WO2018199329A1 - 接着剤組成物、及び接続体の製造方法 - Google Patents

接着剤組成物、及び接続体の製造方法 Download PDF

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Publication number
WO2018199329A1
WO2018199329A1 PCT/JP2018/017317 JP2018017317W WO2018199329A1 WO 2018199329 A1 WO2018199329 A1 WO 2018199329A1 JP 2018017317 W JP2018017317 W JP 2018017317W WO 2018199329 A1 WO2018199329 A1 WO 2018199329A1
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WIPO (PCT)
Prior art keywords
substrate
conductive particles
circuit member
circuit
metal layer
Prior art date
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PCT/JP2018/017317
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English (en)
French (fr)
Japanese (ja)
Inventor
研吾 篠原
泰典 川端
松田　和也
光晴 松沢
由祐 飯島
Original Assignee
日立化成株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立化成株式会社 filed Critical 日立化成株式会社
Priority to CN201880027673.2A priority Critical patent/CN110546222A/zh
Priority to JP2019514686A priority patent/JP7287275B2/ja
Priority to CN202210094165.4A priority patent/CN114479712A/zh
Priority to KR1020197034355A priority patent/KR102573777B1/ko
Publication of WO2018199329A1 publication Critical patent/WO2018199329A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member

Definitions

  • the present invention relates to an adhesive composition and a method for producing a connection body.
  • the electrode of the flexible substrate or the glass substrate for example, a transparent electrode formed of a metal oxide or the like is used.
  • a circuit member such as an FPC
  • a circuit member having an electrode such as a metal oxide
  • it tends to be difficult to ensure a sufficient electrical connection.
  • the main object of the present invention is to obtain a more reliable electrical connection when connecting a circuit member having a flexible substrate or a glass substrate with an adhesive containing conductive particles.
  • One aspect of the present invention includes an adhesive component and conductive particles, the conductive particles include plastic particles and a metal layer that covers the plastic particles, and a plurality of protrusions on the surface of the conductive particles.
  • the height of the plurality of protrusions is 85 to 1200 nm on average.
  • Another aspect of the present invention is a first circuit member having a first substrate and a first connection terminal provided on the first substrate, and is disposed to face the first circuit member.
  • a circuit connection material is arranged between the second substrate and the second circuit member having the second connection terminal provided on the second substrate to produce a laminate, and the laminate is heated and heated.
  • the step of electrically connecting the first circuit member and the second circuit member to each other, the circuit connecting material contains an adhesive component and conductive particles, and the conductive particles are made of plastic.
  • a metal layer covering the plastic particles, and a plurality of protrusions are formed on the surface of the conductive particles, and the average height of the plurality of protrusions is 85 to 1200 nm. It is a manufacturing method.
  • the ratio of the area of the protrusions to the surface area of the conductive particles may be 8 to 60%.
  • the conductive particles may have a layer formed of Pd on the outermost surface of the conductive particles as a metal layer.
  • the thickness of the layer formed of Pd may be 2 to 200 nm.
  • the above-mentioned adhesive composition is provided on the first substrate and the first circuit member having the first connection terminal provided on the first substrate, the second substrate and the second substrate.
  • the second circuit member having the formed second connection terminal may be used to electrically connect to each other.
  • the first substrate is an IC chip or a flexible substrate
  • the second substrate is a flexible substrate containing at least one thermoplastic resin selected from the group consisting of polyimide, polyethylene terephthalate, polycarbonate, and polyethylene naphthalate. It may be.
  • the first substrate may be an IC chip or a flexible substrate
  • the second substrate may be a glass substrate or a composite substrate having a glass substrate and an insulating film provided on the glass substrate.
  • the first substrate is an IC chip or a flexible substrate
  • the second substrate is at least one thermoplastic selected from the group consisting of polyimide, polyethylene terephthalate, polycarbonate, and polyethylene naphthalate. It may be a flexible substrate containing a resin.
  • the first substrate may be an IC chip or a flexible substrate
  • the second substrate may be a glass substrate or a composite substrate having a glass substrate and an insulating film provided on the glass substrate.
  • the adhesive composition according to one embodiment is an adhesive film formed in a film shape.
