JP2011091044A - 回路接続材料及び回路部材の接続構造 - Google Patents
回路接続材料及び回路部材の接続構造 Download PDFInfo
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- JP2011091044A JP2011091044A JP2010234364A JP2010234364A JP2011091044A JP 2011091044 A JP2011091044 A JP 2011091044A JP 2010234364 A JP2010234364 A JP 2010234364A JP 2010234364 A JP2010234364 A JP 2010234364A JP 2011091044 A JP2011091044 A JP 2011091044A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- C09J11/02—Non-macromolecular additives
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Abstract
【解決手段】回路電極32,42が形成された2つの回路部材30,40を、回路電極を対抗させて電気的に接続するための回路接続材料10であって、回路接続材料は、接着剤組成物11と導電粒子12とを含有し、導電粒子は、有機高分子化合物からなる核体がニッケル又はニッケル合金からなる金属層で被覆された、表面に複数の突起部14を有する導電粒子であり、核体の平均粒径が1〜4μm、金属層の厚みが65〜125nmであり、回路電極の厚みが50nm以上である回路部材を接続するために用いられる回路接続材料。
【選択図】図1
Description
まず、導電粒子12の構成について詳細に説明する。導電粒子12は、導電性を有する粒子(本体部)と、この粒子の表面上に形成された複数の突起部14とから構成されている。ここで、複数の突起部14は、導電性を有する金属で構成されている。図2は、本発明の回路接続材料に含まれる導電粒子の種々の形態を示す断面図である。
次に、接着剤組成物について詳細に説明する。接着剤組成物は、絶縁性及び接着性を有する。接着剤組成物としては、(1)エポキシ樹脂と、エポキシ樹脂の潜在性硬化剤とを含有する組成物、(2)ラジカル重合性物質と、加熱により遊離ラジカルを発生する硬化剤とを含有する組成物、又は(1)と(2)との混合組成物が好ましい。
式中、nは1〜3の整数を示す。
次に、上述した回路部材の接続構造1の製造方法について説明する。
(核体の作製)
テトラメチロールメタンテトラアクリレート、ジビニルベンゼン及びスチレンモノマーの混合比を変えて、重合開始剤としてベンゾイルパーオキサイドを用いて懸濁重合し、得られた重合体を分級することで3μmの平均粒径を有する核体を得た。
上記核体の表面に対して、無電解Niメッキ処理を施して、均一な厚み100nmのNi層(金属層)を有する導電粒子No.1を作製した。
導電粒子No.1上にAuを25nmの厚みで置換メッキすることにより、均一な厚さを有するAu層を形成し、導電粒子No.2を作製した。
上記核体の表面に対して、無電解Niメッキ処理を施す際のメッキ液の仕込量、処理温度及び時間を調整しメッキの厚みを変更することにより、上記核体の表面にNiメッキの突起部を形成した。Ni層の目標厚み40〜60nmの導電粒子No.3を作製した。
上記核体の表面に対して、無電解Niメッキ処理を施す際のメッキ液の仕込量、処理温度及び時間を調整しメッキの厚みを変更することにより、上記核体の表面にNiメッキの突起部を形成した。Ni層の目標厚み60〜80nmの導電粒子No.4を作製した。
上記核体の表面に対して、無電解Niメッキ処理を施す際のメッキ液の仕込量、処理温度及び時間を調整しメッキの厚みを変更することにより、上記核体の表面にNiメッキの突起部を形成した。Ni層の目標厚み90〜100nmの導電粒子No.5を作製した。
上記核体の表面に対して、無電解Niメッキ処理を施す際のメッキ液の仕込量、処理温度及び時間を調整しメッキの厚みを変更することにより、上記核体の表面にNiメッキの突起部を形成した。Ni層の目標厚み110〜130nmの導電粒子No.6を作製した。
上記核体の表面に対して、無電解Niメッキ処理を施す際のメッキ液の仕込量、処理温度及び時間を調整しメッキの厚みを変更することにより、上記核体の表面にNiメッキの突起部を形成した。Ni層の目標厚み130〜150nmの導電粒子No.7を作製した。
