WO2019010749A1 - 显示面板及其制备方法、显示器 - Google Patents

显示面板及其制备方法、显示器 Download PDF

Info

Publication number
WO2019010749A1
WO2019010749A1 PCT/CN2017/097754 CN2017097754W WO2019010749A1 WO 2019010749 A1 WO2019010749 A1 WO 2019010749A1 CN 2017097754 W CN2017097754 W CN 2017097754W WO 2019010749 A1 WO2019010749 A1 WO 2019010749A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
display panel
flexible substrate
display
base substrate
Prior art date
Application number
PCT/CN2017/097754
Other languages
English (en)
French (fr)
Inventor
白思航
Original Assignee
武汉华星光电半导体显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Priority to US15/735,879 priority Critical patent/US20200044198A1/en
Publication of WO2019010749A1 publication Critical patent/WO2019010749A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76886—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
    • H01L21/76892—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances modifying the pattern
    • H01L21/76894—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances modifying the pattern using a laser, e.g. laser cutting, laser direct writing, laser repair
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a display panel, a method for fabricating the same, and a display.
  • OLED Organic Light-Emitting Diode
  • display panels are used by more and more intelligent products due to their self-illumination, simple structure, low cost, wide viewing angle, high color saturation, fast response, light weight and high flexibility, such as smart phones, wearable. Devices, etc.
  • OLED Organic Light-Emitting Diode
  • people have higher performance requirements for OLEDs, such as low voltage, high brightness, high efficiency, low energy consumption, long life, high stability and the like. Based on the above requirements for OLEDs, improving the efficiency and stability of OLED devices has become a hot spot of concern.
  • AMOLED active matrix organic light emitting diodes
  • PI polyimide
  • the invention provides a display panel, a preparation method thereof and a display capable of compensating for a warped portion of a flexible substrate edge, so that a surface of the flexible substrate farther away from the substrate substrate is more flat, thereby improving film formation uniformity of the flexible substrate, thereby Improve the stability and yield of flexible display devices.
  • a technical solution adopted by the present invention is to provide a display including a display panel, the method for preparing the display panel includes: providing a substrate; performing graphics at an edge of the substrate Processing to form a base substrate having a recessed structure; depositing a flexible substrate and a laminated structure on the patterned base substrate, the stacked structure including sequentially depositing on the flexible substrate An array layer and an organic light-emitting layer, wherein the flexible substrate is one of polyimide and polyethylene terephthalate; and the base substrate is peeled off to form the display panel.
  • another technical solution adopted by the present invention is to provide a method for preparing a display panel, the method comprising: providing a substrate; performing pattern processing at an edge of the substrate Forming a base substrate having a recessed structure; depositing a flexible substrate and a laminated structure sequentially on the patterned base substrate; and peeling off the base substrate package to form the display panel.
  • a display panel comprising: a flexible substrate having a downward convex structure at an edge thereof; A structure is formed on the flexible substrate, and an encapsulation layer is formed on the laminated structure.
  • the invention has the beneficial effects of providing a display panel, a preparation method thereof and a display.
  • the concave structure can compensate for the warped portion of the edge of the flexible substrate, so that the flexible substrate is far away.
  • the surface of the base substrate is more flat, improving the film formation uniformity of the flexible substrate, thereby improving the stability and yield of the flexible display device, and reducing the coating of a PI film layer compared to the double-layer PI film layer structure.
  • the preparation method is simple in process.
  • FIG. 1 is a schematic flow chart of an embodiment of a method for preparing a display panel of the present invention
  • FIG. 2 is a front elevational view showing an embodiment of a patterned substrate of the present invention
