JP7287275B2 - 接着剤組成物、及び接続体の製造方法 - Google Patents
接着剤組成物、及び接続体の製造方法 Download PDFInfo
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- JP7287275B2 JP7287275B2 JP2019514686A JP2019514686A JP7287275B2 JP 7287275 B2 JP7287275 B2 JP 7287275B2 JP 2019514686 A JP2019514686 A JP 2019514686A JP 2019514686 A JP2019514686 A JP 2019514686A JP 7287275 B2 JP7287275 B2 JP 7287275B2
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Description
(1)プラスチック粒子
テトラメチロールメタンテトラアクリレート、ジビニルベンゼン及びスチレンをモノマーとして用い、これらを、重合開始剤(ベンゾイルパーオキサイド)を用いた懸濁重合によって重合することで、プラスチック粒子を得た。
得られたプラスチック粒子を無電解Niメッキ処理することで、突起部を有し、Niで形成された金属層(Ni層、厚さ0.2μm)を備える導電性粒子1~3を得た。Niメッキ処理の際、メッキ液の仕込み量、処理温度及び処理時間を適宜調整してNi層の厚さを変更することにより、高さ及び面積率の異なる突起部を形成した。
導電性粒子1~3それぞれのNi層上に、置換メッキによって突起部を有するAuで形成された層(Au層)を形成させて、導電性粒子4~6をそれぞれ得た。
得られたプラスチック粒子上に平坦な表面を有するNi層を形成し、Ni層上に平坦な表面を有するAu層を更に形成して、導電性粒子を作製した。
得られたプラスチック粒子を無電解Niメッキ処理することで、突起部を有するNi層(厚さ0.2μm)を有する導電性粒子を得た。Niメッキ処理の際、メッキ液の仕込み量、処理温度及び処理時間を適宜調整してメッキ厚を変更することにより、高さ及び面積率の異なる突起部を形成した。これらの導電性粒子のNi層上に、置換メッキによって突起部を有するPdで形成された層(Pd層)を形成して、導電性粒子2-1~2-4をそれぞれ得た。
各導電性粒子を含む二次元画像を、走査型電子顕微鏡によって取得した。得られた二次元座画像を特開2016-61722号公報に記載の方法で分析することによって、100個の導電性粒子の突起部の高さ及び面積率を算出し、それらの平均値を求めた。
ラジカル重合性物質であるウレタンアクリレート(製品名:UA-5500T、新中村化学工業株式会社製)20質量部、ビス(アクリロキシエチル)イソシアヌレート(製品名:M-215、東亞合成株式会社製)15質量部、ジメチロールトリシクロデカンジアクリレート(製品名:DCP-A、共栄社化学共栄社化社製)5質量部及び2-メタクリロイロキシエチルアッシドフォスヘート(製品名:P-2M、共栄社化学共栄社化社製)1質量部と、ベンゾイルパーオキサイド(製品名:ナイパーBMT-K、日油株式会社製)8質量部と、ポリエステルウレタン樹脂(製品名:UR4800、東洋紡績株式会社製)を含む濃度40質量%の溶液60質量部と、を混合し、攪拌して、バインダ樹脂の溶液を得た。ポリエステルウレタン樹脂の溶液は、ポリエステルウレタン樹脂をトルエン/メチルエチルケトン=50/50の混合溶剤に溶解して調製した。
・ガラス部材
ガラス基板と、該ガラス基板上に順に積層されたCu膜(厚さ30nm)及びアモルファスITOの接続端子(厚さ40nm)とを有するガラス部材を準備した。
・フレキシブル部材
ポリエチレンテレフタレート(PET)フィルム(25℃での弾性率:4600MPa)と、PETフィルム上に形成されたITOの接続端子(厚さ20nm)とを有するフレキシブル部材を準備した。
・フレキシブル回路基板(FPC)