導電粒子No.5上にAuを25nmの厚みで置換メッキすることにより、複数の突起部を有するAu層を形成し、導電粒子No.8を作製した。
フェノキシ樹脂(重量平均分子量:45000、ユニオンカーバイド(株)社製、商品名「PKHC」、)50gを、トルエン/酢酸エチル=50/50(質量比)の混合溶剤に溶解して、固形分40質量%のフェノキシ樹脂溶液を調製した。
ポリカプロラクトンジオール(重量平均分子量:800)400質量部、2−ヒドロキシプロピルアクリレート131質量部、触媒としてジブチル錫ジラウレート0.5質量部及び重合禁止剤としてハイドロキノンモノメチルエーテル1.0質量部を攪拌しながら50℃に加熱して混合した。次いで、この混合液に、イソホロンジイソシアネート222質量部を滴下し、更に攪拌しながら80℃に昇温してウレタン化反応を行った。イソシアネート基の反応率が99%以上になったことを確認した後、反応温度を下げてウレタンアクリレートを得た。
(回路接続材料Aの作製)
上記フェノキシ樹脂溶液(固形分含量:50g)125g、上記ウレタンアクリレート49g、リン酸エステル型アクリレート1g及び加熱により遊離ラジカルを発生する硬化剤としてt−ヘキシルパーオキシ−2−エチルヘキサノネート5gとを混合して接着剤組成物を得た。得られた接着剤組成物100質量部に対して導電粒子No.4を2.3質量部分散させて回路接続材料を調製した。
導電粒子No.4に代えて、導電粒子No.5を3.0質量部用いた以外は回路接続材料Aと同様にして、厚み18μmのフィルム状回路接続材料Bを作製した。
導電粒子No.4に代えて、導電粒子No.6を3.6質量部用いた以外は回路接続材料Aと同様にして、厚み18μmのフィルム状回路接続材料Cを作製した。
導電粒子No.4に代えて、導電粒子No.3を1.8質量部用いた以外は回路接続材料Aと同様にして、厚み18μmのフィルム状回路接続材料Dを作製した。
導電粒子No.4に代えて、導電粒子No.7を4.0質量部用いた以外は回路接続材料Aと同様にして、厚み18μmのフィルム状回路接続材料Eを作製した。
導電粒子No.4に代えて、導電粒子No.1を3.0質量部用いた以外は回路接続材料Aと同様にして、厚み18μmのフィルム状回路接続材料Fを作製した。
導電粒子No.4に代えて、導電粒子No.2を3.0質量部用いた以外は回路接続材料Aと同様にして、厚み18μmのフィルム状回路接続材料Gを作製した。
導電粒子No.4に代えて、導電粒子No.8を3.0質量部用いた以外は回路接続材料Aと同様にして、厚み18μmのフィルム状回路接続材料Hを作製した。
(実施例1)
第1の回路部材として、ポリイミドフィルム(厚み38μm)と、SnめっきCu箔(厚み8μm)とからなる2層構造を有するフレキシブル回路板(以下、FPCという)を準備した。このFPCの回路については、ライン幅18μm及びピッチ50μmとした。
第1の回路部材として、実施例1と同様のFPCを準備した。次に、第2の回路部材として表面上にIZO回路電極(厚み50nm、表面抵抗<20Ω)を備えるガラス基板(厚み1.1mm)を準備した。この第2の回路部材の回路については、ライン幅25μm及びピッチ50μmとした。そして、実施例1と同様にして、回路接続材料Aを使用し、回路部材の接続構造を作製した。
第1の回路部材として、実施例1と同様のFPCを準備した。次に、第2の回路部材として表面上にITO(最外層、厚み50nm)/Cr(厚み200nm)の2層構成の回路電極(表面抵抗<20Ω))を備えるガラス基板(厚み1.1mm)を準備した。この第2の回路部材の回路については、ライン幅25μm及びピッチ50μmとした。そして、実施例1と同様にして、回路接続材料Aを使用し、回路部材の接続構造を作製した。
第1の回路部材として、実施例1と同様のFPCを準備した。次に、第2の回路部材として表面上にITO(最外層、厚み50nm)/Ti(厚み100nm)/Al(厚み200nm)/Ti(厚み100nm)の4層構成の回路電極(表面抵抗<20Ω))を備えるガラス基板(厚み1.1mm)を準備した。この第2の回路部材の回路については、ライン幅25μm及びピッチ50μmとした。そして、実施例1と同様にして、回路接続材料Aを使用し、回路部材の接続構造を作製した。
第1の回路部材として、実施例1と同様のFPCを準備した。次に、第2の回路部材として表面上にAl回路電極(厚み200nm、表面抵抗<5Ω)を備えるガラス基板(厚み1.1mm)を準備した。この第2の回路部材の回路については、ライン幅25μm及びピッチ50μmとした。そして、実施例1と同様にして、回路接続材料Aを使用し、回路部材の接続構造を作製した。
