WO2019127698A1 - 一种柔性面板的制备方法及柔性显示装置 - Google Patents

一种柔性面板的制备方法及柔性显示装置 Download PDF

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Publication number
WO2019127698A1
WO2019127698A1 PCT/CN2018/072977 CN2018072977W WO2019127698A1 WO 2019127698 A1 WO2019127698 A1 WO 2019127698A1 CN 2018072977 W CN2018072977 W CN 2018072977W WO 2019127698 A1 WO2019127698 A1 WO 2019127698A1
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flexible
layer
glass substrate
flexible material
forming
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PCT/CN2018/072977
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English (en)
French (fr)
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李朝
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武汉华星光电半导体显示技术有限公司
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Priority to US15/909,808 priority Critical patent/US10522770B2/en
Publication of WO2019127698A1 publication Critical patent/WO2019127698A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/7806—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/221—Changing the shape of the active layer in the devices, e.g. patterning by lift-off techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates

Definitions

  • the present invention relates to the field of flexible display technologies, and in particular, to a method for preparing a flexible panel and a flexible display device.
  • the array substrate of the flexible display device must be a flexible substrate. Since the flexible substrate is easily deformed, in the preparation process of the display substrate, it is required to form a flexible material layer on the glass substrate, and then sequentially form various layers on the flexible material layer.
  • the display structure such as a thin film transistor, a data line, a gate line, a capacitor, a cathode/cathode, and an organic light-emitting layer, is then stripped from the glass substrate to form a separate flexible display substrate.
  • the inventors of the present application found in the long-term research and development that in the preparation process of the display substrate, the cleaning of the glass substrate can not completely clean the particulate matter on the glass substrate, thereby causing the glass substrate and the flexible material layer not to be completely peeled off, affecting the flexible material.
  • the success rate of layer peeling also affects the optical characteristics of the flexible display device.
  • the technical problem to be solved by the present invention is to provide a method for preparing a flexible panel and a flexible display device, which can completely peel the glass substrate from the flexible material, reduce the defect rate of peeling of the flexible material, and improve the optical characteristics of the flexible display.
  • a technical solution adopted by the present invention is to provide a method for preparing a flexible panel, comprising: forming a protective layer on a glass substrate; forming a flexible material layer on the protective layer; and forming a flexible material layer on the flexible material layer A thin film transistor, an organic functional layer, and an encapsulation layer are sequentially formed to form a flexible panel; the glass substrate is separated from the flexible material layer by laser lift-off to obtain a flexible panel.
  • another technical solution adopted by the present invention is to provide a flexible display device comprising the flexible panel prepared by any of the above methods.
  • the beneficial effects of the present invention are: by adding a protective layer between the glass substrate and the flexible material layer, the particulate matter on the glass substrate does not directly affect the flexible material layer, and when the glass substrate and the flexible material layer are peeled off, A complete flexible panel is obtained, which reduces the defective rate of peeling of the flexible material while improving the optical characteristics of the flexible display.
  • FIG. 1 is a schematic flow chart of a first embodiment of a method for preparing a flexible panel according to the present invention
  • FIG. 2 is a schematic structural view of a first embodiment of a method for preparing a flexible panel according to the present invention
  • FIG. 3 is a schematic flow chart of a second embodiment of a method for preparing a flexible panel according to the present invention.
  • FIG. 4 is a schematic structural view of a second embodiment of a method for preparing a flexible panel according to the present invention.
  • FIG. 5 is a schematic flow chart of a third embodiment of a method for preparing a flexible panel according to the present invention.
  • FIG. 6 is a schematic structural view of a third embodiment of a method for preparing a flexible panel according to the present invention.
  • Fig. 7 is a schematic structural view of an embodiment of a flexible display device of the present invention.
  • FIG. 1 is a schematic flow chart of a first embodiment of a method for fabricating a flexible panel according to the present invention.
  • the flexible panel preparation method includes:
  • a protective layer 21 is formed on the glass substrate 20.