  • the adhesive composition may be in a state other than a film (for example, a paste).
  • FIG. 1 is a cross-sectional view schematically showing a film-like adhesive composition (adhesive film) according to an embodiment.
  • the adhesive film 1 includes an adhesive component (insulating adhesive) 2 and conductive particles 3 dispersed in the adhesive component 2 in one embodiment.
  • the thickness of the adhesive film 1 may be, for example, 10 to 50 ⁇ m.
  • the adhesive component has an insulating property and contains a curable component that is cured by heat or light.
  • the adhesive component is defined as a solid content other than the conductive particles in the adhesive composition.
  • the curable component may contain a radical polymerizable substance and a free radical generator, may contain a thermosetting resin, and may contain a radical polymerizable substance, a free radical generator and a thermosetting resin.
  • the radical polymerizable substance is a substance having a functional group that is polymerized by radicals, and examples thereof include acrylate, methacrylate, and maleimide compounds.
  • the content of the radical polymerizable substance may be, for example, 50 to 80% by mass based on the total amount of the adhesive component.
  • acrylate and methacrylate examples include urethane acrylate, urethane methacrylate, methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, dimethylol tricyclodecane diacrylate, Trimethylolpropane triacrylate, tetramethylolmethane tetraacrylate, 2-hydroxy-1,3-diaacryloxypropane, 2,2-bis [4- (acryloxymethoxy) phenyl] propane, 2,2-bis [4- (Acryloxypolyethoxy) phenyl] propane, dicyclopentenyl acrylate, tricyclodecanyl acrylate, bis Acryloxyethyl) isocyanurate, .epsilon.-caprolactone-modified tris (acryloyloxyethyl) isocyanur
  • a urethane acrylate or urethane methacrylate and a radically polymerizable substance having a Tg of 100 ° C. or more alone, cross-linked with an organic peroxide may be used in combination.
  • a radically polymerizable substance may have a dicyclopentenyl group, a tricyclodecanyl group and / or a triazine ring, and preferably has a tricyclodecanyl group or a triazine ring.
  • the radical polymerizable substance may be at least one radical polymerizable substance having a viscosity at 25 ° C. of 100,000 to 1,000,000 mPa ⁇ s, and preferably at least one radical polymerizable substance having a viscosity of 100,000 to 500,000 mPa ⁇ s. It may be.
  • the viscosity of the radical polymerizable substance can be measured using a commercially available E-type viscometer.
  • the free radical generator is a compound that decomposes by heating or light to generate free radicals, such as a peroxide compound or an azo compound.
  • the free radical generator is appropriately selected depending on the intended connection temperature, connection time, pot life, and the like.
  • the free radical generator may be at least one selected from, for example, benzoyl peroxide, diacyl peroxide, peroxydicarbonate, peroxyester, peroxyketal, dialkyl peroxide, and hydroperoxide. From the viewpoint of high reactivity and pot life, the free radical generator is preferably an organic peroxide having a half-life of 10 hours at a temperature of 40 ° C or higher and a half-life of 1 minute at a temperature of 180 ° C or lower. is there.
  • the free radical generator may be used in combination with a decomposition accelerator, an inhibitor and the like.
  • the content of the free radical generator may be, for example, 0.05 to 15% by mass based on the total amount of adhesive components.
  • the adhesive component may further contain a polymerization inhibitor.
  • the polymerization inhibitor may be hydroquinone, methyl ether hydroquinone, or the like.
  • the content of the polymerization inhibitor may be 0.05 to 5% by mass based on the total amount of the adhesive component.
  • Thermosetting resins are, for example, epoxy resins, cyanate ester resins, maleimide resins, allyl nadiimide resins, phenol resins, urea resins, melamine resins, alkyd resins, acrylic resins, unsaturated polyester resins, diallyl phthalate resins, silicone resins, Resorcinol formaldehyde resin, xylene resin, furan resin, polyurethane resin, ketone resin, triallyl cyanurate resin, polyisocyanate resin, resin containing tris (2-hydroxyethyl) isocyanurate, resin containing triallyl trimellitate And thermosetting resins synthesized from cyclopentadiene, thermosetting resins by trimerization of aromatic dicyanamide, and the like. These thermosetting resins are used alone or in combination of two or more. The content of the thermosetting resin may be, for example, 20 to 50% by mass based on the total amount of the adhesive component.