  • FIG. 3 is a top plan view showing an embodiment of a patterned substrate of the present invention.
  • FIG. 4 is a top plan view showing another embodiment of the patterned substrate of the present invention.
  • FIG. 5 is a schematic structural view of an embodiment of a display panel of the present invention.
  • Figure 6 is a block diagram showing an embodiment of a display of the present invention.
  • FIG. 1 is a schematic flow chart of an embodiment of a method for preparing a display panel according to the present invention
  • FIG. 2 is a front view of an embodiment of a patterned substrate substrate according to the present invention
  • 3 is a schematic plan view of an embodiment of a patterned substrate according to the present invention
  • FIG. 4 is a top plan view of another embodiment of the patterned substrate of the present invention.
  • the substrate may be a transparent material, and may be any substrate such as a glass, a ceramic substrate, or a transparent plastic.
  • the present invention is not limited thereto, and in the embodiment, the substrate used is glass substrate.
  • patterning is performed at an edge of the base substrate to form a base substrate having a recessed structure.
  • the edge of the glass substrate is patterned by laser etching so that the edge of the substrate has a recessed structure, as shown in FIG. 2 .
  • the laser etched recessed structure may be a connected channel. See FIG. 3 for details.
  • the connected channel has a square shape, and in other embodiments, may be a circular, elliptical, or rhombic shape. The specific shape is not limited to the present invention.
  • the width and width of the connected channel can be adjusted to accommodate the convex portion of the subsequent flexible substrate. Specifically, if the convex portion of the flexible substrate has a large area, the connecting channel is correspondingly adjusted to be wider to make the flexible substrate flat. If the area of the convex portion of the flexible substrate is small, the communication channel is correspondingly adjusted to be narrower to make the flexible substrate flat.
  • the recessed structure may also be provided as a plurality of spaced holes, as specifically shown in FIG.
  • the recessed structure may be a circular hole which is spaced apart.
  • it may be a square hole, an elliptical hole or the like, which is not specifically limited in the present invention.
  • the spacing between the adjacent circular holes and the size of the circular holes are adjustable to accommodate the convex portion of the subsequent flexible substrate.
  • the spacing between the circular holes is adjusted to make the distribution dense, thereby improving the flatness of the flexible substrate, or adjusting the size of the circular hole to make the adjacent
  • the inter-round holes become larger to improve the flatness of the flexible substrate.
  • the area of the convex portion of the flexible substrate is small, the distance between the corresponding adjustment circular holes is large or the adjustment circular hole becomes small to improve the flatness of the flexible substrate.
  • the specific adjustment of the plurality of pitch-provided holes is not specifically limited in the present invention, and any adjustment method capable of improving the flatness of the subsequent film layer is within the protection scope of the present invention.
  • the recessed structure may be alternately disposed between the communication channel and the plurality of spaced-apart holes, or may be a half-connected channel, and a plurality of spaced-apart holes, and the present invention does not further limited.
  • the substrate may be patterned by wet etching to form a recessed structure.
  • the substrate substrate, and the specific operation method is similar to the above laser etching method, and details are not described herein again.
  • a flexible substrate and a laminated structure are sequentially deposited on the patterned substrate.
  • a flexible substrate is deposited, which may be polyimide (PI) and polyethylene terephthalate (Polyethylene).
  • PI polyimide
  • Polyethylene polyethylene terephthalate
  • PET polyethylene terephthalate
  • the flexible substrate used in this embodiment is PI.
  • the laminated structure may include any existing display structure, such as LED, OLED, LCD, EL, and the like.
  • the stacked structure may include an active array layer and an organic light emitting layer.
