WO2018113056A1 - 用丝网印刷机制作柔性基板和柔性面板的方法 - Google Patents

用丝网印刷机制作柔性基板和柔性面板的方法 Download PDF

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Publication number
WO2018113056A1
WO2018113056A1 PCT/CN2017/071070 CN2017071070W WO2018113056A1 WO 2018113056 A1 WO2018113056 A1 WO 2018113056A1 CN 2017071070 W CN2017071070 W CN 2017071070W WO 2018113056 A1 WO2018113056 A1 WO 2018113056A1
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Prior art keywords
flexible substrate
printing machine
screen printing
blade
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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PCT/CN2017/071070
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English (en)
French (fr)
Inventor
李想
余威
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Technology Co Ltd
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Wuhan China Star Optoelectronics Technology Co Ltd
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Application filed by Wuhan China Star Optoelectronics Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Technology Co Ltd
Priority to US15/327,796 priority Critical patent/US20180213650A1/en
Publication of WO2018113056A1 publication Critical patent/WO2018113056A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C1/00—Forme preparation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/12—Stencil printing; Silk-screen printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/08—Machines
    • B41F15/0831—Machines for printing webs
    • B41F15/0845—Machines for printing webs with flat screens
    • B41F15/085—Machines for printing webs with flat screens with a stationary screen and a moving squeegee
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/08—Machines
    • B41F15/0881—Machines for printing on polyhedral articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/34—Screens, Frames; Holders therefor
    • B41F15/36—Screens, Frames; Holders therefor flat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/40—Inking units
    • B41F15/42—Inking units comprising squeegees or doctors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/44—Squeegees or doctors
    • B41F15/46—Squeegees or doctors with two or more operative parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/22—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of impact or pressure on a printing material or impression-transfer material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/12—Stencil printing; Silk-screen printing
    • B41M1/125—Stencil printing; Silk-screen printing using a field of force, e.g. an electrostatic field, or an electric current
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/26—Printing on other surfaces than ordinary paper
    • B41M1/34—Printing on other surfaces than ordinary paper on glass or ceramic surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
    • B41M3/006—Patterns of chemical products used for a specific purpose, e.g. pesticides, perfumes, adhesive patterns; use of microencapsulated material; Printing on smoking articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00—Printing plates or foils; Materials therefor
    • B41N1/12—Printing plates or foils; Materials therefor non-metallic other than stone, e.g. printing plates or foils comprising inorganic materials in an organic matrix
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00—Printing plates or foils; Materials therefor
    • B41N1/16—Curved printing plates, especially cylinders
    • B41N1/22—Curved printing plates, especially cylinders made of other substances
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6758—Thin-film transistors [TFT] characterised by the insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01—Manufacture or treatment
    • H10D86/021—Manufacture or treatment of multiple TFTs
    • H10D86/0212—Manufacture or treatment of multiple TFTs comprising manufacture, treatment or coating of substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01—Manufacture or treatment
    • H10D86/021—Manufacture or treatment of multiple TFTs
    • H10D86/0214—Manufacture or treatment of multiple TFTs using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01—Manufacture or treatment
    • H10D86/021—Manufacture or treatment of multiple TFTs
    • H10D86/0241—Manufacture or treatment of multiple TFTs using liquid deposition, e.g. printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/411—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs characterised by materials, geometry or structure of the substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901—Materials
    • H10P14/2922—Materials being non-crystalline insulating materials, e.g. glass or polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326—Deposition processes
    • H10P14/6342—Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating
    • H10P14/6346—Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating using printing, e.g. ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/65—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
    • H10P14/6516—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/68—Organic materials, e.g. photoresists
    • H10P14/683—Organic materials, e.g. photoresists carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/206—Organic displays, e.g. OLED
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/42—Printing without contact between forme and surface to be printed, e.g. by using electrostatic fields
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
    • B41P2200/00—Printing processes
    • B41P2200/40—Screen printing
    • B41P2200/42—Mimeographic printing, e.g. stencilling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
    • B41P2215/00—Screen printing machines
    • B41P2215/10—Screen printing machines characterised by their constructional features
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
    • B41P2215/00—Screen printing machines
    • B41P2215/50—Screen printing machines for particular purposes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01—Manufacture or treatment
    • H10D86/021—Manufacture or treatment of multiple TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to the field of display technology, in particular to a method for manufacturing a flexible substrate and a flexible panel by a screen printing machine.
  • OLED Organic Light-Emitting Diode
  • OLED has the advantages of self-illumination, wide viewing angle, high contrast, low power consumption and fast response speed. It has been widely used in display technology and has been gradually applied to our daily life. in life.
  • the mainstream flexible OLED device is processed by first coating the polyimide on the carrier glass to form a flexible substrate, and then performing electrical devices, optical devices, and thin film packages on the flexible substrate, and then using Laser cutting machine (Laser Cutting) The entire carrier glass is cut into panels along with the flexible substrate. Finally, the flexible OLED device is stripped from the carrier glass by a laser stripper (LLO) to form the flexible OLED device we want.
  • LLO laser stripper
  • the invention provides a method for manufacturing a flexible substrate and a flexible panel by using a screen printing machine, so as to solve the manufacturing method of the flexible OLED device in the prior art, the manufacturing process of the polyimide full-surface coating is high in cost and complicated in process. And laser cutting machine (Laser Cutting equipment is expensive and increases the technical cost of processing.