  • the adhesive component may further contain a curing agent.
  • the curing agent may be melamine and derivatives thereof, hydrazide-based curing agent, boron trifluoride-amine complex, sulfonium salt, amine imide, diaminomaleonitrile, polyamine salt, dicyandiamide, etc., or modified products thereof. Or in combination of two or more.
  • the curing agent may be a polyaddition type curing agent such as polyamines, polymercaptans, polyphenols, and acid anhydrides, or a polyaddition type curing agent and a catalyst type curing agent may be used in combination. .
  • the content of the curing agent may be 0.5 to 15% by mass based on the total amount of the adhesive component.
  • these hardeners are coated with a polymer material such as polyurethane or polyester, or a metal thin film such as Ni or Cu, and an inorganic material such as calcium silicate, the pot life can be extended. preferable.
  • the adhesive component may further contain a filler such as silicone particles, a softener, an accelerator, an anti-aging agent, a colorant, a flame retardant, a thixotropic agent, a coupling agent and the like.
  • a filler such as silicone particles, a softener, an accelerator, an anti-aging agent, a colorant, a flame retardant, a thixotropic agent, a coupling agent and the like.
  • the adhesive component may contain a resin having a functional group such as a hydroxyl group in order to improve the film formability.
  • resins are polystyrene, polyethylene, polyvinyl butyral, polyvinyl formal, polyimide, polyamide, polyester, polyvinyl chloride, polyphenylene oxide, urea resin, melamine resin, phenol resin, xylene resin, epoxy resin, polyisocyanate resin, phenoxy resin. , Polyimide resin, polyester urethane resin, polyurethane resin, etc.
  • the adhesive component may contain those resins modified with radically polymerizable functional groups, or contain a mixture of these resins and a styrene resin or acrylic resin for melt viscosity adjustment, etc. May be.
  • the adhesive component may contain rubber to enhance film formability.
  • FIG. 2 is a cross-sectional view schematically showing an embodiment of the conductive particles 3 included in the adhesive film 1.
  • the conductive particle 3 ⁇ / b> A includes a plastic particle 31 and a metal layer 32 ⁇ / b> A that covers the plastic particle 31 in one embodiment.
  • the plastic particle 31 may be used as long as the function as a circuit connecting material (function of electrically connecting circuit members) is maintained. A part of the surface of the particle 31 may be exposed without being covered with the metal layer 32A.
  • the plastic particle 31 may be, for example, a particle including a polymer including, as a monomer unit, at least one monomer selected from styrene and divinylbenzene.
  • the polymer may further contain (meth) acrylate as a monomer unit.
  • the diameter of the plastic particles 31 is preferably 1 ⁇ m or more on average and may be 40 ⁇ m or less. From the viewpoint of high-density mounting, the diameter of the plastic particles 31 is more preferably 1 ⁇ m or more and 30 ⁇ m or less on average. From the viewpoint of maintaining the connection state more stably when there are variations in the surface irregularities of the electrodes, the diameter of the plastic particles 31 is more preferably 2 ⁇ m or more and 20 ⁇ m or less on average.
  • the metal layer 32A is composed of, for example, a single metal layer.
  • the metal layer 32A is made of, for example, Ni, Cu, NiB, Ag, or Ru.
  • the thickness of the metal layer 32A may be, for example, 50 nm or more and 300 nm or less.
  • the thickness of the metal layer 32 ⁇ / b> A means the thickness in the portion of the metal layer where the protrusions described later are not formed.
  • the thickness of the metal layer 32A can be measured with an electron microscope.
  • the metal layer 32B is a metal layer which consists of two layers, the 1st metal layer 32a and the 2nd metal layer 32b, Good. That is, the conductive particle 3B according to another embodiment includes a plastic particle 31, a first metal layer 32a that covers the plastic particle 31, and a second metal layer 32b that covers the first metal layer 32a. It has.
  • the first metal layer 32a is made of, for example, Ni.
