端与所述第二固定板固定连接；所述第一上部固定杆和所述第二上部固定杆上均设置有多个限位柱，且每个所述限位柱包括圆柱状的主体和半球状的端头；
    下部固定杆，所述下部固定杆设置于所述第一上部固定杆和所述第二上部固定杆的下方，所述下部固定杆的第一端与所述第一固定板固定连接，所述下部固定杆的第二端与所述第二固定板固定连接。
  2. 根据权利要求1所述的硅片的承载装置，其中，所述第一上部固定杆和所述第二上部固定杆上设置的限位柱的个数相同且是一一对应排列的。
  3. 根据权利要求1或2所述的硅片的承载装置，其中，所述第一上部固定杆包括固定于同一侧的两个第一上部固定杆，所述两个第一上部固定杆沿竖直方向排列，设置为固定所述硅片的第一侧边；所述第二上部固定杆包括固定于同一侧的两个第二上部固定杆，所述两个第二上部固定杆沿竖直方向排列，设置为固定所述硅片的第二侧边；且所述两个第一上部固定杆的高度分别一一对应地与所述两个第二上部固定杆的高度相同。
  4. 根据权利要求1、2或3所述的硅片的承载装置，其中，所述下部固定杆上设置有多个限位槽。
  5. 根据权利要求4所述的硅片的承载装置，其中，每个所述限位槽的宽度大于所述硅片的厚度。
  6. 根据权利要求5所述的硅片的承载装置，其中，每个所述限位槽的宽度在所述硅片的厚度的3倍-5倍范围内。
  7. 根据权利要求4、5或6所述的硅片的承载装置，其中，所述下部固定杆的形状为圆柱体状，每个所述限位槽是通过在所述下部固定杆上进行开槽形成的。
  8. 根据权利要求7所述的硅片的承载装置，其中，每个所述限位槽的长度小于或等于所述下部固定杆的直径，每个所述限位槽的深度小于或等于所述下部固定杆的半径。
  9. 根据权利要求4、5或6所述的硅片的承载装置，其中，所述下部固定杆包括：板体和多个限位凸起，所述多个限位凸起设置在所述板体上，所述多个限位凸起中每两个相邻的限位凸起之间形成一个限位槽。
  10. 根据权利要求9所述的硅片的承载装置，其中，每个所述限位凸起为半圆柱体状。
  11. 根据权利要求1-10任一项所述的硅片的承载装置，其中，所述下部固定杆的每个所述限位槽中均开设有溢流孔。
  12. 根据权利要求1-11任一项所述的硅片的承载装置，其中，所述限位柱的数量在1-300的数值范围内。
  13. 根据权利要求1-12任一项所述的硅片的承载装置，其中，所述第一固定板和所述第二固定板上均设置有对流孔。
  14. 根据权利要求1-13任一项所述的硅片的承载装置，其中，所述第一固定板和所述第二固定板上均设置有工具卡槽，以方便提取所述承载装置。
  15. 根据权利要求1-14任一项所述的硅片的承载装置，其中，所述第一上部固定杆的形状和所述第二上部固定杆的形状均为圆柱体状。
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