  • a technical solution adopted by the present invention is to provide a method for manufacturing a flexible substrate by using a screen printing machine, wherein the screen printing machine comprises a stencil having an opening, and is disposed on the stencil The upper side of the ink returning knife, the scraper and the rubber material, the lower side of the screen is provided with a glass substrate, and the method comprises:
  • the doctor blade Moving the ink repelling blade and the doctor blade, the doctor blade being above the ink refining blade, the ink repelling blade coating the glue material on the opening;
  • the baking temperature ranges from 350 to 500 ° C
  • the baking time ranges from 2 to 4 hours
  • the thickness range of the flexible substrate It is 20-400 microns.
  • a method for manufacturing a flexible substrate by a screen printing machine wherein the screen printing machine comprises a stencil having an opening, and is disposed on the stencil The upper side of the ink returning knife, the scraper and the rubber material, the lower side of the screen is provided with a glass substrate, and the method comprises:
  • the doctor blade Moving the ink repelling blade and the doctor blade, the doctor blade being above the ink refining blade, the ink repelling blade coating the glue material on the opening;
  • the flexible substrate film is baked to obtain a cured flexible substrate.
  • the baking temperature ranges from 350 to 500 ° C
  • the baking time ranges from 2 to 4 hours.
  • the baking temperature ranges from 400 to 450 ° C
  • the baking time ranges from 2.5 to 3.5 hours.
  • the rubber material is one of polyethylene, polypropylene, polystyrene, polyethylene terephthalate, polyethylene naphthalate, and polyimide. .
  • the glue material is polyimide.
  • the flexible substrate has a thickness ranging from 20 to 400 microns.
  • the flexible substrate has a thickness in the range of 50-100 microns.
  • the open area has an area of 6-10000 square centimeters.
  • the spacing between adjacent two of said open areas is between 5 and 100 mm.
  • another technical solution adopted by the present invention is to provide a method for manufacturing a flexible panel by using a screen printing machine, the method comprising:
  • the flexible substrate and the glass substrate are separated by a laser lift-off process.
  • the baking temperature ranges from 350 to 500 ° C
  • the baking time ranges from 2 to 4 hours.
  • the baking temperature ranges from 400 to 450 ° C
  • the baking time ranges from 2.5 to 3.5 hours.
  • the rubber material is one of polyethylene, polypropylene, polystyrene, polyethylene terephthalate, polyethylene naphthalate, and polyimide. .
  • the glue material is polyimide.
  • the flexible substrate has a thickness ranging from 20 to 400 microns.
  • the flexible substrate has a thickness in the range of 50-100 microns.
  • the open area has an area of 6-10000 square centimeters.
  • the spacing between adjacent two of said open areas is between 5 and 100 mm.
  • the invention has the beneficial effects that the method for manufacturing a flexible substrate by a screen printing machine provided by the present invention is different from the prior art, and a flexible substrate film corresponding to the opening of the screen printing machine is formed by providing a screen printing machine. Directly get the desired flexible substrate size, which simplifies the production process and saves production costs.
  • FIG. 1 is a schematic flow chart of an embodiment of a method for manufacturing a flexible substrate by a screen printing machine according to the present invention
  • FIG. 2 is a schematic structural view of a screen printing machine in a first embodiment of the present invention
  • FIG. 2a is a schematic structural view of a screen printing machine in a first embodiment of the present invention
  • 2b is a schematic structural view of the screen printing machine in the reverse movement according to the first embodiment of the present invention
  • FIG. 3 is a schematic structural view of an embodiment of a flexible substrate provided by the present invention.
  • FIG. 4 is a schematic flow chart of an embodiment of a method for manufacturing a flexible panel by a screen printing machine provided by the present invention
  • FIG. 5 is a cross-sectional structural view of an embodiment of a flexible panel provided by the present invention.
  • FIG. 1 is a schematic flow chart of a first embodiment of a method for manufacturing a flexible substrate by using a screen printing machine according to the present invention
  • FIG. 2, FIG. 2a and FIG. 2b are respectively a first embodiment of the present invention.
  • the screen printing machine 100 includes a screen 110 having an opening 112, an ink returning blade 120 disposed on the upper side of the screen 110, a doctor blade 130, and a glue material 140.
  • the lower side of the screen 110 is provided with glass.
  • the substrate 150 and the glass substrate 150 are placed on the carrying surface 101.
  • the screen printing machine is a machine for printing with a screen printing plate, which belongs to a type of printing machine, and has good adaptability to the material, shape and large-format printing of the substrate.
  • a screen printer is a machine for printing text and images and is a general term for machines or equipment used to produce printed matter.
  • Screen printing machine is a representative printing equipment in stencil printing machine.
  • the material for making wire mesh can also be made of nylon wire, copper wire, steel wire or stainless steel wire. It can also be divided into flat screen printing machine. Curved screen printing machine, rotary screen printing machine, etc. In this embodiment, a screen printing machine using a stainless steel wire flat is used.
  • FIG. 1 is an embodiment of a flexible substrate manufactured by the screen printer 100 of the present invention. Specifically, the method includes the following steps:
  • Step S11 moving the ink returning blade and the scraping blade, the scraping blade is above the ink returning knife, and the ink returning knife applies the rubber material to the opening.
  • the stencil 110 of the screen printing machine 100 includes an open area 112 and a closed area 114.
  • the open area 112 and the closed area 114 are spaced apart to form a full-surface stencil having a size ranging from 300 mm * 300 mm to 2000 mm. * 3000 mm; further, the size of the stencil ranges from 650 mm * 650 mm to 1000 mm * 1000 mm, and the size of the stencil 110 must be larger than the size of the glass substrate 150.
  • the closed area 114 is printed with a photosensitive paste on the corresponding screen, and the photosensitive paste is cross-linked and solidified by the action of the sensitizer under the irradiation of ultraviolet rays, and the closed region 114 is closed.