  • the active array layer can be prepared by various preparation methods well known in the industry, and the simple fabrication process is described as follows: a barrier layer, a buffer layer, an active layer, a gate insulating layer, a dielectric layer, and the like are sequentially deposited on the flexible substrate.
  • the passivation layer forms an active array layer.
  • the material used for the barrier layer and the buffer layer is at least one of silicon nitride (SiNx) and silicon dioxide (SiO2). Of course, other materials may also be used, and the invention is not specifically limited.
  • the organic light emitting layer used in this embodiment is an OLED display medium, and generally includes: a planarization layer, a pixel definition layer, and an OIED pixel.
  • the substrate After depositing the above-described laminated structure, the substrate is peeled off and packaged to form a display panel.
  • the method further includes preparing a protective film layer on the encapsulation layer after the package is completed. Finally, the packaged display panel is subjected to bending processing and testing.
  • the recess structure by preparing the recess structure at the edge of the substrate substrate, the recess structure can compensate for the warped portion of the edge of the flexible substrate, making the surface of the flexible substrate farther away from the substrate substrate, improving the formation of the flexible substrate.
  • Membrane uniformity thereby improving the stability and yield of the flexible display device, and reducing the coating of a PI film layer compared to the double-layer PI film layer structure, the preparation method is simple.
  • FIG. 5 is a schematic structural diagram of an embodiment of a display panel according to the present invention.
  • the display panel 10 as shown in FIG. 5 includes a flexible substrate 12, a laminated structure 13, and an encapsulation layer 14.
  • the flexible substrate 12 has a downward convex structure A at the edge thereof, and the convex structure A may be a communicating convex structure or may be spaced apart, and the convex structure A is prepared with the display panel of the present invention.
  • the recessed structure in the process is matched.
  • the flexible substrate 12 may be polyimide (PI) and polyethylene terephthalate (Polyethylene).
  • PI polyimide
  • PET polyethylene terephthalate
  • PET polyethylene terephthalate
  • the laminated structure 13 is formed on the flexible substrate 12, and further includes: an active array layer 131 and an organic light emitting layer.
  • the active array layer 131 further includes a barrier layer 1311, a buffer layer 1312, gate insulating layers 1313 and 1314, an interlayer insulating layer 1315, and a planarization layer 1316.
  • the material used for the barrier layer 1311 and the buffer layer 1312 is at least one of silicon nitride (SiNx) and silicon dioxide (SiO2). Of course, other materials may also be used, and the invention is not specifically limited.
  • the organic light emitting layer further includes a pixel defining layer 1322 and an OIED pixel (not shown) and the like.
  • the encapsulation layer 14 is formed on the stacked structure 13 and further includes a protective film 141.
  • the recess structure by preparing the recess structure at the edge of the substrate substrate, the recess structure can compensate for the warped portion of the edge of the flexible substrate, making the surface of the flexible substrate farther away from the substrate substrate, improving the formation of the flexible substrate.
  • Membrane uniformity thereby improving the stability and yield of the flexible display device, and reducing the coating of a PI film layer compared to the double-layer PI film layer structure, the preparation method is simple.
  • the present invention provides a display panel, a method of fabricating the same, and a display.
  • the recessed structure can compensate for the warpage of the edge of the flexible substrate by preparing a recessed structure at the edge of the substrate substrate. Making the surface of the flexible substrate farther away from the substrate substrate, improving the film formation uniformity of the flexible substrate, thereby improving the stability and yield of the flexible display device, and reducing one PI film compared to the double-layer PI film layer structure
  • the coating method of the layer, the preparation method is simple.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