回路接続材料Aに代えて、回路接続材料Bを用いた以外は実施例1と同様にして、回路部材の接続構造を作製した。
回路接続材料Aに代えて、回路接続材料Bを用いた以外は実施例2と同様にして、回路部材の接続構造を作製した。
回路接続材料Aに代えて、回路接続材料Bを用いた以外は実施例3と同様にして、回路部材の接続構造を作製した。
回路接続材料Aに代えて、回路接続材料Bを用いた以外は実施例4と同様にして、回路部材の接続構造を作製した。
回路接続材料Aに代えて、回路接続材料Bを用いた以外は実施例5と同様にして、回路部材の接続構造を作製した。
回路接続材料Aに代えて、回路接続材料Cを用いた以外は実施例1と同様にして、回路部材の接続構造を作製した。
回路接続材料Aに代えて、回路接続材料Cを用いた以外は実施例2と同様にして、回路部材の接続構造を作製した。
回路接続材料Aに代えて、回路接続材料Cを用いた以外は実施例3と同様にして、回路部材の接続構造を作製した。
回路接続材料Aに代えて、回路接続材料Cを用いた以外は実施例4と同様にして、回路部材の接続構造を作製した。
回路接続材料Aに代えて、回路接続材料Cを用いた以外は実施例5と同様にして、回路部材の接続構造を作製した。
回路接続材料Aに代えて、回路接続材料Dを用いた以外は実施例1と同様にして、回路部材の接続構造を作製した。
回路接続材料Aに代えて、回路接続材料Dを用いた以外は実施例2と同様にして、回路部材の接続構造を作製した。
回路接続材料Aに代えて、回路接続材料Dを用いた以外は実施例3と同様にして、回路部材の接続構造を作製した。
回路接続材料Aに代えて、回路接続材料Dを用いた以外は実施例4と同様にして、回路部材の接続構造を作製した。
回路接続材料Aに代えて、回路接続材料Dを用いた以外は実施例5と同様にして、回路部材の接続構造を作製した。
回路接続材料Aに代えて、回路接続材料Eを用いた以外は実施例1と同様にして、回路部材の接続構造を作製した。
回路接続材料Aに代えて、回路接続材料Eを用いた以外は実施例2と同様にして、回路部材の接続構造を作製した。
回路接続材料Aに代えて、回路接続材料Eを用いた以外は実施例3と同様にして、回路部材の接続構造を作製した。
回路接続材料Aに代えて、回路接続材料Eを用いた以外は実施例4と同様にして、回路部材の接続構造を作製した。
回路接続材料Aに代えて、回路接続材料Eを用いた以外は実施例5と同様にして、回路部材の接続構造を作製した。
回路接続材料Aに代えて、回路接続材料Fを用いた以外は実施例1と同様にして、回路部材の接続構造を作製した。
回路接続材料Aに代えて、回路接続材料Fを用いた以外は実施例2と同様にして、回路部材の接続構造を作製した。
回路接続材料Aに代えて、回路接続材料Fを用いた以外は実施例3と同様にして、回路部材の接続構造を作製した。
回路接続材料Aに代えて、回路接続材料Fを用いた以外は実施例4と同様にして、回路部材の接続構造を作製した。
回路接続材料Aに代えて、回路接続材料Fを用いた以外は実施例5と同様にして、回路部材の接続構造を作製した。
回路接続材料Aに代えて、回路接続材料Gを用いた以外は実施例1と同様にして、回路部材の接続構造を作製した。
回路接続材料Aに代えて、回路接続材料Gを用いた以外は実施例2と同様にして、回路部材の接続構造を作製した。
回路接続材料Aに代えて、回路接続材料Gを用いた以外は実施例3と同様にして、回路部材の接続構造を作製した。
回路接続材料Aに代えて、回路接続材料Gを用いた以外は実施例4と同様にして、回路部材の接続構造を作製した。
回路接続材料Aに代えて、回路接続材料Gを用いた以外は実施例5と同様にして、回路部材の接続構造を作製した。
回路接続材料Aに代えて、回路接続材料Hを用いた以外は実施例1と同様にして、回路部材の接続構造を作製した。
回路接続材料Aに代えて、回路接続材料Hを用いた以外は実施例2と同様にして、回路部材の接続構造を作製した。
回路接続材料Aに代えて、回路接続材料Hを用いた以外は実施例3と同様にして、回路部材の接続構造を作製した。
回路接続材料Aに代えて、回路接続材料Hを用いた以外は実施例4と同様にして、回路部材の接続構造を作製した。
回路接続材料Aに代えて、回路接続材料Hを用いた以外は実施例5と同様にして、回路部材の接続構造を作製した。
微分干渉顕微鏡を用いて、上記回路部材の接続構造における各回路電極上に存在する導電粒子数を目視にて計数(n=38)した。その結果、実施例1〜15、比較例1〜25の回路電極上の平均導電粒子数は32〜45個の範囲内であり、回路接続材料や回路部材の違いによる導電粒子数の極端な増減は見られなかった。
