WO2017166344A1 - 叠层柔性基板及制作方法 - Google Patents

叠层柔性基板及制作方法 Download PDF

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Publication number
WO2017166344A1
WO2017166344A1 PCT/CN2016/080029 CN2016080029W WO2017166344A1 WO 2017166344 A1 WO2017166344 A1 WO 2017166344A1 CN 2016080029 W CN2016080029 W CN 2016080029W WO 2017166344 A1 WO2017166344 A1 WO 2017166344A1
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Prior art keywords
organic layer
layer
grooves
flexible substrate
inorganic
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Ceased
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PCT/CN2016/080029
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English (en)
French (fr)
Inventor
刘哲
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Wuhan China Star Optoelectronics Technology Co Ltd
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Wuhan China Star Optoelectronics Technology Co Ltd
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Priority to US15/302,961 priority Critical patent/US20180104915A1/en
Publication of WO2017166344A1 publication Critical patent/WO2017166344A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/04—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
    • B29C59/046—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts for layered or coated substantially flat surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/12—Making multilayered or multicoloured articles
    • B29C39/123—Making multilayered articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C69/00—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore
    • B29C69/02—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore of moulding techniques only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/263—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer having non-uniform thickness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2079/00—Use of polymers having nitrogen, with or without oxygen or carbon only, in the main chain, not provided for in groups B29K2061/00 - B29K2077/00, as moulding material
    • B29K2079/08—PI, i.e. polyimides or derivatives thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3475—Displays, monitors, TV-sets, computer screens
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to the field of display, and in particular to a laminated flexible substrate and a method of fabricating the same.
  • the structural design of the laminate is usually used (stacked flexible Substrate), that is, using an "organic-inorganic-organic-inorganic" multilayer overlapping film as a flexible substrate to improve the ability of the display substrate to block water oxygen.
  • stacked flexible Substrate used as a flexible substrate to improve the ability of the display substrate to block water oxygen.
  • An object of the present invention is to provide a laminated flexible substrate and a manufacturing method thereof, which solve the problem of film surface damage caused by stress deposition of the conventional inorganic film.
  • Embodiments of the present invention provide a method for fabricating a laminated flexible substrate, including the following steps:
  • the substrate is peeled off from the first organic layer.
  • the plurality of first grooves have the same depth, and the first inorganic layer has a uniform thickness; the plurality of second grooves have the same depth, and the first The thickness of the two inorganic layers is uniform.
  • the plurality of first grooves respectively correspond to the plurality of second grooves, and each of the first grooves is opposite to the corresponding second groove.
  • the shape and size are the same.
  • the first organic layer, the second organic layer, and the flat layer are each a polyimide fiber layer.
  • the plurality of first grooves are arranged in a rectangular array, and the plurality of second grooves are arranged in a rectangular array.
  • the step of forming a plurality of first grooves on the first organic layer comprises:
  • a patterning process is performed on the first organic layer by a roll-to-roll embossing process to form the plurality of first grooves.
  • the step of forming a plurality of second grooves on the second organic layer comprises:
  • a patterning process is performed on the second organic layer by roll-to-roll imprinting to form the plurality of second grooves.
  • the invention also provides a laminated flexible substrate comprising:
  • first inorganic layer deposited on the first organic layer, the first inorganic layer having a maximum thickness less than a minimum depth of the first groove;
  • the first organic layer, the second organic layer, and the flat layer are each a polyimide fiber layer.
  • the plurality of first grooves are arranged in a rectangular array
  • the plurality of second grooves are arranged in a rectangular array.