  • the open area 112 is a portion where the photosensitive paste is not printed, is dissolved and dissolved in water, and is developed to be consistent with the preset flexible substrate pattern.
  • the glue material 140 is polyethylene (PE), polypropylene (PP), polystyrene (PS), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), poly One of methacrylic acid (PMMA) and polyimide (PI); among them, polyimide (PI) is one of the best organic polymer materials with high comprehensive resistance, high temperature resistance up to 400 °C, long-term It has a temperature range of -200 to 300 ° C, no obvious melting point, excellent mechanical properties and high insulation properties, making it the most commonly used material for making flexible substrates.
  • Step S12 moving the ink returning blade and the scraper in the opposite direction, the scraper descending to the lower side of the ink returning blade, and the scraping blade prints the rubber material from the opening onto the glass substrate to form a flexible substrate film corresponding to the opening on the glass substrate.
  • Step S13 baking the flexible substrate film to obtain a cured flexible substrate.
  • the method for manufacturing a flexible substrate by using a screen printing machine provides a flexible substrate film corresponding to the opening of the screen printing machine by providing a screen printing machine, thereby directly obtaining a desired flexible substrate size, thereby simplifying the production process and saving Cost of production.
  • the baking temperature ranges from 350 to 500 ° C, and the baking time ranges from 2-4 hours; further, the baking temperature ranges from 400 to 450 ° C, and the baking time ranges from 2.5 to 3.5 hours.
  • the thickness of the flexible substrate after baking is 20-400 micrometers. Further, the thickness of the flexible substrate after baking is 40-200 micrometers; further, the thickness of the flexible substrate after baking is 50-100 microns.
  • the area of the open area 112 is 6-10000 square centimeters. Further, the area of the open area 112 is 50-2500 square centimeters. Further, when the area of the open area 112 is 100 square centimeters, and the shape of the open area 112 is rectangular or square, The length or width thereof is 1 to 50 inches, preferably 4 to 10 inches, and further preferably 6 inches. The interval between two adjacent open areas 112 is 5 to 100 mm, preferably 10 to 40 mm, and further 30 mm.
  • FIG. 3 is a schematic structural view of an embodiment of a flexible substrate provided by the present invention.
  • the flexible substrate 10 is fabricated by the above method, including a glass substrate 150 and a flexible substrate 140, wherein the flexible substrate 140 is disposed on the glass substrate 150 in a pattern.
  • the manufacturing method of the flexible substrate 140 is as described above, and will not be described herein.
  • FIG. 4 is an embodiment of a flexible panel manufactured by the screen printing machine 100 of the present invention. Specifically, the method includes the following steps:
  • Steps S21-S23 and step S11 of fabricating a flexible substrate with screen printer 100 S13 is basically the same and will not be described here.
  • an electrical device and a light-emitting device are added to the flexible substrate. Specifically, step S24 and step S25 are added.
  • Step S24 sequentially forming a thin film transistor, a light emitting device, and a package film on top of the flexible substrate.
  • the thin film transistor, the light emitting device, and the package film are sequentially formed on the flexible substrate 140, which is the same as the current mainstream manufacturing process, and is not the focus of the present invention, and will not be described in detail herein.
  • Step S25 separating the flexible substrate and the glass substrate by a laser lift-off process.
  • the method for manufacturing a flexible panel by a screen printing machine comprises a screen printing machine, forming a flexible substrate film corresponding to the opening of the screen printing machine, and then forming a thin film transistor, a light emitting device and a packaging film on the flexible substrate, Reduce the use of laser cutting machine (Laser Cutting) The step of cutting the entire carrier glass together with the flexible substrate into panels, simplifying the production process and saving production costs.
  • Laser Cutting Laser Cutting
  • FIG. 5 is a cross-sectional structural diagram of an embodiment of a flexible panel provided by the present invention.
  • the flexible panel 20 is fabricated by the above method, and includes a flexible substrate 10 and a thin film transistor 21, a light emitting device 22, and a package film 23 which are sequentially formed over the flexible substrate 10.
  • the manufacturing method and structure of the flexible substrate 10 are as described above, and are not described herein again.
  • the method for fabricating a flexible substrate by a screen printing machine provided by the present invention is provided with a screen printing machine to form a flexible substrate film corresponding to the opening of the screen printing machine.
  • the size of the flexible substrate is required to simplify the production process and save production costs.