一种显示面板(10)及制备方法、显示器(20)，方法包括：S1：提供一衬底基板；S2：在衬底基板的边缘处进行图形化处理，以形成具有凹陷结构的衬底基板；S3：在图案化后的衬底基板上依次沉积一层柔性衬底(12)及层叠结构(13)；S4：剥离衬底基板封装形成显示面板。这一方式能够弥补柔性衬底边缘的翘曲部分，使得柔性衬底的远离衬底基板的表面更加平坦，改善柔性衬底的成膜均匀性，从而提高柔性显示器件的稳定性和良率。

Description

显示面板及其制备方法、显示器
【技术领域】
本发明涉及显示技术领域，特别是涉及一种显示面板及其制备方法、显示器。
【背景技术】
有机发光二极管（Organic Light-Emitting Diode, OLED）显示面板因其具有自发光、结构简单、成本低、广视角、色饱和度高、反应速度快、轻薄及柔性高等优点被越来越多的智能产品所运用，如智能手机，可穿戴器件等。随着OLED面板的大规模的商业应用，人们对OLED的性能要求更高，如低电压、高亮度、高效率、低能耗、长寿命、高稳定性等。基于上述对OLED的要求，提高OLED器件的效率和稳定性成为人们关注的热点。
为了提高OLED的稳定性，研究工作者对各层结构优化改善显得尤为重要。目前，柔性的主动矩阵有机发光二极管（Active-matrix organic light emitting diode，AMOLED）采用的是聚酰亚胺(Polyimide，PI)基板，PI基板涂覆之后，边缘可能存在的形态对后期TFT膜层结构会造成影响，最终影响TFT电学性能。且目前也有研究工作者采用双层PI的模式达到平坦化PI柔性基板的目的，但此方法需要涂覆双层PI，工艺复杂，成本高。
【发明内容】
本发明提供一种显示面板及其制备方法、显示器，能够弥补柔性衬底边缘的翘曲部分，使得柔性衬底的远离衬底基板的表面更加平坦，改善柔性衬底的成膜均匀性，从而提高柔性显示器件的稳定性和良率。
为解决上述技术问题，本发明采用的一个技术方案是：提供一种显示器，包括显示面板，所述显示面板的制备方法包括：提供一衬底基板；在所述衬底基板的边缘处进行图形化处理，以形成具有凹陷结构的衬底基板；在所述图案化后的衬底基板上依次沉积一层柔性衬底及层叠结构，所述层叠结构包括依次沉积于所述柔性衬底上主动阵列层及有机发光层，所述柔性衬底为聚酰亚胺及聚对苯二甲酸乙二醇酯的一种；剥离所述衬底基板封装形成所述显示面板。
为解决上述技术问题，本发明采用的另一个技术方案是：提供一种显示面板的制备方法，所述制备方法包括：提供一衬底基板；在所述衬底基板的边缘处进行图形化处理，以形成具有凹陷结构的衬底基板；在所述图案化后的衬底基板上依次沉积一层柔性衬底及层叠结构；剥离所述衬底基板封装形成所述显示面板。
为解决上述技术问题，本发明采用的又一个技术方案是：提供一种显示面板，所述柔性显示面板包括：柔性衬底，所述柔性衬底的边缘处具有向下的凸起结构；层叠结构，形成于所述柔性衬底上，封装层，形成于所述层叠结构上。
本发明的有益效果是：提供一种显示面板及其制备方法、显示器，通过在衬底基板边缘处上制备凹陷结构，凹陷结构能够弥补柔性衬底边缘的翘曲部分，使得柔性衬底的远离衬底基板的表面更加平坦，改善柔性衬底的成膜均匀性，从而提高柔性显示器件的稳定性和良率，且较双层PI膜层结构相比，减少一道PI膜层的涂覆，该制备方法工艺简单。
【附图说明】
图1是本发明显示面板制备方法一实施方式的流程示意图；
图2是本发明图形化后的衬底基板一实施方式的正视示意图；