  • the laminated flexible substrate and the manufacturing method provided by the present invention form a plurality of first grooves and second grooves by patterning on the first organic layer and the second organic layer, so that the laminate
  • the physical length of the actual cumulative stress in the direction of the applied force is reduced, which reduces the probability of stress accumulation; and since the first organic layer and the second organic layer can be contacted through the inner side wall of the first groove, The second organic layer and the flat layer may be in contact through the inner sidewall of the second groove, increasing the adhesion between the organic layers, reducing the possibility of film surface peeling in subsequent processes; and
  • the inorganic "patterned structure" increases the actual flexibility of the laminated flexible substrate, and can realize the bending of the display substrate with a smaller radius of curvature.
  • FIG. 1 is a schematic structural view of a preferred embodiment of a laminated flexible substrate of the present invention
  • FIG. 2 is a schematic structural view of another preferred embodiment of the laminated flexible substrate of the present invention.
  • FIG. 3 is a flow chart of a preferred embodiment of a method of fabricating a laminated flexible substrate of the present invention
  • 4A-4H are schematic views showing the fabrication of a preferred embodiment of a method for fabricating a laminated flexible substrate of the present invention.
  • FIG. 1 is a schematic structural view of a preferred embodiment of a laminated flexible substrate according to the present invention.
  • the laminated flexible substrate of the preferred embodiment includes a first organic layer 10, a first inorganic layer 20, a second organic layer 30, a second inorganic layer 40, and a flat layer 50.
  • the first organic layer 10 is a polyimide fiber layer, and is patterned by an imprint method to form a plurality of first grooves 11 on the first organic layer 10; the imprint method can be adopted.
  • Micro/nano Micro/Nano Imprint
  • the depth and shape of the plurality of first grooves 11 are the same, and may of course be different.
  • the plurality of first grooves 11 are arranged in a rectangular array.
  • a first inorganic layer 20 is deposited on the first organic layer 10, which can be obtained by a thin film deposition method.
  • the maximum thickness of the first inorganic layer 20 is smaller than the minimum depth of the first groove 11, so that the first organic layer 10 and the second organic layer 30 can be contacted through the side wall faces of the first grooves 11.
  • the thickness of the first inorganic layer 20 is uniform and equal throughout.
  • the second organic layer 30 is a polyimide fiber layer deposited on the first inorganic layer 20, and the second organic layer 30 is patterned by an imprint method to form a plurality of second grooves 31.
  • the imprint method can be micro/nano (Macro/Nano) Imprint) The method of imprinting, or the "roll-to-roll" imprinting method.
  • the plurality of second grooves 31 have the same depth and shape, and the plurality of second grooves 31 are arranged in a rectangular array.
  • a second inorganic layer 40 is deposited on the second organic layer 30, which can be obtained by a thin film deposition method.
  • the maximum thickness of the second inorganic layer 40 is smaller than the minimum depth of the second groove 31, so that the flat layer 50 and the second organic layer 30 can be contacted through the side wall faces of the second grooves 31.
  • the thickness of the second inorganic layer 40 is uniform and equal throughout.
  • the flat layer 50 is a polyimide fiber layer deposited on the second inorganic layer 40.
  • the laminated flexible substrate in the preferred embodiment forms a plurality of first grooves 11 and second grooves 31 by patterning on the first organic layer 10 and the second organic layer 30, so that when the laminated flexible substrate is bent
  • the physical length of the actual cumulative stress in the direction of the applied force is reduced, reducing the probability of stress accumulation; and since the first organic layer 10 and the second organic layer 30 can be contacted through the inner side wall of the first groove 11,
  • the two organic layer 30 and the flat layer 50 may be in contact through the inner side wall of the second groove 31, which increases the adhesion between the organic layers, reduces the possibility of film surface peeling in subsequent processes;
  • the organic-inorganic "patterned structure" increases the actual flexibility of the laminated flexible substrate, and can achieve bending of the display substrate with a smaller radius of curvature.
  • the plurality of first grooves 11 are arranged in a rectangular array, and the plurality of second grooves 31 are arranged in a rectangular array.
  • the patterning process on the first organic layer 10 is the same as the pattern on the second organic layer 30. That is, the plurality of first grooves 11 are respectively in one-to-one correspondence with the plurality of second grooves 31, and each of the first grooves 11 is opposite to the corresponding second groove 31 and has the same shape and size.