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Abstract

一种用丝网印刷机(100)制作柔性基板(10)和柔性面板的方法，该方法包括：移动回墨刀(120)和刮刀(130)，刮刀(130)在回墨刀(120)的上方，回墨刀(120)将胶材材料(140)涂覆在开口(112)(S11)；反向移动回墨刀(120)和刮刀(130)，刮刀(130)下降至回墨刀(120)的下方，刮刀(130)将胶材材料(140)从开口(112)印刷至玻璃基板(150)上，以形成与开口(112)对应的柔性基板薄膜(S12)；对柔性基板薄膜进行烘烤，以得到固化的柔性基板(10)(S13)。该方法形成与丝网印刷机(100)开口(112)对应的柔性基板薄膜，直接得到想要的柔性基板(10)尺寸，简化生产流程、节省生产成本。

Description

用丝网印刷机制作柔性基板和柔性面板的方法
【技术领域】
本发明涉及显示技术领域，具体是指一种用丝网印刷机制作柔性基板和柔性面板的方法。
【背景技术】
有机发光二极管（Organic Light-Emitting Diode，简称“OLED”）在显示技术具有自发光、广视角、对比度高、低耗电、反应速度快等优点，使其在显示技术领域中得到广泛应用，并且已经被逐渐应用到我们的日常生活中。
近几年，随着柔性OLED得到了快速的发展，柔性可弯曲变形的显示器从屏幕尺寸到显示质量都得到大大提升。而目前，主流的柔性OLED器件的制程方法为首先将聚酰亚胺整面涂布覆盖在载体玻璃上形成柔性衬底，然后在柔性衬底上做电学器件、光学器件以及薄膜封装，然后用镭射切割机（Laser Cutting）将整片载体玻璃连同柔性衬底切成面板，最后用激光剥离机（LLO）将柔性OLED器件从载体玻璃上剥离下来，形成我们所要的柔性OLED器件。上述的制程方法中将聚酰亚胺整面涂布的制作成本高，且工艺复杂，而镭射切割机（Laser Cutting）设备价格昂贵，增加加工成本。
【发明内容】
本发明提供一种用丝网印刷机制作柔性基板和柔性面板的方法，以解决现有技术中柔性OLED器件的制程方式中将聚酰亚胺整面涂布的制作成本高，且工艺复杂，而镭射切割机（Laser Cutting）设备价格昂贵，增加加工成本的技术问题。
为解决上述技术问题，本发明采用的一个技术方案是：提供一种用丝网印刷机制作柔性基板的方法，其中，所述丝网印刷机包括具有开口的网板、设于所述网板上侧的回墨刀、刮刀以及胶材材料，所述网板的下侧设有玻璃基板，所述方法包括：
移动所述回墨刀和所述刮刀，所述刮刀在所述回墨刀的上方，所述回墨刀将所述胶材材料涂覆在所述开口；
反向移动所述回墨刀和所述刮刀，所述刮刀下降至所述回墨刀的下方，所述刮刀将所述胶材材料从所述开口印刷至所述玻璃基板上，以在所述玻璃基板上形成与所述开口对应的柔性基板薄膜；
对所述柔性基板薄膜进行烘烤，以得到固化的柔性基板，所述烘烤的温度范围为350~500℃，所述烘烤的时间范围为2-4小时，所述柔性基板的厚度范围为20-400微米。
为解决上述技术问题，本发明采用的另一个技术方案是：一种用丝网印刷机制作柔性基板的方法，其中，所述丝网印刷机包括具有开口的网板、设于所述网板上侧的回墨刀、刮刀以及胶材材料，所述网板的下侧设有玻璃基板，所述方法包括：
移动所述回墨刀和所述刮刀，所述刮刀在所述回墨刀的上方，所述回墨刀将所述胶材材料涂覆在所述开口；
反向移动所述回墨刀和所述刮刀，所述刮刀下降至所述回墨刀的下方，所述刮刀将所述胶材材料从所述开口印刷至所述玻璃基板上，以在所述玻璃基板上形成与所述开口对应的柔性基板薄膜；
对所述柔性基板薄膜进行烘烤，以得到固化的柔性基板。
根据本发明一实施例，所述烘烤的温度范围为350~500℃，所述烘烤的时间范围为2-4小时。
根据本发明一实施例，所述烘烤的温度范围为400~450℃，所述烘烤的时间范围为2.5-3.5小时。
根据本发明一实施例，所述胶材材料为聚乙烯、聚丙烯、聚苯乙烯、聚对苯二甲酸乙二醇、聚对萘二甲酸乙二醇脂、聚酰亚胺中的一种。
根据本发明一实施例，所述胶材材料为聚酰亚胺。
根据本发明一实施例，所述柔性基板的厚度范围为20-400微米。
根据本发明一实施例，所述柔性基板的厚度范围为50-100微米。
根据本发明一实施例，所述开口区的面积为6-10000平方厘米。
根据本发明一实施例，相邻两个所述开口区之间的间隔为5-100毫米。
为解决上述技术问题，本发明采用的另一个技术方案是：提供一种用丝网印刷机制作柔性面板的方法，所述方法包括：
由上述所述的方法制成的柔性基板；
在所述柔性基板的上方依次制作薄膜晶体管、发光器件以及封装薄膜；
通过激光剥离工艺将所述柔性基板和所述玻璃基板分离。
根据本发明一实施例，所述烘烤的温度范围为350~500℃，所述烘烤的时间范围为2-4小时。
根据本发明一实施例，所述烘烤的温度范围为400~450℃，所述烘烤的时间范围为2.5-3.5小时。
根据本发明一实施例，所述胶材材料为聚乙烯、聚丙烯、聚苯乙烯、聚对苯二甲酸乙二醇、聚对萘二甲酸乙二醇脂、聚酰亚胺中的一种。
根据本发明一实施例，所述胶材材料为聚酰亚胺。
根据本发明一实施例，所述柔性基板的厚度范围为20-400微米。
根据本发明一实施例，所述柔性基板的厚度范围为50-100微米。
根据本发明一实施例，所述开口区的面积为6-10000平方厘米。
根据本发明一实施例，相邻两个所述开口区之间的间隔为5-100毫米。
本发明的有益效果是：区别于现有技术的情况，本发明提供的用丝网印刷机制作柔性基板的方法由于设有丝网印刷机，形成与丝网印刷机开口对应的柔性基板薄膜，直接得到想要的柔性基板尺寸，从而简化生产流程、节省生产成本。
【附图说明】
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图，其中：
图1是本发明提供的用丝网印刷机制作柔性基板的方法一实施方式的流程示意图；
图2是本发明第一实施方式中丝网印刷机的结构示意图；
图2a是本发明第一实施方式中丝网印刷机移动时的结构示意图；
图2b是本发明第一实施方式中丝网印刷机反向移动时的结构示意图；
图3是本发明提供的柔性基板一实施例的结构示意图；
图4是本发明提供的用丝网印刷机制作柔性面板的方法一实施方式的流程示意图；
图5是本发明提供的柔性面板一实施例的剖面结构示意图。
【具体实施方式】
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
请一并参阅图1至图2b，图1是本发明提供的用丝网印刷机制作柔性基板的方法第一实施方式的流程示意图，图2、图2a、图2b分别是本发明第一实施方式中丝网印刷机、丝网印刷机移动时和丝网印刷机反向移动时的结构示意图。