  • the panel of the flexible display device must be a flexible substrate. Since the flexible substrate is easily deformed, in the preparation process of the display substrate, a flexible material layer needs to be formed on the glass substrate, and then various displays are sequentially formed on the flexible material layer. structure. Therefore, after the initial cleaning of the glass substrate, a yellow organic photoresist coating, such as DL-1001-C, or other coating may be performed to form a temporary buffer layer on the glass substrate to protect the flexible substrate. Affected by the glass substrate.
  • a layer of flexible material 22 is formed on the protective layer 21. Specifically, coating, drying, and curing of polyimide are performed on the protective layer 21 to form a flexible material layer 22, that is, a flexible substrate.
  • the protective layer on the flexible material layer can effectively block the influence of large particles on the glass substrate, reduce the problem of convex base and depression of the flexible substrate, and thereby improve the success rate of the flexible substrate coating.
  • polyimide is one of the best organic polymer materials with comprehensive performance, which makes the flexible material on the protective layer have good optical, chemical resistance and water and oxygen resistance.
  • a thin film transistor 23, an organic functional layer, and an encapsulation layer are sequentially formed on the flexible material layer 22 to form a flexible panel.
  • a thin film transistor, a data line, a gate line, a capacitor, an anode, a cathode, an organic light emitting layer, a pixel defining layer, and the like are sequentially formed on the flexible material layer, and a series of operations such as evaporation and packaging are performed. .
  • the glass substrate 20 is separated from the flexible material layer 21 by laser lift-off. Specifically, the glass substrate 20 and the protective layer 21 and the flexible material layer 22 are peeled off by the LLO laser lift-off technique.
  • the glass substrate and the protective layer may be stripped by LLO laser stripping technology, and then the LLO laser stripping technique is used to peel off the protective layer and the flexible material layer to finally achieve the glass substrate and flexibility. The effect of material layer separation.
  • a protective layer is added between the glass substrate and the flexible material layer, so that the particulate matter on the glass substrate does not directly affect the flexible material layer, thereby obtaining complete flexibility when peeling off the glass substrate and the flexible material layer.
  • the panel reduces the defect rate of the peeling of the flexible material while improving the optical characteristics of the flexible display.
  • FIG. 3 is a schematic flow chart of a second embodiment of the method for fabricating a flexible panel according to the present invention.
  • a flexible panel preparation method includes:
  • the organic photoresist film 41 is formed on the glass substrate 40 by a yellow light process. Specifically, a layer of organic photoresist is coated on the glass substrate using a yellow light technique.
  • the technology used by Huang Guang is Lithography.
  • the material used is photosensitive material. This material is called photoresist (photo Resistance, PR).
  • PR photo Resistance
  • the Lithography technique is to transfer the pattern on the mask to the PR first, and then dissolve or retain the portion irradiated with the PR by solvent soaking to form a photoresist pattern which is identical or complementary to the mask. And curing, and finally form an organic photoresist film.
  • the organic photoresist film has a thickness of 1.5-2 um.
  • a layer of flexible material 42 is formed on the organic photoresist film 41.
  • polyimide Polyimide
  • the organic photoresist film can effectively block the influence of large particles on the glass substrate, reduce the problem of convex base and depression of the flexible substrate, and thereby improve the success rate of the flexible substrate coating.
  • S32 sequentially forming a thin film transistor, an organic functional layer, and an encapsulation layer on the flexible material layer to form a flexible panel.
  • a thin film transistor 43, an organic functional layer, and an encapsulation layer are sequentially formed on the flexible material layer 42 to form a flexible panel.
  • a thin film transistor 43, a data line, a gate line, a capacitor, an anode, a cathode, an organic light-emitting layer, a pixel defining layer, and the like are sequentially formed on the flexible material layer 42 and are vapor-deposited, packaged, and the like. Series operation.
  • the glass substrate 40 is separated from the organic photoresist film 41 by laser lift-off.
  • the organic photoresist film 41 is separated from the flexible material layer 42 by laser lift-off.
  • a relatively complete flexible substrate is obtained by two LLO laser stripping techniques, and the planarization is optimized to facilitate the optical characteristics of the flexible display.
  • FIG. 5 is a schematic flow chart of a third embodiment of a method for fabricating a flexible panel according to the present invention.