  • the pattern obtained by the patterning process on the first organic layer 10 and the pattern on the second organic layer 30 may be different, and the plurality of first grooves 11 respectively
  • the plurality of second grooves 31 are in one-to-one correspondence, and each of the first grooves 11 is offset from the corresponding second groove 31 and has the same shape and size.
  • FIG. 3 is a flow chart of a preferred embodiment of a method for fabricating a laminated flexible substrate according to the present invention.
  • the manufacturing method of the laminated flexible substrate comprises the following steps:
  • the first organic layer 10 is a polyimide fiber layer.
  • the step of forming a plurality of first grooves on the first organic layer includes:
  • a patterning process is performed on the first organic layer 10 by imprinting to form the plurality of first grooves 11.
  • This imprint method can be used in micro/nano (Macro/Nano) Imprint) The method of imprinting, or the "roll-to-roll” imprinting method.
  • the plurality of first grooves 11 have the same depth and shape, and the plurality of first grooves 11 are arranged in a rectangular array. As shown in FIG. 4A and FIG. 4B, the process goes to step S302.
  • step S302 when the first inorganic layer 20 is deposited on the first organic layer 10, it can be obtained by a method of thin film deposition.
  • the maximum thickness of the first inorganic layer 20 is smaller than the minimum depth of the first groove 11, so that the first organic layer 10 and the second organic layer 30 can be contacted through the side wall faces of the first grooves 11.
  • the thickness of the first inorganic layer 20 is uniform and equal throughout. As shown in FIG. 4C, the process goes to step S303.
  • the second organic layer 30 is a polyimide fiber layer deposited on the first inorganic layer 20, and the second organic layer 30 is patterned by an imprint method to form a plurality of layers.
  • Second groove 31; the imprint method can be micro/nano (Macro/Nano Imprint) The method of imprinting, or the "roll-to-roll" imprinting method.
  • the plurality of second grooves 31 have the same depth and shape, and the plurality of second grooves 31 are arranged in a rectangular array. As shown in FIG. 4D and FIG. 4E, the process goes to step S304.
  • a second inorganic layer 40 is deposited on the second organic layer 30, which can be obtained by a thin film deposition method.
  • the maximum thickness of the second inorganic layer 40 is smaller than the minimum depth of the second groove 31, so that the flat layer 50 and the second organic layer 30 can be contacted through the side wall faces of the second grooves 31.
  • the thickness of the second inorganic layer 40 is uniform and equal throughout. As shown in FIG. 4F, the process goes to step S305.
  • step S305 the flat layer 50 is a polyimide fiber layer. As shown in FIG. 4G, the process goes to step S306.
  • step S306 the substrate 100 is peeled off from the first organic layer 10 of the laminated flexible substrate by a Laser-Lift-Off process. As shown in Figure 4H.
  • a display layer is provided on the flat layer 50 to form a flexible display panel having the laminated flexible substrate.