如图2所示，丝网印刷机100包括具有开口112的网板110、设于网板110上侧的回墨刀120、刮刀130以及胶材材料140，网板110的下侧设有玻璃基板150，玻璃基板150放置在承载台面101上。
其中，丝网印刷机是用丝网印版施印的机器，属于印刷机的一种，对承印物的材料、形状、大幅面印刷具有良好的适应性。丝网印刷机是印刷文字和图像的机器，是用于生产印刷品的机器或设备的总称。丝网印刷机属于孔版印刷机中较有代表性的印刷设备，制作丝网的材料除真丝外，还可用尼龙丝、铜丝、钢丝或不锈钢丝等，还可分为平面丝网印刷机、曲面丝网印刷机、转式丝网印刷机等。本实施例中，采用不锈钢丝平面的丝网印刷机。
参阅图1，图1是本发明用丝网印刷机100制作柔性基板的一实施方式，具体来说，包括以下步骤：
步骤S11：移动回墨刀和刮刀，刮刀在回墨刀的上方，回墨刀将胶材材料涂覆在开口。
如图2a所示，从右向左移动回墨刀120和刮刀130时，刮刀130在回墨刀120的上方，回墨刀120将位于回墨刀120侧边的胶材材料140涂覆在开口112处。
丝网印刷机100的网板110包括开口区112和闭口区114，开口区112和闭口区114间隔设置合成一整平面的网板，网板的尺寸大小范围为300毫米*300毫米至2000毫米*3000毫米；进一步的，网板的尺寸大小范围为650毫米*650毫米至1000毫米*1000毫米，且网板110的尺寸须大于玻璃基板150的尺寸。其中，闭口区114是将对应的网板印刷有感光浆，感光浆在紫外线的照射下，通过敏化剂的作用，发生交联固化，将闭口区114封闭起来。而开口区112是没有印刷感光浆的部份，遇水膨胀溶解，经显影得到与预设的柔性基板图案一致。
胶材材料140为聚乙烯（PE）、聚丙烯（PP）、聚苯乙烯（PS），聚对苯二甲酸乙二醇（PET）、聚对萘二甲酸乙二醇脂（PEN）、聚甲基丙烯酸甲(PMMA)、聚酰亚胺（PI）中的一种；其中，聚酰亚胺（PI）是综合性能最佳的有机高分子材料之一，耐高温达400℃以上，长期使用温度范围-200～300℃，无明显熔点，具有优越机械性能、高绝缘性能，使得其为制作柔性基板最常用的材料。
步骤S12：反向移动回墨刀和刮刀，刮刀下降至回墨刀的下方，刮刀将胶材材料从开口印刷至玻璃基板上，以在玻璃基板上形成与开口对应的柔性基板薄膜。
如图2b所示，从左向右反向移动回墨刀120和刮刀130时，刮刀130下降至回墨刀120的下方，对网板产生一定的压力，刮刀130将胶材材料140从开口112印刷至玻璃基板150上，以在玻璃基板150上形成与开口112对应的柔性基板薄膜。
步骤S13：对柔性基板薄膜进行烘烤，以得到固化的柔性基板。
本发明提供的用丝网印刷机制作柔性基板的方法由于设有丝网印刷机，形成与丝网印刷机开口对应的柔性基板薄膜，直接得到想要的柔性基板尺寸，从而简化生产流程、节省生产成本。
具体来说，烘烤的温度范围为350~500℃，烘烤的时间范围为2-4小时；进一步的，烘烤的温度范围为400~450℃，烘烤的时间范围为2.5-3.5小时。进行烘烤后的柔性基板的厚度范围为20-400微米，进一步的，进行烘烤后的柔性基板的厚度范围为40-200微米；更进一步的，进行烘烤后的柔性基板的厚度范围为50-100微米。
开口区112的面积为6-10000平方厘米，进一步的，开口区112的面积为50-2500平方厘米，进一步，开口区112的面积为100平方厘米，开口区112的形状为长方形或者正方形时，其长或者宽的尺寸为1-50寸，优选为4-10寸，进一步优选为6寸。其中，相邻两个开口区112之间的间隔为5-100毫米，优选为10-40毫米，进一步为30毫米。
参阅图3，图3是本发明提供的柔性基板一实施例的结构示意图。
如图3所示，该柔性基板10采用上述的方法制成，包括玻璃基板150和柔性基板140，其中，柔性基板140以图样化设置在玻璃基板150上。
柔性基板140的制作方法见上文，此处不再赘述。
参阅图4，图4是本发明用丝网印刷机100制作柔性面板的一实施方式，具体来说，包括以下步骤：
步骤S21- S23与用丝网印刷机100制作柔性基板的步骤S11- S13基本一致，在此不再赘述。本实施例是在柔性基板上增加了制作电学器件和发光器件。具体来说，增加步骤S24和步骤S25。
步骤S24：在柔性基板的上方依次制作薄膜晶体管、发光器件以及封装薄膜。
在柔性基板140的上方依次制作薄膜晶体管、发光器件以及封装薄膜，与目前主流的制作工艺相同，不是本发明的重点，在此不再详述。
步骤S25：通过激光剥离工艺将柔性基板和玻璃基板分离。
本发明提供的用丝网印刷机制作柔性面板的方法由于设有丝网印刷机，形成与丝网印刷机开口对应的柔性基板薄膜，再在柔性基板上制作薄膜晶体管、发光器件以及封装薄膜，减少用镭射切割机（Laser Cutting）将整片载体玻璃连同柔性衬底切成面板的步骤，简化生产流程、节省生产成本。
参阅图5，图5是本发明提供的柔性面板一实施例的剖面结构示意图。
如图5所示，为了方便理解，以剖面结构示意图为参考。该柔性面板20采用上述的方法制成，包括柔性基板10以及在柔性基板10的上方依次形成的薄膜晶体管21、发光器件22以及封装薄膜23。其中，柔性基板10的制作方法和结构见上文，此处不再赘述。
综上所述，本领域技术人员容易理解，本发明提供的用丝网印刷机制作柔性基板的方法由于设有丝网印刷机，形成与丝网印刷机开口对应的柔性基板薄膜，直接得到想要的柔性基板尺寸，从而简化生产流程、节省生产成本。
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (19)

  1. 一种用丝网印刷机制作柔性基板的方法，其中，所述丝网印刷机包括具有开口的网板、设于所述网板上侧的回墨刀、刮刀以及胶材材料，所述网板的下侧设有玻璃基板，所述方法包括：
    移动所述回墨刀和所述刮刀，所述刮刀在所述回墨刀的上方，所述回墨刀将所述胶材材料涂覆在所述开口；
    反向移动所述回墨刀和所述刮刀，所述刮刀下降至所述回墨刀的下方，所述刮刀将所述胶材材料从所述开口印刷至所述玻璃基板上，以在所述玻璃基板上形成与所述开口对应的柔性基板薄膜；
    对所述柔性基板薄膜进行烘烤，以得到固化的柔性基板，所述烘烤的温度范围为350~500℃，所述烘烤的时间范围为2-4小时，所述柔性基板的厚度范围为20-400微米。
  2. 一种用丝网印刷机制作柔性基板的方法，其中，所述丝网印刷机包括具有开口的网板、设于所述网板上侧的回墨刀、刮刀以及胶材材料，所述网板的下侧设有玻璃基板，所述方法包括：
    移动所述回墨刀和所述刮刀，所述刮刀在所述回墨刀的上方，所述回墨刀将所述胶材材料涂覆在所述开口；