图3是本发明图形化后的衬底基板一实施方式的俯视示意图；
图4是本发明图形化后的衬底基板另一实施方式的俯视示意图；
图5是本发明显示面板一实施方式的结构示意图；
图6是本发明显示器一实施方式的结构示意图。
【具体实施方式】
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
请一并参阅图1、图2、图3及图4，图1为本发明显示面板制备方法一实施方式的流程示意图，图2为本发明图形化后的衬底基板一实施方式的正视示意图，图3为本发明图形化后的衬底基板一实施方式的俯视示意图，图4为本发明图形化后的衬底基板另一实施方式的俯视示意图。
S1，提供一衬底基板。
其中，衬底基板可以为透明材质，具体可以是玻璃、陶瓷基板或者透明塑料等任意形式的基板，此处本发明不做具体限定，且在本实施例中，所采用的的衬底基板为玻璃基板。
S2，在衬底基板的边缘处进行图形化处理，以形成具有凹陷结构的衬底基板。
在本实施例中，采用激光刻蚀的方法对玻璃基板的边缘处进行图形化处理，以使得该衬底基板的边缘处具有凹陷结构，详见图2。进一步，激光刻蚀的凹陷结构可以为连通的沟道，详见图3，在本实施例中该连通沟道的形状为方形，在其它实施例中也可以为圆形、椭圆、菱形等多边形，且具体形状本发明不做进一步限定。且该连通的沟道的宽窄可以进行调节，以适应后续柔性衬底的凸起部分。具体来说，若柔性衬底的凸起部分面积较大，则相应的调整该连通沟道宽一些，以使得柔性衬底平坦。若柔性衬底的凸起部分面积较小，则相应的调整该连通沟道窄一些，以使得柔性衬底平坦。
在本发明另一实施例中，该凹陷结构还可以设置为多个间隔设置的孔，具体参见图4。在本实施例中，该凹陷结构可以为间隔设置的圆孔，当然在其它实施例中也可以是方形孔、椭圆形孔等等、本发明不做具体限定。其中，该相邻圆孔间的间距以及圆孔的大小均可调，以适应后续柔性衬底的凸起部分。具体来说，若柔性衬底的凸起部分面积较大，则相应的调整圆孔间的间距使其分布密集，以此来改善柔性衬底平坦性，或则调整圆孔的大小使得相邻间圆孔变大，来改善柔性衬底平坦性。反之，若柔性衬底的凸起部分面积较小，则对应调整圆孔间的距离较大或者调整圆孔变小来改善柔性衬底平坦性。且该多个间距设置的孔的具体的调整本发明不做具体限定，只要能够提高后续膜层的平坦性的调整方法均在本发明的保护范围内。
当然在其它实施例中，该凹陷结构还可以是上述的连通沟道和多个间隔设置的孔交替设置，也可以是一半连通沟道，一半多个间隔设置的孔，本发明不做进一步的限定。
此外，除了采用激光刻蚀的方法对该衬底基板进行刻蚀外，在本发明其它实施例中，还可以采用湿法刻蚀的方法对衬底基板进行图形化处理，以形成具有凹陷结构的衬底基板，且具体的操作方法和上述激光刻蚀的方法类似，此处不再赘述。
S3，在图案化后的衬底基板上依次沉积一层柔性衬底及层叠结构。
在上述的图形化后的衬底基板上，沉积一层柔性衬底，该柔性衬底可以为聚酰亚胺（Polyimide，PI）及聚对苯二甲酸乙二醇酯（Polyethylene terephthalate,PET）的一种，本实施例中采用的柔性衬底为PI。其中，因上述步骤中对衬底基板进行了图形化处理，故该PI沉积在上面时，其边缘处不会发生翘曲现象，且相对于双层的PI膜层结构来说，达到的效果都是将PI膜层平坦化，但是却减少一道PI膜层的涂覆，制备工艺更加简单，有效地提高了器件的性能和稳定性。