  • the second metal layer 32b may be formed of, for example, Au or Pd, and is preferably formed of Pd from the viewpoint of further improving the reliability. That is, the conductive particle 3B may have a layer formed of Au or Pd on the outermost surface of the conductive particle 3B as a metal layer. From the viewpoint of further improving the reliability, the conductive particle 3B is preferably made of Pd. It has a layer that is formed.
  • the thickness of the first metal layer 32a may be, for example, 50 nm or more and 300 nm or less.
  • the thickness of the second metal layer 32b may be, for example, 2 nm or more, 5 nm or more, or 10 nm or more, 200 nm or less, 100 nm or less, or 50 nm or less, 2 to 200 nm, 2 to 100 nm, 2 nm, or 2 nm. It may be ⁇ 50 nm, 5 ⁇ 200 nm, 5 ⁇ 100 nm, 5 ⁇ 50 nm, 10 ⁇ 200 nm, 10 ⁇ 100 nm, or 10 ⁇ 50 nm.
  • the thickness of the 1st metal layer 32a and the 2nd metal layer 32b means the thickness in the part of the metal layer in which the projection part mentioned later is not formed, respectively.
  • the thickness of the first metal layer 32a and the second metal layer 32b can be measured with an electron microscope.
  • a plurality of protrusions 33 are formed on the surface of the conductive particles 3.
  • the protrusion 33A is composed of a single metal layer 32A.
  • the protrusion 33B is composed of a metal layer 32B composed of two layers, a first metal layer 32a and a second metal layer 32b.
  • the height of the protrusion 33 is 85 nm or more, 90 nm or more, or 100 nm or more from the viewpoint of improving the reliability of electrical connection, 1200 nm or less, 1000 nm or less, 600 nm or less, 500 nm or less, 400 nm or less, 300 nm or less, Or it is 200 nm or less.
  • the height of the protrusion 33 is 85 to 1200 nm, 85 to 1000 nm, 85 to 600 nm, 85 to 500 nm, 85 to 400 nm, 85 to 300 nm, 85 to 200 nm, 90 to 1200 nm, 90 to 1000 nm, 90 -600 nm, 90-500 nm, 90-400 nm, 90-300 nm, 90-200 nm, 100-1200 nm, 100-1000 nm, 100-600 nm, 100-500 nm, 100-400 nm, 100-300 nm, or 100-200 nm Good.
  • the height of the protrusion 33 is determined by analyzing a two-dimensional image including a projected image of conductive particles.
  • the analysis of the two-dimensional image can be performed according to the method described in JP-A-2016-61722.
  • the particle edge substantially corresponds to the outer periphery including the irregularities derived from the protrusions of the two-dimensional projection image of the conductive particles.
  • a luminance frequency distribution obtained from a two-dimensional image generally shows a local minimum value reflecting a particle edge portion.
  • the two-dimensional image is binarized using the luminance corresponding to the minimum value as the first threshold value to generate a binarized image. Edges formed in the obtained binarized image are detected as particle edges. Based on the particle edges, the center coordinates of the conductive particles on the two-dimensional image are calculated.
  • a circle to be fitted to the particle edge is obtained by the method of least squares, and the center of the circle is set as the center coordinate of the conductive particle.
  • the area ratio of the protrusions 33 (area ratio of the protrusions 33) to the entire projected image of the surface of the conductive particles 3 is preferably 8% or more and 9%. Or more, 20% or more, preferably 60% or less or 50% or less, preferably 8 to 60%, 8 to 50%, 9 to 60%, 9 to 50%, 20 to 60%, Or 20 to 50%.
  • the area ratio of the protrusions can also be determined by analyzing a two-dimensional image of conductive particles according to the method described in JP-A-2016-61722.
  • the area ratio of the protrusions is obtained by, for example, calculating a second threshold corresponding to the boundary between the protrusion and the other part from the luminance frequency distribution in the region inside the particle edge, and the obtained second threshold And binarizing the area inside the particle edge to generate a binarized image, and in the obtained binarized image, the ratio of the area of the area corresponding to the protrusion to the area inside the particle edge And a step of calculating the area ratio of the protrusions.