上記回路部材の接続構造について、第1の回路部材(FPC)の回路電極と、第2の回路部材の回路電極との間の接続抵抗値をマルチメータ(株式会社エーディーシー社製、商品名「デジタルマルチメータ 7461A」)を用いて測定した。接続抵抗値は、初期(接続直後)と、80℃、95%RHの恒温恒湿槽中に500時間保持(高温高湿処理)した後に測定した。結果を表2に示す。
抵抗増加率(%)=[(処理後抵抗値−初期抵抗値)/初期抵抗値]×100
より算出した。接続信頼性の改善効果の判断として、抵抗増加率10%未満を改善効果有り、10%以上20%未満を従来品レベル、20%以上を改善効果無し(NG)とした。
Claims (11)
- 回路電極が形成された2つの回路部材を、前記回路電極を対向させて電気的に接続するための回路接続材料であって、
前記回路接続材料は、接着剤組成物と、導電粒子とを含有し、
前記導電粒子は、有機高分子化合物からなる核体がニッケル又はニッケル合金からなる金属層で被覆された、表面に複数の突起部を有する導電粒子であり、前記核体の平均粒径が1〜4μm、前記金属層の厚みが65〜125nmであり、
前記回路電極の厚みが50nm以上である回路部材を接続するために用いられる、回路接続材料。 - 前記突起部の高さが50〜500nmである、請求項1記載の回路接続材料。
- 隣接する前記突起部間の距離が1000nm以下である、請求項1又は2記載の回路接続材料。
- 前記核体の平均粒径が2.5〜3.5μmである、請求項1〜3のいずれか一項に記載の回路接続材料。
- 前記2つの回路部材の回路電極の少なくとも一方の厚みが50〜1000nmである、請求項1〜4のいずれか一項に記載の回路接続材料。
- 前記2つの回路部材の回路電極の少なくとも一方の厚みが50〜500nmである、請求項1〜5のいずれか一項に記載の回路接続材料。
- 回路電極が形成され、前記回路電極が対向するように配置された2つの回路部材と、
前記回路部材の間に介在し、前記回路電極を電気的に接続する回路接続部材と、
を備え、
前記回路接続部材が、請求項1〜6のいずれか一項に記載の回路接続材料又はその硬化物であり、
前記回路電極の厚みが50nm以上である回路部材の接続構造。 - 前記2つの回路部材の回路電極の少なくとも一方の厚みが50〜1000nmである、請求項7記載の回路部材の接続構造。
- 前記2つの回路部材の回路電極の少なくとも一方の厚みが50〜500nmである、請求項7又は8記載の回路部材の接続構造。
- 前記2つの回路部材の回路電極の少なくとも一方が、インジウム−錫酸化物からなる最外層を有する、請求項7〜9のいずれか一項に記載の回路部材の接続構造。
- 前記2つの回路部材の回路電極の少なくとも一方が、インジウム−亜鉛酸化物からなる最外層を有する、請求項7〜9のいずれか一項に記載の回路部材の接続構造。
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DE112011102641T5 (de) | 2010-08-06 | 2013-06-27 | Canon Kabushiki Kaisha | Bildaufnahmevorrichtung,Anbauteil und Bildgebungssystem |
WO2018199329A1 (ja) * | 2017-04-28 | 2018-11-01 | 日立化成株式会社 | 接着剤組成物、及び接続体の製造方法 |
KR20200108439A (ko) | 2018-01-17 | 2020-09-18 | 히타치가세이가부시끼가이샤 | 접착제 조성물, 접속 구조체 및 그의 제조 방법 |
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JP4737177B2 (ja) * | 2006-10-31 | 2011-07-27 | 日立化成工業株式会社 | 回路接続構造体 |
JP5375374B2 (ja) * | 2009-07-02 | 2013-12-25 | 日立化成株式会社 | 回路接続材料及び回路接続構造体 |
JP5435040B2 (ja) * | 2010-04-01 | 2014-03-05 | 株式会社村田製作所 | 電子部品及びその製造方法 |
JP5476221B2 (ja) * | 2010-06-18 | 2014-04-23 | 積水化学工業株式会社 | 導電性粒子、異方性導電材料及び接続構造体 |
JP5377767B2 (ja) * | 2010-06-24 | 2013-12-25 | 株式会社フジクラ | 自動車用電線 |