    反向移动所述回墨刀和所述刮刀，所述刮刀下降至所述回墨刀的下方，所述刮刀将所述胶材材料从所述开口印刷至所述玻璃基板上，以在所述玻璃基板上形成与所述开口对应的柔性基板薄膜；
    对所述柔性基板薄膜进行烘烤，以得到固化的柔性基板。
  3. 根据权利要求2所述的用丝网印刷机制作柔性基板的方法，其中，所述烘烤的温度范围为350~500℃，所述烘烤的时间范围为2-4小时。
  4. 根据权利要求3所述的用丝网印刷机制作柔性基板的方法，其中，所述烘烤的温度范围为400~450℃，所述烘烤的时间范围为2.5-3.5小时。
  5. 根据权利要求2所述的用丝网印刷机制作柔性基板的方法，其中，所述胶材材料为聚乙烯、聚丙烯、聚苯乙烯、聚对苯二甲酸乙二醇、聚对萘二甲酸乙二醇脂、聚酰亚胺中的一种。
  6. 根据权利要求5所述的用丝网印刷机制作柔性基板的方法，其中，所述胶材材料为聚酰亚胺。
  7. 根据权利要求2项所述的用丝网印刷机制作柔性基板的方法，其中，所述柔性基板的厚度范围为20-400微米。
  8. 根据权利要求7项所述的用丝网印刷机制作柔性基板的方法，其中，所述柔性基板的厚度范围为50-100微米。
  9. 根据权利要求2所述的用丝网印刷机制作柔性基板的方法，其中，所述开口区的面积为6-10000平方厘米。
  10. 根据权利要求2所述的用丝网印刷机制作柔性基板的方法，其中，相邻两个所述开口区之间的间隔为5-100毫米。
  11. 一种用丝网印刷机制作柔性面板的方法，其中，所述方法包括：
    由权利要求2所述的方法制成的柔性基板；
    在所述柔性基板的上方依次制作薄膜晶体管、发光器件以及封装薄膜；
    通过激光剥离工艺将所述柔性基板和所述玻璃基板分离。
  12. 根据权利要求11所述的用丝网印刷机制作柔性面板的方法，其中，所述烘烤的温度范围为350~500℃，所述烘烤的时间范围为2-4小时。
  13. 根据权利要求12所述的用丝网印刷机制作柔性面板的方法，其中，所述烘烤的温度范围为400~450℃，所述烘烤的时间范围为2.5-3.5小时。
  14. 根据权利要求11所述的用丝网印刷机制作柔性面板的方法，其中，所述胶材材料为聚乙烯、聚丙烯、聚苯乙烯、聚对苯二甲酸乙二醇、聚对萘二甲酸乙二醇脂、聚酰亚胺中的一种。
  15. 根据权利要求14所述的用丝网印刷机制作柔性面板的方法，其中，所述胶材材料为聚酰亚胺。
  16. 根据权利要求9项所述的用丝网印刷机制作柔性面板的方法，其中，所述柔性基板的厚度范围为20-400微米。
  17. 根据权利要求16项所述的用丝网印刷机制作柔性面板的方法，其中，所述柔性基板的厚度范围为50-100微米。
  18. 根据权利要求11所述的用丝网印刷机制作柔性面板的方法，其中，所述开口区的面积为6-10000平方厘米。
  19. 根据权利要求11所述的用丝网印刷机制作柔性面板的方法，其中，相邻两个所述开口区之间的间隔为5-100毫米。
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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109304950B (zh) * 2017-07-26 2021-06-25 天津环鑫科技发展有限公司 一种硅片沟槽内丝网印刷工艺
CN109610003A (zh) * 2019-01-02 2019-04-12 天津大学 一种新型可控有机晶体生长设备及其制备有机单晶的方法
CN111258102B (zh) * 2020-03-19 2022-07-12 江门亿都半导体有限公司 一种液晶显示器的制作方法
CN119343017A (zh) * 2023-07-20 2025-01-21 南京工业大学 一种丝网印刷制备柔性钙钛矿太阳能电池基底的方法及柔性钙钛矿太阳能电池
CN118700690B (zh) * 2024-08-23 2024-11-22 苏州迈为科技股份有限公司 一种基材的印刷方法及太阳能电池的印刷设备

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003107519A (ja) * 2001-10-01 2003-04-09 Matsushita Electric Ind Co Ltd 駆動回路内蔵型ｔｆｔ液晶表示装置及びその製造方法
CN101470345A (zh) * 2007-12-28 2009-07-01 比亚迪股份有限公司 一种采用网版印制cd纹的方法
CN102336051A (zh) * 2011-08-11 2012-02-01 南昌大学 一种太阳能电池丝网印刷装置
CN102700238A (zh) * 2012-06-06 2012-10-03 卢宇男 一种承印物印刷机及其工作方法
CN102983085A (zh) * 2012-11-05 2013-03-20 江苏威纳德照明科技有限公司 电子器件的封装方法
CN105098102A (zh) * 2015-08-13 2015-11-25 京东方科技集团股份有限公司 一种印刷玻璃胶的装置及方法

Family Cites Families (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5680814A (en) * 1996-02-20 1997-10-28 Delco Electronics Corp. Squeegee device for screen printing processes
JP3558463B2 (ja) * 1996-09-06 2004-08-25 松下電器産業株式会社 印刷方法及び印刷機
US6138562A (en) * 1998-01-20 2000-10-31 Hertz; Allen D. Vibrational energy waves for assist in the print release process for screen printing
JP2000263752A (ja) * 1999-01-11 2000-09-26 Micro Tekku Kk スクリーン印刷機及びスクリーン印刷方法
EP1203662B1 (en) * 1999-07-26 2010-12-15 Panasonic Corporation Solder-paste printing device and printing method
GB2360252B (en) * 2000-03-07 2002-07-24 Matsushita Electric Industrial Co Ltd Screen printing method