  • Flexible panel preparation methods include:
  • S53 sequentially forming a thin film transistor, an organic functional layer, and an encapsulation layer on the flexible material layer to form a flexible panel.
  • an organic photoresist film 61 is formed on the glass substrate 60 by a yellow light process, and a non-metal plating film is formed on the organic photoresist film 61 to form a non-metal film 62 on the non-metal film 62.
  • Forming a flexible material layer 63 sequentially forming a thin film transistor 64 and a data line, a gate line, a capacitor, an anode, a cathode, an organic light-emitting layer, a pixel defining layer, and the like (not shown) on the flexible material layer 63, and performing evaporation , packaging and other operations.
  • the glass substrate 60 is separated from the organic photoresist film 61 by laser lift-off, and the organic photoresist film 61 is separated from the flexible material layer 63 by laser lift-off, and finally the effect of separating the glass substrate from the flexible material layer is achieved, and flexibility is formed. panel.
  • the non-metallic film has a thickness of 1 um.
  • the non-metal film is silicon nitride and/or silicon oxide.
  • the purpose of blocking water vapor and oxygen can be achieved, and at the same time, the organic photoresist film and the flexible material layer are beneficial.
  • the second LLO laser stripping can be used.
  • plasma enhanced chemical vapor deposition (Plasma) can be used.
  • Enhanced Chemical Vapor Deposition, PECVD by means of microwave or radio frequency, etc., the gas containing the constituent atoms of the film is ionized to form a plasma locally, and the plasma is chemically active, and it is easy to react, and a desired film is deposited on the substrate.
  • the present invention also includes a flexible display device 70, which in a particular embodiment includes a flexible panel 71 prepared by any of the methods described above.
  • the flexible display device is a flexible active matrix organic light emitting diode (Active-matrix) Organic light emitting Diode, AMOLED) or flexible display.