进一步，在上述柔性衬底上沉积层叠结构。其中，该层叠结构可以包括现有的任意一种显示结构，例如LED、OLED，LCD，EL等。在本发明一具体实施例中，该层叠结构可以包括主动阵列层和有机发光层。
其中，主动阵列层的可以通过业界熟知各种制备方式制得，简单的制作工艺描述如下：在柔性衬底上依次沉积阻挡层、缓冲层、有源层、栅极绝缘层、介电层以及钝化层，从而形成主动阵列层。其中，阻挡层及缓冲层所采用的材料至少为氮化硅（SiNx）及二氧化硅中（SiO2）的一种。当然也可以采用其它材料，本发明不做具体限定。
本实施例中采用的有机发光层为OLED显示介质，且其大致包括：平坦化层、像素定义层以及OIED像素。
S4，剥离衬底基板封装形成显示面板。
沉积完上述的层叠结构后，剥离衬底基板并进行封装以形成显示面板。其中，进一步包括，封装完后在封装层上制备一保护膜层。最后将上述封装完后的显示面板进行弯折（bending）处理及测试。
上述实施方式中，通过在衬底基板边缘处上制备凹陷结构，凹陷结构能够弥补柔性衬底边缘的翘曲部分，使得柔性衬底的远离衬底基板的表面更加平坦，改善柔性衬底的成膜均匀性，从而提高柔性显示器件的稳定性和良率，且较双层PI膜层结构相比，减少一道PI膜层的涂覆，该制备方法工艺简单。
请参阅图5，图5为本发明显示面板一实施方式的结构示意图。如图5所述该显示面板10包括：柔性衬底12、层叠结构13以及封装层14。
柔性衬底12的边缘处具有向下的凸起结构A，且该凸起结构A可以为连通的凸起结构，也可以是间隔设置的，且该凸起结构A是与本发明显示面板制备工艺中的凹陷结构相配合。其中，该柔性衬底12可以为聚酰亚胺（Polyimide，PI）及聚对苯二甲酸乙二醇酯（Polyethylene terephthalate,PET）的一种，本实施例中采用的柔性衬底为PI。
层叠结构13形成于柔性衬底12上，进一步包括：主动阵列层131及有机发光层。
其中，主动阵列层131进一步包括：阻挡层1311、缓冲层1312、栅极绝缘层1313、1314、层间绝缘层1315以及平坦化层1316。其中，阻挡层1311及缓冲层1312所采用的材料至少为氮化硅（SiNx）及二氧化硅中（SiO2）的一种。当然也可以采用其它材料，本发明不做具体限定。
有机发光层进一步包括：像素定义层1322以及OIED像素（图未示）等。
封装层14形成于层叠结构13上，且进一步包括一保护膜141。
该实施例中的所有结构的制备或原理请详见上述制备方法中的描述，此处不再赘述。
请参见图6，图6为本发明显示器一实施方式的结构示意图。该显示器20包括上述任一所述的显示面板B，且该显示面板B的具体制备过程和结构详见上文描述，此处不再赘述。
上述实施方式中，通过在衬底基板边缘处上制备凹陷结构，凹陷结构能够弥补柔性衬底边缘的翘曲部分，使得柔性衬底的远离衬底基板的表面更加平坦，改善柔性衬底的成膜均匀性，从而提高柔性显示器件的稳定性和良率，且较双层PI膜层结构相比，减少一道PI膜层的涂覆，该制备方法工艺简单。
综上所述，本领域技术人员容易理解，本发明提供一种显示面板及制备方法、显示器，通过在衬底基板边缘处上制备凹陷结构，凹陷结构能够弥补柔性衬底边缘的翘曲部分，使得柔性衬底的远离衬底基板的表面更加平坦，改善柔性衬底的成膜均匀性，从而提高柔性显示器件的稳定性和良率，且较双层PI膜层结构相比，减少一道PI膜层的涂覆，该制备方法工艺简单。
以上所述仅为本发明的实施方式，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (13)