  • the conductive particles 3 having protrusions as described above can be obtained, for example, by forming the metal layers 32A and 32B on the surface of the plastic particles 31 by metal plating.
  • the protruding portion 33 can be formed by changing the plating conditions and changing the thickness of the metal layers 32A and 32B.
  • the protrusion 33 can be formed by gradually increasing the concentration of the plating solution in the process of metal plating.
  • a metal layer having a knurled protrusion can be formed (Mochizuki et al., Surface Technology, Vol. 48, No. 4, pages 429 to 432, 1997).
  • glycine is used as a complexing agent that contributes to the stability of the plating bath, a metal layer having a flat surface is formed, whereas when tartaric acid or DL-malic acid is used as the complexing agent, a hump is formed.
  • Sugawara et al. Amorphous Plating, Vol. 36, pp.
  • the metal layers 32A and 32B having the protrusions 33 having a desired height and area ratio can be formed.
  • the conductive particles 3B shown in FIG. 2B for example, after forming the first metal layer 32a having the protrusions by the above method, the Au or Pd layer is formed by displacement plating. Thus, the second metal layer 32b can be obtained.
  • the content of the conductive particles 3 contained in the adhesive film 1 is determined according to the definition of the electrode to be connected.
  • the content of the conductive particles 3 may be, for example, 1 part by volume or more and 50 parts by volume or less with respect to 100 parts by volume of the adhesive component, which is preferable from the viewpoint of insulation and manufacturing cost. Is 30 parts by volume or less.
  • the adhesive composition may be a multilayer film (multilayer adhesive film).
  • the multilayer adhesive film may have a two-layer structure including, for example, a layer containing conductive particles and a layer not containing conductive particles, and is provided on both sides of the layer containing conductive particles. A three-layer configuration including a layer not including conductive particles may be used.
  • the multilayer adhesive film may include a plurality of layers including conductive particles.
  • the multilayer adhesive film may include an adhesive layer exhibiting high adhesiveness to the circuit member to be connected in consideration of adhesiveness with the circuit member. When these multilayer adhesive films are used, the conductive particles can be efficiently captured on the connection electrodes, which is advantageous for connecting narrow pitch circuit members.
  • the adhesive composition (adhesive film) described above is preferably used as a material (circuit connection material) for connecting circuit members to each other, and an anisotropic conductive adhesive composition for connecting circuit members to each other. It is particularly preferably used as (anisotropic conductive adhesive film).
  • Drawing 3 is a sectional view showing typically the manufacturing method of the connecting object concerning one embodiment.
  • the 1st circuit member 4, the 2nd circuit member 5, and the adhesive film 1 are prepared.
  • the first circuit member 4 includes a first substrate 6 and a first connection terminal 7 provided on one surface 6 a of the first substrate 6.
  • the second circuit member 5 includes a second substrate 8 and a second connection terminal 9 provided on one surface 8 a of the second substrate 8.
  • first circuit member 4 and the second circuit member 5 are arranged so that the first connection terminal 7 and the second connection terminal 9 face each other, and the first circuit member 4 and the second circuit member 5 are arranged.
  • the adhesive film 1 is disposed between the circuit member 5 and a laminate.
  • the adhesive film 1 is cured while pressurizing the entire laminate in the direction indicated by the arrow in FIG.
  • the pressure at the time of pressurization may be, for example, 1 to 10 MPa per total connection area.
  • the method of curing the adhesive film 1 may be a method by heating, or a method of using light irradiation in combination with heating. Heating may be performed at 100 to 170 ° C., for example. Pressurization and heating (light irradiation as necessary) may be performed, for example, for 1 to 160 seconds. Thereby, the 1st circuit member 4 and the 2nd circuit member 5 are crimped
  • the adhesive film 1 is disposed between the first circuit member 4 and the second circuit member 5, but as another embodiment, instead of the adhesive film, a paste adhesive composition
  • the object may be applied on the first circuit member 4 or the second circuit member 5, or both.
  • the connection body 10 includes the first substrate 6 and the first connection terminal 7 provided on the first substrate 6.