  • the flexible panel in the embodiment has a protective layer formed on the glass substrate; a flexible material layer is formed on the protective layer; and the thin film transistor, the organic functional layer and the encapsulation layer are sequentially formed on the flexible material layer to form a flexible panel;
  • the laser peeling method separates the glass substrate from the flexible material layer to obtain a flexible panel.
  • the protective layer effectively blocks the influence of large particles on the glass substrate, reduces problems such as protrusions and depressions of the flexible substrate, and improves the optical characteristics of the flexible display device.

Abstract

一种柔性面板(71)的制备方法及柔性显示装置(70)。其中，制备方法包括：在玻璃基板(20,40,60)上形成保护层(21)；在保护层(21)上形成柔性材料层(22,42,63)；在柔性材料层(22,42,63)上依次形成薄膜晶体管(23,43,64)、有机功能层以及封装层以形成柔性面板(71)；通过激光剥离的方式使玻璃基板(20,40,60)与柔性材料层(22,42,63)分离，得到柔性面板(71)。通过柔性面板(71)的制备方法，可以将玻璃基板(20,40,60)与柔性材料完全剥离，降低柔性材料剥离的不良率，同时提高柔性显示器的光学特性。

Description

一种柔性面板的制备方法及柔性显示装置
【技术领域】
本发明涉及柔性显示技术领域，特别是涉及一种柔性面板的制备方法及柔性显示装置。
【背景技术】
随着显示技术的发展，柔性显示装置被广泛应用。其中，柔性显示装置的阵列基板必须是柔性基底，由于柔性基底容易发生变形，因此在显示基板的制备过程中，需要在玻璃基板上生成柔性材料层，然后再依次在柔性材料层上形成各种显示结构，如：薄膜晶体管、数据线、栅线、电容、阳/阴极及有机发光层等，然后再将玻璃基板与柔性材料层进行剥离，以形成独立的柔性显示基板。
本申请的发明人在长期的研发中发现，显示基板的制备过程中，玻璃基板的清洗并不能完全清洗掉玻璃基板上的颗粒物质，从而引起玻璃基板与柔性材料层不能完全剥离，影响柔性材料层剥离的成功率，同时也影响柔性显示装置的光学特征。
【发明内容】
本发明主要解决的技术问题是提供一种柔性面板的制备方法及柔性显示装置，可以将玻璃基板与柔性材料完全剥离，降低柔性材料剥离的不良率，同时提高柔性显示器的光学特性。
为解决上述技术问题，本发明采用的一个技术方案是：提供一种柔性面板的制备方法，该方法包括：在玻璃基板上形成保护层；在保护层上形成柔性材料层；在柔性材料层上依次形成薄膜晶体管、有机功能层以及封装层以形成柔性面板；通过激光剥离的方式使玻璃基板与柔性材料层分离，得到柔性面板。
为解决上述技术问题，本发明采用的另一个技术方案是：提供一种柔性显示装置，该显示装置包括上述任意一项方法所制备的柔性面板。
本发明的有益效果是：通过在玻璃基板与柔性材料层之间加入一层保护层，使得玻璃基板上的颗粒物质不会直接影响到柔性材料层，进而在剥离玻璃基板与柔性材料层时，得到完整的柔性面板，降低柔性材料剥离的不良率，同时提高柔性显示器的光学特性。
【附图说明】
图1是本发明基于柔性面板制备方法的第一实施例的流程示意图；
图2是本发明基于柔性面板制备方法的第一实施方式的结构示意图；
图3是本发明基于柔性面板制备方法的第二实施例的流程示意图；
图4是本发明基于柔性面板制备方法的第二实施方式的结构示意图；
图5是本发明基于柔性面板制备方法的第三实施例的流程示意图；
图6是本发明基于柔性面板制备方法的第三实施方式的结构示意图；
图7是本发明柔性显示装置一实施例的结构示意图。
【具体实施方式】
下面结合附图和实施方式对本发明进行详细说明。
请参阅图1，图1是本发明基于柔性面板制备方法的第一实施例的流程示意图。参考图2，该柔性面板制备方法包括：
S10：在玻璃基板上形成保护层。