  1. 一种显示器，其中，包括显示面板，所述显示面板的制备方法包括：
    提供一衬底基板；
    在所述衬底基板的边缘处进行图形化处理，以形成具有凹陷结构的衬底基板；
    在所述图案化后的衬底基板上依次沉积一层柔性衬底及层叠结构，所述层叠结构包括依次沉积于所述柔性衬底上主动阵列层及有机发光层，所述柔性衬底为聚酰亚胺及聚对苯二甲酸乙二醇酯的一种；
    剥离所述衬底基板封装形成所述显示面板。
  2. 根据权利要求1所述的显示器，其中，所述凹陷结构包括连通沟道及多个间隔设置的孔中的至少一种。
  3. 根据权利要求2所述的显示器，其中，所述连通沟道的宽窄可调。
  4. 根据权利要求2所述的显示器，其中，所述孔的数量和间距可调。
  5. 根据权利要求1所述的显示器，其中，所述对所述衬底基板的边缘处进行图案化处理采用激光刻蚀及湿法刻蚀的一种。
  6. 一种显示面板的制备方法，其中，所述制备方法包括：
    提供一衬底基板；
    在所述衬底基板的边缘处进行图形化处理，以形成具有凹陷结构的衬底基板；
    在所述图案化后的衬底基板上依次沉积一层柔性衬底及层叠结构；
    剥离所述衬底基板封装形成所述显示面板。
  7. 根据权利要求6所述的制备方法，其中，所述凹陷结构包括连通沟道及多个间隔设置的孔中的至少一种。
  8. 根据权利要求7所述的制备方法，其中，所述连通沟道的宽窄可调。
  9. 根据权利要求7所述的制备方法，其中，所述孔的数量和间距可调。
  10. 根据权利要求7所述的制备方法，其中，所述柔性衬底为聚酰亚胺及聚对苯二甲酸乙二醇酯的一种。
  11. 根据权利要求6所述的制备方法，其中，所述对所述衬底基板的边缘处进行图案化处理采用激光刻蚀及湿法刻蚀的一种。
  12. 根据权利要求6所述的制备方法，其中，所述层叠结构包括依次沉积于所述柔性衬底上主动阵列层及有机发光层。
  13. 一种显示面板，其中，所述柔性显示面板包括：
    柔性衬底，所述柔性衬底的边缘处具有向下的凸起结构；
    层叠结构，形成于所述柔性衬底上；
    封装层，形成于所述层叠结构上。
PCT/CN2017/097754 2017-07-12 2017-08-17 显示面板及其制备方法、显示器 WO2019010749A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US15/735,879 US20200044198A1 (en) 2017-07-12 2017-08-17 Liquid crystal display (lcd) panel, lcd and manufacturing method thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201710565739.0 2017-07-12
CN201710565739.0A CN107359282B (zh) 2017-07-12 2017-07-12 显示面板及其制备方法、显示器