JP4080148B2 (ja) * 2000-07-11 2008-04-23 松下電器産業株式会社 スクリーン印刷装置およびスクリーン印刷装置用のペースト貯溜容器
JP3820892B2 (ja) * 2001-02-09 2006-09-13 ミナミ株式会社 スクリーン印刷装置
JP3996535B2 (ja) * 2003-03-20 2007-10-24 Ｎｅｃ液晶テクノロジー株式会社 液晶表示装置
US7171897B2 (en) * 2003-06-05 2007-02-06 Georgia Tech Research Corporation System and methods for data-driven control of manufacturing processes
JP2005067005A (ja) * 2003-08-22 2005-03-17 Sony Corp スクリーン印刷装置
US7452786B2 (en) * 2004-06-29 2008-11-18 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing thin film integrated circuit, and element substrate
US7927971B2 (en) * 2004-07-30 2011-04-19 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US7416928B2 (en) * 2004-09-08 2008-08-26 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device
US7566633B2 (en) * 2005-02-25 2009-07-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US7588969B2 (en) * 2005-05-31 2009-09-15 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device, and semiconductor device
US7651932B2 (en) * 2005-05-31 2010-01-26 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing antenna and method for manufacturing semiconductor device
KR20060124940A (ko) * 2005-06-01 2006-12-06 삼성전자주식회사 가요성 표시 장치의 제조 방법
US7485511B2 (en) * 2005-06-01 2009-02-03 Semiconductor Energy Laboratory Co., Ltd. Integrated circuit device and method for manufacturing integrated circuit device
US7727859B2 (en) * 2005-06-30 2010-06-01 Semiconductor Energy Laboratory Co., Ltd Semiconductor device and manufacturing method thereof
CN101916763B (zh) * 2005-09-30 2012-11-14 株式会社半导体能源研究所 半导体器件的制造方法
KR20070047114A (ko) * 2005-11-01 2007-05-04 주식회사 엘지화학 플렉서블 기판을 구비한 소자의 제조방법 및 이에 의해제조된 플렉서블 기판을 구비한 소자
TW201002528A (en) * 2008-07-02 2010-01-16 Atma Champ Entpr Corp Contactless screen printing method and equipment thereof
WO2010018756A1 (ja) * 2008-08-11 2010-02-18 シャープ株式会社 電気回路構造体
TWI419091B (zh) * 2009-02-10 2013-12-11 財團法人工業技術研究院 可轉移的可撓式電子裝置結構及可撓式電子裝置的製造方法
JP2010256769A (ja) * 2009-04-28 2010-11-11 Nippon Seiki Co Ltd 発光表示装置
KR101149433B1 (ko) * 2009-08-28 2012-05-22 삼성모바일디스플레이주식회사 플렉서블 표시 장치 및 그 제조 방법
WO2011107982A1 (en) * 2010-03-01 2011-09-09 Noa Habas Visual and tactile display
KR101097344B1 (ko) * 2010-03-09 2011-12-23 삼성모바일디스플레이주식회사 플렉서블 디스플레이 장치의 제조 방법
TWI470704B (zh) * 2010-07-14 2015-01-21 財團法人工業技術研究院 環境敏感電子元件的封裝方法
US20120042795A1 (en) * 2010-08-23 2012-02-23 Preco, Inc. Method and apparatus for printing on a substrate
CN202439339U (zh) * 2012-03-08 2012-09-19 珠海市英诚电子科技有限公司 一种带气动可调节丝印装置
KR101879831B1 (ko) * 2012-03-21 2018-07-20 삼성디스플레이 주식회사 플렉시블 표시 장치, 유기 발광 표시 장치 및 플렉시블 표시 장치용 원장 기판
JP2014004819A (ja) * 2012-05-28 2014-01-16 Hitachi High-Technologies Corp パターン形成方法及びその形成装置
JP2014075253A (ja) * 2012-10-04 2014-04-24 Nitto Denko Corp 有機エレクトロルミネッセンス装置の製造方法
US9484610B2 (en) * 2012-12-20 2016-11-01 Telekom Malaysia Berhad Processes for forming waveguides using LTCC substrates