  • the method for fabricating the laminated flexible substrate in the preferred embodiment forms a plurality of first grooves 11 and second grooves 31 by patterning on the first organic layer 10 and the second organic layer 30, so that the laminate is flexible When the base is bent, the physical length of the actual cumulative stress in the direction of the applied force is reduced, the probability of stress accumulation is lowered; and since the first organic layer 10 and the second organic layer 30 can pass through the inner side wall of the first groove 11 Contact, the second organic layer 30 and the flat layer 50 may be contacted through the inner sidewall of the second groove 31, increasing the adhesion between the organic layers, reducing the possibility of film surface peeling in subsequent processes; Due to the "organic-inorganic" patterned structure, the actual flexibility of the laminated flexible substrate is increased, and the bending of the display substrate with a smaller radius of curvature can be achieved.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)

Abstract

一种叠层柔性基板及制作方法，该制作方法包括以下步骤：在基板（100）上涂布第一有机涂层（10），并在第一有机层（10）上形成多个第一凹槽（11）；在第一有机层（10）上沉积第一无机层（20）；在第一无机层（20）上沉积第二有机层（30），并在第二有机层（30）上形成多个第二凹槽（31）；在第二有机层（30）上沉积第二无机层（40）；在第二无机层（40）上涂布平坦层（50）；将基板（100）与第一有机层（10）剥离。

Description

叠层柔性基板及制作方法 技术领域
本发明涉及显示领域，特别是涉及一种叠层柔性基板及制作方法。
 背景技术
在柔性显示面板中，通常使用叠层的结构设计（stacked flexible substrate），即利用“有机-无机-有机-无机”多层交叠的薄膜作为柔性基底来提高显示基板阻隔水氧的能力。在目前的叠层柔性基底中，可能会出现：①无机薄膜应力堆积造成的膜面破损；②有机无机薄膜界面黏合力不够引起的膜面误剥离问题。
因此，现有技术存在缺陷，急需改进。
 技术问题
本发明的目的在于提供一种叠层柔性基板及制作方法；以解决现有的无机薄膜应力堆积造成的膜面破损问题。
 技术解决方案
本发明实施例提供一种叠层柔性基板的制作方法,包括以下步骤：
在基板上涂布第一有机层，并在第一有机层上形成多个第一凹槽；
在第一有机层上沉积第一无机层，该第一无机层的最大厚度小于第一凹槽的最小深度；
在第一无机层上沉积第二有机层，并在第二有机层上形成多个第二凹槽；
在第二有机层上沉积第二无机层，该第二无机层的最大厚度小于第二凹槽的最小深度；
在第二无机层上涂布平坦层；