ポリエチレンテフタレート(PET)を基材とした樹脂フィルム基材と、該樹脂フィルム基材上に設けられた配線とを有するFPCを準備した。このFPCの配線は、ピッチ0.3mm(スペース0.15mm、電極幅0.15mm、高さ18μm)のCu層と、Cu層上に順に形成された厚さ3μmのNiメッキ層及び厚さ0.03μmのAuメッキ層とからなる接続端子を有する。
同様に、ガラス部材とFPCとを、これらの間に異方導電性接着フィルムを挟むことで接続して、ガラス/FPCの接続体を得た。
Claims (10)
- 接着剤成分と、導電性粒子とを含有し、
前記導電性粒子が、プラスチック粒子及び該プラスチック粒子を被覆する金属層を有し、
前記導電性粒子の表面には複数の突起部が形成されており、前記複数の突起部の高さが平均で85~1200nmであり、
前記導電性粒子の投影像において、前記導電性粒子表面の面積に対する前記突起部の面積の割合が、8~60%であり、
前記導電性粒子が、前記金属層として、前記導電性粒子の最表面にAu及びPdから選択される金属で形成されている層を有する、接着剤組成物。 - 前記導電性粒子が、前記金属層として、前記導電性粒子の最表面にPdで形成されている層を有する、請求項1に記載の接着剤組成物。
- 前記Pdで形成されている層の厚さが2~200nmである、請求項2に記載の接着剤組成物。
- 第一の基板及び該第一の基板上に設けられた第一の接続端子を有する第一の回路部材と、第二の基板及び該第二の基板上に設けられた第二の接続端子を有する第二の回路部材とを、互いに電気的に接続するために用いられ、
前記第一の基板がICチップ又はフレキシブル基板であり、
前記第二の基板が、ポリイミド、ポリエチレンテレフタレート、ポリカーボネート及びポリエチレンナフタレートからなる群より選ばれる少なくとも1種の熱可塑性樹脂を含むフレキシブル基板である、請求項1~3のいずれか一項に記載の接着剤組成物。 - 第一の基板及び該第一の基板上に設けられた第一の接続端子を有する第一の回路部材と、第二の基板及び該第二の基板上に設けられた第二の接続端子を有する第二の回路部材とを、互いに電気的に接続するために用いられ、
前記第一の基板がICチップ又はフレキシブル基板であり、
前記第二の基板が、ガラス基板、又は、ガラス基板及び該ガラス基板上に設けられた絶縁膜を有する複合基板である、請求項1~3のいずれか一項に記載の接着剤組成物。 - 第一の基板及び該第一の基板上に設けられた第一の接続端子を有する第一の回路部材と、前記第一の回路部材と対向して配置され、第二の基板及び該第二の基板上に設けられた第二の接続端子を有する第二の回路部材との間に回路接続材料を配置して積層体を作製し、前記積層体を加熱及び加圧して、前記第一の回路部材と前記第二の回路部材とを互いに電気的に接続する工程を備え、
前記回路接続材料が、接着剤成分と、導電性粒子とを含有し、
前記導電性粒子が、プラスチック粒子及び該プラスチック粒子を被覆する金属層を有し、
前記導電性粒子の表面には複数の突起部が形成されており、前記複数の突起部の高さが平均で85~1200nmであり、
前記導電性粒子の投影像において、前記導電性粒子表面の面積に対する前記突起部の面積の割合が、8~60%であり、
前記導電性粒子が、前記金属層として、前記導電性粒子の最表面にAu及びPdから選択される金属で形成されている層を有する、接続体の製造方法。 - 前記導電性粒子が、前記金属層として、前記導電性粒子の最表面にPdで形成されている層を有する、請求項6に記載の接続体の製造方法。
- 前記Pdで形成されている層の厚さが2~200nmである、請求項7に記載の接続体の製造方法。
- 前記第一の基板がICチップ又はフレキシブル基板であり、
前記第二の基板が、ポリイミド、ポリエチレンテレフタレート、ポリカーボネート及びポリエチレンナフタレートからなる群より選ばれる少なくとも1種の熱可塑性樹脂を含むフレキシブル基板である、請求項6~8のいずれか一項に記載の接続体の製造方法。 - 前記第一の基板がICチップ又はフレキシブル基板であり、
前記第二の基板が、ガラス基板、又は、ガラス基板及び該ガラス基板上に設けられた絶縁膜を有する複合基板である、請求項6~8のいずれか一項に記載の接続体の製造方法。
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