KR102132882B1 (ko) * 2012-12-20 2020-07-13 삼성디스플레이 주식회사 박막트랜지스터 기판, 이를 구비하는 유기 발광 장치, 박막트랜지스터 기판 제조방법 및 유기 발광 장치 제조방법
MY163051A (en) * 2012-12-20 2017-08-15 Telekom Malaysia Berhad Method of screen printing on low temperature co-fired ceramic (ltcc) tape
CN103531722B (zh) * 2012-12-24 2016-01-20 Tcl集团股份有限公司 一种柔性显示器的制备方法
CA2910431C (en) * 2013-04-26 2017-07-11 Nissan Motor Co., Ltd. Screen printing apparatus with ink recovery mechanism and related method
KR102113687B1 (ko) * 2013-05-13 2020-05-22 삼성디스플레이 주식회사 스크린 인쇄 장치 및 그것을 이용한 스크린 인쇄 방법
KR102133433B1 (ko) * 2013-05-24 2020-07-14 삼성디스플레이 주식회사 유기 발광 표시 장치, 이를 포함하는 전자 기기, 및 유기 발광 표시 장치의 제조 방법
KR102134845B1 (ko) * 2013-07-12 2020-07-17 삼성디스플레이 주식회사 유기 발광 디스플레이 장치와, 이의 제조 방법
KR102255196B1 (ko) * 2014-02-03 2021-05-25 삼성디스플레이 주식회사 플렉서블 디스플레이 장치 및 그 제조 방법
JP2015194515A (ja) * 2014-03-31 2015-11-05 ソニー株式会社 表示装置および表示装置の製造方法
US9789682B2 (en) * 2014-05-19 2017-10-17 Nissan Motor Co., Ltd. Metal mask and screen printing apparatus
CN104022062B (zh) * 2014-06-12 2016-08-17 京东方科技集团股份有限公司 一种柔性显示面板的制备方法
KR20170039306A (ko) * 2014-08-14 2017-04-10 광주과학기술원 직교 패터닝 방법
US20160107926A1 (en) * 2014-10-20 2016-04-21 Shenzhen China Star Optelectronics Technology Co., Ltd Manufacturing method of flexible substrate
JP5715731B1 (ja) * 2014-11-12 2015-05-13 アサヒテック株式会社 スクリーン印刷用マスク及びその製造方法
US10192950B2 (en) * 2015-01-06 2019-01-29 Samsung Electronics Co., Ltd. Display module and multi-display device including the same
JP6471062B2 (ja) * 2015-07-23 2019-02-13 本田技研工業株式会社 印刷装置
CN105682926B (zh) * 2015-09-15 2018-02-02 京东方科技集团股份有限公司 丝网印刷网板、其相关制造方法及封装方法
KR102415326B1 (ko) * 2015-10-29 2022-06-30 삼성디스플레이 주식회사 플렉서블 표시 장치 및 플렉서블 표시 장치의 제조 방법
CN205220031U (zh) * 2015-12-17 2016-05-11 昆山国显光电有限公司 一种回墨刀
WO2017115225A2 (en) * 2015-12-28 2017-07-06 Semiconductor Energy Laboratory Co., Ltd. Flexible device, display device, and manufacturing methods thereof
CN105633281B (zh) * 2016-01-06 2018-07-17 京东方科技集团股份有限公司 一种柔性显示面板及其封装方法、显示装置
KR102548461B1 (ko) * 2016-06-10 2023-06-28 삼성디스플레이 주식회사 표시장치 및 이의 제조방법
WO2018020333A1 (en) * 2016-07-29 2018-02-01 Semiconductor Energy Laboratory Co., Ltd. Separation method, display device, display module, and electronic device
TWI753868B (zh) * 2016-08-05 2022-02-01 日商半導體能源研究所股份有限公司 剝離方法、顯示裝置、顯示模組及電子裝置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003107519A (ja) * 2001-10-01 2003-04-09 Matsushita Electric Ind Co Ltd 駆動回路内蔵型ｔｆｔ液晶表示装置及びその製造方法
CN101470345A (zh) * 2007-12-28 2009-07-01 比亚迪股份有限公司 一种采用网版印制cd纹的方法
CN102336051A (zh) * 2011-08-11 2012-02-01 南昌大学 一种太阳能电池丝网印刷装置
CN102700238A (zh) * 2012-06-06 2012-10-03 卢宇男 一种承印物印刷机及其工作方法
CN102983085A (zh) * 2012-11-05 2013-03-20 江苏威纳德照明科技有限公司 电子器件的封装方法
CN105098102A (zh) * 2015-08-13 2015-11-25 京东方科技集团股份有限公司 一种印刷玻璃胶的装置及方法

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