  • the second circuit member 5 having the first circuit member 4, the second substrate 8 and the second connection terminal 9 provided on the second substrate 8, the first circuit member 4 and the second circuit member 5.
  • the connection part which is provided between the circuit member 5 and electrically connects the first circuit member 4 (first connection terminal 7) and the second circuit member 5 (second connection terminal 9) to each other.
  • the connection part 11 is comprised by the hardened
  • the first substrate 6 may be, for example, an IC chip or a flexible substrate.
  • the second substrate 8 may be, for example, a flexible substrate, a glass substrate, or a composite substrate having a glass substrate and an insulating film provided on the glass substrate.
  • the first substrate 6 may be an IC chip or a flexible substrate
  • the second substrate 8 may be a flexible substrate.
  • the first substrate 6 may be an IC chip or a flexible substrate
  • the second substrate 8 may be a glass substrate or a composite substrate.
  • the first substrate 6 may be an IC chip or a flexible substrate.
  • the above-described adhesive film 1 is used for COP (Chip-on-Plastic-substrate) connection.
  • the above-mentioned adhesive film 1 is used for FOP (Film on Plastic substrate) connection.
  • the flexible substrate includes, for example, at least one thermoplastic resin selected from the group consisting of polyimide (PI), polyethylene terephthalate (PET), polycarbonate (PC), and polyethylene naphthalate (PEN).
  • PI polyimide
  • PET polyethylene terephthalate
  • PC polycarbonate
  • PEN polyethylene naphthalate
  • the flexible substrate may further have a modified film such as a hard coat and / or a protective film formed on the surface of the organic base material for improving optical and mechanical properties.
  • a reinforcing material selected from a glass substrate and SUS or the like may be bonded to the organic substrate.
  • the thickness of the flexible substrate is preferably 10 ⁇ m or more, 200 ⁇ m or less, or 125 ⁇ m or less from the viewpoint of securing the strength as a film and the ease of bending of the substrate alone.
  • the electrodes on the flexible substrate may be easily broken or cracked by heating and pressurization for crimping the circuit members.
  • the connection of electrodes for which it is difficult to form a sufficient electrical connection it is necessary to crimp the circuit member under a condition of lower temperature or lower stress in order to suppress damage to the electrodes.
  • the circuit connection material (adhesive film) of the present embodiment can have an advantageous effect as compared with conventional materials in these respects.
  • the glass substrate may be formed of soda glass, quartz glass, or the like, and may be a substrate subjected to chemical strengthening treatment from the viewpoint of preventing damage due to external stress.
  • the composite substrate may include a glass substrate and an insulating film formed on the surface of the glass substrate and made of polyimide or a colored organic or inorganic material for decoration. It may be formed on an insulating film.
  • the first substrate 6 is an electronic component such as an active element such as a semiconductor chip, a transistor, a diode, or a thyristor, a passive element such as a capacitor, a resistor, or a coil, or a printed circuit. It may be a substrate or the like.
  • the tip of a bump or gold wire formed by plating is melted with a torch or the like to form a gold ball, and the wire is pressed onto the electrode pad, and then the wire is cut.
  • Protruding electrodes first connection terminals 7) such as wire bumps obtained in this way can be provided and used as the first circuit member 4.
  • Examples of electrode materials for forming the first connection terminal 7 and the second connection terminal 9 include Ag paste, metals such as Ni, Al, Au, Cu, Ti, and Mo, metal oxides such as ITO and IZO, and silver nanowires. And conductors such as carbon nanotubes.
  • the first connection terminal 7 and the second connection terminal 9 may be formed of the same material or different materials, but are preferably the same material.
  • a surface layer formed of an oxide, a nitride, an alloy, an organic substance, or the like may be further provided from the viewpoint of preventing disconnection.
  • Each of the first circuit member 4 and the second circuit member 5 may be provided with one first connection terminal 7 or one second connection terminal 9, but preferably a predetermined interval is formed. Many are provided.
  • the first circuit member 4 is an FPC circuit board, and the second connection terminal 9 in the second circuit member 5 ensures sufficient electrical connection. Even when it is formed of a metal oxide that tends to be difficult, a more reliable electrical connection can be obtained.