在玻璃基板20上形成保护层21。其中，柔性显示装置的面板必须是柔性基底，由于柔性基底容易发生变形，因此在显示基板的制备过程中，需要在玻璃基板上生成柔性材料层，然后再依次在柔性材料层上形成各种显示结构。因此，在玻璃基板进行初始化清洗后，可以进行一层黄光有机光阻涂布，例如：DL-1001-C，或进行其他涂布以在玻璃基板上形成临时缓冲层，以保护柔性基底不受玻璃基板的影响。
S11：在保护层上形成柔性材料层。
在保护层21上形成柔性材料层22。具体的，在保护层21上进行聚酰亚胺（Polyimide）的涂布、干燥及固化以形成柔性材料层22，即柔性基底。而柔性材料层上的保护层可以有效的阻挡玻璃基板上大颗粒的影响，降低柔性基底凸起和凹陷问题，进而提升柔性基底涂布的成功率。其中，聚酰亚胺是综合性能最佳的有机高分子材料之一，使得保护层上的柔性材料具有良好的光学，耐化以及阻水阻氧等性能。
S12: 在柔性材料层上依次形成薄膜晶体管、有机功能层以及封装层以形成柔性面板。
在柔性材料层22上依次形成薄膜晶体管23、有机功能层以及封装层（图中未示）以形成柔性面板。具体的，在柔性材料层上依次形成薄膜晶体管、数据线、栅线、电容、阳极、阴极、有机发光层、像素界定层等（图中未示），并进行蒸镀、封装等一系列操作。
S13：通过激光剥离的方式使玻璃基板与柔性材料层分离，得到柔性面板。
通过激光剥离的方式使玻璃基板20与柔性材料层21分离。具体的，利用LLO激光剥离技术将玻璃基板20及保护层21与柔性材料层22之间进行剥离。在本实施例中，可以先利用LLO激光剥离技术将玻璃基板与保护层之间进行剥离，然后，再次利用LLO激光剥离技术将保护层与柔性材料层之间进行剥离，最终达到玻璃基板与柔性材料层分离的效果。
通过上述方法，在玻璃基板与柔性材料层之间加入一层保护层，使得玻璃基板上的颗粒物质不会直接影响到柔性材料层，进而在剥离玻璃基板与柔性材料层时，得到完整的柔性面板，降低柔性材料剥离的不良率，同时提高柔性显示器的光学特性。
请参阅图3，图3是本发明基于柔性面板制备方法的第二实施例的流程示意图。参考图4，柔性面板制备方法包括：
S30：通过黄光工艺在玻璃基板上形成有机光阻膜。
通过黄光工艺在玻璃基板40上形成有机光阻膜41。具体的，使用黄光技术在玻璃基板上涂布一层有机光阻。黄光使用的技术为微影（Lithography）技术，使用的材料为感光材料，这种材料称之为光阻（photo resistance，PR）。微影（Lithography）技术是将光罩(Mask)上的图案先转移至PR上，再以溶剂浸泡将PR受光照射到的部分加以溶解或保留，形成和光罩完全相同或呈互补的光阻图，并进行固化，最终形成一层有机光阻膜。
可选的，有机光阻膜的厚度为1.5-2um。
S31：在有机光阻膜上形成柔性材料层。
在有机光阻膜41上形成柔性材料层42。具体的，在有机光阻膜41上进行聚酰亚胺（Polyimide）的涂布、干燥及固化以形成柔性材料层42，即柔性基底。有机光阻膜可以有效的阻挡玻璃基板上大颗粒的影响，降低柔性基底凸起和凹陷问题，进而提升柔性基底涂布的成功率。
S32：在柔性材料层上依次形成薄膜晶体管、有机功能层以及封装层以形成柔性面板。
在柔性材料层42上依次形成薄膜晶体管43、有机功能层以及封装层（图中未示）以形成柔性面板。具体的，在柔性材料层42上依次形成薄膜晶体管43、数据线、栅线、电容、阳极、阴极、有机发光层、像素界定层等（图中未示），并进行蒸镀、封装等一系列操作。
S33：通过激光剥离的方式使玻璃基板与有机光阻膜分离。
通过激光剥离的方式使玻璃基板40与有机光阻膜41分离。
S34：通过激光剥离的方式使有机光阻膜与柔性材料层分离。
通过激光剥离的方式使有机光阻膜41与柔性材料层42分离。通过两次LLO激光剥离技术得到比较完整的柔性基底，平坦化得到优化，有利柔性显示器光学特性。
通过上述方法，通过在玻璃层上涂布有机光阻膜层，临时起到缓冲作用，用以保护柔性基底，使得玻璃层上的颗粒物质不会影响到柔性材料层，有效防止柔性基底因颗粒物质引起的凸起和凹陷等不良问题。
参考图5，图5是本发明基于柔性面板制备方法的第三实施例的流程示意图。柔性面板制备方法包括：
S50：通过黄光工艺在玻璃基板上形成有机光阻膜；
S51：在有机光阻膜上进行非金属镀膜，以形成非金属膜。
S52：在非金属膜上形成柔性材料层。
S53：在柔性材料层上依次形成薄膜晶体管、有机功能层以及封装层以形成柔性面板。
S54：通过激光剥离的方式使玻璃基板与有机光阻膜分离。
S55：通过激光剥离的方式使有机光阻膜与柔性材料层分离。
如图6所示，具体的，通过黄光工艺在玻璃基板60上形成有机光阻膜61，在有机光阻膜61上进行非金属镀膜，以形成非金属膜62，在非金属膜62上形成柔性材料层63，在柔性材料层63上依次形成薄膜晶体管64以及、数据线、栅线、电容、阳极、阴极、有机发光层、像素界定层等（图中未示），并进行蒸镀、封装等一系列操作。通过激光剥离的方式使玻璃基板60与有机光阻膜61分离，通过激光剥离的方式使有机光阻膜61与柔性材料层63分离，最终达到玻璃基板与柔性材料层分离的效果，并形成柔性面板。
可选的，非金属膜的厚度为1um。