将基板与第一有机层剥离。
在本发明所述的叠层柔性基板的制作方法中，该多个第一凹槽的深度相同，且该第一无机层的厚度均匀；该多个第二凹槽的深度相同，且该第二无机层的厚度均匀。
在本发明所述的叠层柔性基板的制作方法中，该多个第一凹槽分别与该多个第二凹槽一一对应，每一第一凹槽与对应的第二凹槽正对且形状和大小相同。
在本发明所述的叠层柔性基板的制作方法中，所述第一有机层、第二有机层以及所述平坦层均为聚酰亚胺纤维层。
在本发明所述的叠层柔性基板的制作方法中，该多个第一凹槽按照矩形阵列排布，该多个第二凹槽按照矩形阵列排布。
在本发明所述的叠层柔性基板的制作方法中，所述在第一有机层上形成多个第一凹槽的步骤包括：
通过卷对卷压印的方法在该第一有机层上进行图案化处理，以形成该多个第一凹槽。
在本发明所述的叠层柔性基板的制作方法中，所述在第二有机层上形成多个第二凹槽的步骤包括：
通过卷对卷压印的方法在该第二有机层上进行图案化处理，以形成该多个第二凹槽。
本发明还提供了一种叠层柔性基板，包括：
第一有机层，其上形成多个第一凹槽；
第一无机层，其沉积于该第一有机层上，该第一无机层的最大厚度小于第一凹槽的最小深度；
第二有机层，其沉积于该第一无机层上，该第二有机层上形成有多个第二凹槽；
第二无机层，其沉积于该第二有机层上，该第二无机层的最大厚度小于第二凹槽的最小深度；
平坦层，其沉积于该第二无机层上。
在本发明所述的叠层柔性基板中，所述第一有机层、第二有机层以及所述平坦层均为聚酰亚胺纤维层。
在本发明所述的叠层柔性基板中，该多个第一凹槽按照矩形阵列排布，该多个第二凹槽按照矩形阵列排布。
 有益效果
相较于现有技术，本发明提供的叠层柔性基板及制作方法通过在第一有机层以及第二有机层上进行图形化处理形成多个第一凹槽以及第二凹槽，使得叠层柔性基弯曲时，在施力方向上的实际累积应力的物理长度减小，降低了应力堆积的几率；并且由于第一有机层与第二有机层可以通过第一凹槽的内侧壁进行接触，第二有机层和平坦层可以通过第二凹槽的内侧壁进行接触，增加了有机层之间的粘附力，减小了后续制程中的膜面脱落的可能性；并且由于采用“有机-无机”图案化的结构，增加了该叠层柔性基板实际的柔韧度，可实现显示基板更小曲率半径的弯折。
 附图说明
图1为本发明的叠层柔性基板的优选实施例的结构示意图；
图2为本发明的叠层柔性基板的另一优选实施例的结构示意图；
图3为本发明叠层柔性基板的制作方法的优选实施例的流程图；
图4A-图4H为本发明叠层柔性基板的制作方法的优选实施例的制作示意图。
 本发明的最佳实施方式
以下各实施例的说明是参考附加的图式，用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语，例如「上」、「下」、「前」、「后」、「左」、「右」、「内」、「外」、「侧面」等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。
在图中，结构相似的单元是以相同标号表示。
请参照图1，图1为本发明的叠层柔性基板的优选实施例的结构示意图。本优选实施例的叠层柔性基板包括：第一有机层10、第一无机层20、第二有机层30、第二无机层40以及平坦层50。
其中，第一有机层10为聚酰亚胺纤维层，其上采用压印方法进行图形化处理，以在该第一有机层10上形成多个第一凹槽11；该压印方法可以采用微米/纳米（Macro/Nano imprint）压印的方法，或者“卷对卷（roll-to-roll）”压印的方法。优选地，在本实施例中，该多个第一凹槽11的深度及形状相同，当然也可以不同。而且，该多个第一凹槽11呈矩形阵列排布。
第一无机层20沉积于该第一有机层10上，其可通过薄膜沉积的方法得到。该第一无机层20的最大厚度小于第一凹槽11的最小深度，从而使得第一有机层10和第二有机层30可以通过第一凹槽11的侧壁面进行接触。在本实施例中该第一无机层20各处的厚度均匀且相等。
第二有机层30为聚酰亚胺纤维层，其沉积于该第一无机层20上，该第二有机层30上采用压印方法进行图形化处理，以形成有多个第二凹槽31；该压印方法可以采用微米/纳米（Macro/Nano imprint）压印的方法，或者“卷对卷（roll-to-roll）”压印的方法。优选地，在本实施例中，该多个第二凹槽31的深度以及形状相同，而且，该多个第二凹槽31呈矩形阵列排布。