  • FIG. 4 is a cross-sectional view schematically showing a main part of the connection body 10 according to an embodiment.
  • the height of the protrusion 33 of the conductive particle 3 is within a predetermined range. Since the conductive particles 3 interposed therebetween can apply sufficient pressure to the first connection terminal 7 and the second connection terminal 9 (and the second substrate 8) by the protrusions 33, higher reliability can be achieved. For example, it is considered that the increase in connection resistance under high temperature and high humidity is unlikely to occur.
  • FIG. 5 a cross-sectional view schematically showing a main part of a conventional connection body
  • the conductive particles 23 have a relatively low protrusion 23a. Sufficient pressure cannot be applied to the first connection terminal 7 and the second connection terminal 9 (and the second substrate 8). Therefore, the conventional connection body 20 is inferior in the reliability of electrical connection.
  • Plastic particles Using tetramethylolmethane tetraacrylate, divinylbenzene, and styrene as monomers and polymerizing them by suspension polymerization using a polymerization initiator (benzoyl peroxide), plastic particles were obtained.
  • Conductive particles 1-7 A Ni layer having a flat surface was formed on the obtained plastic particles, and an Au layer having a flat surface was further formed on the Ni layer to produce conductive particles.
  • Each conductive particle was dispersed in the prepared binder resin solution at a ratio of 10 parts by volume with respect to 100 parts by volume of the binder resin.
  • silicone fine particles product name: KMP-605, manufactured by Shin-Etsu Chemical Co., Ltd.
  • KMP-605 manufactured by Shin-Etsu Chemical Co., Ltd.
  • a coating solution containing particles and silicone fine particles was obtained.
  • This coating liquid was applied to a polyethylene terephthalate (PET) film (thickness 50 ⁇ m) having a surface treated on one side using a coating apparatus.
  • the coating film was dried by hot air drying at 70 ° C. to prepare an anisotropic conductive adhesive film (thickness: 18 ⁇ m) as a circuit connecting material.
  • -Glass member The glass member which has a glass substrate, Cu film
  • -Flexible member A flexible member having a polyethylene terephthalate (PET) film (elastic modulus at 25 ° C .: 4600 MPa) and an ITO connection terminal (thickness 20 nm) formed on the PET film was prepared.
  • PET polyethylene terephthalate
  • This FPC wiring is composed of a Cu layer having a pitch of 0.3 mm (space 0.15 mm, electrode width 0.15 mm, height 18 ⁇ m), a Ni plating layer 3 ⁇ m thick formed in order on the Cu layer, and a thickness of 0 It has a connection terminal composed of a 0.03 ⁇ m Au plating layer.
  • An anisotropic conductive adhesive film was sandwiched between the flexible member and the FPC.
  • the flexible member and the FPC were connected by pressurizing the whole for 10 seconds at a pressure of 2 MPa per total connection area while heating the anisotropic conductive adhesive film to reach 160 ° C.
  • a flexible / FPC connector was obtained.
  • the glass member and FPC were connected by sandwiching an anisotropic conductive adhesive film between them to obtain a glass / FPC connector.
  • Each obtained connecting body was subjected to a reliability test of 85 ° C., 85% RH, 72 hours. About the connection body before and behind a test, the connection resistance between the circuit members which oppose was measured.
  • Tables 1 and 2 show characteristics such as the outermost surface layer, protrusion height, protrusion area ratio, and evaluation results of the obtained conductive particles.