可选的，非金属膜为氮化硅和/或氧化硅。
在本实施例中，通过在有机光阻膜层和柔性材料层之间镀上一层非金属膜层，可以起到阻挡水汽和氧气的目的，同时，有利于有机光阻膜与柔性材料层的第二次LLO激光剥离。其中，可以使用等离子体增强化学的气相沉积法（Plasma Enhanced Chemical Vapor Deposition，PECVD），借助微波或射频等使含有薄膜组成原子的气体电离，在局部形成等离子体，而等离子体化学活性很强，很容易发生反应，在基片上沉积出所期望的薄膜。
参考图7，本发明还包括一种柔性显示装置70，在具体实施方式中，该柔性显示装置70包括上述任意方法所制备的柔性面板71。具体方法如上述各实施方式，此处不再赘述。进一步地，柔性显示装置为柔性主动矩阵有机发光二极体（Active-matrix organic light emitting diode，AMOLED）或柔性显示器。其中，本实施方式中的柔性面板，通过在玻璃基板上形成保护层；在保护层上形成柔性材料层；在柔性材料层上依次形成薄膜晶体管、有机功能层以及封装层以形成柔性面板；通过激光剥离的方式使玻璃基板与柔性材料层分离，得到柔性面板。通过保护层有效的阻挡玻璃基板上大颗粒的影响，降低柔性基底凸起和凹陷等问题，提高柔性显示装置的光学特性。
以上所述仅为本发明的实施方式，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (16)

  1. 一种柔性面板的制备方法，其中，所述方法包括：
    在玻璃基板上形成保护层；
    在所述保护层上形成柔性材料层；
    在所述柔性材料层上依次形成薄膜晶体管、有机功能层以及封装层以形成所述柔性面板；
    通过激光剥离的方式使所述玻璃基板与所述柔性材料层分离，得到所述柔性面板；
    其中，所述在玻璃基板上形成保护层，包括：
    通过黄光工艺在玻璃基板上形成有机光阻膜；
    所述在玻璃基板上形成保护层，包括：
    通过黄光工艺在玻璃基板上形成有机光阻膜；
    在所述有机光阻膜上进行非金属镀膜，以形成非金属膜。
  2. 根据权利要求1所述的方法，其中，所述通过激光剥离的方式使所述玻璃基板与所述柔性材料层分离，包括：
    通过激光剥离的方式使所述玻璃基板与所述有机光阻膜分离；
    通过激光剥离的方式使所述有机光阻膜与所述柔性材料层分离。
  3. 根据权利要求1所述的方法，其中，所述在所述保护层上形成柔性材料层具体包括：
    在所述保护层上进行聚酰亚胺涂布、干燥及固化以形成柔性材料层。
  4. 根据权利要求2所述的方法，其中，所述有机光阻膜的厚度为1.5-2um。
  5. 根据权利要求2所述的方法，其中，所述非金属膜的厚度为1um。
  6. 根据权利要求2所述的方法，其中，所述非金属膜为氮化硅和/或氧化硅。
  7. 一种柔性面板的制备方法，其中，所述方法包括：
    在玻璃基板上形成保护层；
    在所述保护层上形成柔性材料层；
    在所述柔性材料层上依次形成薄膜晶体管、有机功能层以及封装层以形成所述柔性面板；
    通过激光剥离的方式使所述玻璃基板与所述柔性材料层分离，得到所述柔性面板。
  8. 根据权利要求7所述的方法，其中，所述在玻璃基板上形成保护层，包括：
    通过黄光工艺在玻璃基板上形成有机光阻膜。
  9. 根据权利要求7所述的方法，其中，所述在玻璃基板上形成保护层，包括：
    通过黄光工艺在玻璃基板上形成有机光阻膜；
    在所述有机光阻膜上进行非金属镀膜，以形成非金属膜。
  10. 根据权利要求8所述的方法，其中，所述通过激光剥离的方式使所述玻璃基板与所述柔性材料层分离，包括：
    通过激光剥离的方式使所述玻璃基板与所述有机光阻膜分离；
    通过激光剥离的方式使所述有机光阻膜与所述柔性材料层分离。
  11. 根据权利要求7所述的方法，其中，所述在所述保护层上形成柔性材料层具体包括：
    在所述保护层上进行聚酰亚胺涂布、干燥及固化以形成柔性材料层。
  12. 根据权利要求8所述的方法，其中，所述有机光阻膜的厚度为1.5-2um。
  13. 根据权利要求10所述的方法，其中，所述非金属膜的厚度为1um。
  14. 根据权利要求10所述的方法，其中，所述非金属膜为氮化硅和/或氧化硅。
  15. 一种柔性显示装置，其中，所述显示装置包括权利要求7的方法所制备的柔性面板。
  16. 根据权利要15所述的柔性显示装置，其中，所述柔性显示装置为柔性主动矩阵有机发光二极体AMOLED或柔性显示器。
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111627964A (zh) * 2020-05-25 2020-09-04 福建华佳彩有限公司 一种新型柔性激光剥离面板及其制备方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108898953B (zh) * 2018-07-04 2020-12-22 京东方科技集团股份有限公司 柔性显示面板的制备方法、柔性显示面板和显示装置