EP2528167B1 (en) | 2011-05-25 | 2014-04-30 | Tyco Electronics AMP GmbH | Electrical contact element with a cover layer having a chemical reducing agent, electrical contact arrangement and methods for manufacturing an electrical contact element and for reducing oxidization of a contact section of an electrical contact element |
JP5636118B2 (ja) * | 2012-10-02 | 2014-12-03 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
FR2996348B1 (fr) | 2012-10-03 | 2015-05-15 | Amc Holding | Poudre et pate pour ameliorer la conductance des connexions electriques |
FR2997788B1 (fr) | 2012-11-05 | 2016-01-22 | Amc Etec | Dispositif de sectionnement d'une ligne d'alimentation electrique a courant de haute intensite |
JP6397316B2 (ja) * | 2013-11-18 | 2018-09-26 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
CN107075258B (zh) * | 2014-10-01 | 2020-03-06 | 纳美仕有限公司 | 树脂组合物 |
JP6945276B2 (ja) * | 2016-03-31 | 2021-10-06 | デクセリアルズ株式会社 | 異方性導電接続構造体 |
JP7160302B2 (ja) * | 2018-01-31 | 2022-10-25 | 三国電子有限会社 | 接続構造体および接続構造体の作製方法 |
JP7185252B2 (ja) | 2018-01-31 | 2022-12-07 | 三国電子有限会社 | 接続構造体の作製方法 |
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KR20200108439A (ko) | 2018-01-17 | 2020-09-18 | 히타치가세이가부시끼가이샤 | 접착제 조성물, 접속 구조체 및 그의 제조 방법 |
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Also Published As
Publication number | Publication date |
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CN101632199B (zh) | 2011-08-31 |
KR101410108B1 (ko) | 2014-06-25 |
WO2008140094A1 (ja) | 2008-11-20 |
CN101632199A (zh) | 2010-01-20 |
TW200916551A (en) | 2009-04-16 |
EP2148393A1 (en) | 2010-01-27 |
CN102174299A (zh) | 2011-09-07 |
JP4743322B2 (ja) | 2011-08-10 |
TWI431094B (zh) | 2014-03-21 |
TWI402326B (zh) | 2013-07-21 |
EP2148393A4 (en) | 2012-03-28 |
JPWO2008140094A1 (ja) | 2010-08-05 |
KR20100009540A (ko) | 2010-01-27 |
CN102174299B (zh) | 2014-01-29 |
KR20100119830A (ko) | 2010-11-10 |
US20100139947A1 (en) | 2010-06-10 |
TW201122078A (en) | 2011-07-01 |
KR20120043044A (ko) | 2012-05-03 |
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