第二无机层40沉积于该第二有机层30上，其可通过薄膜沉积的方法得到。该第二无机层40的最大厚度小于第二凹槽31的最小深度，从而使得平坦层50和第二有机层30可以通过第二凹槽31的侧壁面进行接触。在本实施例中该第二无机层40各处的厚度均匀且相等。
该平坦层50为聚酰亚胺纤维层，其沉积于该第二无机层40上。
本优选实施例中的叠层柔性基板通过在第一有机层10以及第二有机层30上进行图形化处理形成多个第一凹槽11以及第二凹槽31，使得叠层柔性基弯曲时，在施力方向上的实际累积应力的物理长度减小，降低了应力堆积的几率；并且由于第一有机层10与第二有机层30可以通过第一凹槽11的内侧壁进行接触，第二有机层30和平坦层50可以通过第二凹槽31的内侧壁进行接触，增加了有机层之间的粘附力，减小了后续制程中的膜面脱落的可能性；并且由于采用“有机-无机”图案化的结构，增加了该叠层柔性基板实际的柔韧度，可实现显示基板更小曲率半径的弯折。
优选地，该多个第一凹槽11按照矩形阵列排布，该多个第二凹槽31按照矩形阵列排布。
该第一有机层10上的图形化处理得到的图案与第二有机层30上的图案相同。也即是，该多个第一凹槽11分别与该多个第二凹槽31一一对应，每一第一凹槽11与对应的第二凹槽31正对且形状和大小相同。
当然，可以理解地，如图2所示，该第一有机层10上的图形化处理得到的图案与第二有机层30上的图案可以不相同，该多个第一凹槽11分别与该多个第二凹槽31一一对应，每一第一凹槽11与对应的第二凹槽31错开，且形状和大小相同。
请参照图3，图3为本发明的叠层柔性基板的制作方法的优选实施例的流程图。该叠层柔性基板的制作方法包括以下步骤：
S301，在基板上涂布第一有机层，并在第一有机层上形成多个第一凹槽；
S302，在第一有机层上沉积第一无机层，该第一无机层的最大厚度小于第一凹槽的最小深度；
S303，在第一无机层上沉积第二有机层，并在第二有机层上形成多个第二凹槽；
S304，在第二有机层上沉积第二无机层，该第二无机层的最大厚度小于第二凹槽的最小深度；
S305，在第二无机层上涂布平坦层；
S306，将基板与第一有机层剥离。
下面结合图4A-图4F对该方法的各个步骤进行详细说明。
在步骤S301中，该第一有机层10为聚酰亚胺纤维层。该在第一有机层上形成多个第一凹槽的步骤包括：
通过压印法在该第一有机层10上进行图案化处理，以形成该多个第一凹槽11。该压印方法可以采用微米/纳米（Macro/Nano imprint）压印的方法，或者“卷对卷（roll-to-roll）”压印的方法。优选地，在本实施例中，该多个第一凹槽11的深度及形状相同，而且，该多个第一凹槽11呈矩形阵列排布。如图4A以及图4B所示，转至步骤S302。
在步骤S302中，在第一有机层10上沉积第一无机层20时，可以采用其可通过薄膜沉积的方法得到。该第一无机层20的最大厚度小于第一凹槽11的最小深度，从而使得第一有机层10和第二有机层30可以通过第一凹槽11的侧壁面进行接触。在本实施例中该第一无机层20各处的厚度均匀且相等。如图4C所示，转至步骤S303。
在步骤S303中，第二有机层30为聚酰亚胺纤维层，其沉积于该第一无机层20上，该第二有机层30上采用压印方法进行图形化处理，以形成有多个第二凹槽31；该压印方法可以采用微米/纳米（Macro/Nano imprint）压印的方法，或者“卷对卷（roll-to-roll）”压印的方法。优选地，在本实施例中，该多个第二凹槽31的深度以及形状相同，而且，该多个第二凹槽31呈矩形阵列排布。如图4D以及图4E所示，转至步骤S304。
在步骤S304中，第二无机层40沉积于该第二有机层30上，其可通过薄膜沉积的方法得到。该第二无机层40的最大厚度小于第二凹槽31的最小深度，从而使得平坦层50和第二有机层30可以通过第二凹槽31的侧壁面进行接触。在本实施例中该第二无机层40各处的厚度均匀且相等。如图4F所示，转至步骤S305。
在步骤S305中，该平坦层50为聚酰亚胺纤维层。如图4G所示，转至步骤S306。
在步骤S306中，采用用Laser-Lift-Off工艺将基板100与叠层柔性基板的第一有机层10进行剥离。如图4H所示。