CN109638157B (zh) * 2018-12-14 2023-05-12 合肥鑫晟光电科技有限公司 显示面板母版、柔性显示面板及制备方法和显示装置
CN109904198B (zh) * 2019-02-22 2021-11-02 京东方科技集团股份有限公司 一种器件及制作方法、显示面板及制作方法和显示装置
CN112164707B (zh) * 2020-08-31 2024-04-16 福建华佳彩有限公司 一种柔性显示面板的制备方法
CN113036065B (zh) * 2021-03-08 2024-02-20 京东方科技集团股份有限公司 柔性显示基板及其制备方法、显示装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102509719A (zh) * 2011-09-21 2012-06-20 友达光电股份有限公司 可挠式显示器的制作方法以及可挠式显示器
CN105552247A (zh) * 2015-12-08 2016-05-04 上海天马微电子有限公司 复合基板、柔性显示装置及其制备方法
US20170092885A1 (en) * 2014-02-19 2017-03-30 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device and peeling method
CN106711348A (zh) * 2016-12-29 2017-05-24 上海天马微电子有限公司 一种有机发光显示面板及其制备方法、显示装置
CN107482022A (zh) * 2017-08-25 2017-12-15 京东方科技集团股份有限公司 柔性基板及其制造方法、柔性显示器件和柔性显示装置
CN107507929A (zh) * 2017-08-04 2017-12-22 武汉华星光电半导体显示技术有限公司 Oled显示面板的柔性基底及其制备方法
CN107845741A (zh) * 2017-10-23 2018-03-27 武汉华星光电半导体显示技术有限公司 柔性基板剥离方法及柔性基板

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105511140A (zh) * 2015-12-31 2016-04-20 深圳市易快来科技股份有限公司 一种显示装置及制作方法
CN105489789B (zh) * 2016-01-18 2017-03-01 京东方科技集团股份有限公司 柔性器件制作方法及柔性显示器件
CN105632347A (zh) * 2016-04-01 2016-06-01 京东方科技集团股份有限公司 一种柔性面板及其制作方法、显示装置
CN106784311A (zh) * 2016-12-27 2017-05-31 武汉华星光电技术有限公司 柔性面板及其制作方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102509719A (zh) * 2011-09-21 2012-06-20 友达光电股份有限公司 可挠式显示器的制作方法以及可挠式显示器
US20170092885A1 (en) * 2014-02-19 2017-03-30 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device and peeling method
CN105552247A (zh) * 2015-12-08 2016-05-04 上海天马微电子有限公司 复合基板、柔性显示装置及其制备方法
CN106711348A (zh) * 2016-12-29 2017-05-24 上海天马微电子有限公司 一种有机发光显示面板及其制备方法、显示装置
CN107507929A (zh) * 2017-08-04 2017-12-22 武汉华星光电半导体显示技术有限公司 Oled显示面板的柔性基底及其制备方法
CN107482022A (zh) * 2017-08-25 2017-12-15 京东方科技集团股份有限公司 柔性基板及其制造方法、柔性显示器件和柔性显示装置
CN107845741A (zh) * 2017-10-23 2018-03-27 武汉华星光电半导体显示技术有限公司 柔性基板剥离方法及柔性基板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111627964A (zh) * 2020-05-25 2020-09-04 福建华佳彩有限公司 一种新型柔性激光剥离面板及其制备方法

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