  • SYMBOLS 1 Adhesive film, 2 ... Adhesive component, 3 ... Conductive particle, 4 ... 1st circuit member, 5 ... 2nd circuit member, 6 ... 1st board

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Combinations Of Printed Boards (AREA)
PCT/JP2018/017317 2017-04-28 2018-04-27 接着剤組成物、及び接続体の製造方法 WO2018199329A1 (ja)

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CN201880027673.2A CN110546222A (zh) 2017-04-28 2018-04-27 粘接剂组合物及连接体的制造方法
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CN202210094165.4A CN114479712A (zh) 2017-04-28 2018-04-27 粘接剂组合物及连接体的制造方法
KR1020197034355A KR102573777B1 (ko) 2017-04-28 2018-04-27 접착제 조성물 및 접속체의 제조 방법

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220089915A1 (en) * 2019-02-21 2022-03-24 3M Innovative Properties Company Uv debondable pressure sensitive adhesive composition and pressure sensitive adhesive tape

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102660389B1 (ko) * 2021-07-16 2024-04-24 엑시노 주식회사 저밀도 판상형 도전성 분말의 제조방법

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002245853A (ja) * 2001-02-16 2002-08-30 Nippon Paint Co Ltd 異方性導電接着剤および導電接続構造体
JP2011091044A (ja) * 2007-05-15 2011-05-06 Hitachi Chem Co Ltd 回路接続材料及び回路部材の接続構造
JP2013055058A (ja) * 2007-11-12 2013-03-21 Hitachi Chemical Co Ltd 回路接続材料、及び回路部材の接続構造
JP2016062879A (ja) * 2014-09-22 2016-04-25 デクセリアルズ株式会社 異方性導電材料
JP2016089153A (ja) * 2014-10-29 2016-05-23 デクセリアルズ株式会社 導電材料
JP2016119304A (ja) * 2014-12-22 2016-06-30 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP2016119302A (ja) * 2014-12-18 2016-06-30 積水化学工業株式会社 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体
JP2017069191A (ja) * 2015-09-30 2017-04-06 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2178094A4 (en) * 2007-08-02 2013-02-20 Hitachi Chemical Co Ltd SWITCHING CONNECTING MATERIAL AND CONNECTING STRUCTURE OF A SWITCHING ELEMENT AND CONNECTION METHOD OF A SWITCHING ELEMENT ON THE SWITCHING CONNECTING MATERIAL
JP2012160546A (ja) * 2011-01-31 2012-08-23 Hitachi Chem Co Ltd 回路接続用接着フィルム及び回路接続構造体
JP2014149918A (ja) * 2011-06-06 2014-08-21 Hitachi Chemical Co Ltd フィルム状回路接続材料及び回路接続構造体
JP6079425B2 (ja) * 2012-05-16 2017-02-15 日立化成株式会社 導電粒子、異方性導電接着剤フィルム及び接続構造体
KR102076066B1 (ko) * 2012-07-03 2020-02-11 세키스이가가쿠 고교가부시키가이샤 절연성 입자 부착 도전성 입자, 도전 재료 및 접속 구조체
JP5900535B2 (ja) * 2013-05-16 2016-04-06 日立化成株式会社 導電粒子、絶縁被覆導電粒子、異方導電性接着剤及び導電粒子の製造方法
JP6445833B2 (ja) * 2013-10-21 2018-12-26 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6432240B2 (ja) 2014-09-19 2018-12-05 日立化成株式会社 導電粒子形状評価装置及び導電粒子形状評価方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002245853A (ja) * 2001-02-16 2002-08-30 Nippon Paint Co Ltd 異方性導電接着剤および導電接続構造体
JP2011091044A (ja) * 2007-05-15 2011-05-06 Hitachi Chem Co Ltd 回路接続材料及び回路部材の接続構造
JP2013055058A (ja) * 2007-11-12 2013-03-21 Hitachi Chemical Co Ltd 回路接続材料、及び回路部材の接続構造
JP2016062879A (ja) * 2014-09-22 2016-04-25 デクセリアルズ株式会社 異方性導電材料
JP2016089153A (ja) * 2014-10-29 2016-05-23 デクセリアルズ株式会社 導電材料
JP2016119302A (ja) * 2014-12-18 2016-06-30 積水化学工業株式会社 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体
JP2016119304A (ja) * 2014-12-22 2016-06-30 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP2017069191A (ja) * 2015-09-30 2017-04-06 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220089915A1 (en) * 2019-02-21 2022-03-24 3M Innovative Properties Company Uv debondable pressure sensitive adhesive composition and pressure sensitive adhesive tape

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TWI834608B (zh) 2024-03-11
CN114479712A (zh) 2022-05-13
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TW201843276A (zh) 2018-12-16
KR102573777B1 (ko) 2023-08-31
KR20200002953A (ko) 2020-01-08
JPWO2018199329A1 (ja) 2020-05-14

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