在完成该步骤S306之后，在该平坦层50上设置显示器层即可制成具有该叠层柔性基板的柔性显示面板。
本优选实施例中的叠层柔性基板的制作方法通过在第一有机层10以及第二有机层30上进行图形化处理形成多个第一凹槽11以及第二凹槽31，使得叠层柔性基弯曲时，在施力方向上的实际累积应力的物理长度减小，降低了应力堆积的几率；并且由于第一有机层10与第二有机层30可以通过第一凹槽11的内侧壁进行接触，第二有机层30和平坦层50可以通过第二凹槽31的内侧壁进行接触，增加了有机层之间的粘附力，减小了后续制程中的膜面脱落的可能性；并且由于采用“有机-无机”图案化的结构，增加了该叠层柔性基板实际的柔韧度，可实现显示基板更小曲率半径的弯折。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。

Claims (11)

  1. 一种叠层柔性基板的制作方法,其中，包括以下步骤：
    在基板上涂布第一有机层，并在第一有机层上形成多个第一凹槽；
    在第一有机层上沉积第一无机层，该第一无机层的最大厚度小于第一凹槽的最小深度；
    在第一无机层上沉积第二有机层，并在第二有机层上形成多个第二凹槽；
    在第二有机层上沉积第二无机层，该第二无机层的最大厚度小于第二凹槽的最小深度；
    在第二无机层上涂布平坦层；
    将基板与第一有机层剥离。
  2. 根据权利要求1所述的叠层柔性基板的制作方法,其中，该多个第一凹槽的深度相同，且该第一无机层的厚度均匀；该多个第二凹槽的深度相同，且该第二无机层的厚度均匀。
  3. 根据权利要求2所述的叠层柔性基板的制作方法,其中，该多个第一凹槽分别与该多个第二凹槽一一对应，每一第一凹槽与对应的第二凹槽正对且形状和大小相同。
  4. 根据权利要求1所述的叠层柔性基板的制作方法,其中，所述第一有机层、第二有机层以及所述平坦层均为聚酰亚胺纤维层。
  5. 根据权利要求1所述的叠层柔性基板的制作方法,其中，该多个第一凹槽按照矩形阵列排布，该多个第二凹槽按照矩形阵列排布。
  6. 根据权利要求1所述的叠层柔性基板的制作方法,其中，所述在第一有机层上形成多个第一凹槽的步骤包括：
    通过卷对卷压印的方法在该第一有机层上进行图案化处理，以形成该多个第一凹槽。
  7. 根据权利要求1所述的叠层柔性基板的制作方法,其中，所述在第二有机层上形成多个第二凹槽的步骤包括：
    通过卷对卷压印的方法在该第二有机层上进行图案化处理，以形成该多个第二凹槽。
  8. 一种叠层柔性基板，其中，包括：
    第一有机层，其上形成多个第一凹槽；
    第一无机层，其沉积于该第一有机层上，该第一无机层的最大厚度小于第一凹槽的最小深度；
    第二有机层，其沉积于该第一无机层上，该第二有机层上形成有多个第二凹槽；
    第二无机层，其沉积于该第二有机层上，该第二无机层的最大厚度小于第二凹槽的最小深度；
    平坦层，其沉积于该第二无机层上。
  9. 根据权利要求8所述的叠层柔性基板，其中，所述第一有机层、第二有机层以及所述平坦层均为聚酰亚胺纤维层。
  10. 根据权利要求8所述的叠层柔性基板，其中，该多个第一凹槽按照矩形阵列排布，该多个第二凹槽按照矩形阵列排布。
  11. 一种叠层柔性基板，其中，包括：
    第一有机层，其上形成多个第一凹槽；
    第一无机层，其沉积于该第一有机层上，该第一无机层的最大厚度小于第一凹槽的最小深度；
    第二有机层，其沉积于该第一无机层上，该第二有机层上形成有多个第二凹槽；
    第二无机层，其沉积于该第二有机层上，该第二无机层的最大厚度小于第二凹槽的最小深度；
    平坦层，其沉积于该第二无机层上；
    该多个第一凹槽的深度相同，且该第一无机层的厚度均匀；该多个第二凹槽的深度相同，且该第二无机层的厚度均匀
    该多个第一凹槽分别与该多个第二凹槽一一对应，每一第一凹槽与对应的第二凹槽正对且形状和大小相同；
    所述第一有机层、第二有机层以及所述平坦层均为聚酰亚胺纤维层。
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