Publications (1)

Publication Number Publication Date
WO2019010749A1 true WO2019010749A1 (zh) 2019-01-17

Family

ID=60293401

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2017/097754 WO2019010749A1 (zh) 2017-07-12 2017-08-17 显示面板及其制备方法、显示器

Country Status (3)

Country Link
US (1) US20200044198A1 (zh)
CN (1) CN107359282B (zh)
WO (1) WO2019010749A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190081475A (ko) * 2017-12-29 2019-07-09 엘지디스플레이 주식회사 디스플레이 장치
CN110518118B (zh) * 2019-08-08 2021-05-28 武汉华星光电半导体显示技术有限公司 显示面板及其制作方法
CN110911354A (zh) * 2019-11-06 2020-03-24 深圳市华星光电半导体显示技术有限公司 柔性衬底基板及其制备方法、柔性面板的制备方法
CN112068343B (zh) * 2020-09-11 2022-12-06 深圳市华星光电半导体显示技术有限公司 液晶显示屏单元及其制造方法、以及液晶显示屏幕墙

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103969861A (zh) * 2013-01-30 2014-08-06 索威斯胶带(上海)有限公司 显示装置及装配方法
CN104409408A (zh) * 2014-12-02 2015-03-11 昆山国显光电有限公司 一种刚性基板及柔性显示器的制作方法
US20160085352A1 (en) * 2013-09-05 2016-03-24 Samsung Display Co., Ltd. Manufacturing method of flexible display device and manufacturing method of touch screen panel
CN106129269A (zh) * 2016-06-24 2016-11-16 京东方科技集团股份有限公司 一种柔性显示基板的制备方法
CN106229421A (zh) * 2016-08-24 2016-12-14 昆山工研院新型平板显示技术中心有限公司 柔性基板制作方法和柔性基板
CN106784412A (zh) * 2017-03-30 2017-05-31 武汉华星光电技术有限公司 柔性有机发光二极管显示器及其制作方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102354019B1 (ko) * 2015-03-06 2022-01-21 유니버셜 디스플레이 코포레이션 고효율 oled 소자를 위한 신규 기판 및 공정
CN104752443B (zh) * 2015-04-20 2016-03-02 京东方科技集团股份有限公司 衬底载板、柔性显示面板及相应的制作方法、柔性显示装置
KR20170071660A (ko) * 2015-12-15 2017-06-26 삼성디스플레이 주식회사 플렉서블 컬러필터 및 그 제조 방법
CN106057864B (zh) * 2016-08-23 2019-11-05 武汉华星光电技术有限公司 一种柔性显示面板及其制备方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103969861A (zh) * 2013-01-30 2014-08-06 索威斯胶带(上海)有限公司 显示装置及装配方法
US20160085352A1 (en) * 2013-09-05 2016-03-24 Samsung Display Co., Ltd. Manufacturing method of flexible display device and manufacturing method of touch screen panel
CN104409408A (zh) * 2014-12-02 2015-03-11 昆山国显光电有限公司 一种刚性基板及柔性显示器的制作方法
CN106129269A (zh) * 2016-06-24 2016-11-16 京东方科技集团股份有限公司 一种柔性显示基板的制备方法
CN106229421A (zh) * 2016-08-24 2016-12-14 昆山工研院新型平板显示技术中心有限公司 柔性基板制作方法和柔性基板
CN106784412A (zh) * 2017-03-30 2017-05-31 武汉华星光电技术有限公司 柔性有机发光二极管显示器及其制作方法

Also Published As

Publication number Publication date
US20200044198A1 (en) 2020-02-06
CN107359282A (zh) 2017-11-17
CN107359282B (zh) 2020-06-05

Similar Documents

Publication Publication Date Title
WO2019010749A1 (zh) 显示面板及其制备方法、显示器
CN107957813B (zh) 一种柔性触控显示屏及其制作方法
CN104103673B (zh) 一种oled显示器及其制备方法
TWI540487B (zh) A touch display device and its preparation method
CN104183783B (zh) 具有柔性基板的有机发光显示装置
CN104393017B (zh) 阵列基板的制作方法、阵列基板及显示装置
CN106783881A (zh) 一种柔性显示面板及其制造方法
WO2019006825A1 (zh) 柔性oled阵列基板的制作方法、oled显示面板
WO2019000520A1 (zh) 一种内嵌式触控oled显示装置
CN108630732A (zh) Oled显示面板及其制作方法
CN109659320A (zh) 阵列基板及具有该阵列基板的显示装置
WO2019085065A1 (zh) 柔性 oled 显示面板及其制备方法
WO2019085072A1 (zh) 柔性显示面板及其制造方法、柔性显示装置
WO2019033578A1 (zh) 柔性oled显示面板的柔性基底及其制备方法
WO2019127883A1 (zh) 有机发光器件的封装结构及制备方法
WO2020237982A1 (zh) 显示面板及其制备方法、显示装置
WO2019019275A1 (zh) 一种触控阵列基板及触控面板
WO2019192075A1 (zh) 柔性显示器及其制作方法
CN104752461B (zh) 一种双面显示装置及其制备方法
WO2019090840A1 (zh) 柔性显示组件、制作方法以及显示面板
US20170162819A1 (en) Organic electroluminescent device structure and manufacturing for the same
CN104752460B (zh) 有机发光二极管阵列的制备方法
CN109755287B (zh) 一种柔性oled器件及其制备方法
WO2019024167A1 (zh) 柔性oled显示面板
WO2017063295A1 (zh) Oled显示面板及其制作方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17917402

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 17917402

Country of ref document: EP

Kind code of ref document: A1